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HomeProductsCapacitorsCeramic CapacitorsCL02B331KP2NNNC
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CL02B331KP2NNNC - Samsung Electro-Mechanics

Manufacturer Part Number
CL02B331KP2NNNC
Manufacturer
Samsung Electro-Mechanics
Allelco Part Number
32D-CL02B331KP2NNNC
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
745,400 pcs available, New & Original
Parts Description
CAP CER 330PF 10V X7R 01005
Package
01005 (0402 Metric)
Data sheet
CL02B331KP2NNNC.pdf
RoHs Status
ROHS3 Compliant
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Specifications

CL02B331KP2NNNC Tech Specifications
Samsung Electro-Mechanics - CL02B331KP2NNNC technical specifications, attributes, parameters and parts with similar specifications to Samsung Electro-Mechanics - CL02B331KP2NNNC

Product Attribute Attribute Value
Manufacturer Samsung Electro-Mechanics
Voltage - Rated 10V
Tolerance ±10%
Thickness (Max) 0.009' (0.22mm)
Temperature Coefficient X7R
Size / Dimension 0.016' L x 0.008' W (0.40mm x 0.20mm)
Series CL
Ratings -
Package / Case 01005 (0402 Metric)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features -
Failure Rate -
Capacitance 330 pF
Applications General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0020

Frequently Asked Questions(FAQ)

