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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersSTM32F101CBT6
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STM32F101CBT6 - STMicroelectronics

Manufacturer Part Number
STM32F101CBT6
Manufacturer
STMicroelectronics
Allelco Part Number
32D-STM32F101CBT6
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,836 pcs available, New & Original
Parts Description
IC MCU 32BIT 128KB FLASH 48LQFP
Package
48-LQFP (7x7)
Data sheet
STM32F101CBT6.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 10836
  • Unit Price: $1.941
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.941 $1.94
10+ $1.831 $18.31
30+ $1.766 $52.98
250+ $1.70 $425.00
500+ $1.67 $835.00
1000+ $1.656 $1,656.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

STM32F101CBT6 Tech Specifications
STMicroelectronics - STM32F101CBT6 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - STM32F101CBT6

Product Attribute Attribute Value
Manufacturer STMicroelectronics
Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
Supplier Device Package 48-LQFP (7x7)
Speed 36MHz
Series STM32F1
RAM Size 16K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Package / Case 48-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 37
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 10x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M3
Connectivity I²C, IrDA, LINbus, SPI, UART/USART
Base Product Number STM32F101

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

STM32F101CBT6 Image
STM32F101CBT6 (1)

Manufacturer Part Number

STM32F101CBT6

Manufacturer

stmicroelectronics

Introduction

The STM32F101CBT6 is part of the STM32F1 series of 32-bit single-core ARM® Cortex®-M3 microcontrollers, aimed at providing cost-effective yet high-performance embedded solutions.

Product Features and Performance

Core: ARM® Cortex®-M3, 32-Bit Single-Core Processor

Maximum Speed: 36 MHz

Connectivity: I2C, IrDA, LINbus, SPI, UART/USART

Peripherals: DMA, PDR, POR, PVD, PWM, Temperature Sensor, Watchdog Timer

Number of I/O: 37

Program Memory Size: 128KB (FLASH)

RAM Size: 16KB

Data Converters: 10x12-bit ADC

Internal Oscillator

Operating Temperature Range: -40°C to 85°C

Product Advantages

Highly cost-effective for diverse embedded applications

Robust connectivity options support complex communication needs

Integrated peripherals enhance functionality and reduce external component requirements

Energy-efficient operation supported by wide voltage supply range

Includes a temperature sensor and ADC capability out of the box

STM32F101CBT6 Image
STM32F101CBT6 (2)

Key Technical Parameters

36MHz ARM Cortex-M3 processor

128KB FLASH memory

16KB RAM

2V to 3.6V supply voltage

37 I/O pins

10x12-bit ADC converters

Operating temperature from -40°C to 85°C

Quality and Safety Features

Power-on reset (POR) and Power-down reset (PDR)

Programmable voltage detector (PVD)

Watchdog timer (WDT) for system reliability

Compatibility

Supports surface mount technology for mounting on PCBs

Compatible with 48-LQFP (7x7) package

Application Areas

Consumer electronics

Sensor integration

Industrial control systems

Internet of Things (IoT) devices

Product Lifecycle

Currently active

Not nearing discontinuation and has reliable availability support

Several Key Reasons to Choose This Product

Reliable ARM Cortex-M3 core provides excellent processing power

Extensive connectivity and peripheral integration reduces additional component need

Broad operating temperature and robust safety features suitable for challenging environments

Favorable for applications needing low power consumption and varied I/O capabilities

Availability and support ensure long-term usability and scalability in designs.

Frequently Asked Questions(FAQ)

