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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)DW-30-12-F-D-775
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DW-30-12-F-D-775 - Samtec Inc.

Manufacturer Part Number
DW-30-12-F-D-775
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-DW-30-12-F-D-775
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
41,728 pcs available, New & Original
Parts Description
CONN HDR 60POS 0.1 STACK T/H
Package
Bulk
Data sheet
DW-30-12-F-D-77.pdf
RoHs Status
ROHS3 Compliant
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Specifications

DW-30-12-F-D-775 Tech Specifications
Samtec Inc. - DW-30-12-F-D-775 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - DW-30-12-F-D-775

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, DW
Row Spacing 0.100" (2.54mm)
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 2
Number of Positions 60
Mounting Type Through Hole
Product Attribute Attribute Value
Length - Tail 0.110" (2.794mm)
Length - Stack Height 0.775" (19.685mm)
Length - Post (Mating) 0.145" (3.683mm)
Length - Overall Pin 1.030" (26.162mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number DW-30-12

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the physical footprint and PCB real estate impact of the DW-30-12-F-D-775 when integrating multiple stacked connectors on a single board?
The DW-30-12-F-D-775 occupies a 60-position dual-row configuration with 0.100" pitch spacing in both directions, creating a compact 0.6" × 0.1" footprint per row pair. The critical dimension for multi-connector layouts is the 0.775" stack height, which determines vertical clearance requirements when daisy-chaining or paralleling multiple DW-30-12-F-D-775 headers. For boards with constrained Z-height budgets, this 19.685mm stack dimension becomes a binding constraint; designers must verify clearance against component bodies in adjacent assembly layers. The 0.110" tail length provides minimal solder joint standoff, reducing the risk of bridging but requiring careful trace routing beneath the DW-30-12-F-D-775 to avoid signal integrity degradation in high-speed applications.
How does the gold contact finish specification on the DW-30-12-F-D-775 affect mating cycle durability and connector performance in high-reliability applications?
The DW-30-12-F-D-775 features a 3.00µin (0.076µm) gold plating on the mating posts, which is a thin overlay finish rather than a thick electroplated coating. This thickness is typical for cost-optimized headers but provides limited wear resistance compared to 10–20µin finishes used in aerospace or industrial applications. In mating cycles under 100 insertions, the DW-30-12-F-D-775 gold layer remains intact and maintains reliable contact resistance (typically <50mΩ per contact). However, beyond 200 cycles, the finish may wear through to base copper, introducing oxidation and increasing contact resistance by 2–5×, particularly in humid or thermally cycled environments. For applications exceeding 50 mating cycles annually, designers should specify gold-plated cable-side connectors to minimize reciprocal abrasion and consider conformal coating to protect the DW-30-12-F-D-775 contact area from environmental corrosion.
What are the thermal dissipation and current distribution characteristics of the DW-30-12-F-D-775 in high-density power distribution scenarios?
The DW-30-12-F-D-775 is primarily designed for signal routing rather than bulk power delivery; its 60 contacts support a theoretical maximum of 3A per pin under standard conditions, but thermal coupling in the 0.100" pitch dual-row configuration creates localized hotspots when multiple pins carry current simultaneously. In practical designs, the DW-30-12-F-D-775 performs acceptably for auxiliary power rails (±5V, ±12V) at <500mA per rail, but using it as a primary power distribution connector for >5A aggregate current leads to temperature rise of 15–25°C above ambient, increasing contact resistance and accelerating gold layer degradation. Designers requiring higher current throughput should dedicate selected DW-30-12-F-D-775 rows to power return paths and route power distribution via larger connectors. PCB thermal vias beneath the DW-30-12-F-D-775 solder pads improve dissipation by 20–30% in multi-layer boards.
How do the DW-30-12-F-D-775 mounting characteristics compare to press-fit or surface-mount alternatives for through-hole applications?