What are the key differences between the CL02B331KP2NNNC and comparable 330pF X7R capacitors in 0402 packaging?
The CL02B331KP2NNNC is a Samsung Electro-Mechanics MLCC rated for 10V with ±10% capacitance tolerance and X7R temperature stability across -55°C to 125°C. When compared to alternatives like the C0402X7R1A331K020BC (which uses 1A voltage rating) or C0402X7R0J331M020BC (0J rated), the CL02B331KP2NNNC's 10V rating provides adequate margin for typical 5V logic circuits with safety headroom, while the ±10% tolerance is standard for general-purpose filtering. The X7R dielectric ensures capacitance drift remains within ±15% across the full temperature range, making it suitable for analog signal coupling and decoupling where temperature stability matters more than ultra-tight tolerance control.
Is the CL02B331KP2NNNC suitable for high-frequency decoupling in modern microcontroller designs?
The CL02B331KP2NNNC at 330pF occupies a mid-frequency decoupling role, typically targeting 100MHz to 500MHz range depending on PCB layout parasitic inductance. At 0402 package dimensions (0.40mm × 0.20mm), the CL02B331KP2NNNC exhibits lower self-resonant frequency compared to larger packages, which can be advantageous for reducing impedance at higher frequencies within its operational window. However, for sub-100pF requirements or frequencies above 1GHz, smaller 0201 packages or lower inductance geometries are preferred. The CL02B331KP2NNNC works best in a multi-layer decoupling stack where it complements bulk and lower-value capacitors; its 330pF value bridges the gap between smaller high-frequency capacitors (10-47pF) and medium-value capacitors (1-10nF).
How does the 10V rating of the CL02B331KP2NNNC affect long-term reliability in 3.3V and 5V applications?
The CL02B331KP2NNNC operates well below its 10V derating threshold in standard 3.3V and 5V circuits, typically seeing 33–50% of rated voltage stress. This substantial voltage margin significantly extends projected lifetime; ceramic capacitor aging accelerates nonlinearly as voltage approaches rated limits. At 50% stress on the CL02B331KP2NNNC, capacitance degradation from aging follows a much gentler slope than operation near rating. The MSL 1 (moisture sensitivity level) rating indicates the CL02B331KP2NNNC requires no baking before reflow, reducing assembly risk. For designs operating at 5V continuous, the CL02B331KP2NNNC provides approximately 2× safety margin compared to a 5V-rated alternative, translating to lower probability of parametric drift or latent failure over a 10–15 year field life.
What is the practical capacitance change across temperature for the CL02B331KP2NNNC in real-world filtering applications?
The CL02B331KP2NNNC uses X7R dielectric, which exhibits ±15% maximum capacitance variation from -55°C to 125°C. For a nominal 330pF device, this translates to approximately 280pF at one temperature extreme and 380pF at the other. In coupling or RF matching circuits where absolute capacitance matters, this 100pF swing (relative to the 330pF target) can shift resonant frequencies by 5–10%, potentially affecting filter corner frequencies or impedance matching. However, for general decoupling and bypass filtering, the CL02B331KP2NNNC's X7R stability is sufficient because bypass effectiveness remains within acceptable bounds across the temperature range. For applications like temperature-compensated oscillator biasing or precision RF networks, the ±10% manufacturing tolerance combined with X7R drift should be factored into circuit margin calculations.
Can the CL02B331KP2NNNC be reliably used in automotive or industrial temperature cycling environments?
The CL02B331KP2NNNC is rated for -55°C to 125°C continuous operation, which covers most industrial and automotive ambient scenarios. However, automotive thermal cycling—particularly under underhood conditions reaching 150°C or thermal shock cycles from -40°C to +85°C repeated hundreds of times—introduces mechanical stress beyond simple ambient temperature limits. The 0402 form factor of the CL02B331KP2NNNC, combined with its thin 0.22mm maximum thickness, provides some mechanical flexibility, but repeated solder joint cycling can cause cracking at the termination interface. For automotive-qualified applications, components bearing AEC-Q200 certification are preferred; the CL02B331KP2NNNC should be verified against specific automotive qualification reports if field reliability over 10+ years is required. In industrial environments with moderate cycling (e.g., ±20°C daily swings), the CL02B331KP2NNNC is typically reliable when mounted on rigid PCBs with adequate thermal mass.
How does the ultra-small 01005 package size of the CL02B331KP2NNNC affect PCB layout and assembly yields?
The CL02B331KP2NNNC in 01005 (0.40mm × 0.20mm) is among the smallest discrete passives available, requiring precision handling and high-capability assembly equipment. Component placement accuracy must be ±0.05mm or better, limiting production to advanced contract manufacturers with jet printer or vision-guided placement systems. Rework becomes extremely difficult—hand-soldering the CL02B331KP2NNNC risks accidental tombstoning or component loss due to small pad size and mass. Thermal profiling must be tightly controlled; the small mass means rapid heating and cooling, increasing risk of solder joint voids if reflow curves are not optimized. Inspection of solder joints requires X-ray or high-magnification optical systems. PCB design must include adequate clearance between adjacent CL02B331KP2NNNC components and traces; trace routing between pads becomes constrained. For prototyping or low-volume production, 0402 (1005) equivalents may offer more practical assembly, though they occupy 2.5× the board area.
What substitutes exist for the CL02B331KP2NNNC, and are there functional or supply-chain trade-offs?
The CL02B331KP2NNNC has several functionally similar alternatives, including C0402X7R1A331K020BC, C0402X7R0J331M020BC, C0402X7R1A331M020BC, C0402X7R0G331M020BC, and C0402X7R0J331K020BC. The primary differences lie in voltage rating (0G = 4V, 0J = 6.3V, 1A = 10V) and tolerance code (K = ±10%, M = ±20%). The CL02B331KP2NNNC at 10V with ±10% offers tighter voltage margin and tolerance compared to 0G or 0J alternatives; however, 0J-rated substitutes are often more readily available from alternative suppliers and may reduce single-source risk. Tolerance differences affect circuit performance variability—the M-tolerance variants introduce ±20% capacitance spread, which can exceed ±15% X7R temperature drift in worst-case stack-up. Substitution requires re-validation of circuit performance at tolerance and temperature extremes; interchangeability is not guaranteed without engineering review.
How should the CL02B331KP2NNNC be specified for long-term supply chain continuity in consumer electronics designs?
The CL02B331KP2NNNC is ROHS3 compliant and uses lead-free solder termination, but component lifecycles in consumer markets typically span 5–7 years before manufacturer discontinuation. For designs targeting 10+ year product support, specifying multiple approved alternatives (such as the cross-referenced C0402X7R1A331K020BC) in design documentation and maintaining qualification history for at least two secondary sources reduces obsolescence risk. The 01005 package size limits suppliers to high-volume manufacturers; lower-demand devices in this form factor face earlier discontinuation. Design reviews should include a bill-of-materials (BOM) strategy that identifies the CL02B331KP2NNNC as a preferred component with qualified alternates; communicating this to procurement teams enables proactive qualification of alternatives before supply disruption. Inventory buffering of 6–12 months for the CL02B331KP2NNNC in high-volume products is a practical hedge against sudden availability shifts.
What ESR (equivalent series resistance) and inductance characteristics should be expected from the CL02B331KP2NNNC in filtering circuits?
The CL02B331KP2NNNC datasheet typically does not explicitly publish ESR or ESL values; these must be inferred from impedance curves or measured. For a 330pF capacitor in 01005 package, ESR is typically 50–200 mΩ at 1MHz, while ESL (equivalent series inductance) ranges from 0.3–0.8nH depending on lead termination geometry and PCB layout. The self-resonant frequency (SRF) of the CL02B331KP2NNNC typically falls in the 2–5GHz range, making it unsuitable for DC decoupling at frequencies above this point. In practical circuits, the impedance of the CL02B331KP2NNNC decreases with frequency until SRF, then increases. For decoupling stack analysis, the CL02B331KP2NNNC provides low impedance across the 100MHz–1GHz band in typical PCB stackups with microvia connectivity. Direct measurement on the target PCB and with actual layer stackup is recommended for high-speed designs where impedance profile is critical.
Is the CL02B331KP2NNNC appropriate for RF and microwave matching or coupling networks?
The CL02B331KP2NNNC at 330pF can serve RF coupling or matching roles in circuits operating from 100MHz to approximately 1GHz, depending on impedance level and Q-factor requirements. At 2.4GHz (common in ISM band designs), the CL02B331KP2NNNC impedance is approximately 20–30Ω, making it more suitable for low-impedance matching (source/load under 50Ω). The ±10% tolerance of the CL02B331KP2NNNC introduces 0.5–1dB gain variation in matching networks if not trimmed; RF designs typically require tighter tolerance (±5%) or post-fabrication tuning (via variable capacitors or PCB layout adjustment). The X7R temperature coefficient results in approximately 100–150ppm/°C frequency drift in resonant circuits, which may exceed ±2% over a 100°C operating range—acceptable for many IoT and consumer RF modules but marginal for frequency-locked or temperature-critical systems. For precision RF work, the CL02B331KP2NNNC should be paired with temperature-compensated inductors or active tuning.
What moisture ingress risk and baking requirements apply to the CL02B331KP2NNNC after extended storage?
The CL02B331KP2NNNC is rated MSL 1 (moisture sensitivity level 1), indicating no baking requirement before reflow soldering regardless of storage duration. This is a significant advantage over higher MSL components and reflects the ceramic dielectric's low moisture absorption. However, MSL 1 does not mean the CL02B331KP2NNNC is immune to moisture; stored components should be maintained in dry conditions (below 40% relative humidity) to prevent lead frame corrosion or solder pad oxidation. If the CL02B331KP2NNNC has been stored in humid conditions (above 60% RH) for several months, visual inspection for discoloration or corrosion on terminations is prudent, though no formal baking cycle is mandated. Upon receipt, the CL02B331KP2NNNC can proceed directly to pick-and-place without desiccant cabinet time, reducing assembly process complexity and shortening time-to-production compared to higher MSL components.
How do aging and voltage derating interact to affect the CL02B331KP2NNNC lifetime model?
Ceramic capacitor aging—permanent capacitance loss over time—is voltage-dependent; the CL02B331KP2NNNC aged at 50% rated voltage (5V applied) loses approximately 1.5–2% capacitance per decade (10× time span), while aging accelerates nonlinearly above 75% rating. At 3.3V (33% rating), aging is approximately half the rate, yielding roughly 0.7–1% per decade. Over 10 years, a CL02B331KP2NNNC at 5V continuous may degrade from 330pF to approximately 310–315pF, a 5–6% change within the ±10% tolerance band. Designs sensitive to capacitance drift (e.g., frequency-setting circuits) should account for aging in circuit margins; conservative designs apply an initial de-rating of 10–15% below nominal capacitance in calculations. The CL02B331KP2NNNC's ±10% manufacturing tolerance combined with aging drift means worst-case end-of-life capacitance could be 20–25% below initial nominal, which should be factored into filter corner frequency or impedance matching calculations for long-life products.
What are the thermal and acoustic considerations when using the CL02B331KP2NNNC near switching power supplies or high-dI/dt circuits?
The CL02B331KP2NNNC, like all MLCCs, can exhibit piezoelectric effects—mechanical vibration induced by rapidly changing electric fields. Near switching regulators with dI/dt transitions in the 1–10 A/μs range, the CL02B331KP2NNNC may vibrate at frequencies audible in the 20–100kHz band, potentially producing an audible whine. The thin 0.22mm form factor of the 01005 CL02B331KP2NNNC makes it more susceptible to acoustic resonance than larger packages. Thermal considerations are minimal—the CL02B331KP2NNNC's small capacitance (330pF) and low ESR result in negligible self-heating even at high-frequency charging/discharging. However, proximity to high-power components can elevate localized PCB temperature; thermal modeling or empirical measurement of CL02B331KP2NNNC junction temperature under worst-case switching conditions is prudent for high-reliability designs. Placing the CL02B331KP2NNNC close to the switching node (within 5mm) minimizes loop inductance and reduces electromagnetic interference, but requires careful thermal management if the switching device dissipates significant power.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samsung Electro-Mechanics CL02B331KP2NNNC

