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HomeProductsIntegrated Circuits (ICs)Linear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsM5224P
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M5224P - Renesas Electronics America Inc

Manufacturer Part Number
M5224P
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
32D-M5224P
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
67,990 pcs available, New & Original
Parts Description
IC OPAMP GP 4 CIRCUIT 8DIP
Package
8-PDIP
Data sheet
-
RoHs Status
 
Compare
Our certification
In stock: 67990
  • Unit Price: $0.50
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $0.50 $0.50
200+ $0.194 $38.80
500+ $0.186 $93.00
1000+ $0.183 $183.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

M5224P Tech Specifications
Renesas Electronics America Inc - M5224P technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - M5224P

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Voltage - Supply Span (Min) 36 V
Voltage - Supply Span (Max) 36 V
Supplier Device Package 8-PDIP
Slew Rate -
Series -
Package / Case 8-DIP (0.300", 7.62mm)
Product Attribute Attribute Value
Package Bulk
Output Type -
Operating Temperature -
Number of Circuits 4
Mounting Type Through Hole
Current - Supply -
Amplifier Type General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99

Frequently Asked Questions(FAQ)

What are the key design considerations when selecting the M5224P for a high-precision signal conditioning circuit in an industrial sensor interface?
The M5224P, a general-purpose quad op-amp in a 14-PDIP package, requires careful attention to supply voltage stability and thermal management due to its fixed ±18 V supply span (36 V total). With no specified slew rate or bandwidth in the datasheet, designers must empirically validate dynamic response for time-critical conditioning. Its through-hole mounting supports robust mechanical integration in harsh environments, but trace layout should minimize parasitic capacitance at inputs to avoid oscillation, especially given the lack of internal frequency compensation details. The MSL 3 rating indicates a 168-hour floor life after moisture exposure, necessitating controlled handling in high-humidity assembly areas.
How does the M5224P compare to modern low-power quad op-amps like the MCP6004 in terms of power efficiency and noise performance for battery-powered instrumentation?
Unlike the MCP6004, which operates down to 1.8 V and consumes microamperes of supply current, the M5224P demands a rigid 36 V supply span and lacks published quiescent current data—making it unsuitable for low-power applications. Its general-purpose architecture suggests higher intrinsic noise and offset drift compared to precision CMOS alternatives. For battery-powered systems, the M5224P’s fixed high-voltage requirement and undefined current draw present significant efficiency drawbacks, despite potential advantages in output drive under high-voltage rails.
Can the M5224P be used in a single-supply configuration, and what biasing challenges might arise?
While the M5224P is specified for a ±18 V dual supply (36 V span), it can be adapted to single-supply operation with a virtual ground at half the rail. However, input common-mode range and output swing limitations—not detailed in available specs—require validation to ensure linear operation near ground. Without rail-to-rail input or output capability, signal headroom is constrained, and DC biasing must be carefully designed to avoid saturation, particularly in AC-coupled stages where coupling capacitors may introduce offset drift.
What are the thermal implications of operating all four amplifiers in the M5224P at maximum rated supply voltage in a confined enclosure?
The M5224P’s 14-PDIP package has limited thermal dissipation due to its through-hole construction and lack of an exposed pad. Running all four circuits at ±18 V with moderate loads can lead to significant internal power dissipation, especially if output stages drive low-impedance loads. Without published thermal resistance (θJA) or maximum junction temperature data, thermal runaway risk increases in poorly ventilated enclosures. Designers should derate supply voltage or implement external heat sinking if ambient temperatures exceed 50°C.
How does the M5224P’s lack of RoHS compliance affect its use in new product designs targeting European or North American markets?
The M5224P is marked as “Not applicable” under RoHS, indicating it contains restricted substances such as lead in solder or packaging materials. This limits its use in new designs requiring full RoHS compliance, particularly in consumer electronics or products destined for the EU. While industrial or legacy systems may still permit its use under exemptions, lifecycle planning must account for potential obsolescence or redesign costs if regulatory standards tighten.
What input protection strategies are recommended when using the M5224P in environments with high EMI or transient voltage risks?
The M5224P’s general-purpose input stage lacks built-in ESD or overvoltage protection. In high-EMI environments, series current-limiting resistors (1–10 kΩ) combined with clamping diodes to the supply rails are advisable to protect inputs from transients. Additionally, low-pass RC filtering at each input reduces high-frequency noise coupling. Since the device is not specified for latch-up immunity, care must be taken to avoid input voltages exceeding the supply rails, which could damage internal junctions.
How does the M5224P perform in a high-gain audio preamplifier application compared to audio-optimized op-amps like the NE5532?
