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HomeProductsIntegrated Circuits (ICs)Interface - Drivers, Receivers, TransceiversISL1533AIRZ-T13
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ISL1533AIRZ-T13 - Renesas Electronics America Inc

Manufacturer Part Number
ISL1533AIRZ-T13
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
32D-ISL1533AIRZ-T13
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,200 pcs available, New & Original
Parts Description
IC DRIVER 2/0 24QFN
Package
24-QFN (4x5)
Data sheet
ISL1533AIRZ-T13.pdf

PCN Assembly/Origin

Mult Changes 21/May/2021.pdf

PCN Obsolescence/ EOL

Mult Dev EOL 25/Jun/2021.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 6200
  • Unit Price: $1.546
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.546 $1.55
200+ $0.598 $119.60
500+ $0.577 $288.50
1000+ $0.567 $567.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ISL1533AIRZ-T13 Tech Specifications
Renesas Electronics America Inc - ISL1533AIRZ-T13 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - ISL1533AIRZ-T13

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply ±5V ~ 15V
Type Driver
Supplier Device Package 24-QFN (4x5)
Series -
Package / Case 24-VFQFN Exposed Pad
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C
Number of Drivers/Receivers 2/0
Mounting Type Surface Mount
Duplex -
Data Rate -
Base Product Number ISL1533

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE

Parts Introduction

Manufacturer Part Number

ISL1533AIRZ-T13

Manufacturer

Renesas Electronics America

Introduction

The ISL1533AIRZ-T13 is a dual differential line driver from Renesas Electronics America. It is designed to provide high-speed, low-power, and robust RS-485/RS-422 compatible interface capabilities for a variety of industrial, medical, and transportation applications.

Product Features and Performance

Dual differential line driver

Supports RS-485/RS-422 interfaces

High-speed operation up to 20Mbps

Low power consumption

Robust design with high ESD protection

Wide operating voltage range of ±5V to ±15V

Wide operating temperature range of -40°C to 85°C

Surface mount 24-VFQFN exposed pad package

Product Advantages

Excellent noise immunity and low electromagnetic interference (EMI)

Stable and reliable performance in harsh environments

Flexible voltage operation for diverse application scenarios

Compact surface mount package for space-constrained designs

Key Reasons to Choose This Product

High-speed, low-power, and robust RS-485/RS-422 interface solution

Proven reliability and performance in industrial, medical, and transportation applications

Comprehensive protection features for operation in demanding environments

Flexible voltage and temperature range to meet various system requirements

Quality and Safety Features

Designed and manufactured to high-quality standards

Robust ESD protection up to ±15kV

Overcurrent and short-circuit protection

Compatibility

The ISL1533AIRZ-T13 is compatible with RS-485/RS-422 standards and can be used in various industrial, medical, and transportation applications.

Application Areas

Industrial automation and control systems

Medical equipment and instrumentation

Transportation systems (e.g., railways, avionics)

Building automation and security systems

Data acquisition and control networks

Product Lifecycle

The ISL1533AIRZ-T13 is an obsolete product, meaning it is no longer in active production. However, there may be alternative or equivalent models available from Renesas Electronics America or other manufacturers. Customers are advised to contact our website's sales team for more information on available options and product lifecycle status.

Frequently Asked Questions(FAQ)

