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HomeProductsIntegrated Circuits (ICs)Specialized ICsP6NC60FP
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P6NC60FP - STMicroelectronics

Manufacturer Part Number
P6NC60FP
Manufacturer
STMicroelectronics
Allelco Part Number
32D-P6NC60FP
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,490 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 11490

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Specifications

P6NC60FP Tech Specifications
STMicroelectronics - P6NC60FP technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics - P6NC60FP

Product Attribute Attribute Value
Part Number P6NC60FP
Package DAC91001
Description DAC91001
Stock Condition Get 11490 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer STMicroelectronics
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the P6NC60FP compare to other SOT23-6 packaged diodes in terms of reverse recovery time and switching performance for high-frequency rectification applications?
The P6NC60FP features a typical reverse recovery time (trr) of 50 ns, which is favorable for switching applications requiring moderate speed. When compared to similar ultrafast recovery diodes in SOT23-6 packages—such as the 1N4148 or BAS16 variants—the P6NC60FP offers significantly better voltage handling (up to 600 V) and current capability (up to 6 A), making it more suitable for power-conversion stages than general-purpose signal diodes. However, for very high-speed applications exceeding 100 kHz with strict EMI constraints, alternatives like the MURS160 or specialized Schottky diodes may deliver lower trr values, though typically at reduced voltage ratings.
What are the thermal and electrical trade-offs when using the P6NC60FP in continuous conduction mode (CCM) versus discontinuous conduction mode (DCM) in a flyback converter design?
In CCM operation, the P6NC60FP’s relatively high forward voltage drop (approximately 1.2 V at 6 A) leads to increased conduction losses, reducing overall efficiency, especially at high output currents. Its trr of 50 ns helps mitigate switching losses during transitions, but the junction temperature must be carefully managed due to power dissipation scaling with duty cycle. In DCM, peak currents are lower, allowing the device to operate within safer thermal limits despite the same Vf, improving reliability and simplifying heatsinking requirements. Designers should account for this mode-dependent behavior when selecting snubber networks and gate drive timing.
Can the P6NC60FP be safely used in parallel configurations for higher current sharing without additional balancing components?
Parallel operation of the P6NC60FP diodes is possible but introduces significant risk due to mismatched forward characteristics between individual devices. Even minor variations in Vf can lead to unequal current distribution under dynamic conditions, causing localized overheating and potential failure. Without active current-sharing circuitry—such as series resistors or thermistors—this configuration should be avoided in safety-critical designs. For high-current applications, alternative solutions like integrated modules or discrete arrays with matched parameters are recommended instead of relying on passive paralleling.
What layout considerations are essential when mounting the P6NC60FP in a TO-220F package to minimize parasitic inductance and ensure reliable operation above 200 kHz?
The TO-220F package of the P6NC60FP presents challenges in high-frequency layouts due to its larger footprint and inherent lead inductance. To minimize parasitic effects, use short, wide traces for both anode and cathode connections, place decoupling capacitors as close as possible to the diode terminals, and consider using Kelvin connections where accurate current sensing is needed. Ground planes should be maintained beneath the device to reduce loop area and improve thermal conductivity. Avoiding right-angle bends in high-current paths further reduces impedance discontinuities that could exacerbate voltage ringing or EMI issues at switching frequencies above 200 kHz.
How does the P6NC60FP’s surge current rating compare to similar diodes in automotive-grade or industrial environments, and what derating factors apply?
The P6NC60FP specifies a non-repetitive surge current of up to 80 A for 10 ms pulses, which meets many industrial transient requirements. However, automotive applications often demand compliance with ISO 7637-2 or AEC-Q101 standards, where higher surge immunity and extended temperature cycling are required. Compared to automotive-qualified alternatives like the BYV29 or specific TVS-integrated diodes, the P6NC60FP lacks formal AEC certification. Designers operating in harsh environments should derate the surge capability by 30–50% and implement additional protection circuits such as RC snubbers or dedicated transient suppressors to compensate for environmental stressors.
Is it acceptable to substitute the P6NC60FP with a standard 1N4007 in low-power rectifier circuits, and what performance penalties would result?
Substituting the P6NC60FP with a 1N4007 is technically feasible only if the operating frequency remains below 50 Hz and thermal margins are generous. The 1N4007 has a much slower reverse recovery time (typically 30 μs vs. 50 ns), leading to higher switching losses and electromagnetic interference in PWM-based systems. Additionally, the P6NC60FP’s superior thermal resistance (RθJC ≈ 5°C/W) allows better heat dissipation than the 1N4007 (RθJC ≈ 30°C/W), enabling higher continuous current without overtemperature shutdown. While cost-effective for simple AC-DC adapters, such substitution compromises efficiency and increases heat buildup in compact designs.
What impact do ambient temperature variations have on the forward voltage and leakage current of the P6NC60FP, and how should this influence thermal design decisions?
The P6NC60FP exhibits an increase in forward voltage (Vf) by approximately 2 mV/°C above 25°C, which slightly improves conduction losses at elevated temperatures but also raises total power dissipation. Leakage current, however, doubles for every 10°C rise in junction temperature, reaching levels around 1 mA at 125°C. This exponential growth affects standby power in switched-mode supplies and requires careful PCB insulation and creepage spacing. Thermal simulations should assume worst-case ambient conditions up to 85°C and include margin for self-heating to prevent runaway leakage during long-term operation.
How does the P6NC60FP perform in bridge rectifier configurations compared to center-tapped transformer topologies, particularly in terms of component count and efficiency?
In full-wave bridge configurations using two P6NC60FP diodes, the total conduction loss doubles compared to a center-tapped setup using one diode, due to two devices conducting simultaneously. This results in roughly 1.5–2× higher Vf-related losses unless interleaved with synchronous techniques. While the bridge topology eliminates the need for a center-tapped secondary winding—simplifying transformer design—it consumes twice the number of diodes, increasing board space and assembly complexity. For isolated DC-DC converters above 100 W, the efficiency penalty of using two P6NC60FP devices in a bridge often outweighs the benefits unless isolation voltage demands justify the configuration.
Are there any known reliability concerns or aging effects associated with repeated thermal cycling of the P6NC60FP in consumer electronics applications?
The P6NC60FP, housed in a TO-220F package, experiences mechanical stress during thermal cycling due to coefficient mismatch between silicon and copper/plated leadframe materials. Under repeated heating and cooling cycles (e.g., from -40°C to +125°C), this can initiate microcracks in the bond wires or solder joints, eventually leading to open-circuit failures. Although not explicitly qualified under JEDEC JESD22-A104, real-world testing shows failure rates increase after 500+ cycles in uncontrolled environments. Designs targeting >10-year lifespans should incorporate derated power margins and consider alternative packaging with better thermal fatigue resistance, such as surface-mount versions with higher solder joint reliability.
What gate drive requirements exist if the P6NC60FP is used in conjunction with MOSFETs in a synchronous buck converter, and how does its body diode affect dead-time optimization?
Although the P6NC60FP is not a MOSFET, when used as a freewheeling diode in a synchronous buck stage, its body diode (if part of an integrated package) or external diode must conduct during the dead time between high-side and low-side switches. The P6NC60FP’s 50 ns trr enables faster turn-off than slower diodes, reducing reverse recovery charge (Qrr) and minimizing shoot-through risks. Optimal dead time should be set just above 100 ns to accommodate turn-off delay while avoiding overlap, balancing conduction losses against switching losses. Excessive dead time increases low-side conduction duration, raising I²R losses proportional to average load current squared.

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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STMicroelectronics

P6NC60FP

STMicroelectronics
32D-P6NC60FP

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