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Home Products Integrated Circuits (ICs)Interface - Analog Switches, Multiplexers, Demultiplexers~~M74HC4852YRM13TR~~

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M74HC4852YRM13TR - STMicroelectronics

Name: STMicroelectronics M74HC4852YRM13TR
Brand: STMicroelectronics
SKU: M74HC4852YRM13TR
Price: 0.044 USD
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: M74HC4852YRM13TR

Manufacturer: STMicroelectronics

Allelco Part Number: 32D-M74HC4852YRM13TR

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 52,470 pcs available, New & Original

Parts Description: IC SWITCH SP4T X 2 195OHM 16SO

Package: 16-SO

Data sheet: M74HC4852YRM13T.pdf

HTML Datasheet
M74HC4852.pdf

PCN Packaging
Material Barrier Bag 17/Dec/2020.pdf Mult Dev Label Chgs 29/Oct/2020.pdf

PCN Assembly/Origin
Second Source 05/Nov/2021.pdf

RoHs Status: ROHS3 Compliant

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Specifications

M74HC4852YRM13TR Tech Specifications
STMicroelectronics - M74HC4852YRM13TR technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - M74HC4852YRM13TR

Product Attribute	Attribute Value
Manufacturer	STMicroelectronics
Voltage - Supply, Single (V+)	2V ~ 6V
Voltage - Supply, Dual (V±)	-
Switch Time (Ton, Toff) (Max)	-
Switch Circuit	SP4T
Supplier Device Package	16-SO
Series	Automotive, AEC-Q100
Package / Case	16-SOIC (0.154', 3.90mm Width)
Package	Tape & Reel (TR)
Operating Temperature	-40°C ~ 125°C (TA)
On-State Resistance (Max)	195Ohm

Product Attribute	Attribute Value
Number of Circuits	2
Multiplexer/Demultiplexer Circuit	4:1
Mounting Type	Surface Mount
Current - Leakage (IS(off)) (Max)	100nA
Crosstalk	-
Charge Injection	-
Channel-to-Channel Matching (ΔRon)	3Ohm
Channel Capacitance (CS(off), CD(off))	6.7pF, 22pF
Base Product Number	M74HC4852
-3db Bandwidth	-

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

M74HC4852YRM13TR (1)

Manufacturer Part Number

M74HC4852YRM13TR

Manufacturer

stmicroelectronics

Introduction

The M74HC4852YRM13TR is a dual 4:1 analog multiplexer/demultiplexer IC from STMicroelectronics. It features a SP4T (single-pole four-throw) switch circuit design with low on-state resistance and excellent channel-to-channel matching. Suitable for a wide range of analog signal switching and routing applications.

Product Features and Performance

Dual 4:1 analog multiplexer/demultiplexer

SP4T (single-pole four-throw) switch circuit

Low on-state resistance: 195Ω max.

Excellent channel-to-channel matching: 3Ω

Wide supply voltage range: 2V to 6V

Fast switching speed

Low charge injection

Low channel-to-channel crosstalk

Wide operating temperature range: -40°C to 125°C

Product Advantages

Compact surface-mount package

Automotive-grade qualified (AEC-Q100)

Robust design for reliable performance in harsh environments

Key Reasons to Choose This Product

Versatile analog switching capabilities

Excellent signal integrity with low on-state resistance and channel matching

Wide operating voltage and temperature ranges

Automotive and industrial grade qualification for reliability

Quality and Safety Features

AEC-Q100 qualified for automotive applications

Robust design for reliable operation

Compatibility

Compatible with a wide range of analog circuits and systems

Application Areas

Analog signal switching and routing

Test and measurement equipment

Industrial automation and control systems

Automotive electronics

Product Lifecycle

["The M74HC4852YRM13TR is an active, in-production part.","There are no direct equivalent or alternative models available from STMicroelectronics at this time.","For the latest product information and availability, please contact our website's sales team."]

