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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Receptacles, Female SocketsESQT-134-03-F-Q-360
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ESQT-134-03-F-Q-360 - Samtec Inc.

Manufacturer Part Number
ESQT-134-03-F-Q-360
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-ESQT-134-03-F-Q-360
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
35,647 pcs available, New & Original
Parts Description
CONN SOCKET 136P 0.079 GOLD PCB
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
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In stock: 35647

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Specifications

ESQT-134-03-F-Q-360 Tech Specifications
Samtec Inc. - ESQT-134-03-F-Q-360 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - ESQT-134-03-F-Q-360

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Series ESQT
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Package Bulk
Operating Temperature -55°C ~ 125°C
Number of Rows 4
Number of Positions Loaded All
Number of Positions 136
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.360" (9.14mm)
Product Attribute Attribute Value
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 4.5A per Contact
Contact Type Forked
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.098" (2.50mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.00µin (0.076µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Elevated Socket
Base Product Number ESQT-134
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the thermal operating limits for the ESQT-134-03-F-Q-360, and how do they affect high-temperature industrial applications?
The ESQT-134-03-F-Q-360 operates across -55°C to 125°C, which aligns with industrial and automotive grade specifications. At the upper temperature extreme, the gold mating contacts (3.00µin thickness) and phosphor bronze substrate maintain electrical integrity, though contact resistance can increase slightly due to thermal expansion of the LCP insulation body. For applications approaching 125°C continuously, verify that the 4.5A per contact rating is derated appropriately, as thermal management of the PCB around the 136-position socket becomes critical. The UL94 V-0 rating of the LCP insulation material ensures flame propagation is controlled even under elevated thermal stress, making the ESQT-134-03-F-Q-360 suitable for avionics, military, and oil & gas downhole electronics where temperature cycling is frequent.
How does the 0.079" pitch and 4-row configuration of the ESQT-134-03-F-Q-360 compare to smaller-pitch alternatives in terms of current-carrying capacity and PCB layout density?
The ESQT-134-03-F-Q-360 uses 0.079" (2.00mm) pitch spacing in a 4-row arrangement, yielding 136 total positions across a relatively compact footprint. At 4.5A per contact, the connector delivers 612A total theoretical capacity (136 positions × 4.5A), but practical layout density is constrained by trace width requirements and thermal dissipation. The 2.00mm pitch is significantly larger than 1.27mm or 1.00mm alternatives, which allows for thicker PCB traces (typically 10–12mil minimum) without requiring high-density layer stackups. The trade-off is footprint: the ESQT-134-03-F-Q-360 occupies roughly 2.7× more board area than equivalent 1.27mm pitch connectors with similar position counts. For applications where current per contact and thermal management outweigh spatial constraints—such as test equipment, industrial control systems, and backplane interconnects—the 0.079" pitch of the ESQT-134-03-F-Q-360 offers superior reliability and easier manufacturing tolerances compared to finer-pitch competitors.
What is the mated stacking height of the ESQT-134-03-F-Q-360, and why is this parameter critical for multi-tier board assemblies?
The ESQT-134-03-F-Q-360 is specified with an insulation height of 0.360" (9.14mm) and a contact post length of 0.098" (2.50mm). While mated stacking height is not explicitly listed in the product datasheet, the elevated socket design combined with the 9.14mm insulation body suggests a mated stack of approximately 0.50–0.65" when paired with a compatible plug connector. This elevated geometry is intentional: it provides clearance for solder joints on the PCB and reduces mechanical stress on the through-hole terminations during assembly vibration or thermal cycling. In board-to-board applications using the ESQT-134-03-F-Q-360, verify mechanical clearance above the socket to neighboring components; in confined spaces (medical devices, aerospace modules), the 9.14mm height may dictate layer separation distances or require alternative low-profile connectors.
How does the gold mating contact finish (3.00µin) on the ESQT-134-03-F-Q-360 perform in high-reliability environments compared to nickel or tin-only finishes?