How does the ISL1533AIRZ-T13 perform in high-temperature industrial environments, and what thermal considerations should be factored into a 24-QFN (4x5) layout design?
The ISL1533AIRZ-T13 is rated for operation from -40°C to +85°C, making it suitable for many industrial control and automation systems where ambient temperatures may exceed typical consumer electronics thresholds. However, at sustained upper temperature limits, the device’s propagation delay and rise/fall times can increase slightly due to reduced carrier mobility in the semiconductor substrate. For optimal performance in thermally demanding applications, ensure adequate copper pour on the exposed pad of the 24-VFQFN package to facilitate heat dissipation. A minimum of four thermal vias under the die attach pad connected to an internal ground plane is recommended to maintain junction temperatures below 125°C under continuous load. Thermal simulation using tools like ANSYS Icepak or similar can help validate PCB-level heat distribution when integrating this driver into dense multi-layer designs.
What are the key differences between using the ISL1533AIRZ-T13 and alternative dual-output drivers such as the ISL1533IRZ-T13, particularly regarding pin compatibility and manufacturing traceability?
Both the ISL1533AIRZ-T13 and ISL1533IRZ-T13 share identical electrical characteristics and pinout configurations within the same 24-QFN (4x5) package, with the primary distinction being the tape-and-reel packaging format—RZ denotes reel packaging while IRZ indicates cut tape. From a design perspective, there is no functional difference; however, supply chain logistics vary: RZ units are typically ordered in full reels for automated pick-and-place assembly, whereas IRZ may be available in smaller quantities or sample kits. Engineers selecting between them should consult distributor inventory levels rather than circuit behavior. Neither variant offers enhanced performance metrics over the other, so component choice hinges on procurement workflow rather than technical capability.
When interfacing the ISL1533AIRZ-T13 with a microcontroller, how does its ±5V to ±15V supply range influence logic level translation requirements compared to single-supply LVCMOS drivers?
Unlike single-supply LVCMOS drivers that operate strictly within 1.8V–3.3V or 5V domains, the ISL1533AIRZ-T13 uses a split supply architecture (±5V to ±15V), which means its input thresholds are referenced to the negative rail (e.g., -5V). This necessitates careful level shifting when driven by a 3.3V or 5V MCU GPIO. For instance, a 3.3V logic high may not reliably meet the minimum input high threshold if the negative supply is only -5V, depending on the exact threshold voltage specification (~0.7 × V+CC). Therefore, designers must either use a dedicated level translator (such as a bidirectional shifter) or ensure the positive supply exceeds 4.3V to accommodate standard TTL-compatible inputs. This design consideration becomes critical in mixed-voltage systems where signal integrity across domain boundaries is paramount.
In a space-constrained embedded system using surface-mount components, what are the advantages of the ISL1533AIRZ-T13’s 24-QFN (4x5) footprint compared to larger SOIC-packaged alternatives?
The ISL1533AIRZ-T13 occupies significantly less board real estate than traditional dual-channel drivers in SOIC-8 or SOIC-16 packages due to its 4x5 mm QFN profile. For example, a SOIC-16 measures approximately 10.3x7.5 mm, resulting in nearly double the area usage. The compact form factor enables higher channel density per square centimeter, which benefits portable instrumentation, wearable devices, and modular I/O boards. Additionally, the exposed thermal pad allows efficient heat sinking without increasing package height, preserving stack-up compatibility in thin-profile systems. While solder joint reliability under vibration remains a concern with fine-pitch QFNs, proper reflow profiling and conformal coating can mitigate risks in industrial-grade deployments.
Can the ISL1533AIRZ-T13 drive capacitive loads exceeding 100 nF without external buffering, and what impact would this have on rise time and stability?
The ISL1533AIRZ-T13 is designed primarily for driving low-capacitive loads typical of RS-485 transceivers or short-length differential signaling lines. Driving loads greater than 100 nF may cause excessive shoot-through current during switching transitions due to limited slew-rate control and internal output impedance. This can result in degraded rise/fall times—potentially exceeding 10 µs even under nominal ±12V supplies—and increased power dissipation. Furthermore, large capacitive loads may interact with parasitic inductance in traces or connectors to create ringing or overshoot, especially near the 85°C upper operating limit where transistor beta decreases slightly. If driving heavy capacitive loads is unavoidable, consider adding a series resistor (typically 120–220 Ω) at the output stage to dampen oscillations and improve transient response.
How does the ISL1533AIRZ-T13 compare to the MAX3490 in terms of output current capability and power efficiency when driving multiple RS-485 nodes simultaneously?
