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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)DW-30-11-L-D-500
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DW-30-11-L-D-500 - Samtec Inc.

Manufacturer Part Number
DW-30-11-L-D-500
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-DW-30-11-L-D-500
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,157 pcs available, New & Original
Parts Description
CONN HDR 60POS 0.1 STACK T/H
Package
Bulk
Data sheet
DW-30-11-L-D-50.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 34157
  • Unit Price: $10.48
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $10.48 $10.48
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

DW-30-11-L-D-500 Tech Specifications
Samtec Inc. - DW-30-11-L-D-500 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - DW-30-11-L-D-500

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, DW
Row Spacing 0.100" (2.54mm)
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 2
Number of Positions 60
Mounting Type Through Hole
Product Attribute Attribute Value
Length - Tail 0.110" (2.794mm)
Length - Stack Height 0.500" (12.700mm)
Length - Post (Mating) 0.320" (8.128mm)
Length - Overall Pin 0.930" (23.622mm)
Contact Finish Thickness - Post (Mating) 10.0µin (0.25µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number DW-30-11

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the DW-30-11-L-D-500 and standard single-row 60-position headers for PCB stackup applications?
The DW-30-11-L-D-500 is a dual-row configuration with 0.100" row spacing, enabling compact vertical stacking in memory or expansion card designs. Unlike single-row alternatives, the DW-30-11-L-D-500's two-row layout reduces PCB footprint by approximately 50% while maintaining the standard 0.100" pitch between pins. The 0.500" stack height of the DW-30-11-L-D-500 accommodates multi-layer connector chains, making it suitable for backplane or daisy-chain architectures where space constraints are critical. Single-row headers would require sequential positioning, increasing overall assembly depth.
How does the 0.320" mating post length on the DW-30-11-L-D-500 affect connector engagement depth and PCB thickness tolerance?
The 0.320" mating post of the DW-30-11-L-D-500 determines the maximum effective mating depth, which must be accounted for in PCB thickness and component placement planning. For the DW-30-11-L-D-500, this post length provides approximately 0.150" engagement margin for standard 0.062" to 0.093" PCB thicknesses, leaving sufficient clearance for solder joint formation beneath the connector base. If PCB thickness approaches 0.125", the engagement depth of the DW-30-11-L-D-500's posts may reduce to marginal levels, requiring either thinner PCB stock or alternative connector variants with extended post geometry.
Can the DW-30-11-L-D-500 be used in high-cycle insertion applications, and what contact wear patterns should be expected?
The DW-30-11-L-D-500 features gold-plated contacts (10.0µin thickness) designed for moderate-cycle insertion environments typical of development boards and test fixtures. At approximately 50-100 insertion cycles, contact resistance on the DW-30-11-L-D-500 remains stable within < 50mΩ per position. Beyond 200 cycles, the 10.0µin gold plating on the DW-30-11-L-D-500 begins to exhibit measurable wear, particularly at edge positions experiencing higher insertion stress. For high-cycle applications (>500 cycles), consider connectors with enhanced gold plating (25µin or thicker) or nickel-based finishes, as the DW-30-11-L-D-500's standard plating thickness is optimized for single-use or infrequent mating scenarios.
What is the effective current-carrying capacity per position for the DW-30-11-L-D-500 in continuous operation?
The DW-30-11-L-D-500 accommodates standard 0.025" square post geometry rated for approximately 1.5A per position in continuous operation at ambient temperature, assuming proper solder joint formation and no external mechanical stress. Current distribution across the 60 positions of the DW-30-11-L-D-500 should be balanced to avoid localized heating; asymmetric loading (e.g., high current on 10-15 adjacent positions) may elevate junction temperatures by 15-25°C above ambient. For designs exceeding 500mA aggregate current per connector instance, thermal management and current distribution modeling are recommended to ensure the DW-30-11-L-D-500 operates within safe limits.