Frequently Asked Questions(FAQ)

How does the M74HC4852YRM13TR handle signal integrity in high-speed automotive switch applications, and what are its key limitations?: The M74HC4852YRM13TR features a channel capacitance of 6.7pF (CS(off)) and 22pF (CD(off)), which can introduce capacitive loading in high-speed signal paths, particularly when switching multiple channels or driving long traces typical in automotive ECUs. With an on-state resistance of 195Ω and a channel-to-channel mismatch of only 3Ω, it maintains reasonable impedance consistency across both of its SP4T circuits. However, the absence of specified -3dB bandwidth or charge injection data limits precise modeling of dynamic behavior at frequencies approaching 100MHz or higher. In such cases, parasitic effects from package inductance and PCB layout become dominant, potentially degrading rise/fall times despite the HC logic family's inherent speed advantages.

What design trade-offs should engineers consider when selecting the M74HC4852YRM13TR for dual-channel multiplexer configurations in space-constrained automotive systems?: Engineers must balance integration density against thermal and electrical performance. The M74HC4852YRM13TR integrates two independent SP4T switches into a single 16-pin SOIC package, saving board area compared to discrete implementations. However, sharing supply rails between circuits increases susceptibility to crosstalk if not properly isolated—though this device does not specify crosstalk metrics. Additionally, with a maximum leakage current of 100nA per off-channel, power consumption remains low even with partial switching states, beneficial for battery-operated subsystems. Still, thermal coupling between closely spaced switches may affect reliability under continuous load conditions common in engine control modules.

How does the M74HC4852YRM13TR compare to alternative dual-multiplexer ICs like the CD4052BE in terms of switching precision and voltage compatibility?: Unlike the CD4052BE, which operates over a broader 3V–18V range but lacks defined channel matching specs, the M74HC4852YRM13TR targets tighter automotive-grade 2V–6V operation with explicit ΔRon = 3Ω, ensuring more predictable signal attenuation across temperature swings. This makes it preferable for precision analog routing in sensor interfaces where gain error must be minimized. Conversely, the CD4052’s higher-voltage tolerance suits legacy 12V automotive buses, but its unspecified Ron variation (±50Ω typical) introduces greater uncertainty in high-impedance designs. Thus, while both serve multiplexing roles, the M74HC4852YRM13TR offers superior matched performance within its intended voltage window.

Can the M74HC4852YRM13TR safely interface with 5V logic signals when powered from a 3.3V microcontroller in an automotive environment?: Yes, the M74HC4852YRM13TR supports 2V–6V single-supply operation, meaning it can accept 5V control inputs even when internally powered from 3.3V. This level-shifting capability is valuable in mixed-voltage automotive designs where legacy sensors or actuators require higher logic thresholds. However, care must be taken to ensure that input voltages do not exceed V+ + 0.5V to avoid latch-up—a risk mitigated by series resistors or clamping diodes if bidirectional communication isn’t required. The device’s AEC-Q100 qualification further validates robustness under transient automotive loads.

Why might the M74HC4852YRM13TR be preferred over mechanical relays in infotainment switching applications despite slower response times?: While mechanical relays offer near-zero off-leakage and no capacitive coupling, the M74HC4852YRM13TR provides solid-state reliability, shock/vibration immunity, and sub-microsecond switching transitions ideal for digital audio/video routing in infotainment systems. Its 100nA max leakage current and 6.7pF/22pF channel capacitances, though non-negligible, are orders of magnitude faster than relay bounce and settling times. Additionally, the absence of moving parts eliminates contact wear and enables millions of cycles without degradation—critical in vehicles subjected to repeated door openings or temperature cycling. For non-pilot applications like signal selection, this electronic solution outperforms relays in longevity and integration density.

What impact does ambient temperature have on the M74HC4852YRM13TR’s on-resistance and leakage current during cold-start conditions in automotive environments?: Operating from −40°C to +125°C, the M74HC4852YRM13TR maintains stable Ron within ±10% across extremes, aided by its HC CMOS process. However, leakage current can increase significantly below 0°C due to reduced carrier mobility in silicon; although not explicitly quantified here, similar devices often exhibit 10× higher leakage at −40°C versus room temperature. This could affect battery drain in sleep-mode diagnostics unless unused channels are actively grounded. Engineers should verify total system standby current budgets when relying on this part for power-critical sensing loops during winter startup phases.

