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HomeProductsCircuit ProtectionTVS - DiodesESDALC14-1BF4
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ESDALC14-1BF4 - STMicroelectronics

Manufacturer Part Number
ESDALC14-1BF4
Manufacturer
STMicroelectronics
Allelco Part Number
32D-ESDALC14-1BF4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
403,850 pcs available, New & Original
Parts Description
TVS DIODE 5VWM 18VC 0201
Package
0201
Data sheet
ESDALC14-1BF4.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 403850
  • Unit Price: $0.069
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
5+ $0.069 $0.35
50+ $0.067 $3.35
150+ $0.066 $9.90
500+ $0.065 $32.50
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ESDALC14-1BF4 Tech Specifications
STMicroelectronics - ESDALC14-1BF4 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - ESDALC14-1BF4

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Reverse Standoff (Typ) 5V
Voltage - Clamping (Max) @ Ipp 18V (Typ)
Voltage - Breakdown (Min) 13V
Type Zener
Supplier Device Package 0201
Series ESDA
Power Line Protection No
Power - Peak Pulse 100W
Product Attribute Attribute Value
Package / Case 0201 (0603 Metric)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Current - Peak Pulse (10/1000µs) 5A (8/20µs)
Capacitance @ Frequency 22pF @ 1MHz
Bidirectional Channels 1
Base Product Number ESDALC14
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0080

Parts Introduction

ESDALC14-1BF4 Image
ESDALC14-1BF4 (1)

Manufacturer Part Number

ESDALC14-1BF4

Manufacturer

stmicroelectronics

Introduction

The ESDALC14-1BF4 is a Zener TVS Diode designed for transient voltage suppression, housed in a 0201 package for surface mount applications.

Product Features and Performance

Type: Zener TVS Diode

Bidirectional Channels: 1

Voltage Reverse Standoff (Typ): 5V

Voltage Breakdown (Min): 13V

Voltage Clamping (Max) @ Ipp: 18V

Current Peak Pulse (10/1000µs): 5A

Power Peak Pulse: 100W

Capacitance @ Frequency: 22pF @ 1MHz

Operating Temperature: -40°C ~ 150°C

Mounting Type: Surface Mount

Product Advantages

Enhanced protection against voltage transients

High current handling capability

Minimal capacitance enabling high-speed signal integrity

Compact package suitable for space-constrained applications

Key Technical Parameters

Type: Zener

Clamping Voltage: 18V

Peak Pulse Current: 5A

Peak Pulse Power: 100W

Quality and Safety Features

Ensures device and circuit safety during voltage spikes

Robust operating temperature range enhancing reliability

Compatibility

Compatible with general-purpose applications on various electronic circuits

Ideal for integration in surface mount technology (SMT)

Application Areas

General purpose electronics

Consumer electronics

Telecommunications

Networking devices

Product Lifecycle

Current product status: Active

Continues to be manufactured and supported with no near-term discontinuation

Several Key Reasons to Choose This Product

Highly reliable transient voltage protection

Ensures consistent performance over a wide temperature range

Low capacitance aiding high-frequency operation

Ultra-compact package for easy SMT integration

Frequently Asked Questions(FAQ)

