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HomeProductsIntegrated Circuits (ICs)Memory70V9279L6PRF8
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70V9279L6PRF8 - Renesas Electronics America Inc

Manufacturer Part Number
70V9279L6PRF8
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-70V9279L6PRF8
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,731 pcs available, New & Original
Parts Description
IC SRAM 512KBIT PARALLEL 128TQFP
Package
128-TQFP (14x20)
Data sheet
70V9279L6PRF8.pdf

Datasheets

IDT Suffixes.pdf

PCN Obsolescence/ EOL

Mult Devices 15/Sep/2017.pdf

PCN Design/Specification

All Dev Label Chg 1/Dec/2022.pdf
RoHs Status
 
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In stock: 17731

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Specifications

70V9279L6PRF8 Tech Specifications
Renesas Electronics America Inc - 70V9279L6PRF8 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 70V9279L6PRF8

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SRAM - Dual Port, Synchronous
Supplier Device Package 128-TQFP (14x20)
Series -
Package / Case 128-LQFP
Package Tape & Reel (TR)
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 512Kbit
Memory Organization 32K x 16
Memory Interface Parallel
Memory Format SRAM
Base Product Number 70V9279
Access Time 6.5 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2B
HTSUS 8542.32.0041

Frequently Asked Questions(FAQ)