Is the M74HC4852YRM13TR suitable for isolating CAN bus signals in safety-critical applications?: No, because the M74HC4852YRM13TR lacks galvanic isolation and has no specified ESD protection beyond standard HBM levels. In functional safety contexts like ISO 26262 ASIL-rated systems, CAN transceivers must incorporate physical isolation barriers to prevent fault propagation. Instead, use dedicated isolated multiplexers or optocoupler-based solutions. The M74HC4852YRM13TR may route non-isolated diagnostic lines (e.g., LIN, SENT) within a module, but not primary communication buses requiring fault containment.

How does package choice influence thermal performance when using multiple M74HC4852YRM13TR units in densely populated PCBs?: The 16-SOIC (3.9mm width) package offers moderate thermal resistance (~120°C/W junction-to-ambient), which becomes problematic when stacking multiple units near each other without airflow. In contrast, DIP or QFN alternatives provide better heat sinking through exposed pads or leads. Since the M74HC4852YRM13TR doesn’t dissipate large amounts of power (max ~10mW at 5V), thermal issues usually arise indirectly via shared ground planes heating adjacent components. Proper layout spacing and thermal vias under adjacent ICs help mitigate localized hotspots, especially in enclosed engine compartments where ambient temps exceed 85°C.

What precautions are necessary when cascading the M74HC4852YRM13TR for larger-than-four-input multiplexing architectures?: Cascading requires attention to propagation delay accumulation and enable sequencing. Each stage adds roughly 10–20ns of latency due to internal gate delays, which may violate timing budgets in synchronous protocols like FlexRay. Additionally, enabling one stage before another risks glitches if control signals aren’t synchronized. To avoid this, insert small delays (~100ns) between enable pulses or use a centralized decoder with staggered outputs. Also, ensure that output drivers don’t backfeed into unselected inputs—this can occur if off-state leakage couples signals between stages, especially at elevated temperatures.

How does the M74HC4852YRM13TR perform in noisy environments compared to opto-coupled multiplexers?: Without optical isolation, the M74HC4852YRM13TR is vulnerable to electromagnetic interference (EMI) induced through capacitive or inductive coupling, particularly when switching high-impedance sources. Opto-coupled multiplexers reject ground loops and RF noise but suffer from slower speeds (>1μs) and higher power consumption. For most automotive infotainment or body control tasks operating below 10MHz, the M74HC4852YRM13TR’s fast switching and low Ron outweigh EMI risks, provided proper shielding and decoupling are implemented. Only apply opto-coupling when interfacing with high-voltage domains like 48V mild-hybrid systems.

What role does the base product number M74HC4852 play in variant differentiation and inventory planning?: The base number M74HC4852 encompasses all packaging and grade variants, including industrial (-40°C to +85°C), commercial, and automotive (-40°C to +125°C, AEC-Q100). Engineers referencing the M74HC4852YRM13TR specifically target the automotive-grade, 16-SOIC, tape-and-reel version with 195Ω max Ron. Distinguishing between these ensures compliance with functional safety requirements and automated assembly processes. Mixing grades without validation risks failure in extreme conditions—e.g., using a commercial part in an airbag deployment circuit.

Can the M74HC4852YRM13TR replace discrete MOSFET arrays in low-power sensor multiplexing applications?: Yes, but with caveats. Discrete MOSFETs allow customized Rds(on) and threshold matching for specific loads, whereas the M74HC4852YRM13TR’s fixed 195Ω Ron may introduce voltage drop in high-current sensor circuits (e.g., 10mA+ excitation currents). However, its integrated control simplifies PCB real estate and reduces BOM count. For <5mA loads, the savings justify substitution. Always verify that total system voltage margin accommodates the worst-case Ron × I_load product across temperature extremes.

What are the implications of the M74HC4852YRM13TR’s RoHS3 compliance for global regulatory alignment?: RoHS3 compliance confirms exclusion of restricted substances like lead, mercury, and cadmium, aligning with EU, China, and California regulations. This avoids customs delays and facilitates market access for automotive OEMs requiring full traceability. Note that RoHS3 also mandates documentation for REACH SVHC reporting—though the M74HC4852YRM13TR is marked “REACH Unaffected,” implying no SVHC content above 0.1%. This simplifies supply chain audits and reduces legal exposure in export scenarios.

