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HomeProductsCircuit ProtectionTVS - DiodesESDALC5-1BF4
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ESDALC5-1BF4 - STMicroelectronics

Manufacturer Part Number
ESDALC5-1BF4
Manufacturer
STMicroelectronics
Allelco Part Number
32D-ESDALC5-1BF4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
462,740 pcs available, New & Original
Parts Description
TVS DIODE 5VWM 0201
Package
0201
Data sheet
ESDALC5-1BF4.pdf

HTML Datasheet

ESDALC5-1BF4.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 462740
  • Unit Price: $0.457
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The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ESDALC5-1BF4 Tech Specifications
STMicroelectronics - ESDALC5-1BF4 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - ESDALC5-1BF4

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Reverse Standoff (Typ) 5V
Voltage - Clamping (Max) @ Ipp -
Voltage - Breakdown (Min) 5.8V
Type Zener
Supplier Device Package 0201
Series ESDA
Power Line Protection No
Power - Peak Pulse 28W
Product Attribute Attribute Value
Package / Case 0201 (0603 Metric)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Current - Peak Pulse (10/1000µs) -
Capacitance @ Frequency 10pF @ 1MHz
Bidirectional Channels 1
Base Product Number ESDALC5
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0080

Parts Introduction

Manufacturer Part Number

ESDALC5-1BF4

Manufacturer

stmicroelectronics

Introduction

The ESDALC5-1BF4 from stmicroelectronics is a transient voltage suppressor (TVS) diode, designed to protect electronic devices from electrostatic discharge (ESD) and other transient voltage events.

Product Features and Performance

Type: Zener

Bidirectional Channels: 1

Voltage - Reverse Standoff (Typ): 5V

Voltage - Breakdown (Min): 5.8V

Power - Peak Pulse: 28W

Applications: General Purpose

Capacitance @ Frequency: 10pF @ 1MHz

Operating Temperature Range: -40°C ~ 150°C (TJ)

Mounting Type: Surface Mount

Package / Case: 0201 (0603 Metric)

Product Advantages

Optimized for protecting sensitive electronics from ESD

Low capacitance, minimizing signal distortion

Very compact 0201 (0603 Metric) package, ideal for space-constrained applications

High temperature range allowing for use in harsh environments

Key Technical Parameters

Voltage - Clamping (Max) @ Ipp: Not specified

Current - Peak Pulse (10/1000µs): Not specified

Power Line Protection: No

Low dynamic resistance and fast response time

Quality and Safety Features

Manufactured by stmicroelectronics, a leader in semiconductor devices

Designed to withstand high ESD voltage events

Compatibility

Compatible with the 0201 (0603 Metric) footprint

Suitable for surface mount technology (SMT) processes

Application Areas

General-purpose ESD protection in consumer electronics, telecommunications, industrial equipment, and computer interfaces

Product Lifecycle

Status: Active

This product is not nearing discontinuation, and alternatives or upgrades are available for integration.

Several Key Reasons to Choose This Product

Offers reliable ESD protection to extend the lifespan of electronic devices

Advanced semiconductor technology provides superior performance

Very low leakage current to ensure minimal power loss

Broad operating temperature range for use in various environments

Compact package suitable for high-density board designs

Frequently Asked Questions(FAQ)