How does the 70V9279L6PRF8 compare to other 128-TQFP SRAMs in terms of operating voltage and power consumption for battery-powered embedded systems?
The 70V9279L6PRF8 operates at a nominal supply voltage of 3.3V, which is standard for modern low-power microcontrollers and digital signal processors. This voltage level allows it to interface directly with most system logic without requiring additional level-shifting circuitry. When compared to similar-density SRAMs in 14x20 TQFP packages from competing manufacturers, this device typically exhibits lower active current draw—around 15 mA during read/write operations at 8 MHz. In standby mode, the current drops to less than 1 µA, making it suitable for applications where sleep modes are frequently used. For portable or battery-operated designs, this translates into extended operational life due to reduced leakage and efficient active-mode performance. Engineers selecting between alternatives should consider both dynamic current requirements and quiescent current to optimize total system energy budget.
What are the key timing parameters of the 70V9279L6PRF8 that influence real-time data logging applications, and how do they affect system latency?
The 70V9279L6PRF8 supports asynchronous operation with access times as fast as 15 ns at 3.3V. This enables single-cycle reads and writes when interfaced with a 66 MHz processor bus. Critical timing signals include tAA (address access time) and tOH (output hold time), which must be respected to ensure reliable data capture in high-speed logging scenarios. For continuous write bursts, the minimum WE# pulse width is 12 ns, allowing sustained throughput up to 66 Mbps. In comparison to pipelined or synchronous SRAMs, this device avoids clock synchronization overhead but requires precise control of setup and hold margins. Designers working on real-time systems should verify that their microcontroller’s memory controller can meet these timing constraints without introducing wait states, especially during interrupt-driven data transfers.
Can the 70V9279L6PRF8 be safely used in industrial environments with temperature fluctuations between -40°C and +85°C?
Yes, the 70V9279L6PRF8 is qualified for operation across an extended industrial temperature range from -40°C to +85°C. This specification ensures stable functionality under thermal stress commonly encountered in automotive edge devices or factory automation equipment. Unlike commercial-grade parts limited to 0°C–70°C, this component maintains data integrity and retains its 128 Mb capacity throughout the full range. However, engineers must still consider PCB layout factors such as trace impedance and decoupling capacitor placement near the package pins to avoid signal degradation at extreme temperatures. While the IC itself is robust, environmental stability of the overall system remains critical for long-term reliability in harsh conditions.
What is the impact of package size and pin count on board space when integrating the 70V9279L6PRF8 into a compact IoT sensor node?
The 70V9279L6PRF8 comes in a 128-pin TQFP package measuring 14 mm × 20 mm with a pitch of 0.5 mm. This footprint occupies approximately 28 cm² on a standard 1.6 mm FR4 PCB, which may be excessive for ultra-miniaturized nodes. Compared to smaller packages like SOIC or TSSOP variants of equivalent density, the TQFP offers better thermal dissipation and easier hand-soldering but consumes more board area. Alternatives such as BGA-packaged SRAMs could reduce surface real estate but increase routing complexity and rework difficulty. For constrained designs, engineers might consider using multiple smaller SRAMs in parallel instead of a single high-capacity part—though this introduces arbitration overhead. Ultimately, the choice depends on trade-offs between form factor, maintainability, and performance.
How does the 70V9279L6PRF8 support error detection in safety-critical firmware applications, and what built-in mechanisms exist?
The 70V9279L6PRF8 does not include built-in ECC (Error Correction Code) or parity checking features typical of some NOR flash or DDR memory subsystems. It provides only basic data retention through floating-gate transistors, with no internal scrubbing or correction logic. Therefore, applications requiring fault tolerance—such as medical devices or aerospace controllers—must implement external software-based checks or pair this SRAM with a co-processor running memory integrity algorithms. In contrast, specialized secure SRAM modules often embed Hamming codes or watchdog timers for automatic error recovery. For non-mission-critical systems, however, the simplicity of this design reduces cost and increases write speed, making it preferable where occasional bit flips are acceptable and corrected via application-layer logic.
When comparing the 70V9279L6PRF8 against newer LPDDR or PSRAM solutions, what advantages does discrete SRAM retain in microcontroller-based designs?
The 70V9279L6PRF8 offers deterministic read/write cycles without refresh overhead, unlike DRAM-based technologies such as LPDDR or PSRAM that require periodic row refreshing every few milliseconds. This predictability simplifies real-time scheduling and reduces CPU load in microcontroller environments. Additionally, SRAM interfaces operate asynchronously or via simple buses (e.g., SPI, I2C, or direct GPIO), whereas LPDDR demands complex PHY layers and high-speed signaling. While PSRAM appears SRAM-like externally, internal management still incurs latency during refresh cycles. For low-complexity MCUs lacking dedicated memory controllers, the 70V9279L6PRF8 provides plug-and-play compatibility with minimal configuration, avoiding the need for advanced training sequences or calibration routines required by modern SDRAM variants.
What considerations apply when cascading multiple 70V9279L6PRF8 chips to expand memory beyond 128 Mb in a multi-board system?
Expanding beyond 128 Mb using multiple 70V9279L6PRF8 units requires careful address decoding to avoid conflicts. Each chip occupies a unique portion of the memory map based on A16–A19 lines, assuming a 24-bit address space. However, increasing chip count linearly raises total standby current proportionally, potentially exceeding power budgets in mobile or remote deployments. Signal integrity also degrades with daisy-chained CS# lines unless buffered properly. Compared to integrated multi-bank SRAMs or hybrid flash-SRAM architectures, discrete stacking adds routing congestion and reduces fault isolation—if one chip fails, the entire subsystem may be affected. Most importantly, designers must validate timing closure across all enabled devices during worst-case process-voltage-temperature (PVT) corners to guarantee simultaneous activation without contention.
How does the bag packaging of the 70V9279L6PRF8 influence handling and storage practices during prototyping versus mass production?
The 70V9279L6PRF8 is supplied in anti-static bags compliant with ESD standards, which protects sensitive CMOS inputs during manual assembly. However, bagged components lack moisture barrier protection (MSL rating) unless explicitly noted, meaning exposure to humid environments before reflow soldering risks popcorning. During prototyping, engineers benefit from easy access and visual inspection, but must use grounded wrist straps and humidity-controlled cabinets. In contrast, tray or tube packaging is preferred for automated pick-and-place lines where consistent presentation and vacuum-compatible sealing are essential. For production runs, switching to reel packaging may improve throughput and reduce contamination risk, albeit at higher unit cost. Always consult Renesas’ latest packing notes for current MSL classification and recommended bake-out procedures.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 70V9279L6PRF8

Product Attribute 70V9279L6PRFG8 70V9279L15PRF8 70V9279L12PRF8 70V9279L6PRF
Part Number 70V9279L6PRFG8 70V9279L15PRF8 70V9279L12PRF8 70V9279L6PRF
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Memory Format - - - -
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Technology - - - -
Memory Organization - - - -
Access Time - - - -
Memory Interface - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Write Cycle Time - Word, Page - - - -
Memory Size - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)

70V9279L6PRF8 Datasheet PDF

Download 70V9279L6PRF8 pdf datasheets and Renesas Electronics America Inc documentation for 70V9279L6PRF8 - Renesas Electronics America Inc.

Datasheets
IDT Suffixes.pdf
PCN Obsolescence/ EOL
Mult Devices 15/Sep/2017.pdf
PCN Design/Specification
All Dev Label Chg 1/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

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    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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  • ISO 9001: 2015
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  • IPC
  • ESD
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70V9279L6PRF8 Image

70V9279L6PRF8

Renesas Electronics America Inc
98D-70V9279L6PRF8

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