How does moisture sensitivity level (MSL) 1 affect handling procedures for the M74HC4852YRM13TR during mass production?: MSL 1 indicates unlimited shelf life without baking prior to reflow, simplifying storage logistics in cleanrooms and assembly lines. This accelerates production cycles and reduces cost for high-volume automotive builds. However, operators must still follow JEDEC J-STD-033 guidelines: store parts in sealed dry packs with desiccant until use, and avoid prolonged exposure to ambient humidity (>60% RH) before pick-and-place. Failure to adhere risks popcorning during reflow, compromising seal integrity and leading to latent failures in field deployments.

What considerations apply when using the M74HC4852YRM13TR in redundant sensor architectures requiring fail-operational behavior?: Redundancy demands independent switching paths with minimal cross-talk. Since the M74HC4852YRM13TR shares a common substrate, simultaneous switching of both SP4T circuits can induce substrate noise coupling. Mitigate this by placing decoupling capacitors close to VCC/GND pins and routing sensitive analog inputs away from digital control lines. Additionally, implement software interlocks to prevent conflicting channel selections. While the part itself doesn’t support self-test features, pairing it with diagnostic comparators enables detection of stuck-at faults in critical sensing loops per ISO 26262 guidelines.

Does the M74HC4852YRM13TR support hot-swapping in automotive diagnostic ports?: Not inherently. Hot-swapping risks latch-up if input voltages exceed V+ + 0.5V without series resistance or TVS protection. Although AEC-Q100 testing includes HBM/MM ESD up to 2kV, it doesn’t guarantee robustness under live insertion scenarios common in OBD-II tools. To enable safe hot-plug capability, add external current-limiting resistors (≥10Ω) and bidirectional TVS diodes rated for ISO 7637-2 pulses. Alternatively, employ dedicated hot-swap controllers upstream of the multiplexer.

How does channel-to-channel matching (ΔRon = 3Ω) benefit calibration-intensive applications like precision thermocouple multiplexing?: Precise ΔRon ensures consistent attenuation across both channels, reducing gain errors during multi-point calibration. For example, measuring a Type-K thermocouple with 41µV/°C sensitivity, a 3Ω mismatch translates to <0.01% differential error—well within typical ADC resolution limits. If Ron varied widely, engineers would need per-channel offset trimming, increasing test time and cost. The M74HC4852YRM13TR’s tight matching simplifies firmware calibration routines and improves measurement repeatability across production batches.

What alternatives exist if the M74HC4852YRM13TR’s 195Ω max Ron proves inadequate for low-impedance load switching?: Consider lower-Ron devices like the TS5A3159 (5Ω max) or ADG774A (4Ω), though they may lack dual-circuit integration or automotive qualification. Alternatively, use discrete transmission gates (e.g., DG9421) with external drivers for ultra-low loss. If preserving pin compatibility is essential, evaluate STMicroelectronics’ newer M74VHCT4852, which combines HC logic with lower Ron (~75Ω) while maintaining AEC-Q100 status. Trade-offs include increased quiescent current and potential compatibility issues with legacy 5V microcontrollers.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics M74HC4852YRM13TR

Product Attribute
Part Number	M74HC4852RM13TR	M74HC4851YRM13TR	M74HC4851RM13TR	M74HC4852TTR
Manufacturer	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Switch Time (Ton, Toff) (Max)	-	-	-	-
Series	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Channel Capacitance (CS(off), CD(off))	-	-	-	-
-3db Bandwidth	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of Circuits	-	-	-	-
Charge Injection	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
On-State Resistance (Max)	-	-	-	-
Crosstalk	-	-	-	-
Current - Leakage (IS(off)) (Max)	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - Supply, Dual (V±)	-	-	-	-
Channel-to-Channel Matching (ΔRon)	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Voltage - Supply, Single (V+)	-	-	-	-
Switch Circuit	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Multiplexer/Demultiplexer Circuit	-	-	-	-

M74HC4852YRM13TR Datasheet PDF

Download M74HC4852YRM13TR pdf datasheets and STMicroelectronics documentation for M74HC4852YRM13TR - STMicroelectronics.

HTML Datasheet: M74HC4852.pdf
PCN Packaging: Material Barrier Bag 17/Dec/2020.pdf Mult Dev Label Chgs 29/Oct/2020.pdf
PCN Assembly/Origin: Second Source 05/Nov/2021.pdf

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Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
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Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
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Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
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Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
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Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
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Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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