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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)DW-04-19-F-S-1065
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DW-04-19-F-S-1065 - Samtec Inc.

Manufacturer Part Number
DW-04-19-F-S-1065
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-DW-04-19-F-S-1065
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
45,812 pcs available, New & Original
Parts Description
CONN HDR 4POS 0.1 STACK T/H GOLD
Package
Bulk
Data sheet
DW-04-19-F-S-10.pdf
RoHs Status
 
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Specifications

DW-04-19-F-S-1065 Tech Specifications
Samtec Inc. - DW-04-19-F-S-1065 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - DW-04-19-F-S-1065

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, DW
Row Spacing -
Pitch 0.100' (2.54mm)
Package Bulk
Number of Rows 1
Number of Positions 4
Mounting Type Through Hole
Product Attribute Attribute Value
Length - Tail 0.110' (2.794mm)
Length - Stack Height 1.065' (27.051mm)
Length - Post (Mating) 0.155' (3.937mm)
Length - Overall Pin 1.330' (33.782mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number DW-04-19

Frequently Asked Questions(FAQ)

What is the stack height specification of the DW-04-19-F-S-1065, and how does it affect PCB layout planning?
The DW-04-19-F-S-1065 has a stack height of 1.065 inches (27.051mm), which defines the vertical distance from the PCB surface to the top of the connector header. This dimension is critical for enclosure design, as it determines clearance requirements above the board and influences whether daughterboards or shields can be mounted in proximity. The 1.330-inch overall pin length of the DW-04-19-F-S-1065 means approximately 0.265 inches (6.731mm) extends below the PCB after soldering, so mechanical retention or strain relief may be needed depending on vibration exposure.
How does the mating post length of the DW-04-19-F-S-1065 compare to standard 0.1-inch pitch headers, and what mating force implications does this create?
The DW-04-19-F-S-1065 features a 0.155-inch (3.937mm) mating post length, which is relatively shallow compared to extended-post variants common in industrial applications. This shorter engagement depth reduces insertion/withdrawal forces and is suitable for low-vibration consumer and commercial environments, but it also leaves less contact surface area for current-carrying capacity and mechanical retention during thermal cycling. Applications requiring repeated mating cycles or high-reliability performance may need auxiliary locking features or complementary connector designs paired with the DW-04-19-F-S-1065.
What are the practical current-carrying limits of the DW-04-19-F-S-1065 given its gold contact finish and 0.100-inch pitch in a 4-position configuration?
The DW-04-19-F-S-1065 uses gold-plated contacts (3.00µin finish thickness) with 4 positions at 0.100-inch spacing, a configuration typically rated for 1–2 amperes per contact in continuous applications, though peak transient currents can be higher. The thin gold plating (0.076µm) is sufficient for signal-level and low-power applications but may show accelerated wear under high-frequency switching or high-current pulse scenarios. For designs approaching 1.5A per contact on the DW-04-19-F-S-1065, thermal analysis and contact resistance verification are recommended to avoid localized heating or intermittent connection loss.
How does the DW-04-19-F-S-1065 tail length of 0.110 inches affect solder joint reliability and PCB trace routing?
The DW-04-19-F-S-1065 has a 0.110-inch (2.794mm) tail length, which creates a relatively short solder-joint footprint. This short tail reduces mechanical stress on the solder joint during thermal cycling because the connector body is closer to the PCB, minimizing lever-arm effects from vibration or thermal expansion mismatches. However, the compact geometry also limits trace routing space beneath the connector and can make rework or inspection more difficult. PCB designers using the DW-04-19-F-S-1065 should plan for thermal relief pads and avoid routing high-speed signals immediately underneath the connector to prevent crosstalk or impedance discontinuities.
Is the DW-04-19-F-S-1065 suitable for automated assembly, and what handling precautions apply during pick-and-place operations?