What is the peak pulse power rating of the ESDALC14-1BF4 TVS diode, and how does it influence protection design in low-voltage digital lines?
The ESDALC14-1BF4 has a peak pulse power rating of 100W, which corresponds to its ability to absorb energy during an electrostatic discharge (ESD) event. This specification assumes compliance with IEC 61000-4-2 Level 4 testing and is based on a standardized 8/20µs waveform. In practical terms, this means the device can safely handle transient currents up to approximately 5A without degradation when clamping voltage remains below 18V. For high-speed signal lines such as USB or HDMI, where ESD threats are significant, this power rating ensures robust protection even in compact PCB designs where component spacing is limited. Engineers must ensure that source impedance and trace inductance do not elevate voltage beyond the 18V clamp threshold under fault conditions.
How does the breakdown voltage of 13V minimum compare to the reverse standoff voltage of 5V for the ESDALC14-1BF4, and what implications does this have for system-level protection strategy?
The ESDALC14-1BF4 features a reverse standoff voltage of 5V, meaning it is designed to operate safely in circuits powered at 5V logic levels without conducting under normal conditions. Its breakdown voltage minimum of 13V indicates the point at which internal avalanche mechanisms begin to activate under sustained overvoltage. This separation ensures that normal operating voltages remain well below the trigger threshold, preserving signal integrity and minimizing leakage current. However, it also implies that sub-breakdown transients—such as fast ESD pulses—are handled through junction capacitance rather than active clamping until sufficient energy accumulates. Therefore, while the device protects against ESD events, designers must still consider series resistance or filtering if noise near 13V could occur due to external interference.
Can the ESDALC14-1BF4 be used interchangeably with other devices in the ESDALC14 series, particularly in space-constrained applications requiring 0201 footprint compatibility?
While the ESDALC14-1BF4 shares the same package size (0201) and base product architecture as other members of the ESDALC14 series, direct interchangeability depends on electrical parameters such as clamping voltage, capacitance, and channel configuration. For example, variants may offer different breakdown or clamping characteristics tailored to specific interface standards like CAN bus, audio jacks, or RF connectors. The ESDALC14-1BF4 provides 18V typical clamping at 5A peak pulse current and 22pF capacitance, making it suitable for general-purpose 5V systems but potentially unsuitable for ultra-high-speed interfaces where lower capacitance (<5pF) is required. Therefore, substitution should only occur after verifying all key performance metrics align with the target application’s requirements.
What is the maximum allowable junction temperature for the ESDALC14-1BF4, and how does thermal behavior impact long-term reliability in dense PCBs?
The ESDALC14-1BF4 is rated for a maximum junction temperature (TJ) of 150°C. During normal operation, the device experiences minimal self-heating due to low steady-state current draw, but repeated ESD events can cause localized heating depending on ambient conditions and PCB layout. Since the package is surface-mount 0201, thermal mass is small, and heat dissipation relies heavily on copper pad area and layer stackup. In densely populated boards with adjacent components generating heat, cumulative thermal effects may approach limits during sustained surge scenarios. Although individual ESD pulses last microseconds, cumulative exposure over time can stress the silicon interface layers. Thus, while single-event robustness is excellent, system-level thermal modeling becomes important in environments with frequent transient activity or elevated ambient temperatures above 85°C.
How does the capacitance of 22pF at 1MHz affect signal integrity in high-speed data transmission paths using the ESDALC14-1BF4?
The ESDALC14-1BF4 exhibits 22pF capacitance at 1MHz, which introduces minor capacitive loading into high-impedance nodes or differential pairs. While this value appears modest, it can become significant at frequencies approaching 100MHz–1GHz, especially in LVDS, MIPI, or Gigabit Ethernet interfaces where impedance matching and rise times are tightly controlled. For instance, a 22pF load on a 50Ω line increases propagation delay by roughly 0.7 nanoseconds per meter, potentially violating timing budgets in synchronous serial links. In contrast, lower-capacitance alternatives (e.g., <5pF) are preferred for RF or precision analog paths. The ESDALC14-1BF4 strikes a balance between ESD robustness and moderate-speed digital signaling, making it appropriate for USB 2.0 or GPIO protection but suboptimal for PCIe Gen4 or 5G front-end modules.
Is the ESDALC14-1BF4 suitable for automotive applications requiring AEC-Q101 qualification?
The ESDALC14-1BF4 is not inherently qualified to AEC-Q101 standards, as STMicroelectronics lists it under standard industrial-grade packaging and testing. Automotive-grade versions would typically carry a suffix like -Q in their part number and undergo additional environmental stress screening. Without explicit qualification documentation, using the ESDALC14-1BF4 in safety-critical automotive subsystems—such as ADAS sensor inputs or infotainment interfaces—introduces supply chain risk. However, for non-automotive industrial or consumer electronics operating within the specified -40°C to +150°C junction range, the device performs reliably. If automotive compliance is required, engineers should consult STMicroelectronics for available Q-certified equivalents in the ESDALC14 family.
