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HomeProductsIntegrated Circuits (ICs)Clock/Timing - Programmable Timers and Oscillators8N3Q001EG-1052CDI8
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8N3Q001EG-1052CDI8 - Renesas Electronics America Inc

Manufacturer Part Number
8N3Q001EG-1052CDI8
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-8N3Q001EG-1052CDI8
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
12,449 pcs available, New & Original
Parts Description
IC OSC CLOCK QD FREQ 10CLCC
Package
10-CLCC (7x5)
Data sheet
8N3Q001EG-1052C.pdf

PCN Design/Specification

All Dev Label Chg 1/Dec/2022.pdf
RoHs Status
 
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In stock: 12449

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Specifications

8N3Q001EG-1052CDI8 Tech Specifications
Renesas Electronics America Inc - 8N3Q001EG-1052CDI8 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 8N3Q001EG-1052CDI8

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply 3.135V ~ 3.465V
Type Clock Oscillator
Supplier Device Package 10-CLCC (7x5)
Series FemtoClock® NG
Package / Case 10-CLCC
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Frequency 425MHz, 212.5MHz, 106.25MHz, 159.375MHz
Current - Supply 140 mA
Count -
Base Product Number 8N3Q001

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the 8N3Q001EG-1052CDI8 FemtoClock® NG oscillator support frequency flexibility in high-speed serial link applications, and what are the practical implications for system designers selecting a clock source?
The 8N3Q001EG-1052CDI8 provides four selectable output frequencies—425MHz, 212.5MHz, 106.25MHz, and 159.375MHz—through internal divider logic or external pin configuration, enabling single-device adaptation across different data rates without requiring multiple oscillators. This flexibility reduces board real estate, simplifies inventory management, and supports backward compatibility in multi-protocol systems such as PCIe, USB 3.x, and Ethernet transceivers. However, designers must verify that the chosen frequency aligns with the target interface’s reference clock requirements and that phase noise performance remains within acceptable limits at lower frequencies due to potential harmonic folding effects.
What is the impact of the 8N3Q001EG-1052CDI8’s supply current draw of 140 mA on thermal design and power budgeting in compact embedded systems?
Operating at 140 mA under a 3.3V supply results in approximately 468 mW of dynamic power dissipation, which contributes significantly to total module heat load—especially in densely populated FPGA or ASIC designs where multiple timing devices may be used. In thermally constrained environments such as industrial control units or portable instrumentation, this necessitates careful PCB layout with adequate copper pour, thermal vias, or even heatsinking. System-level power planning should account for steady-state consumption, as intermittent high-frequency switching can exacerbate localized heating if not properly managed through decoupling and grounding strategies.
How do the frequency options of the 8N3Q001EG-1052CDI8 compare in terms of jitter performance and suitability for SerDes-based communication interfaces?
While all four frequencies share the same core PLL architecture and exhibit similar integrated jitter specifications (typically <1 ps RMS), lower frequencies like 106.25 MHz may show marginally improved jitter due to reduced bandwidth demands on the loop filter. Conversely, higher outputs such as 425 MHz stress the VCO and output buffers more heavily, potentially increasing deterministic jitter under varying load conditions. For SerDes applications requiring precise symbol alignment—such as in 10G Ethernet or USB4—the 212.5 MHz or 159.375 MHz options often represent optimal trade-offs between speed and signal integrity, whereas 425 MHz is better suited for internal fabric clocks rather than line-side transmission.
Can the 8N3Q001EG-1052CDI8 be used reliably in automotive-grade environments, and what modifications might be needed for such deployment?
No. The 8N3Q001EG-1052CDI8 is rated only for commercial temperature operation (-40°C to +85°C), which falls short of AEC-Q100 Grade 2 requirements commonly needed for automotive infotainment or ADAS subsystems. Additionally, its RoHS non-compliance raises concerns about lead content, further limiting use in regulated environments. For automotive applications, engineers should consider Renesas’ qualified Q-driver variants with extended temperature ranges and full compliance certifications, even if they involve additional qualification steps and cost premiums.
How does the 10-CLCC package size influence routing density and manufacturability when integrating the 8N3Q001EG-1052CDI8 into high-layer-count PCBs?
With dimensions of 7x5 mm in a 10-pin configuration, the CLCC form factor occupies moderate surface area but benefits from vertical standoff that improves solder joint inspection and reworkability compared to flat packages. Its surface-mount nature allows placement on inner layers using via-in-pad techniques, though care must be taken to avoid via stub resonance near the crystal or feedback traces. The small pitch enables dense routing in multi-channel timing architectures, but designers should maintain guard traces and minimize stub lengths to preserve signal integrity, particularly at frequencies above 200 MHz.