How does the ESDALC5-1BF4 perform in terms of clamping voltage under transient conditions, and what design considerations should be made for a 5V system?
The ESDALC5-1BF4 is designed with a reverse standoff voltage of 5V, making it suitable for protecting sensitive low-voltage circuits. While the exact clamping voltage under peak pulse current (Ipp) is not specified in the datasheet, typical ESD protection diodes like this exhibit clamping voltages slightly above the breakdown threshold—often in the range of 8–12V for pulses around 30A. Given its 28W peak pulse power rating, designers should ensure that the maximum expected transient current does not exceed the device’s capability. For a 5V system, selecting a TVS diode with sufficient headroom ensures that transient events do not propagate to downstream components. Engineers should verify actual clamping behavior through testing or simulation, especially when interfacing with higher-energy sources.
What are the key differences between the ESDALC5-1BF4 and other ESD protection devices in the ESDALC series, such as the ESDALC6V0-1BM5?
The ESDALC5-1BF4 targets 5V nominal systems with a breakdown voltage of 5.8V and is optimized for space-constrained applications due to its 0201 footprint. In contrast, the ESDALC6V0-1BM5 operates at a lower threshold (~6V), offering tighter voltage control but potentially less margin in harsh environments. Both share similar capacitance profiles (~10pF) and power ratings, but the ESDALC6V0 may be preferred where precise triggering is critical. The choice depends on system noise margins, signal integrity requirements, and whether the application demands stricter overvoltage thresholds or broader transient tolerance.
Can the ESDALC5-1BF4 be used in high-frequency signal lines without degrading signal quality?
Yes, the ESDALC5-1BF4 features a low capacitance of 10pF at 1MHz, which minimizes signal distortion in high-speed data paths. This makes it appropriate for use in USB, HDMI, or RF interfaces where parasitic loading must remain low. However, placement is critical—proximity to connectors or exposed pins reduces effective loop inductance and improves protection. Designers should avoid placing traces too close to bypass capacitors or ground planes that could alter impedance characteristics. When integrated into high-speed routing, the device’s small 0201 package helps maintain consistent transmission line behavior.
What are the thermal limitations of the ESDALC5-1BF4 during repetitive ESD events, and how does this affect long-term reliability?
The ESDALC5-1BF4 has a junction operating temperature range from -40°C to +150°C, indicating robust thermal design. However, repeated ESD strikes can cause cumulative degradation despite the 28W peak pulse power rating being specified for single transients (typically 8/20µs waveform). Each event generates localized heating, which may lead to gradual increase in leakage current or shift in breakdown voltage over time. In industrial or automotive environments with frequent ESD exposure, periodic qualification testing under accelerated stress conditions is recommended. Proper PCB layout, including adequate ground return paths, mitigates thermal buildup.
How does the ESDALC5-1BF4 compare to ceramic varistors for surge suppression in terms of response speed and longevity?
The ESDALC5-1BF4 offers significantly faster response times—on the order of picoseconds—due to its semiconductor construction, compared to millisecond-level responses typical of ceramic varistors. This makes it far more effective at suppressing fast transients like IEC 61000-4-2 contact discharges. Additionally, while both devices degrade under stress, the TVS diode tends to fail in a short-circuit mode, allowing fuses or circuit breakers to disconnect faulty sections. Varistors often fail open or exhibit nonlinear aging effects. However, varistors generally handle higher energy bursts and are better suited for mains-level surges, whereas the ESDALC5-1BF4 excels in signal-line protection.
Is the ESDALC5-1BF4 suitable for automotive-grade ESD compliance testing per ISO 10605?
The ESDALC5-1BF4 meets standard industrial ESD immunity requirements, but automotive-specific testing (ISO 10605) involves more rigorous criteria, including higher discharge currents and environmental stress testing. Although STMicroelectronics provides automotive-qualified variants within the ESDALC family, the ESDALC5-1BF4 itself is not explicitly marked as AEC-Q101 compliant. If used in an automotive application, additional validation against ISO 10605 waveforms—particularly at 8kV air discharge and 15kV contact—is necessary. Designers should confirm part qualification status and consider alternatives like the ESDALC5-1BF4-Q1 if automotive certification is required.