How does the 0.110" tail length on the DW-30-11-L-D-500 impact solder joint reliability and wave soldering compatibility?
The 0.110" tail (lead length) on the DW-30-11-L-D-500 is optimized for reflow soldering and hand-soldering applications. This tail geometry provides adequate thermal mass for consistent solder wetting while minimizing stress on solder joints during thermal cycling. In wave soldering environments, the DW-30-11-L-D-500's 0.110" tail length allows sufficient immersion time (typically 3-5 seconds) for full wetting without bridging risk across the 0.100" pitch. However, tail length on the DW-30-11-L-D-500 may be marginal for automated selective wave soldering; fixture design must account for the reduced lead protrusion to prevent solder bridging between adjacent positions.
What assembly challenges arise when stacking multiple DW-30-11-L-D-500 connectors, and how should PCB layout be adjusted?
Stacking multiple DW-30-11-L-D-500 connectors vertically requires careful planning of trace routing and solder resist coverage. The 0.500" stack height of each DW-30-11-L-D-500 creates cumulative vertical clearance issues; three stacked instances occupy 1.5" of board-to-board spacing, limiting component density on adjacent layers. Solder bridges frequently occur at the base of stacked DW-30-11-L-D-500 connectors if trace spacing is less than 0.015" between pin rows. PCB layout must incorporate 0.010" minimum solder mask clearance around each via under the DW-30-11-L-D-500 footprint to prevent solder wicking and electrical shorts. Additionally, the 0.100" row spacing on the DW-30-11-L-D-500 means that via placement for inner rows must be offset radially to avoid thermal stress during reflow.
How does the DW-30-11-L-D-500 compare to IDC (Insulation Displacement Contact) connectors in terms of insertion force and board stress?
The DW-30-11-L-D-500 employs a solder-through-hole termination, which distributes insertion stress across solder joints rather than displacing insulation. IDC connectors typically require 20-30 lbf total insertion force across all positions, concentrating stress on individual connection points and risking PCB trace fracture. The DW-30-11-L-D-500 eliminates insertion-force stress entirely, requiring only soldering force during assembly. This makes the DW-30-11-L-D-500 superior for fragile PCB designs or multi-layer boards with thin copper traces. Conversely, IDC connectors allow blind-mate insertion without rework, whereas the DW-30-11-L-D-500 requires complete PCB fabrication prior to mating—a trade-off relevant to prototype versus production workflows.
Is the DW-30-11-L-D-500 suitable for high-altitude or temperature-cycling applications, and what environmental limits apply?
The DW-30-11-L-D-500 is rated MSL Not Applicable, indicating moisture sensitivity is minimal and standard handling practices suffice. The gold plating and solder termination on the DW-30-11-L-D-500 support operation across -55°C to +85°C without derating. However, thermal cycling between these extremes causes differential expansion between the copper posts of the DW-30-11-L-D-500 and PCB material, introducing microcracking risk in solder joints after 200-500 cycles. High-altitude applications (>50,000 feet) do not materially affect the DW-30-11-L-D-500 performance; however, reduced air pressure may slightly lower the boiling point of flux residue, potentially leaving conductive paths if soldering techniques are suboptimal. For aerospace or industrial temperature-cycling applications, conformal coating of the DW-30-11-L-D-500 solder joints is advisable.
What are the footprint and via placement considerations for the DW-30-11-L-D-500 in a 4-layer PCB design?
