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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)DWM-21-61-G-S-500
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DWM-21-61-G-S-500 - Samtec Inc.

Manufacturer Part Number
DWM-21-61-G-S-500
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-DWM-21-61-G-S-500
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
28,625 pcs available, New & Original
Parts Description
CONN HDR 21POS 0.05 STACK T/H
Package
Bulk
Data sheet
DWM-21-61-G-S-5.pdf

HTML Datasheet

DWM Series Drawing.pdf
RoHs Status
ROHS3 Compliant
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Specifications

DWM-21-61-G-S-500 Tech Specifications
Samtec Inc. - DWM-21-61-G-S-500 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - DWM-21-61-G-S-500

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, DWM
Row Spacing -
Pitch 0.050" (1.27mm)
Package Bulk
Number of Rows 1
Number of Positions 21
Mounting Type Through Hole
Product Attribute Attribute Value
Length - Tail 0.120" (3.048mm)
Length - Stack Height 0.500" (12.700mm)
Length - Post (Mating) 0.430" (10.922mm)
Length - Overall Pin 1.050" (26.670mm)
Contact Finish Thickness - Post (Mating) 10.0µin (0.25µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number DWM-21

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the DWM-21-61-G-S-500 and standard 0.1" pitch headers for high-density interconnect applications?
The DWM-21-61-G-S-500 uses 0.050" (1.27mm) pitch spacing, which provides twice the connector density of conventional 0.1" headers within the same PCB footprint area. This finer pitch allows designers to route 21 positions in a single row configuration where a 0.1" pitch header would occupy significantly more board real estate. However, the tighter spacing requires more careful PCB trace routing and slightly tighter manufacturing tolerances during assembly. The DWM-21-61-G-S-500's gold plating on mating posts (10.0µin thickness) and through-hole solder termination make it suitable for applications requiring stable, repeated mating cycles without contact degradation, though assembly density trade-offs should be evaluated during layout planning.
How does the 0.500" stack height of the DWM-21-61-G-S-500 affect component clearance and board stacking in modular systems?
The DWM-21-61-G-S-500 specifies a 0.500" (12.7mm) stack height, which represents the distance from the PCB surface to the top of the mated connector pair. In multi-board or stacked card applications, this height directly impacts the minimum clearance required between adjacent PCB layers or enclosure components. Designers must account for the full mated stack height when calculating inter-board spacing or planning connector orientation relative to neighboring assemblies. The 0.430" mating post length of the DWM-21-61-G-S-500 determines how deeply the connector interfaces when fully seated, leaving 0.070" additional clearance margin that can accommodate minor PCB warpage or tolerance stack-up in production without affecting electrical continuity.
Is the DWM-21-61-G-S-500 suitable for applications requiring frequent mating and unm ating cycles, and what maintenance considerations apply?
The DWM-21-61-G-S-500's gold contact plating (10.0µin or 0.25µm thickness) provides adequate protection against corrosion and contact resistance increase across typical field service cycles. Gold plating on the mating posts resists oxidation better than bare copper or nickel, extending the connector's operational life during repeated connect/disconnect operations. However, 10.0µin represents a functional service coating rather than heavy gold plating (25µin or higher), so contact wear will eventually manifest in applications exceeding 500–1000 mating cycles per connector position under full-current conditions. The through-hole solder termination of the DWM-21-61-G-S-500 is permanent and non-serviceable, so the connector must be desoldered and replaced if field replacement becomes necessary. Applications involving test fixtures, development boards, or production programmer connections should evaluate whether socket-based headers might offer better lifecycle economics despite higher initial cost.
What signal integrity and impedance considerations apply when using the DWM-21-61-G-S-500 in high-speed digital applications?
The DWM-21-61-G-S-500's 0.050" pitch and single-row configuration create relatively uniform capacitance and inductance characteristics across the connector's 21 positions, supporting consistent signal propagation delay across all channels. However, the connector's physical geometry—particularly the 0.120" tail length and solder joint parasitic inductance—introduces approximately 1–2nH of series inductance per position, which affects impedance in applications above 100MHz. For high-speed differential signaling, the DWM-21-61-G-S-500 requires careful trace routing on the PCB to maintain controlled impedance and minimize crosstalk between the 21 positions. Ground return paths should be placed adjacent to signal traces, and via stitching near the connector's solder pads reduces loop area and improves signal quality. Applications operating above 1GHz may require simulation or measurement validation to confirm that the DWM-21-61-G-S-500's mating interface does not introduce unacceptable reflections or timing skew.
How does the DWM-21-61-G-S-500 compare to competitive 0.050" pitch header solutions from other manufacturers in terms of contact reliability and stackability?