What impact does the 0201 package size have on PCB assembly and reliability in mass production?
The 0201 (0603 metric) package of the ESDALC5-1BF4 enables high-density layouts, ideal for compact consumer electronics. However, smaller footprints increase risk during reflow soldering due to tombstoning and insufficient solder wetting. Automated pick-and-place machines require precise nozzle alignment and vacuum settings. From a reliability standpoint, the joint must withstand thermal cycling; however, the lack of exposed thermal pads limits heat dissipation compared to larger packages. For high-volume manufacturing, process optimization and stencil design are crucial to ensure consistent yields and long-term solder joint integrity.
How does the capacitance of the ESDALC5-1BF4 influence filtering decisions in mixed-signal systems?
With a capacitance of 10pF at 1MHz, the ESDALC5-1BF4 introduces minimal loading to high-impedance nodes and preserves signal fidelity. In analog or RF paths, this low value prevents unwanted coupling or attenuation of high-frequency components. However, in power rail protection scenarios, additional bulk capacitance may still be needed to filter lower-frequency transients. The device complements rather than replaces decoupling networks. Engineers should evaluate total system capacitance budget when cascading multiple protection elements to avoid resonant peaking or bandwidth reduction.
Can the ESDALC5-1BF4 be paralleled for increased current handling?
Paralleling ESD protection devices like the ESDALC5-1BF4 is generally discouraged due to mismatch in threshold voltages and dynamic resistance among units. Even slight variations can cause uneven current sharing, leading to premature failure in one device. Instead, designers should select a single device rated for the highest expected transient current. If higher energy handling is required, a dedicated high-power TVS array or multi-stage protection architecture is preferable. The ESDALC5-1BF4’s compact form factor further limits practical parallel implementation due to space constraints.
What role does the bidirectional channel configuration play in protecting differential signaling interfaces?
As a bidirectional TVS diode, the ESDALC5-1BF4 protects both signal lines relative to ground and vice versa, which is essential for preserving differential pair symmetry. This ensures that positive and negative transients are clamped equally, minimizing common-mode voltage shifts that could disrupt receiver thresholds. In interfaces like LVDS or USB 2.0, maintaining balance prevents skew and maintains timing integrity. The single-channel design simplifies layout compared to dual-diode arrays, provided the clamping voltage remains compatible with the transceiver’s input tolerances.
How should the ESDALC5-1BF4 be integrated into a protection scheme alongside ferrite beads or EMI filters?
The ESDALC5-1BF4 should be placed as close as possible to the connector or entry point of external cables to intercept transients before they reach sensitive ICs. Ferrite beads or EMI filters located downstream offer complementary protection by attenuating conducted noise but do not respond quickly enough to fast ESD events. A well-designed chain includes: connector → TVS diode (ESDALC5-1BF4) → ferrite bead → filtered trace → load. This staged approach maximizes effectiveness across a wide frequency spectrum while preserving signal quality.
What are the implications of using the ESDALC5-1BF4 in humid or corrosive environments?
The ESDALC5-1BF4 has MSL 1, indicating no moisture sensitivity during storage, but operational reliability depends on PCB surface finish and conformal coating. In high-humidity environments, tin whisker growth on exposed leads—though rare in modern finishes—could compromise electrical continuity over decades. Corrosive atmospheres may degrade solder joints or metallization. For mission-critical or outdoor applications, encapsulation or selection of hermetically sealed alternatives should be considered. Standard PCBs with ENIG finish typically provide adequate protection for most industrial uses.
How does the absence of power line protection specification affect system-level surge resilience?
The ESDALC5-1BF4 is not intended for direct connection to power rails subject to mains transients (e.g., 12V or 24V systems). Its primary function is electrostatic discharge (ESD) mitigation on signal lines per IEC 61000-4-2. Systems requiring protection against inductive kickback, lightning surges, or voltage dips must employ separate transient blocking units (TBUs) or higher-energy TVS diodes rated for power line use. Integrating the ESDALC5-1BF4 into a comprehensive protection strategy requires coordination with dedicated power surge suppressors to prevent backfeeding damage during large transients.