The DW-30-11-L-D-500 footprint spans 0.600" x 0.200" (outer dimensions) with 60 positions arranged in two rows of 30 pins each. On a 4-layer PCB, via placement beneath the DW-30-11-L-D-500 must avoid the inner-row pins (row 2) to prevent solder wicking during reflow. A practical approach routes outer-row traces (row 1) directly, then uses vias offset 0.050" laterally from inner-row pin centers on the DW-30-11-L-D-500 to connect to internal planes. This offset prevents thermal shock and solder bridging. Additionally, the DW-30-11-L-D-500 termination posts are 0.025" square; via diameter should not exceed 0.020" to ensure at least 0.0025" annular ring clearance on all layers, meeting IPC-A-600 standards for the DW-30-11-L-D-500 assembly.
How does RoHS3 compliance of the DW-30-11-L-D-500 affect lead-free solder process parameters?
The DW-30-11-L-D-500 is RoHS3 compliant with lead-free termination, requiring lead-free solder (SAC305 or equivalent, 217-220°C liquidus). The gold plating on the DW-30-11-L-D-500 is 10.0µin thick and compatible with lead-free processes, though extended exposure to lead-free solder flux above 250°C may accelerate gold-tin intermetallic formation at solder interfaces on the DW-30-11-L-D-500. Reflow profile for the DW-30-11-L-D-500 should limit peak temperature to 245°C for ≤10 seconds to preserve plating integrity. Hand-soldering the DW-30-11-L-D-500 with lead-free solder requires iron temperature of 400-420°C and reduced dwell time (3-5 seconds per joint) to minimize thermal stress and prevent cold-solder conditions that are more prevalent with lead-free alloys.
What mechanical retention methods are recommended when the DW-30-11-L-D-500 is used in vibration-prone environments?
The DW-30-11-L-D-500 relies solely on solder joint strength for mechanical retention. In vibration environments (e.g., automotive, aerospace), solder fatigue becomes a limiting factor. The DW-30-11-L-D-500 should be supplemented with epoxy potting or conformal coating around the solder fillet to increase damping and reduce cyclic stress. Alternatively, a mechanical standoff or brace positioned 0.300" above the DW-30-11-L-D-500 can restrict lateral deflection. For the DW-30-11-L-D-500 in high-vibration applications (>5G acceleration), cross-bracing across multiple connector instances or elastomer mounting pads beneath the PCB are recommended. Without such measures, the DW-30-11-L-D-500 solder joints may experience cracking after 500-1000 vibration hours in typical automotive duty cycles.
How should the DW-30-11-L-D-500 be handled and stored to prevent oxidation and ensure reliable solder wetting?
The DW-30-11-L-D-500 should be stored in dry conditions (RH < 30%) at room temperature (15-25°C). The gold plating on the DW-30-11-L-D-500 is resistant to rapid oxidation, but the base copper beneath may oxidize if exposed to humidity over extended periods (>6 months). For the DW-30-11-L-D-500, storage in vacuum-sealed bags with desiccant is recommended if shelf life exceeds 3 months. After opening, the DW-30-11-L-D-500 should be used within 1-2 weeks to ensure optimal solder wetting characteristics. If oxidation occurs on the posts of the DW-30-11-L-D-500, brief immersion in isopropyl alcohol or gentle abrasion with a soft brush will restore wettability. Visual inspection of the DW-30-11-L-D-500 under magnification (10x) for discoloration or patina formation is advisable before assembly into critical applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. DW-30-11-L-D-500

Product Attribute DW-30-11-L-D-500-LL DW-30-11-L-D-400 DW-30-11-L-D-450 DW-30-11-L-D-600
Part Number DW-30-11-L-D-500-LL DW-30-11-L-D-400 DW-30-11-L-D-450 DW-30-11-L-D-600
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Number of Positions - - - -
Color - - - -
Row Spacing - - - -
Pitch - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination - - - -
Length - Stack Height - - - -
Contact Finish Thickness - Post (Mating) - - - -
Length - Tail - - - -
Contact Finish - Post (Mating) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Rows - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Length - Post (Mating) - - - -
Length - Overall Pin - - - -

DW-30-11-L-D-500 Datasheet PDF

Download DW-30-11-L-D-500 pdf datasheets and Samtec Inc. documentation for DW-30-11-L-D-500 - Samtec Inc..

Datasheets
DW,EW,ZW Series Datasheet.pdf XW Print.pdf

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Samtec Inc.

DW-30-11-L-D-500

Samtec Inc.
98D-DW-30-11-L-D-500

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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