Is it advisable to operate the 8N3Q001EG-1052CDI8 near its maximum specified supply voltage, and what risks does this pose?
Operating near 3.465 V—close to the upper limit of the 3.135–3.465 V range—increases susceptibility to voltage transients and reduces margin against brownout conditions. Given that semiconductor aging and process variations can shift threshold voltages over time, sustained high supply levels may accelerate electromigration or bias temperature instability, especially in high-current scenarios like the 140 mA draw during active oscillation. Designers should implement robust LDO regulation with low dropout and transient response, and include bulk capacitance close to the device to dampen ripple without compromising stability.
How does the absence of an enable/disable pin on the 8N3Q001EG-1052CDI8 affect power-up sequencing in multi-clock systems?
Unlike some fractional-N synthesizers with shutdown modes, the 8N3Q001EG-1052CDI8 lacks explicit power-down control, meaning it draws continuous current once powered. This simplifies initialization logic but requires careful power rail sequencing so that the oscillator starts before dependent circuits expect valid clocks. In systems with mixed-voltage domains or staggered bring-up sequences, failure to sequence correctly can result in metastable states or incorrect reset behavior. Therefore, designers often pair it with a supervisor IC or use external MOSFETs to gate the entire supply, adding minor complexity but improving reliability.
What considerations apply when cascading multiple 8N3Q001EG-1052CDI8 units to generate multiple phase-aligned clocks for parallel data buses?
While each 8N3Q001EG-1052CDI8 operates independently, achieving sub-picosecond skew across multiple instances requires identical PCB layout, matched trace lengths, and synchronized power delivery. Even slight differences in propagation delay or supply droop can introduce timing mismatches unacceptable in DDR memory interfaces or camera sensor pipelines operating above 1 Gbps per lane. Instead of relying solely on separate oscillators, designers are increasingly turning to integrated clock multipliers or fan-out buffers with built-in deskew capabilities, which offer superior phase coherence despite higher component count.
How does the REACH and RoHS status of the 8N3Q001EG-1052CDI8 influence long-term procurement strategy in consumer electronics manufacturing?
Being RoHS non-compliant means the 8N3Q001EG-1052CDI8 cannot be sold into EU markets without exemption documentation, posing regulatory risk for mass-market products. Although REACH status is unaffected, the lack of halogen-free and lead-free certification complicates global supply chain harmonization. Manufacturers targeting international distribution should either qualify a compliant alternative or plan for end-of-life transitions within 12–18 months, factoring in obsolescence risks and potential redesign costs associated with substituting the device.
What role does the Moisture Sensitivity Level (MSL) 1 classification play in handling and storage of the 8N3Q001EG-1052CDI8 prior to assembly?
MSL 1 indicates unlimited floor life at 30°C/60% RH, eliminating the need for baking or dry storage under controlled atmosphere before reflow. This simplifies logistics and reduces handling overhead in high-volume production, particularly beneficial for just-in-time manufacturing lines where inventory turnover is frequent. Nevertheless, standard ESD precautions remain essential due to the sensitive CMOS input stages, and packaging integrity must be maintained to prevent contamination during transport.
In comparison to discrete crystal oscillator solutions, how does the integrated design of the 8N3Q001EG-1052CDI8 improve system-level reliability in mission-critical applications?
Discrete solutions typically combine a resonator, amplifier, and load capacitors across several components, increasing failure points and sensitivity to layout parasitics. The monolithic integration in the 8N3Q001EG-1052CDI8 embeds the crystal, feedback network, and drive circuitry, reducing part count and enhancing immunity to mechanical shock or vibration. Moreover, built-in calibration algorithms compensate for initial frequency drift, yielding better long-term stability (<±10 ppm over temperature) compared to many ceramic resonator-based designs, making it preferable in telecommunications base stations or test equipment where uptime is critical.
How should designers evaluate the suitability of the 8N3Q001EG-1052CDI8 versus a programmable synthesizer for applications requiring fine frequency resolution below 10 MHz?
The 8N3Q001EG-1052CDI8 is optimized for fixed high-frequency outputs and lacks fine-tuning capability below 100 MHz; attempting to derive low frequencies via division introduces quantization noise and degrades spectral purity. Programmable synthesizers, by contrast, allow arbitrary frequency synthesis with fractional-N resolution down to tens of kHz, making them better suited for RF sampling converters or flexible radio platforms. When choosing between the two, engineers must weigh whether coarse, high-speed timing suffices—or if agile frequency generation justifies the added complexity and cost of a dedicated synth.