The DW-04-19-F-S-1065 is through-hole mounted and compatible with wave or selective soldering processes typical in automated assembly. However, the 1.065-inch stack height and 0.100-inch pitch make it relatively tall and narrow, which can create vacuum-cup pickup challenges during pick-and-place if the gripper contact area is inadequate. Ensuring proper pick-point geometry and sufficient contact pressure during placement minimizes misalignment. Post-placement inspection via automated optical inspection (AOI) is recommended for the DW-04-19-F-S-1065 because the vertical geometry can obscure solder fillet visibility from standard top-down camera angles.
What environmental and regulatory compliance factors should be verified before specifying the DW-04-19-F-S-1065 in aerospace or automotive applications?
The DW-04-19-F-S-1065 is RoHS3 Compliant and REACH Unaffected, making it suitable for consumer and most commercial applications. However, it carries an ECCN classification of EAR99, which has no export restrictions. For aerospace applications, additional qualification such as MIL-DTL-55302 or IPC-A-610 acceptance criteria may be required, and design approval would need to verify that the DW-04-19-F-S-1065's gold finish thickness and through-hole termination meet flight-critical reliability standards. Automotive applications typically require AEC-Q200 or equivalent testing; verify with Samtec whether the DW-04-19-F-S-1065 holds such certifications or whether substitute models in the Flex Stack series are preferred.
How does the gold contact finish thickness of 3.00µin on the DW-04-19-F-S-1065 affect long-term reliability in humid or corrosive environments?
The 3.00µin (0.076µm) gold plating on the DW-04-19-F-S-1065 is a standard commercial finish designed to prevent base-metal corrosion and maintain contact resistance over the product's intended service life in typical indoor environments. In applications with extended exposure to salt-spray, high humidity (>85% RH), or industrial contaminants, the relatively thin gold layer on the DW-04-19-F-S-1065 may eventually wear through, exposing underlying nickel or copper to oxidation. For such environments, periodic maintenance inspection, conformal coating, or connector enclosures are advisable. Alternative Samtec connectors with thicker palladium-nickel or hard-gold finishes should be evaluated if the DW-04-19-F-S-1065 is intended for marine or outdoor long-term exposure.
What is the effective current density when distributing power across all 4 positions of the DW-04-19-F-S-1065, and how does unbalanced loading affect contact wear?
Distributing current evenly across the four contacts of the DW-04-19-F-S-1065 optimizes performance and extends service life. If, for example, all 4A of circuit current flows through a single contact pair on the DW-04-19-F-S-1065, contact resistance becomes non-linear, localized heating accelerates, and gold migration or micro-welding risk increases, potentially causing intermittent connection or short circuits. Best practice with the DW-04-19-F-S-1065 is to dedicate separate contacts for power, return, and signal functions, or to parallel multiple DW-04-19-F-S-1065 connectors if higher aggregate current capacity is needed. Contact resistance and thermal model validation under the intended load profile should be performed before production release.
How does the 0.100-inch pitch of the DW-04-19-F-S-1065 compare to 0.050-inch alternatives when balancing ease of hand assembly against density requirements?
The DW-04-19-F-S-1065 uses the ubiquitous 0.100-inch (2.54mm) pitch, which offers superior hand-assembly ergonomics, lower soldering defect rates, and readily available low-cost mating connectors and accessories compared to 0.050-inch and smaller pitches. For prototyping, field service, and lower-production-volume applications, the DW-04-19-F-S-1065's pitch is ideal. However, if PCB real estate is severely constrained or if the design requires more than 8–10 signals in a compact footprint, 0.050-inch or finer-pitch alternatives from the Flex Stack series should be evaluated. The trade-off with smaller pitch is increased assembly cost, reduced rework tolerance, and higher soldering defect probability, making the DW-04-19-F-S-1065 the preferred choice for cost-conscious or reliability-critical designs.
What mating connector options are compatible with the DW-04-19-F-S-1065, and how do pin-length specifications affect interchangeability?
The DW-04-19-F-S-1065 is a header connector designed to mate with standard 0.100-inch-pitch socket connectors, commonly available from multiple suppliers. Pin-length compatibility is critical: the DW-04-19-F-S-1065 has a mating post length of 0.155 inches, so socket connectors with insertion-depth ratings at or above this value will engage reliably. Shorter-post sockets may fail to achieve full insertion, resulting in high contact resistance or intermittent faults. Cross-compatibility between the DW-04-19-F-S-1065 and sockets from manufacturers other than Samtec should be verified through mating-force testing and continuity checks in prototype builds to confirm dimensional tolerance stack-up does not cause binding or under-insertion.
