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HomeProductsIntegrated Circuits (ICs)Memory70V9279L6PRFG8
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70V9279L6PRFG8 - Renesas Electronics America Inc

Manufacturer Part Number
70V9279L6PRFG8
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-70V9279L6PRFG8
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,576 pcs available, New & Original
Parts Description
IC SRAM 512KBIT LVTTL 128TQFP
Package
128-TQFP (14x20)
Data sheet
70V9279L6PRFG8.pdf
RoHs Status
 
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Specifications

70V9279L6PRFG8 Tech Specifications
Renesas Electronics America Inc - 70V9279L6PRFG8 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 70V9279L6PRFG8

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SRAM - Dual Port, Standard
Supplier Device Package 128-TQFP (14x20)
Series -
Package / Case 128-LQFP
Package Tape & Reel (TR)
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 512Kbit
Memory Organization 32K x 16
Memory Interface LVTTL
Memory Format SRAM
Clock Frequency 100 MHz
Base Product Number 70V9279
Access Time 15 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN OBSOLETE

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the 70V9279L6PRFG8 dual-port SRAM that influence timing closure in a high-speed digital system?
The 70V9279L6PRFG8 operates with an access time of 15 ns and supports a maximum clock frequency of 100 MHz, which directly impacts signal propagation delays within a system. With a supply voltage range of 3 V to 3.6 V, designers must ensure stable power delivery to maintain consistent timing margins. The LVTTL interface introduces specific logic threshold requirements that affect setup and hold times relative to other TTL-compatible components. These parameters collectively determine whether the memory can reliably support synchronous operations without requiring additional buffering or clock tree adjustments, particularly in systems where multiple ports operate concurrently.
How does the 70V9279L6PRFG8 compare to the 70V9279L7PRFGI8 in terms of temperature tolerance and industrial applicability?
While both devices share the same core architecture and pinout, the 70V9279L7PRFGI8 is specified for extended industrial temperatures up to +85°C, whereas the 70V9279L6PRFG8 is rated only from 0°C to +70°C. This difference makes the L7 variant more suitable for automotive or outdoor applications where ambient heat may push junction temperatures beyond the L6’s operational envelope. For designs constrained to controlled environments such as consumer electronics or office infrastructure, the L6 version provides sufficient thermal performance at potentially lower cost and tighter lead times.
What layout considerations are critical when routing data and control lines for the 70V9279L6PRFG8 in a dual-port configuration?
In a dual-port SRAM like the 70V9279L6PRFG8, simultaneous read/write operations on either port can induce crosstalk due to shared address and data buses. PCB trace lengths should be matched within ±5 mm to minimize skew, especially for clock and strobe signals. Differential routing or guard traces grounded on both sides help suppress noise between adjacent LVTTL lines. Decoupling capacitors must be placed within 2 mm of each VDD/VSS pin to stabilize transient currents during burst transfers. Given the 128-pin TQFP footprint, layer stacking should prioritize signal integrity over density, often necessitating dedicated top-layer routing with continuous ground planes beneath.
Can the 70V9279L6PRFG8 support asynchronous handshaking protocols outside its synchronous interface specifications?
Yes, but with constraints. Although the 70V9279L6PRFG8 lacks native synchronous handshake pins, external logic can implement asynchronous communication using WE#, OE#, and CS# control lines. However, the 15 ns access time implies that any asynchronous read cycle must accommodate this delay before valid data appears on the bus. Write cycles similarly require attention to setup times relative to WE# assertion. Because the device is not designed for glueless asynchronous operation, additional latching or FIFO staging may be needed to meet system timing budgets, increasing latency compared to synchronous implementations.
Why might a designer choose the 70V9279L6PRFG8 over single-port alternatives despite its higher complexity?
The dual-port nature of the 70V9279L6PRFG8 enables concurrent access from two independent controllers—such as a CPU and DMA engine—without arbitration overhead. This improves throughput in real-time systems like network packet buffers or display frame managers. At 512 Kbit organized as 32K x 16, it offers moderate capacity without the pin count penalties of larger memories. Compared to single-port SRAMs, the trade-off includes slightly higher power consumption and layout complexity, but the benefit of parallelism often justifies these costs in performance-critical embedded designs where deterministic latency outweighs integration effort.
What impact do voltage fluctuations have on the 70V9279L6PRFG8’s reliability during power-up sequences?
The 70V9279L6PRFG8 requires stable operation within 3 V to 3.6 V, meaning undervoltage conditions below 2.7 V could corrupt internal state during initialization. A soft-start circuit or brown-out detection is recommended to prevent partial writes or bus contention. During power-up, the device draws transient current spikes that exceed steady-state levels; adequate bulk capacitance (e.g., 10 µF) near the package minimizes voltage droop. If the system uses dynamic voltage scaling, ramping must stay within spec to avoid triggering unintended resets or memory faults.