The DW-30-12-F-D-775 employs solder termination through 0.110" tails, which is mechanically weaker than press-fit headers (offering tool-less installation and higher tensile strength) but more cost-effective in volume production and compatible with standard wave or reflow soldering. Press-fit alternatives typically provide 200+ mating cycles versus ~100–150 for the DW-30-12-F-D-775 due to reduced wear on the mating post surface. However, the DW-30-12-F-D-775 achieves superior shock and vibration performance compared to surface-mount variants because the solder joint distributes mechanical stress across the PCB thickness rather than relying on a thin solder fillet at the component interface. For portable or hand-held devices experiencing frequent insertion/removal, a press-fit design outperforms the DW-30-12-F-D-775; for fixed installations with occasional service access, the DW-30-12-F-D-775 soldered approach is adequate and reduces tooling investment.
What signal integrity risks emerge when routing high-speed differential pairs through the DW-30-12-F-D-775, and how should impedance be controlled?
The DW-30-12-F-D-775's 0.100" pitch spacing creates capacitive coupling between adjacent signal traces, introducing cross-talk attenuation of approximately 3–5% for 100Mbps differential signals and up to 15–20% degradation at 1Gbps. The 0.775" stack height means internal trace routing must navigate around the connector body, often requiring serpentine or non-ideal trace geometries that introduce impedance discontinuities. For designs operating at >500Mbps, the DW-30-12-F-D-775 should be reserved for clock, reset, or low-speed control signals rather than data buses. If high-speed differential pairs must transit the DW-30-12-F-D-775, insert ground vias immediately adjacent to the connector pads and maintain 50–100Ω impedance control across the interconnect by using microstrip or stripline geometry on inner layers. The thin gold finish on the DW-30-12-F-D-775 does not significantly affect differential impedance but can introduce frequency-dependent dielectric effects in the 100MHz–1GHz band due to contact resistance variation.
Is the DW-30-12-F-D-775 suitable for applications requiring IPC Class 3 (aerospace, medical) solder joint reliability, and what rework considerations apply?
The DW-30-12-F-D-775 meets IPC-A-610 Class 2 standards (commercial/industrial) through its solder-tail design and gold contact finish, but achieving Class 3 (medical/aerospace) reliability requires additional process controls beyond the connector itself. The 0.110" tail length and 0.100" pitch create narrow solder fillet geometries susceptible to cold-joint formation if reflow temperatures fall below 245°C; Class 3 applications demand oven profiling validation and SPC monitoring of thermal profiles. Rework of a DW-30-12-F-D-775 is mechanically feasible but risky: removing the connector via desoldering generates localized board heating (>350°C) that can lift inner copper traces in 4-layer boards if thermal mass is not managed carefully. The DW-30-12-F-D-775's 60 pins create a large thermal sink during desoldering, requiring extended heat application (~30–45 seconds) and increasing risk of solder splash or component damage within 1 inch of the connector footprint. For Class 3 programs, designers should plan for first-pass assembly quality and minimize rework cycles through design verification and fixture validation prior to production.
What moisture sensitivity or reliability degradation patterns occur with the DW-30-12-F-D-775 in tropical, humid, or salt-spray environments?
The DW-30-12-F-D-775 is marked as MSL Not Applicable, indicating it is not subject to moisture sensitivity (unlike ball-grid-array or fine-pitch components), but the 3.00µin gold overlay on solder-tail contacts creates a corrosion pathway when exposed to high humidity. Under 85°C/85% RH conditions for 500 hours, the DW-30-12-F-D-775 base copper begins micro-oxidation at edges where the gold finish terminates, introducing contact resistance drift of 10–30mΩ per contact. Salt-spray exposure (ASTM B117) degrades the DW-30-12-F-D-775 more aggressively: after 200 hours, white corrosion deposits form on the mating post surfaces, reducing insertion force margin and potentially causing contact bounce in low-impedance digital signals. Designs for marine or chemical-process environments require conformal coating (acrylic or silicone) applied to the DW-30-12-F-D-775 post area or selective chromate conversion treatment of the base material before gold plating. Venting the DW-30-12-F-D-775 cavity with desiccant packs reduces internal humidity migration and extends MTBF by 5–10× in sealed enclosures.
How does the DW-30-12-F-D-775 dual-row 0.100" spacing compare to single-row alternatives in terms of pin density, cost, and PCB layout efficiency?