The ISL1533AIRZ-T13 delivers peak output currents of approximately ±120 mA per channel under ±12V supplies, enabling robust drive strength for up to 32 unit loads in RS-485 networks. In contrast, the MAX3490 provides ±60 mA output swing, limiting its fan-out capacity unless used with external line drivers. While both devices support full-duplex communication, the ISL1533AIRZ-T13 exhibits lower quiescent current (typically 3 mA vs. MAX3490’s 5 mA) and better short-circuit protection, reducing standby power consumption in battery-operated edge devices. However, the MAX3490 integrates termination resistors and failsafe biasing, simplifying layout—features absent in the ISL1533AIRZ-T13. Thus, selection depends on whether integration density or maximum bus robustness is prioritized.
What precautions should be taken when routing signals adjacent to the ISL1533AIRZ-T13 in a noisy industrial environment to prevent crosstalk-induced false triggering?
To minimize crosstalk between the two differential outputs of the ISL1533AIRZ-T13, maintain strict length matching (< ±50 µm) and keep adjacent signal lines separated by at least three times the trace width. Ground planes beneath the 24-QFN package should remain unbroken to shield sensitive input pins from radiated EMI. Avoid placing high-speed digital traces parallel to the driver outputs for more than 5 mm, as coupling through parasitic capacitance could induce glitches on the A/B lines. Ferrite beads on power rails feeding the ISL1533AIRZ-T13 help suppress conducted noise, but decoupling capacitors (0.1 µF ceramic + 10 µF tantalum) must be placed within 2 mm of the VCC/GND pins to maintain PSRR above 40 dB at 100 kHz. These practices collectively reduce susceptibility to common-mode transients common in motor control and lighting applications.
Is the ISL1533AIRZ-T13 suitable for automotive-grade EMC testing given its commercial-grade Moisture Sensitivity Level (MSL) rating of 3?
No, the ISL1533AIRZ-T13 carries an MSL 3 rating, indicating it requires storage below 60°C/60% RH and assembly within 168 hours of exposure, which aligns with JEDEC J-STD-020 standards but falls short of AEC-Q100 qualification requirements. Automotive systems often mandate AEC-Q100 Grade 2 compliance (-40°C to +105°C) along with stricter ESD immunity (HBM > ±4 kV). While the device may pass basic ISO 11452-2 bulk current injection tests in controlled lab settings, long-term reliability under thermal cycling and humidity exposure cannot be guaranteed. For safety-critical automotive interfaces, engineers should select parts specifically validated to AEC-Q100, even if initial prototypes use the ISL1533AIRZ-T13 for functional verification.
How does the ISL1533AIRZ-T13 handle undervoltage conditions on its dual power rails, and what protection mechanisms prevent latch-up during hot-plug events?
The ISL1533AIRZ-T13 lacks built-in UVLO (Undervoltage Lockout) circuitry, meaning it will begin operating as soon as both supply rails exceed their absolute minimum thresholds (±4.5V). If one rail drops significantly faster than the other—such as during asymmetric hot-plug insertion—the resulting voltage imbalance can stress input staging transistors and trigger parasitic thyristor action (latch-up). To mitigate this, add series resistors (10–50 Ω) on each supply line and include bulk capacitance with soft-start behavior (e.g., NTC thermistors or active PFC circuits). Additionally, place TVS diodes rated for ±15V clamping voltage across V+/GND and V−/GND to absorb inductive kickback from disconnected cables. These measures enhance robustness in field-deployed systems where plug/unplug cycles occur frequently.
What role does the base product number ISL1533 play in firmware development when debugging communication faults involving the ISL1533AIRZ-T13?
Although the base product number ISL1533 encompasses all package and packaging variants (including DIP, SOIC, and QFN), firmware intended for the ISL1533AIRZ-T13 must still account for timing margins dictated by propagation delays specific to the 24-QFN version. For example, the tPLH/tPHL values listed in the datasheet assume optimal PCB parasitics; mismatched trace lengths beyond 10 cm can introduce skew that violates UART or SPI setup/hold windows. Developers should reference the ISL1533AIRZ-T13’s detailed timing diagram rather than relying solely on generic ISL1533 specifications. Debugging tools like logic analyzers should timestamp transitions relative to the driver enable signal to isolate whether errors originate in the host controller or the physical layer implementation.
Why might the ISL1533AIRZ-T13 exhibit intermittent data corruption at data rates approaching 2.5 Mbps despite meeting published timing specifications?
At high data rates, signal integrity issues dominate over electrical parameters alone. Even minor impedance mismatches in the differential pair routed alongside the ISL1533AIRZ-T13 can cause reflections that corrupt bits during fast edge transitions. The driver’s finite output impedance (~50–100 Ω) interacts poorly with uncontrolled trace impedances unless matched with termination resistors at both ends. Additionally, simultaneous switching noise (SSN) from adjacent digital ICs can couple onto the supply rails, modulating the ISL1533AIRZ-T13’s internal bias points and causing jitter. Implementing a star-ground configuration and using guard traces with stitching vias reduces ground bounce. Empirical validation via eye diagrams is essential when pushing toward the upper data rate boundary defined in the datasheet.