How does the obsolete status of the 70V9279L6PRFG8 affect long-term design planning?
As an obsolete part, the 70V9279L6PRFG8 presents risks regarding supply continuity and lifecycle management. Designers must verify that authorized distributors still carry stock or consider migrating to active substitutes like the 70V9279L7PRFGI8. Migration involves validating thermal and timing margins under worst-case conditions, especially if moving from commercial to industrial grade. Documentation updates and qualification records become essential for production releases. Proactive obsolescence planning ensures uninterrupted deployment and avoids last-time-buy bottlenecks.
What role does package parasitics play in signal integrity for the 70V9279L6PRFG8’s LVTTL interface?
The 128-TQFP (14x20) package introduces parasitic inductance and capacitance across bond wires and leads, which elevates effective output impedance and reduces high-frequency drive strength. At 100 MHz, reflections and ringing can distort LVTTL edges unless termination strategies are employed. Input receivers may experience degraded noise margins due to crosstalk coupling through shared substrate paths. Careful PCB routing—short stubs, controlled impedance traces, and minimized via counts—helps mitigate these effects. Simulation models incorporating package parasitics are advisable before finalizing layout.
When interfacing the 70V9279L6PRFG8 with modern microcontrollers lacking dedicated dual-port support, what architectural modifications are necessary?
Since most MCUs lack native dual-port awareness, software-based arbitration becomes necessary. One common approach routes one port through a direct memory interface while the other uses buffered reads/writes via CPU intervention. Alternatively, a small external arbiter IC can manage access conflicts transparently. This adds latency but preserves functionality. Another option is to partition memory space so each controller accesses non-overlapping regions, though this wastes addressable capacity. Trade-offs between hardware simplicity and software overhead depend on real-time requirements.
How does the 15 ns access time of the 70V9279L6PRFG8 constrain processor selection in a co-design scenario?
Processors with instruction fetch latencies exceeding 15 ns may stall waiting for SRAM data, reducing effective bandwidth. Fast microcontrollers capable of issuing memory requests every 10 ns or faster can fully exploit the device’s speed. Slower processors might require prefetching or cache augmentation to hide latency. Additionally, if the MCU uses pipelined bursts, alignment between burst length and SRAM response granularity affects efficiency. Matching the processor’s memory controller timing to the 70V9279L6PRFG8’s 15 ns window ensures optimal utilization without unnecessary wait states.
Are there any known errata or silicon anomalies documented for the 70V9279L6PRFG8 that affect functional safety applications?
No public errata specifically tied to functional safety hazards have been disclosed for the 70V9279L6PRFG8. However, as a standard commercial-grade component operating only up to 70°C, it lacks built-in features required for safety-certified systems—such as error detection and correction (EDAC), lockstep cores, or diagnostic counters. Using it in safety-critical contexts would necessitate external monitoring circuits and redundancy measures. Engineers should consult Renesas’s latest application notes or contact technical support for updated reliability reports before applying the part in certified designs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 70V9279L6PRFG8

Product Attribute 70V9279L6PRF8 70V9279L7PRFGI8 70V9279L6PRFG 70V9279L7PRFG8
Part Number 70V9279L6PRF8 70V9279L7PRFGI8 70V9279L6PRFG 70V9279L7PRFG8
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Base Product Number - DAC34H84 MAX500 ADS62P42
Write Cycle Time - Word, Page - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Format - - - -
Access Time - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply - - - -
Clock Frequency - - - -
Technology - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Interface - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Size - - - -
Memory Organization - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Type - - - -
Series - - - -

70V9279L6PRFG8 Datasheet PDF

Download 70V9279L6PRFG8 pdf datasheets and Renesas Electronics America Inc documentation for 70V9279L6PRFG8 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 19/Jan/2022.pdf Mult Dev EOL 28/Feb/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

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    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
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    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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  • ISO 28000: 2007
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  • IPC
  • ESD
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Renesas Electronics America Inc

70V9279L6PRFG8

Renesas Electronics America Inc
98D-70V9279L6PRFG8

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