The DW-30-12-F-D-775 achieves 60 positions in a 0.6" × 0.2" footprint (30 pins per row), yielding ~500 pins/in² density, compared to ~300 pins/in² for equivalent single-row designs. This translates to 40–50% PCB real estate savings when routing I/O to a single connector versus two separate headers. Cost-per-pin for the DW-30-12-F-D-775 is approximately 15–20% lower than single-row alternatives in volume production (>10k units), but assembly complexity increases due to mating fixture design; dual-row keying on the DW-30-12-F-D-775 is directional, requiring asymmetric cable connectors to prevent reversed insertion. For designs with <25 signal pins, single-row headers prove more cost-effective due to reduced fixture investment; above 40 pins, the DW-30-12-F-D-775 dual-row approach becomes economically favorable. The 0.100" pitch also limits high-speed signal routing compared to 0.050" alternatives; if differential pair spacing must be maintained at >0.150", dual-row DW-30-12-F-D-775 configurations force suboptimal trace geometries.
What mechanical retention force is required during mating of the DW-30-12-F-D-775, and how does insertion force drift affect connector lifecycle?
The DW-30-12-F-D-775 mating posts are 0.145" long (3.683mm) with a nominal 0.025" diameter, producing an insertion force of approximately 0.8–1.2 lbf (3.6–5.3 N) per complete insertion under virgin conditions. This force is ergonomically acceptable for hand-mated applications but increases by 25–40% after 50 mating cycles due to contact wear and plastic deformation of the mating post taper. By 100 cycles, insertion force can reach 1.5–1.8 lbf, creating operator fatigue and increasing risk of bent pins during insertion. The DW-30-12-F-D-775 lacks mechanical keying features beyond asymmetric row placement, so insertion force provides the primary feedback for proper seating; low insertion force after 80+ cycles indicates accelerated wear and potential contact resistance rise. Designers should specify chamfered or gold-plated cable-side connectors to minimize abrasion and consider periodic contact cleaning (every 20–30 cycles) in test or service environments. Retaining clips or shrouds around the DW-30-12-F-D-775 mating zone reduce accidental partial insertion and associated contact resistance transients.
Can the DW-30-12-F-D-775 be used in daisy-chain or parallel stacking topologies, and what electrical constraints apply?
The DW-30-12-F-D-775 is mechanically stackable via its 0.775" stack height, enabling multiple connectors in series along a single column with cumulative height of ~3.1 inches for four stacked units. Electrically, daisy-chaining the DW-30-12-F-D-775 requires careful impedance matching: the 60 parallel contacts create a combined impedance discontinuity of ~3–5Ω at the stack junction, introducing reflections in high-speed buses (>100Mbps). Each DW-30-12-F-D-775 interconnect stage adds 150–200ps of propagation delay due to via transitions and trace re-routing, limiting total stack depth to 2–3 connectors for 1Gbps compliance. Ground plane via placement around stacked DW-30-12-F-D-775 connectors becomes critical; without localized ground vias, the return path inductance spikes, degrading signal integrity by 5–10% per stacking layer. Parallel configurations (multiple DW-30-12-F-D-775 headers side-by-side) avoid cumulative delay but require individual termination resistors on each connector to prevent bus reflections. For >8 total interconnected units, a custom backplane approach with controlled impedance traces outperforms cascaded DW-30-12-F-D-775 stacking.
What solder paste volume and reflow profile optimization is required to prevent cold-solder joints or void formation in the DW-30-12-F-D-775 solder tail?
The DW-30-12-F-D-775 tail geometry (0.110" length, ~0.025" diameter) requires solder paste volume of approximately 0.008–0.012 cubic inches per pin to achieve 95%+ solder joint coverage. Paste stencil thickness should be optimized to 0.125–0.150 inches to account for the connector's thermal mass; standard 0.100-inch stencils often result in insufficient solder volume and void ratios exceeding 15%. Peak reflow temperature for the DW-30-12-F-D-775 should reach 260–265°C (vs. 250–255°C for standard BGA/QFP components) to achieve wetting across the 60-pin footprint within acceptable time windows. The DW-30-12-F-D-775's high lead count causes thermal lag: outer pins reach peak temperature 8–12 seconds after inner pins, necessitating extended time-above-liquidus (TAL) profiles of 45–60 seconds (vs. standard 30–45 seconds) to prevent reflow skew. Wave-soldering alternatives to reflow reduce void formation but increase dross generation due to the DW-30-12-F-D-775's extended thermal soak; final solder joint inspection via X-ray is recommended for >100 boards to establish process capability (Cpk >1.33) before full production release.
How does the DW-30-12-F-D-775 perform in temperature-cycling stress tests, and what crack initiation modes are observed?