Product Attribute CL02B221KP2NNNC CL02B151KP2NNNC CL02B121KP2NNNC CL02B102KP2NNNC
Part Number CL02B221KP2NNNC CL02B151KP2NNNC CL02B121KP2NNNC CL02B102KP2NNNC
Manufacturer Samsung Electro-Mechanics Samsung Electro-Mechanics Samsung Electro-Mechanics Samsung Electro-Mechanics
Features - - - Simultaneous Sampling
Temperature Coefficient - - - -
Thickness (Max) - - - -
Size / Dimension - - - -
Applications - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Capacitance - - - -
Lead Spacing - - - -
Height - Seated (Max) - - - -
Series - - - -
Voltage - Rated - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Failure Rate - - - -
Lead Style - - - -
Ratings - - - -
Tolerance - - - -

CL02B331KP2NNNC Datasheet PDF

Download CL02B331KP2NNNC pdf datasheets and Samsung Electro-Mechanics documentation for CL02B331KP2NNNC - Samsung Electro-Mechanics.

Datasheets
CL02B331KP2NNNC Spec.pdf
HTML Datasheet
CL Series, MLCC Datasheet.pdf Multitlayer Ceramic Cap Catalog.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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CL02B331KP2NNNC Image

CL02B331KP2NNNC

Samsung Electro-Mechanics
32D-CL02B331KP2NNNC

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