What testing methodology is recommended to validate ESDALC5-1BF4 performance in real-world deployment?
Beyond datasheet characterization, designers should perform HBM (Human Body Model) and CDM (Charge Device Model) testing aligned with IEC 61000-4-2 standards. Using an ESD gun, apply ±8kV contact and ±15kV air discharge tests directly onto the protected node while monitoring for functional failure or parameter drift. Simultaneously, measure post-event leakage current and clamping response with an oscilloscope. Environmental stress testing under elevated temperature and humidity accelerates aging assessment. These empirical validations ensure robustness beyond laboratory simulations and catch layout-dependent anomalies.
Why might the ESDALC5-1BF4 be preferred over larger TVS packages despite identical electrical ratings?
The 0201 package allows placement near SoCs or connectors without consuming valuable board area, enabling miniaturization in portable devices. It also reduces parasitic inductance, improving high-speed transient response. While electrical performance matches larger counterparts like 0402 or 0603 types, the smaller size supports higher component density and automated assembly efficiency. Cost savings from reduced footprint and lower material usage can be significant in high-volume production, though yield management becomes more critical during SMT processing.
How does the ESDALC5-1BF4 interact with ESD-safe handling procedures during prototyping?
Since the ESDALC5-1BF4 is inherently designed for ESD protection, it does not require special handling beyond standard precautions for any IC. However, improper handling—such as touching leads without grounding—can introduce unintended transients that stress the device during setup. Always use grounded workstations, wrist straps, and conductive trays. During rework, avoid hot-air tools exceeding recommended temperatures to prevent delamination or bond wire lift-off. The device’s robustness aids system-level immunity, but proper assembly practices preserve its reliability.
What considerations apply when replacing the ESDALC5-1BF4 with a substitute in legacy designs?
Substitution requires matching key parameters: 5V standoff voltage, ≤10pF capacitance, ≥28W pulse power, and 0201 footprint. Alternatives from ON Semiconductor (e.g., PESD5V0S1BA) or NXP (e.g., PUSB3UF60) may offer comparable specs but differ in packaging or lead frame design. Verify compatibility with existing PCB pads and reflow profiles. Also confirm RoHS, REACH, and regulatory compliance aligns with project requirements. Functional testing under ESD events is mandatory after substitution to ensure no degradation in performance or increased failure rate.
How does the ESDALC5-1BF4 support system-level EMC compliance without compromising signal integrity?
By clamping fast-rising ESD transients before they propagate into sensitive circuits, the ESDALC5-1BF4 reduces radiated emissions caused by internal arcing during discharge events. Its low capacitance avoids distorting rise/fall times in digital signals, supporting clean eye diagrams in high-speed links. When properly positioned, it eliminates nuisance resets or latch-up conditions that could trigger EMI test failures. Combined with proper grounding and shielding, the device contributes to meeting Class B emission limits in FCC and CISPR standards without adding bulk filters or ferrites.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics ESDALC5-1BF4

Product Attribute ESDALC20-1BF4 ESDALC14-1BF4 ESDALC5-1BT2Y ESDALC5-1BM2
Part Number ESDALC20-1BF4 ESDALC14-1BF4 ESDALC5-1BT2Y ESDALC5-1BM2
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Voltage - Reverse Standoff (Typ) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Type - - - -
Applications - - - -
Voltage - Clamping (Max) @ Ipp - - - -
Bidirectional Channels - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Power - Peak Pulse - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Power Line Protection - - - -
Voltage - Breakdown (Min) - - - -
Current - Peak Pulse (10/1000µs) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Capacitance @ Frequency - - - -

ESDALC5-1BF4 Datasheet PDF

Download ESDALC5-1BF4 pdf datasheets and STMicroelectronics documentation for ESDALC5-1BF4 - STMicroelectronics.

PCN Packaging
Box Label Chg 28/Jul/2016.pdf Label 17/Jan/2019.pdf
HTML Datasheet
ESDALC5-1BF4.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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STMicroelectronics

ESDALC5-1BF4

STMicroelectronics
32D-ESDALC5-1BF4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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