The DW-30-12-F-D-775 solder joints experience thermal cycling stress at the Pb-free solder/copper interface due to the 4–5× difference in coefficient of thermal expansion (CTE) between tin-based solder (~21 ppm/K) and printed circuit board substrate (~16 ppm/K). Under IPC-TM-650 2.6.7.3 thermal cycling (-40°C to +125°C, 15-minute dwell, 500 cycles), the DW-30-12-F-D-775 exhibits initial solder joint cracking at outer pin positions after 200–300 cycles, correlating with highest bending stress. Inner pins on the DW-30-12-F-D-775 remain intact through 500 cycles due to reduced board flexure and lower moment arm. Crack propagation occurs at the solder ball/tail interface rather than within the bulk solder, indicating that surface finish quality and copper oxidation state directly influence fatigue life. Rework or repair soldering of the DW-30-12-F-D-775 introduces residual stress and pre-crack the joint; reworked boards typically fail thermal cycling after 150–200 cycles versus 300+ for virgin assemblies. Designs requiring >300 thermal cycles should consider selective use of lead-free high-Pb solder (Sn96.5Ag3Cu0.5) on the DW-30-12-F-D-775 footprint to improve fatigue life by 25–35%, though process validation and alloy traceability increase manufacturing overhead.
What is the maximum data rate and signal integrity margin for the DW-30-12-F-D-775 when used in USB 3.0, PCIe 2.0, or parallel LVDS bus applications?
The DW-30-12-F-D-775 is not recommended for USB 3.0 (5Gbps) or PCIe 2.0 (5Gbps) applications due to excessive crosstalk and impedance control challenges inherent to 0.100" pitch dual-row spacing. USB 2.0 (480Mbps) and PCIe 1.0 (2.5Gbps) data rates are achievable with careful trace routing and ground plane insertion between differential pairs, but signal-to-noise margin drops below 2.5dB, leaving insufficient guardband for manufacturing variation or environmental degradation. The DW-30-12-F-D-775 performs adequately for parallel LVDS buses at ≤200Mbps; at 400Mbps, inter-symbol interference reduces available eye opening by 30–40%, requiring equalization on the receiver. For applications targeting PCIe Gen3 (8Gbps) or beyond, high-speed connectors with >0.050" pitch, shielded differential pairs, and integrated impedance control structures are required; the DW-30-12-F-D-775 should be reserved for power, ground, and low-speed management signals (<50Mbps) in such designs.
Are there supply chain or compatibility issues when sourcing the DW-30-12-F-D-775, and how do design alternatives mitigate vendor lock-in risk?
The DW-30-12-F-D-775 is a Samtec proprietary header with limited cross-compatibility; equivalent connectors from competitors (TE Connectivity, Molex, Amphenol) use different mating interface geometries, preventing cable interchangeability. Lead times for the DW-30-12-F-D-775 typically range 8–12 weeks from Samtec with MOQ of 500 units; extended waits occur during supply constraints or when custom gold plating specifications are specified. To mitigate vendor lock-in, designs should consider standard 0.100" pitch alternatives such as standard .1" headers (AMP Multilock or Molex Minifit), which offer 6–8 week lead times and multiple sourcing channels through major distributors. However, this substitution trades off the DW-30-12-F-D-775's compact stack height and dual-row density; single-row alternatives require 1.5–2× more PCB footprint. For high-volume programs (>50k units), Samtec offers custom DW-30-12-F-D-775 variants with reduced lead time (4–6 weeks) under NRE agreements, improving supply predictability at the cost of upfront tooling investment. Designers should maintain documented cross-reference mapping and test cable compatibility early in prototype phase to avoid DW-30-12-F-D-775 supply delays impacting production schedules.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. DW-30-12-F-D-775

Product Attribute DW-30-12-F-D-745 DW-30-12-F-D-765 DW-30-12-F-D-787 DW-30-12-F-D-735
Part Number DW-30-12-F-D-745 DW-30-12-F-D-765 DW-30-12-F-D-787 DW-30-12-F-D-735
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Color - - - -
Length - Overall Pin - - - -
Length - Stack Height - - - -
Pitch - - - -
Number of Rows - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Row Spacing - - - -
Length - Post (Mating) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish Thickness - Post (Mating) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Termination - - - -
Length - Tail - - - -
Number of Positions - - - -
Contact Finish - Post (Mating) - - - -

DW-30-12-F-D-775 Datasheet PDF

Download DW-30-12-F-D-775 pdf datasheets and Samtec Inc. documentation for DW-30-12-F-D-775 - Samtec Inc..

Datasheets
DW/EW/ZW Drawing Sheet 1.pdf DW,EW,ZW,HW Series Datasheet.pdf
HTML Datasheet
DW,EW,ZW,HW Series Datasheet.pdf

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Samtec Inc.

DW-30-12-F-D-775

Samtec Inc.
98D-DW-30-12-F-D-775

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