How does the STM32F101CBT6 compare to other STM32F1 series microcontrollers in terms of program memory capacity and core performance for industrial control applications?
The STM32F101CBT6 features 128KB of embedded FLASH memory, which is among the higher-capacity variants within the STM32F101 family. With an ARM Cortex-M3 core clocked at 36MHz, it delivers balanced performance for real-time control tasks such as motor drives or sensor data processing. Compared to lower-memory models like the STM32F101RBT6 (64KB), this device supports larger firmware stacks and more complex algorithms without external memory expansion, making it suitable for space- and power-constrained embedded systems.
What are the key trade-offs when selecting the STM32F101CBT6 over alternative microcontroller families like the NXP LPC13xx series for a low-power IoT endpoint design?
While the STM32F101CBT6 offers robust connectivity (I2C, SPI, UART) and a proven Cortex-M3 architecture, its maximum operating frequency of 36MHz results in higher active current compared to ultra-low-power MCUs such as those in the NXP LPC13xx line. However, the STM32F101CBT6 provides greater program memory (128KB vs. typically 32–64KB) and richer peripheral integration, including a built-in temperature sensor and watchdog timer, reducing reliance on external components. This makes it preferable when deterministic timing and code size outweigh absolute power efficiency.
Can the STM32F101CBT6 reliably operate in automotive environments, and what derating considerations should be applied given its industrial temperature range?
The STM32F101CBT6 is rated for operation from -40°C to +85°C, which aligns with standard industrial requirements but falls short of AEC-Q100 qualification needed for full automotive compliance. In harsh environments where temperatures may exceed 85°C intermittently, designers should implement thermal management strategies such as heatsinking or reduced clock speeds. Additionally, long-term reliability assessments should account for potential electromigration risks under sustained high-temperature operation near the upper limit.
How does the internal oscillator accuracy of the STM32F101CBT6 impact timing-critical communication protocols like LINbus or I2C?
The STM32F101CBT6 relies on an internal 8MHz RC oscillator with typical accuracy of ±1%, which can lead to timing deviations exceeding protocol tolerances under temperature variations. For precise I2C clock stretching or LINbus frame synchronization, this margin may require calibration or use of an external crystal oscillator. Alternatively, the device supports PLL multiplication up to 72MHz, but even then, the base oscillator drift necessitates software compensation or hardware-level timing adjustments to maintain protocol integrity across the full operating temperature range.
What is the practical impact of the STM32F101CBT6’s 37 GPIO count when designing a system requiring multiple analog inputs and digital interfaces simultaneously?
With only 37 general-purpose I/O pins available, careful allocation is essential when combining analog functionality—such as the 10-channel 12-bit ADC—with digital peripherals like UARTs, SPI, and PWM outputs. For example, configuring three USARTs consumes six dedicated pins, while enabling five ADC channels may require additional pins for channel selection via GPIOs if not using alternate function modes. Designers must balance pin usage against application needs, often leveraging alternate pin mappings to optimize layout density in compact form factors like the 48-LQFP package.
How does the STM32F101CBT6 support real-time task scheduling in resource-constrained environments, and what limitations exist due to its RAM size?
The STM32F101CBT6 includes 16KB of SRAM, sufficient for basic RTOS-based multitasking with moderate stack and heap requirements. However, running multiple concurrent threads—especially those involving large buffers or dynamic memory allocation—can exhaust available RAM quickly. For instance, a FreeRTOS project with three tasks each requiring 2KB stack space already consumes 6KB, leaving limited headroom for global variables or heap allocations. Developers must minimize static allocations and consider static memory pools to avoid runtime failures.
What are the implications of using the STM32F101CBT6’s internal voltage regulator in battery-powered applications with fluctuating supply conditions?
The STM32F101CBT6 operates from 2V to 3.6V, allowing direct connection to batteries down to 2V without external regulation. However, the internal POR (Power-On Reset) and PDR (Programmable Brown-Out Reset) circuits provide limited hysteresis during brown-out events, potentially causing unstable behavior if VDD drops rapidly. In lithium-based systems, where discharge curves can cause rapid voltage transitions, adding an LDO with tighter tolerance (±1%) may improve stability unless the firmware includes software-based monitoring of VREFINT.
How does the presence of DMA support in the STM32F101CBT6 influence peripheral data throughput compared to polling-based designs?
The STM32F101CBT6 integrates DMA controllers that offload CPU cycles from repetitive data transfers between peripherals (e.g., ADC-to-RAM) and memory blocks. For continuous ADC sampling at 1Msps (limited by 12-bit resolution and internal bus speed), DMA reduces CPU utilization from nearly 100% in polling mode to negligible levels, freeing cycles for control logic or communication handling. This enables responsive system behavior even when managing high-speed sensor streams, though buffer management complexity increases due to interrupt-driven transfer completion.
Are there known limitations in using the STM32F101CBT6 for USB CDC class implementations, and what external components are required?
Although the STM32F101CBT6 lacks native USB hardware, it supports USB 2.0 Full-Speed through bit-banged implementation using GPIOs, which imposes significant CPU overhead and limits reliability for sustained data transfers. Most commercial applications instead use STM32F103xx variants with integrated USB peripherals. Therefore, the STM32F101CBT6 is generally unsuitable for USB CDC unless bandwidth demands are minimal (<50 kbps) and software efficiency compensates adequately—a rare scenario in production systems.
How does the choice of packaging (48-LQFP) affect thermal performance and PCB routing density when integrating the STM32F101CBT6?
The 48-pin LQFP (7x7mm) package offers good signal integrity and moderate pin count for compact designs, but its exposed pad provides limited heat dissipation compared to QFN packages. Under continuous high-load operation (e.g., FFT computation), junction temperatures may rise significantly if airflow is restricted. Thermal vias under the package are recommended to conduct heat to inner layers. Additionally, the square layout allows dense routing, but careful layer stacking and trace spacing (>0.15mm) are necessary to prevent crosstalk between high-speed lines like SPI or I2C clocks.
What role does the internal voltage reference (VREFINT) play in calibration routines with the STM32F101CBT6, and how accurate is it for ADC measurements?
The STM32F101CBT6 embeds a 1.2V internal bandgap reference (VREFINT) used by the ADC and DAC subsystems. Its typical accuracy is ±5%, which introduces nonlinearity in absolute voltage measurements unless calibrated. During production testing, users can measure VREFINT output via an ADC channel and adjust conversion formulas accordingly. This self-calibration technique improves measurement consistency across batches, especially critical in battery-powered devices where external references are impractical.
How does the STM32F101CBT6 handle wake-up latency from STOP mode, and what are the associated power consumption trade-offs?
When entering STOP mode, the STM32F101CBT6 consumes approximately 2 µA while retaining RAM and register contents. Wake-up occurs within tens of microseconds after an interrupt event, depending on clock recovery time from the internal HSI oscillator. However, this comes at the cost of lost CPU context unless saved manually. For applications requiring sub-millisecond response times, deeper sleep states may not be feasible, favoring RUN or SLEEP modes instead despite higher current draw (~20 mA).
What are the security implications of using the STM32F101CBT6 in untrusted environments, and does it support any hardware protection mechanisms?
The STM32F101CBT6 lacks advanced security features such as secure boot, tamper detection, or cryptographic accelerators present in newer STM32G0 or STM32L5 series. While it supports read-out protection (RDP) levels to prevent code extraction via SWD, these protections can often be bypassed with physical attacks or firmware exploits. Consequently, it is unsuitable for storing sensitive credentials or enforcing intellectual property rights. Any confidential data should be encrypted externally or avoided entirely.
How does the availability of alternate function remapping benefit PCB layout when using the STM32F101CBT6?
The STM32F101CBT6 supports partial I/O port remapping via the AFIO register, allowing certain peripherals to relocate from default pins to more convenient locations. For example, SPI1 can move from PA5–PA7 to PB3–PB5, facilitating routing around mechanical constraints or shared buses. This flexibility reduces the need for complex jumper traces or level-shifter circuits, particularly valuable in tightly packed enclosures where pin accessibility is limited.
What considerations apply when cascading multiple STM32F101CBT6 devices using SPI for daisy-chained sensor networks?
Cascading SPI slaves requires careful attention to chip select (CS) signal timing and propagation delay across devices. Since the STM32F101CBT6 does not support hardware daisy chaining, each slave must assert its own CS line, consuming additional GPIOs. Moreover, the master’s SPI clock must remain stable during entire transaction sequences to avoid misalignment. Firmware should disable interrupts during transfers to ensure atomicity, and pull-up resistors on MOSI/MISO lines help prevent floating states during idle periods.
How does the absence of an on-chip EEPROM in the STM32F101CBT6 affect non-volatile configuration storage strategies?
Unlike some STM32 variants, the STM32F101CBT6 has no dedicated EEPROM, forcing designers to emulate persistent storage using FLASH sectors. This approach incurs write endurance limits (~10k cycles per sector) and requires wear-leveling algorithms for frequent updates. Alternatively, external serial EEPROMs (e.g., 24LCxx) add BOM cost and PCB real estate. For infrequent writes, reserving a small FLASH region with checksum validation may suffice, but adds firmware complexity.