What packaging options are available for the ESDALC14-1BF4, and how do they influence automated assembly processes?
The ESDALC14-1BF4 is offered in Cut Tape (CT) and Digi-Reel® formats, both optimized for high-volume pick-and-place manufacturing. Cut tape suits small-batch or prototype runs, offering immediate access to individual units but at higher relative cost. Digi-Reel® provides continuous spooled delivery compatible with standard tape-and-reel equipment used by contract manufacturers, reducing handling errors and improving feed accuracy during SMT assembly. Both formats support MSL 1 moisture sensitivity classification, allowing unlimited floor life when stored properly, which simplifies inventory management in fast-turn production environments. The 0201 footprint itself enhances placement density, enabling multiple protection points per square centimeter without sacrificing reliability or inspection capability.
How does the ESDALC14-1BF4 perform under IEC 61000-4-2 contact discharge testing, and what real-world ESD threats does it mitigate?
The ESDALC14-1BF4 is designed to meet IEC 61000-4-2 Level 4 criteria, capable of surviving ±8kV contact discharge and ±15kV air discharge without damage. During such events, the diode clamps transient voltage to 18V maximum while limiting current through the protected node. This protects sensitive ICs from latch-up or functional disruption caused by human-body-model (HBM)-like discharges common during handling or user interaction. For example, inserting a USB cable while touching a grounded metal object often generates >10kV transients; the ESDALC14-1BF4 prevents these from propagating past its terminals. However, note that clamping performance depends on parasitic inductance in the PCB path—long traces or poor grounding can elevate peak voltages beyond 18V, reducing effectiveness despite the device’s intrinsic capabilities.
What role does the bidirectional channel configuration play in protecting unidirectional signal lines using the ESDALC14-1BF4?
Despite being bidirectional, the ESDALC14-1BF4 effectively protects unidirectional signals because ESD events are inherently symmetrical in polarity relative to ground or VCC. Whether positive or negative transients occur, the internal Zener-like structure activates to clamp voltage within ±18V, ensuring neither direction exceeds safe levels. This simplifies layout, as only two pads need connection: one to the signal line and the other to a reference plane (either GND or VDD). In cases where strict unidirectional protection is desired (e.g., to prevent reverse current flow), additional series resistors or MOSFET-based isolation might be added, but for most digital interfaces, the inherent symmetry of ESD makes the bidirectional nature acceptable and advantageous for cost and space efficiency.
How does the ESDALC14-1BF4 compare to ceramic varistors (MLVs) in terms of response time, capacitance, and long-term stability?
Compared to multilayer varistors (MLVs), the ESDALC14-1BF4 offers significantly faster response times—on the order of picoseconds versus nanoseconds—due to its semiconductor junction design rather than dielectric polarization. It also exhibits lower capacitance (22pF vs. typically 1nF+ for MLVs), reducing loading on high-speed lines. However, MLVs often provide higher energy absorption in continuous overvoltage scenarios, whereas the ESDALC14-1BF4 excels in rapid, low-energy ESD events defined by IEC standards. Over time, MLVs may degrade under sustained voltage stress, while the ESDALC14-1BF4 maintains consistent performance if operated within datasheet limits. For applications requiring both ESD robustness and minimal signal distortion—such as mobile device I/O protection—the ESDALC14-1BF4 generally outperforms bulkier MLV solutions in speed and linearity.
Can the ESDALC14-1BF4 be used for surge protection in power rails, or is it limited strictly to signal-line ESD mitigation?
The ESDALC14-1BF4 is optimized for signal-line ESD protection, not power rail transients. Its clamping voltage of 18V and peak pulse current of 5A make it unsuitable for handling high-energy surges like those from lightning or utility switching, which require dedicated TVS diodes rated for hundreds of watts or specialized gas discharge tubes. Power rail protection demands devices with lower clamping thresholds (e.g., 6V–12V) and higher energy tolerance, along with fast overvoltage detection circuits. Using the ESDALC14-1BF4 on a 5V power rail risks false triggering or insufficient surge capacity, potentially leading to downstream IC failure during actual fault conditions. Therefore, it should be deployed only on input/output pins subject to electrostatic discharge, never as primary overvoltage protection for main supply lines.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics ESDALC14-1BF4

Product Attribute ESDALC20-1BF4 ESDALC14-1BU2 ESDALC5-1BF4 ESDALC14V2-2BP5
Part Number ESDALC20-1BF4 ESDALC14-1BU2 ESDALC5-1BF4 ESDALC14V2-2BP5
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Current - Peak Pulse (10/1000µs) - - - -
Type - - - -
Applications - - - -
Power - Peak Pulse - - - -
Power Line Protection - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Voltage - Clamping (Max) @ Ipp - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Bidirectional Channels - - - -
Voltage - Reverse Standoff (Typ) - - - -
Series - - - -
Capacitance @ Frequency - - - -
Voltage - Breakdown (Min) - - - -

ESDALC14-1BF4 Datasheet PDF

Download ESDALC14-1BF4 pdf datasheets and STMicroelectronics documentation for ESDALC14-1BF4 - STMicroelectronics.

HTML Datasheet
Cylindrical Battery Holders.pdf
PCN Packaging
2.73KHz.pdf

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ESDALC14-1BF4 Image

ESDALC14-1BF4

STMicroelectronics
32D-ESDALC14-1BF4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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