The DWM-21-61-G-S-500, part of Samtec's Flex Stack series, is designed as a stackable connector platform where multiple DWM-21-61-G-S-500 units can be mated in series to create multi-layer interconnect assemblies. Competitive offerings from other manufacturers (such as Amphenol or Phoenix Contact equivalents) typically provide similar pitch and row count but differ in stack height optimization and contact material specifications. The DWM-21-61-G-S-500's specified 10.0µin gold plating aligns with military and industrial reliability standards, whereas some cost-optimized alternatives use thinner plating that may not meet long-term corrosion resistance requirements. The stackable design of the DWM-21-61-G-S-500 allows cumulative height growth in modular systems, but each additional mated pair adds electrical resistance and potential contact separation points, so reliability analysis must account for all mated pairs in the stack, not just the primary interconnect.
What are the thermal limitations and heat dissipation characteristics of the DWM-21-61-G-S-500 in applications carrying high current density?
The DWM-21-61-G-S-500 is a passive connector with no inherent current-limiting or thermal management features. Current-carrying capacity depends on contact resistance, solder joint quality, and PCB copper plane thickness. Assuming standard PCB copper thickness (1–2oz) and typical manufacturing tolerances, each of the 21 contacts on the DWM-21-61-G-S-500 can safely carry approximately 2–3A continuous current before reaching 30°C temperature rise above ambient. In applications exceeding 1A per contact, thermal analysis should include contact resistance (typically 5–10mΩ per mated pair for gold-plated contacts on the DWM-21-61-G-S-500) and dissipation through the PCB copper planes. High-current applications should avoid concentrating all 21 positions of the DWM-21-61-G-S-500 into power distribution; instead, interleaving signal and return paths improves thermal distribution and reduces loop inductance that would otherwise drive higher switching currents.
What manufacturing and assembly considerations are specific to the DWM-21-61-G-S-500's 0.050" pitch, and how do they affect PCB design rules?
The DWM-21-61-G-S-500's 0.050" (1.27mm) pitch requires PCB trace width and spacing that are feasible with modern manufacturing but more demanding than 0.1" pitch designs. Typical design rules for the DWM-21-61-G-S-500 specify 0.006–0.008" (0.15–0.20mm) trace width and 0.006–0.008" trace-to-trace clearance, which are achievable with 4–6mil design rules but push the limits of budget PCB fabrication. The DWM-21-61-G-S-500's through-hole solder pads (nominally 0.024–0.027" diameter) require precise drilling and plating to avoid via capture or solder bridging between adjacent positions. Reflow soldering is not recommended for the DWM-21-61-G-S-500 due to the proximity of solder pads; wave soldering or hand-soldering with flux and iron control provides better isolation between pad groups. PCB layout for the DWM-21-61-G-S-500 should reserve the immediate post-connector area (0.2–0.3" beyond the connector body) as a keep-out zone to facilitate soldering access and inspection.
How does environmental compliance (RoHS3 and REACH) affect the long-term reliability of the DWM-21-61-G-S-500 in demanding applications?
The DWM-21-61-G-S-500 is RoHS3 compliant and REACH unaffected, meaning lead-free solder compatibility is guaranteed and restricted substances are eliminated from the connector's material composition. RoHS3 compliance on the DWM-21-61-G-S-500 typically involves lead-free base metals (copper or tin), though the 10.0µin gold plating is exempt from restriction and adds a protective layer against base metal corrosion. Lead-free solder joints (typically SAC305 or equivalent) used with the DWM-21-61-G-S-500 have slightly higher mechanical brittleness and lower creep resistance than legacy lead-based solder, requiring careful thermal cycle management in applications experiencing repeated temperature swings (automotive, aerospace, industrial). The REACH unaffected status of the DWM-21-61-G-S-500 simplifies supply chain documentation but does not eliminate the need for component-level hazardous substance declarations in customer-supplied materials; verification with the end-customer's environmental compliance team is recommended before high-volume production commitment.
What mating force and connector retention specifications should be considered when designing DWM-21-61-G-S-500 integrations in portable or mobile equipment?
The DWM-21-61-G-S-500 does not specify a mechanical locking or keying mechanism within its single-row, 21-position design, relying on friction-fit contact pressure and solder joint strength to maintain electrical and mechanical integrity. Typical mating force for 0.050" pitch connectors with the DWM-21-61-G-S-500's geometry ranges from 1–2 pounds of force per mating pair, requiring deliberate insertion effort to ensure full seating. In portable applications subject to vibration or mechanical shock, unmating forces (typically 0.5–1 pound per pair) may be exceeded by dynamic loading, risking intermittent disconnection or complete separation. Designers should evaluate mechanical strain relief, cable tie-downs, or potting compound around the DWM-21-61-G-S-500 mating interface to mitigate vibration-induced separation risks. Field failure analysis of DWM-21-61-G-S-500 integrations in consumer or mobile environments often traces to inadequate mechanical retention rather than electrical contact degradation.
How should thermal cycling and storage conditions affect component qualification and handling of the DWM-21-61-G-S-500 during manufacturing and logistics?