The M5224P lacks published THD, noise density, or slew rate specifications critical for audio performance evaluation. In contrast, the NE5532 offers 0.002% THD and 9 V/μs slew rate, making it better suited for high-fidelity preamps. The M5224P’s undefined dynamic behavior may introduce audible distortion or bandwidth limitations above 20 kHz. While usable in non-critical voice-band applications, it is not recommended for high-SNR audio chains without extensive bench validation.
What layout practices are essential to minimize crosstalk between the four amplifiers in the M5224P when used in a multiplexed data acquisition system?
In the 14-PDIP package, adjacent pins for different op-amp channels increase susceptibility to capacitive and inductive coupling. To reduce crosstalk, separate analog ground returns for each amplifier should be routed to a single star point, and high-impedance nodes must be shielded with guard traces tied to ground. Power supply decoupling with 100 nF ceramic capacitors placed within 5 mm of each supply pin minimizes shared impedance coupling. Avoid routing high-level output traces parallel to sensitive inputs.
Is the M5224P suitable for use in automotive under-hood applications, and what environmental derating should be applied?
The M5224P lacks AEC-Q100 qualification and has no published operating temperature range, making it unsuitable for direct automotive under-hood deployment. Even if functional at elevated temperatures, the MSL 3 rating and undefined thermal characteristics increase failure risk under thermal cycling. For automotive use, qualified alternatives with extended temperature ranges and shock/vibration testing should be selected instead.
How should the M5224P be handled during rework or field replacement given its moisture sensitivity and through-hole package?
As an MSL 3 device, the M5224P must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 168 hours. During rework, prolonged heat exposure from soldering irons can degrade internal bonds; use temperature-controlled irons below 350°C with minimal dwell time. The 14-PDIP package is mechanically robust but prone to socket wear—consider using low-insertion-force sockets or direct soldering to avoid contact resistance issues in high-reliability systems.
What are the implications of the M5224P’s undefined supply current for system-level power budgeting in multi-channel measurement systems?
Without published supply current specifications, estimating total power consumption for systems using multiple M5224P devices is speculative. Empirical measurement under expected load conditions is necessary. In a 16-channel system using four M5224P chips, unanticipated quiescent current could lead to thermal hotspots or exceed regulator capacity. Designers should provision a 20–30% margin in power supply headroom and monitor thermal performance during prototype testing.
Can the M5224P be safely paralleled to increase output drive capability, and what stability concerns arise?
Paralleling the M5224P’s outputs is not recommended due to lack of current-sharing specifications and undefined output impedance matching. Minor variations in offset voltage or internal resistance can cause unequal current distribution, leading to thermal imbalance and potential device failure. If higher drive is needed, use a dedicated buffer stage instead. The absence of short-circuit protection further increases risk under fault conditions.
How does the M5224P’s through-hole packaging impact high-frequency performance in precision filter designs?
The 14-PDIP package introduces lead inductance (approximately 10–15 nH per pin), which degrades high-frequency response above 1 MHz. In active filter topologies, this can cause peaking, reduced phase margin, or unintended oscillation. For filters operating beyond 100 kHz, surface-mount alternatives with lower parasitics are preferable. If using the M5224P, minimize lead lengths and use ground planes beneath the package to reduce loop inductance.
What verification steps are necessary before committing the M5224P to a production design with no published reliability data?
Given the absence of MTBF, HTOL, or ESD ratings, designers must conduct in-house qualification including thermal cycling (-40°C to +85°C), powered burn-in at maximum supply voltage, and input overstress testing. Monitor offset voltage drift and supply current over time to detect parametric degradation. Cross-reference with Renesas’ broader op-amp reliability reports if available, and consider second-source evaluation to mitigate supply chain risk.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc M5224P

Product Attribute M5224P M5223FP#DG1J M5223AL#TF0Z M5223AP
Part Number M5224P M5223FP#DG1J M5223AL#TF0Z M5223AP
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics Corporation
Operating Temperature - -20°C ~ 75°C (TA) - -
Amplifier Type General Purpose General Purpose - -
Package Bulk Bulk Bulk -
Output Type - - - -
Current - Supply - 700µA - -
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.173", 4.40mm Width) - -
Voltage - Supply Span (Min) 36 V 36 V - -
Mounting Type Through Hole Surface Mount - -
Supplier Device Package 8-PDIP 8-SOP - -
Slew Rate - 0.6V/µs - -
Number of Circuits 4 2 - -
Voltage - Supply Span (Max) 36 V 36 V - -
Series - - * -

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
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  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Renesas Electronics America Inc

M5224P

Renesas Electronics America Inc
32D-M5224P

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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