Parts with Similar Specifications

The three parts on the right have similar specifications to STMicroelectronics STM32F101CBT6

Product Attribute STM32F101CBT6TR STM32F101C6T6 STM32F101C6T6ATR STM32F101C8T6
Part Number STM32F101CBT6TR STM32F101C6T6 STM32F101C6T6ATR STM32F101C8T6
Manufacturer STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Peripherals - - - -
Data Converters - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Program Memory Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
EEPROM Size - - - -
Speed - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Connectivity - - - -
Program Memory Type - - - -
Core Size - - - -
Series - - - -
Core Processor - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Oscillator Type - - - -
Number of I/O - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
RAM Size - - - -

STM32F101CBT6 Datasheet PDF

Download STM32F101CBT6 pdf datasheets and STMicroelectronics documentation for STM32F101CBT6 - STMicroelectronics.

PCN Packaging
Box Label Chg 28/Jul/2016.pdf Material Barrier Bag 17/Dec/2020.pdf
HTML Datasheet
STM32F101x8, STM32F101xB.pdf
PCN Design/Specification
LQFP 48 7x7 Products Increased Capacity 21/Dec/201.pdf Mult Dev 03/Nov/2022.pdf
PCN Assembly/Origin
STM8/STM32 10/Mar/2020.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
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  • IPC
  • ESD
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STM32F101CBT6 Image

STM32F101CBT6

STMicroelectronics
32D-STM32F101CBT6

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