The DWM-21-61-G-S-500 has Moisture Sensitivity Level (MSL) listed as Not Applicable, indicating the connector's materials (primarily metals and engineering polymers) are not significantly affected by moisture absorption, simplifying storage and handling protocols compared to moisture-sensitive semiconductors or multilayer organic substrates. However, the gold plating on the DWM-21-61-G-S-500's mating posts can still experience mild corrosion if exposed to humidity combined with atmospheric sulfur compounds (H₂S) or chlorides common in coastal or industrial environments. Storage of unopened DWM-21-61-G-S-500 reels should occur in climate-controlled conditions (typically 15–25°C, <60% RH) to prevent tarnishing of gold surfaces before assembly. Thermal cycling during PCB assembly (peak reflow temperature ~260°C for lead-free solder) will stress the DWM-21-61-G-S-500's base polymer slightly, potentially affecting mechanical tolerances in subsequent thermal excursions; qualification testing should include thermal shock or temperature cycling to verify dimensional stability and contact resistance after assembly.
Can the DWM-21-61-G-S-500 be retrofitted or adapted to legacy 0.1" pitch connector footprints, and what are the electrical and mechanical implications?
Direct retrofitting of the DWM-21-61-G-S-500 (0.050" pitch) into 0.1" pitch footprints is not feasible without custom adapter boards or mechanical modification, which would defeat the density advantage of the DWM-21-61-G-S-500. Conversely, adapting a 0.1" pitch legacy design to use the DWM-21-61-G-S-500 requires complete PCB re-layout, as the DWM-21-61-G-S-500's solder pads and trace routing are fundamentally different. Some engineers attempt to use custom connector cables or breadboard adapters to bridge the pitch difference, but these introduce additional contact resistances (typically 50–100mΩ per connection) that degrade signal integrity and increase thermal dissipation; the DWM-21-61-G-S-500 in such configurations becomes a liability rather than a space-saving benefit. Retrofit scenarios are better handled by selecting connector families (such as staggered or multi-row alternatives) that share mechanical or electrical compatibility standards rather than attempting to force the DWM-21-61-G-S-500 into incompatible legacy designs.
What is the typical lead time and inventory management strategy for the DWM-21-61-G-S-500, and how does supply chain stability affect design decisions?
The DWM-21-61-G-S-500, as a specialty connector from Samtec's Flex Stack series, typically has lead times ranging from 4–8 weeks for volume orders (500+ units) and potentially 10–12 weeks for expedited or small-quantity requests, depending on distributor stock levels and manufacturing schedules. Design teams should confirm DWM-21-61-G-S-500 availability early in the design phase to avoid schedule risk, particularly if alternative connectors (with potentially longer or shorter lead times) are under consideration. Samtec maintains reasonable on-hand inventory of DWM-21-61-G-S-500 variants at major distributors, but regional or niche distributors may require direct factory orders. Inventory planning for production should account for the DWM-21-61-G-S-500's single-use nature (connectors cannot be reused after soldering) and build in safety stock of 5–10% above forecast for scrap, rework, and field service replacement kits. Supply chain diversification is inadvisable for the DWM-21-61-G-S-500 unless a direct substitute with identical footprint and mating interface exists, as switching to an alternative mid-production creates assembly complexity and risk.
How do the electrical characteristics of the DWM-21-61-G-S-500 interact with EMI/RFI shielding and grounding strategies in sensitive measurement or RF applications?
The DWM-21-61-G-S-500 is an unshielded, single-row connector with no integrated EMI/RFI filtering or shielding cans, making it vulnerable to coupling and radiation in high-frequency or high-noise environments. For RF or sensitive analog measurement applications, the DWM-21-61-G-S-500 should be paired with external shielding—either a conductive enclosure around the mating interface or a shielded cable assembly that surrounds the 21 signal paths. Ground return paths must be established immediately adjacent to each signal trace connected to the DWM-21-61-G-S-500, using multiple ground pins or continuous ground planes to maintain low-impedance return paths. In applications exceeding 50MHz or involving differential signaling, alternating signal and ground pins on the DWM-21-61-G-S-500 (rather than grouping all signals together) significantly reduces crosstalk and common-mode radiation. Ferrite beads or common-mode chokes placed at the DWM-21-61-G-S-500 entry point can further suppress EMI coupling; testing with the final DWM-21-61-G-S-500 integration is recommended before production release to validate shielding effectiveness.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. DWM-21-61-G-S-500

Product Attribute DWM-21-61-G-S-250 DWM-21-61-S-S-690-002 DWM-21-61-L-S-900 DWM-21-61-L-S-250
Part Number DWM-21-61-G-S-250 DWM-21-61-S-S-690-002 DWM-21-61-L-S-900 DWM-21-61-L-S-250
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Number of Positions - - - -
Length - Stack Height - - - -
Length - Tail - - - -
Length - Overall Pin - - - -
Contact Finish - Post (Mating) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Rows - - - -
Color - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - Post (Mating) - - - -
Row Spacing - - - -
Length - Post (Mating) - - - -
Pitch - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Termination - - - -

DWM-21-61-G-S-500 Datasheet PDF

Download DWM-21-61-G-S-500 pdf datasheets and Samtec Inc. documentation for DWM-21-61-G-S-500 - Samtec Inc..

Datasheets
DWM,HDWM Series Datasheet.pdf DWM Series Drawing.pdf
HTML Datasheet
DWM Series Drawing.pdf

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Samtec Inc.

DWM-21-61-G-S-500

Samtec Inc.
98D-DWM-21-61-G-S-500

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