Does the DW-04-19-F-S-1065 require any conformal coating considerations, and how does the connector geometry affect coating application uniformity?
If conformal coating is required for moisture or contamination protection, the DW-04-19-F-S-1065's tall, narrow profile can create shadowing zones where coating thickness is reduced or uneven, particularly in the gap between the connector body and mating contacts. Vacuum-based coating processes (parylene or vapor-phase) provide better coverage uniformity on the DW-04-19-F-S-1065 than liquid spray or dip methods. If liquid coating is used, masking or post-coating cleaning of the mating interface is essential to prevent coating buildup that could cause high insertion forces or connection failures. Field-assembled or frequently disconnected applications may benefit from selectively leaving the mating area of the DW-04-19-F-S-1065 uncoated to preserve mating reliability.
How should the DW-04-19-F-S-1065 be oriented and supported on the PCB to minimize solder-joint stress during thermal cycling?
The DW-04-19-F-S-1065 should be mounted perpendicular to the PCB with its solder joints aligned to the connector centerline to distribute thermal stress evenly. The 1.065-inch stack height creates a significant moment arm above the PCB; if the connector is subjected to vibration or thermal cycling, the solder joints experience cyclic stress. Thermal expansion mismatches between the connector body (typically plastic or composite) and the PCB cause flex at the joint interface. To mitigate this, ensure adequate solder fillet volume on each pin of the DW-04-19-F-S-1065, use thermal-relief pads for larger ground connections, and avoid routing rigid cable or harnesses directly to the mating end—instead, route from the side or incorporate strain relief. Testing of prototype assemblies with the DW-04-19-F-S-1065 under thermal shock (−10°C to +70°C, minimum 5 cycles) is advisable for applications in automotive or industrial environments.
What is the approximate contact resistance specification for the DW-04-19-F-S-1065, and how does it affect signal integrity in high-speed or low-voltage applications?
Commercial-grade 0.100-inch-pitch connectors like the DW-04-19-F-S-1065 typically have initial contact resistance in the range of 15–50 mΩ per contact when new and properly seated, though this can increase over time due to wear, corrosion, or contamination. For analog signal applications or low-voltage sensor interfaces (3.3V or 5V logic), a contact resistance of 30–50 mΩ on the DW-04-19-F-S-1065 introduces minimal voltage drop (typically <0.1% for milliamp-level currents). However, in high-speed digital applications (GHz frequencies) or differential signaling, the DW-04-19-F-S-1065's inductance and discontinuity effects may dominate over ohmic resistance, potentially causing signal reflections or timing skew. For high-speed designs, validate return-path continuity and consider shielded variants or co-designed signal routing.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. DW-04-19-F-S-1065

Product Attribute DW-04-19-F-S-1035 DW-04-19-F-S-1050 DW-04-19-F-S-1055 DW-04-19-F-S-1060
Part Number DW-04-19-F-S-1035 DW-04-19-F-S-1050 DW-04-19-F-S-1055 DW-04-19-F-S-1060
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Number of Positions - - - -
Length - Post (Mating) - - - -
Row Spacing - - - -
Length - Tail - - - -
Series - - - -
Color - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Rows - - - -
Length - Stack Height - - - -
Contact Finish Thickness - Post (Mating) - - - -
Pitch - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Length - Overall Pin - - - -
Termination - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish - Post (Mating) - - - -

DW-04-19-F-S-1065 Datasheet PDF

Download DW-04-19-F-S-1065 pdf datasheets and Samtec Inc. documentation for DW-04-19-F-S-1065 - Samtec Inc..

HTML Datasheet
DW/EW/ZW Drawing Sheet 1.pdf DW,EW,ZW,HW Series Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
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    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
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    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Samtec Inc.

DW-04-19-F-S-1065

Samtec Inc.
98D-DW-04-19-F-S-1065

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