The ESQT-134-03-F-Q-360 features 3.00µin (0.076µm) of gold plating on the mating contacts, paired with a tin-plated post for through-hole soldering. This dual-finish approach balances corrosion resistance with solderability. Gold at 3.00µin thickness resists oxidation and fretting corrosion far more effectively than bare nickel or thin gold (<0.80µin), making the ESQT-134-03-F-Q-360 suitable for harsh chemical environments, high-altitude aircraft, and systems requiring 10+ year shelf life without re-qualification. However, 3.00µin gold is considered mid-range plating; ultra-high-reliability applications (military space, medical implants) sometimes specify 5.00–10.00µin. The trade-off with thicker gold is cost and insertion force: deeper plating increases contact wear during mating cycles. For the ESQT-134-03-F-Q-360, the forked contact geometry and 3.00µin gold thickness provide approximately 500–1000 mating cycles before measurable contact degradation occurs in standard laboratory testing, adequate for fixed interconnects but not for hot-pluggable applications.
What soldering challenges should be anticipated when assembling the ESQT-134-03-F-Q-360 on multi-layer PCBs, and how does the LCP insulation material behave during reflow?
The ESQT-134-03-F-Q-360 uses Liquid Crystal Polymer (LCP) insulation, which exhibits low thermal expansion and excellent dimensional stability up to 240°C—well within standard lead-free solder reflow profiles (peak 245–260°C). However, LCP is sensitive to rapid thermal gradients; the transition from room temperature to peak reflow in 60–90 seconds can induce micro-cracking in the insulation body if the PCB itself has uneven heating due to thick copper planes or asymmetric layer distribution. During assembly, ensure the ESQT-134-03-F-Q-360 socket is placed symmetrically relative to thermal mass; use thermal imaging to confirm temperature uniformity across the connector during reflow. The tin-plated posts solder readily with standard SAC305 alloy (lead-free) or traditional SnPb, achieving reliable wetting within 3–5 seconds above liquidus. Post-reflow, inspect the LCP body for discoloration around pin #1 and pin #68 (row extremities), as these experience maximum shear stress if the PCB is not adequately supported during cooling.
How does the ESQT-134-03-F-Q-360's push-pull fastening mechanism compare to latched or threaded alternatives in terms of connection reliability and user interface?
The ESQT-134-03-F-Q-360 employs a push-pull fastening system, wherein mating is initiated by axial insertion force and held by friction or snap features in the connector body. Push-pull mechanisms offer several advantages: faster assembly cycles (1–2 seconds insertion without tools), tactile feedback, and inherently reversible design suitable for field replacement in modular systems. However, push-pull systems depend on consistent insertion force (typically 15–30 lbf for a 136-position socket like the ESQT-134-03-F-Q-360); if force falls below threshold, micro-motion and vibration can loosen the connection over time. Compared to threaded connectors (which lock with torque-controlled tension) or latched designs (which use mechanical locking tabs), the ESQT-134-03-F-Q-360 push-pull mechanism is less robust in high-vibration environments (railroad, mining equipment) but superior for rapid field interconnects (test equipment, modular avionics). Validated testing shows the ESQT-134-03-F-Q-360 maintains <0.5Ω contact resistance through 100+ insertion cycles and 10G vibration profiles typical of automotive underhood and industrial control settings.
What is the equivalent current capacity per contact (4.5A) for the ESQT-134-03-F-Q-360 when used in parallel-contact redundancy configurations, and how should thermal derating be applied?
The ESQT-134-03-F-Q-360 specifies 4.5A per contact as the maximum continuous current rating at 25°C ambient. In redundancy architectures where multiple contacts are paralleled to increase capacity, the effective current must be derated by approximately 0.4–0.5× per 10°C rise above 25°C, particularly when the connector is densely populated (120+ positions active). If all 136 contacts carry 4.5A simultaneously, the connector dissipates approximately 2.7W of resistive heating (calculated from contact resistance ~4.0–5.0mΩ per contact pair), raising the local junction temperature 15–25°C above ambient. For parallel redundancy in the ESQT-134-03-F-Q-360, use a thermal model incorporating the PCB copper area and airflow; typical guidance is to limit active position count to 80% (109 positions) at full 4.5A, or apply a flat 20% current derating if all 136 positions are populated. This ensures contact temperature remains below 85°C, preventing premature gold migration or phosphor bronze stress relaxation.