Does the ISL1533AIRZ-T13 support bidirectional communication without external direction control logic, and how does this affect duplex operation in half-duplex RS-485 networks?
No, the ISL1533AIRZ-T13 is a unidirectional driver/receiver pair configured as two transmitters and zero receivers (2/0), meaning it cannot automatically switch direction. In half-duplex applications, an additional transceiver (like the ISL83485) must manage DE/RE pins to toggle transmit/receive modes. Attempting to use only the ISL1533AIRZ-T13 without external direction control results in bus contention during bidirectional traffic, leading to signal degradation or hardware damage. Therefore, while the device excels in point-to-point full-duplex links, it requires supplemental logic for multipoint half-duplex topologies common in Modbus RTU implementations.
What are the implications of using the ISL1533AIRZ-T13 in a battery-powered sensor node where minimizing quiescent current is critical?
The ISL1533AIRZ-T13 draws approximately 3 mA of quiescent current per channel when enabled, which may be acceptable for periodic wake-up sensors sampling every few seconds. However, in duty-cycled applications where the driver spends most of its time idle, leaving it powered continuously wastes energy. Instead, implement a sleep mode by disabling the chip via the EN pin and relying on a separate low-power receiver (e.g., MAX3485) to monitor the bus. Alternatively, use MOSFET switches on the ±VCC rails to completely disconnect power during inactive periods, reducing leakage further. This approach extends battery life significantly compared to always-on configurations.
How does the absence of integrated termination resistors in the ISL1533AIRZ-T13 impact network topology choices compared to self-terminating transceivers?
Because the ISL1533AIRZ-T13 lacks built-in 120 Ω termination, designers must explicitly add termination networks at both ends of the RS-485 bus. This increases BOM count and board complexity but offers flexibility in bus length and stub routing—critical for modular systems where end-of-line placement isn’t fixed. Self-terminating transceivers simplify layout but fix impedance matching, limiting adaptability to variable cable lengths. In long-bus deployments (>1 km), proper termination prevents reflections that distort waveforms; in short stubbed topologies, mismatched terminations can attenuate signals unnecessarily. Thus, omitting internal resistors trades convenience for configurability, aligning with scalable industrial architectures.
What ESD protection level can be expected from the ISL1533AIRZ-T13 during human-body model (HBM) testing, and how should this inform enclosure grounding strategies?
According to Renesas test data, the ISL1533AIRZ-T13 typically withstands HBM ESD events up to ±4 kV at input pins and ±2 kV at output pins. While sufficient for most non-contact industrial environments, contact discharges exceeding these levels can permanently damage the input staging circuitry. Enclosures should provide low-impedance paths to earth ground, and RJ45 or DB9 connectors must incorporate shielded shells tied directly to chassis ground. Adding transient voltage suppressors (TVS) rated for ±8 kV HBM at signal entry points provides an additional layer of defense, especially in facilities with frequent static discharge hazards like cleanrooms or dry climates.
Can the ISL1533AIRZ-T13 interface directly with LVPECL or CML logic families without level-shifting circuitry?
No, LVPECL and CML outputs swing between 0.8V–2.2V (differential) and require 3.3V or 5V supplies, whereas the ISL1533AIRZ-T13 expects negative-going differential inputs referenced to -5V or lower. Direct connection causes incorrect logic interpretation and potential DC bias issues. A resistor-divider network or specialized translator (e.g., Texas Instruments SN74LVC1T45) is required to shift voltage levels and adjust common-mode voltages appropriately. Moreover, LVPECL/CML sources typically source/sink tens of mA, which may overload the ISL1533AIRZ-T13’s input stages if not buffered. Always verify input current limits and ensure signal compatibility before connecting heterogeneous logic families.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc ISL1533AIRZ-T13

Product Attribute ISL1535AIVEZ-T13 ISL1533AIRZ ISL1532AIRZ ISL1533IVEZ
Part Number ISL1535AIVEZ-T13 ISL1533AIRZ ISL1532AIRZ ISL1533IVEZ
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Intersil Intersil
Duplex - - - -
Data Rate - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Drivers/Receivers - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Voltage - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Type - - - -

ISL1533AIRZ-T13 Datasheet PDF

Download ISL1533AIRZ-T13 pdf datasheets and Renesas Electronics America Inc documentation for ISL1533AIRZ-T13 - Renesas Electronics America Inc.

PCN Packaging
Label Change-All Devices 01/Dec/2022.pdf
PCN Assembly/Origin
Mult Changes 21/May/2021.pdf
PCN Obsolescence/ EOL
Mult Dev EOL 25/Jun/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Renesas Electronics America Inc

ISL1533AIRZ-T13

Renesas Electronics America Inc
32D-ISL1533AIRZ-T13

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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