What are the implications of using the 8N3Q001EG-1052CDI8 in a system with multiple asynchronous clock domains regarding synchronization and metastability?
Since the 8N3Q001EG-1052CDI8 generates a stable reference but does not coordinate transitions across domains, cross-domain signals require explicit synchronization—typically via double-flopping or FIFOs—to prevent metastable states. This adds latency and resource overhead, especially in data-intensive pipelines. Where tight timing correlation matters, designers may prefer a shared clock tree driven by a single master oscillator, avoiding the need for complex handshaking protocols altogether.
How does the choice of output frequency on the 8N3Q001EG-1052CDI8 affect EMI characteristics and compliance testing outcomes?
Higher frequencies such as 425 MHz radiate more aggressively due to shorter wavelength and faster edge rates, increasing susceptibility to FCC Part 15 or CISPR 22 emissions limits. Lower outputs like 106.25 MHz emit less energy but may still violate conducted emission bands if harmonics fall within restricted zones. Effective mitigation includes proper ground plane stitching, filtered power delivery, and minimizing loop areas in clock paths. Pre-compliance testing should model worst-case configurations, including all four frequencies, to identify problematic harmonics early in development.
Can the 8N3Q001EG-1052CDI8 drive multiple loads simultaneously without degrading jitter or introducing phase noise?
Driving more than one high-impedance input typically requires a fan-out buffer, as the output driver in the 8N3Q001EG-1052CDI8 is designed for a single CMOS load. Multiple loads increase capacitive loading, slowing rise/fall times and potentially distorting waveform edges, which manifests as increased jitter and degraded eye diagrams in downstream logic. If multiple destinations are needed, designers should insert a low-jitter buffer near the oscillator or select a variant with differential outputs capable of driving LVDS pairs, preserving signal integrity across distributed nodes.
What steps should be taken to validate the 8N3Q001EG-1052CDI8’s performance under actual operating conditions before finalizing board bring-up?
Beyond datasheet verification, engineers must perform time-domain measurements using high-bandwidth oscilloscopes with proper probing techniques to capture true jitter and rise-time characteristics. Spectral analysis via FFT on a spectrum analyzer helps identify spurs from power supply coupling or nonlinearities. Additionally, thermal cycling tests confirm stability across the full -40°C to +85°C range, while long-duration burn-in ensures no latent defects emerge. Only after these empirical validations can confidence in system robustness be established.
How does the base product number 8N3Q001 relate to other members of the FemtoClock® NG family, and what differentiation exists among variants like the 8N3Q001EG-1052CDI8?
The 8N3Q001 base platform supports a range of output frequencies, supply voltages, and packaging options, with the 8N3Q001EG-1052CDI8 representing a specific configuration featuring dual-edge clocking at 212.5 MHz derived from a 425 MHz fundamental. Other variants may offer lower power, different package styles (e.g., SOIC), or extended temperature grades. Understanding the full matrix helps avoid misapplication and enables migration paths for future design updates without major layout changes.
What are the key trade-offs involved in selecting the 8N3Q001EG-1052CDI8 versus a MEMS-based oscillator for high-reliability industrial automation equipment?
MEMS oscillators generally offer superior shock/vibration resistance and broader temperature range, making them ideal for harsh environments. However, they often consume more power and exhibit slightly higher phase noise, which can limit performance in precision timing chains. The 8N3Q001EG-1052CDI8 trades ruggedness for lower jitter and tighter frequency tolerance, benefiting applications where signal integrity outweighs mechanical stress concerns. Choosing between them depends on whether the environment demands resilience (favoring MEMS) or spectral purity (favoring this quartz-based solution).

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 8N3Q001EG-1052CDI8

Product Attribute 8N3Q001EG-1053CDI8 8N3Q001EG-105LCDI8 8N3Q001EG-1054CDI8 8N3Q001EG-1045CDI8
Part Number 8N3Q001EG-1053CDI8 8N3Q001EG-105LCDI8 8N3Q001EG-1054CDI8 8N3Q001EG-1045CDI8
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Frequency - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Supply - - - -
Type - - - -
Count - - - -
Series - - - -

8N3Q001EG-1052CDI8 Datasheet PDF

Download 8N3Q001EG-1052CDI8 pdf datasheets and Renesas Electronics America Inc documentation for 8N3Q001EG-1052CDI8 - Renesas Electronics America Inc.

Datasheets
FemtoClock® NG Ordering Guide.pdf
PCN Design/Specification
All Dev Label Chg 1/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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8N3Q001EG-1052CDI8 Image

8N3Q001EG-1052CDI8

Renesas Electronics America Inc
98D-8N3Q001EG-1052CDI8

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