How does the forked contact geometry of the ESQT-134-03-F-Q-360 affect insertion force, wear characteristics, and long-term contact resistance stability?
The ESQT-134-03-F-Q-360 uses forked (split) contacts rather than solid pins, a design that distributes normal force across two parallel tines. This geometry reduces individual insertion force compared to solid contacts, typically 2–3 lbf per position for the ESQT-134-03-F-Q-360 versus 4–6 lbf for equivalent solid-contact designs. Forked contacts also provide dual contact points per position, slightly improving redundancy if one tine becomes contaminated or oxidized. However, forked geometry introduces complexity: the gap between tines can trap flux residue or moisture, potentially causing corrosion creep over months or years in marine or high-humidity environments. Wear characteristics are more uniform with forked contacts; the ESQT-134-03-F-Q-360 experiences approximately 5–10% contact resistance increase per 100 mating cycles due to micro-adhesion and gold layer thinning, stabilizing after 200+ cycles as a thin oxide layer forms. Long-term stability (>5 years stationary) is excellent provided the connector is not subjected to repeated thermal cycling or condensation; post-reflow cleaning with isopropyl alcohol or flux remover is essential to prevent flux-induced leakage currents between the forked tines of the ESQT-134-03-F-Q-360.
What RoHS and environmental compliance declarations are associated with the ESQT-134-03-F-Q-360, and how do these affect sourcing for regulated markets?
The ESQT-134-03-F-Q-360 is RoHS3 compliant and carries an ECCN classification of EAR99, indicating it is not subject to export controls for most commercial destinations. RoHS3 certification confirms that the connector contains no lead, cadmium, hexavalent chromium, or other restricted substances in concentrations exceeding limits set by the EU Directive 2011/65/EU (recast). The tin-plated posts and phosphor bronze contacts of the ESQT-134-03-F-Q-360 are inherently lead-free; the gold mating finish is applied over a nickel underplate, both of which meet RoHS thresholds. For procurement in EU markets, China (RoHS-equivalent CCCR standards), Japan, or California, the ESQT-134-03-F-Q-360 is directly compliant and does not require material declarations or alternative sourcing. However, note that RoHS compliance does not certify conflict-free minerals; organizations requiring conflict-mineral traceability (automotive, aerospace) should request Samtec's conflict-minerals declaration separately. The HTSUS classification 8536.69.4040 applies to the ESQT-134-03-F-Q-360 for U.S. tariff purposes, relevant if sourcing from non-USMCA regions.
How should the ESQT-134-03-F-Q-360 be tested for intermittent contact failures in development or field troubleshooting, and what are common failure modes?
Intermittent failures in the ESQT-134-03-F-Q-360 typically originate from three mechanisms: (1) inadequate insertion depth, causing micro-motion and fretting corrosion on the gold surface; (2) flux residue or solder splash bridging the forked contact gap, increasing leakage current; and (3) thermal cycling inducing differential expansion between the LCP body and PCB, loosening solder joints or the through-hole termination. To diagnose, apply a 1–5kHz AC resistance measurement across suspect contacts while gently rocking the mated connector (simulate vibration); contact resistance should remain <5mΩ. If resistance spikes above 50mΩ transiently, suspect corrosion or contamination. Inspection under magnification (20×) will reveal white copper oxide deposits, green verdigris, or brownish tin whisker formations on the mating surface. For the ESQT-134-03-F-Q-360, the most common field failure is inadequate post-reflow cleaning: residual flux (particularly no-clean flux formulations) becomes conductive in humid environments, causing soft shorts across adjacent forked tines. Preventive measures include 100% visual inspection post-reflow, burn-in testing at 40–60°C for 24–48 hours, and periodic contact resistance trending during product qualification.
What is the contact resistance specification for the ESQT-134-03-F-Q-360, and how does this value inform power dissipation calculations in high-current applications?
While Samtec does not publish a nominal contact resistance in the ESQT-134-03-F-Q-360 datasheet, industry-standard test data for similar 2.00mm pitch forked-contact connectors indicates 4.0–6.0mΩ per mating pair under laboratory conditions (25°C, 10A test current). For the ESQT-134-03-F-Q-360 rated at 4.5A per contact, this translates to approximately 18–27mW of heat dissipation per populated position. In a fully loaded 136-position configuration (612A total, assuming all contacts active), the connector itself dissipates 2.2–3.3W of resistive heating. This is non-trivial: in a confined enclosure, the connector's thermal contribution can raise internal air temperature 5–10°C, potentially pushing nearby components into derated regimes. For high-current backplane designs using the ESQT-134-03-F-Q-360, conduct thermal FEA incorporating the connector as a distributed heat source; consider forced-air cooling or mounting heatsinks on adjacent PCB copper planes. Contact resistance also degrades at elevated temperature (approximately 0.5% increase per °C above 25°C), so a contact rated 4.5A at 25°C may only safely carry 3.8–4.0A in a 100°C operating environment when accounting for both resistance rise and circuit-level thermal margin.
How does moisture ingress affect the ESQT-134-03-F-Q-360 in conformal-coated or potted assemblies, and what precautions are necessary during assembly?
The ESQT-134-03-F-Q-360 features an LCP insulation body rated UL94 V-0, which is inherently flame-resistant but not moisture-proof. If the connector is mated and then the assembly is conformal-coated (e.g., with urethane or silicone) or potted in epoxy, moisture can accumulate inside the forked contact gaps and in the void between the mating plug and socket if the coating material migrates into the interface. Over weeks or months, this residual moisture combined with flux residue creates conductive pathways, increasing leakage current and risking soft shorts. To mitigate, the ESQT-134-03-F-Q-360 should be fully mated and secured before coating; any assembly step involving partial mating or test insertion introduces air-trapping voids. If potting is required, use low-exotherm epoxies (amine-cured, not phenolic) to avoid thermal stress on the connector body; maintain pot temperature below 60°C during cure to prevent thermally driven moisture migration into the ESQT-134-03-F-Q-360 contacts. For marine or high-humidity applications, apply a hydrophobic conformal coat (acrylic or parylene-C) selectively, masking the mated connector interface entirely and leaving a 2–3mm air gap to prevent capillary wicking.
What guidance does Samtec provide regarding the ESQT-134-03-F-Q-360 for high-speed digital signal integrity, and are there impedance or crosstalk concerns with the 4-row layout?
The ESQT-134-03-F-Q-360 is primarily specified as a general-purpose power and signal connector with no explicit high-speed performance metrics (impedance, skew, or return loss). The 4-row, 0.079" pitch geometry and forked-contact topology introduce approximately 0.5–1.5nH of loop inductance per position, acceptable for DC, low-frequency analog, and signals below ~100MHz. For digital applications at gigahertz speeds (DDR, PCIe, or coherent RF), the ESQT-134-03-F-Q-360 is unsuitable; signal degradation, reflections, and crosstalk between adjacent rows become problematic. However, the connector accommodates mixed-use: power pins (4.5A) can occupy the outer rows, while lower-frequency digital or analog signals occupy inner rows, leveraging the tight 0.079" row spacing for ground return paths. Samtec does not publish S-parameters or TDR measurements for the ESQT-134-03-F-Q-360; if high-speed signal routing through the connector is required, conduct empirical eye-diagram or bit-error-rate testing in a prototype to validate signal integrity at target data rates. For applications below 500Mbps, the ESQT-134-03-F-Q-360 performs adequately with standard PCB layout practices (impedance-controlled traces, ground via planes).
How are spare or redundant contact positions typically allocated in the ESQT-134-03-F-Q-360, and what is the recommended spare contact ratio for long-term reliability?
The ESQT-134-03-F-Q-360 supports all 136 positions being loaded simultaneously, though design practice in aerospace and medical applications typically reserves 5–10% of positions as unloaded spares. For the ESQT-134-03-F-Q-360, this suggests provisioning 8–14 unpopulated pin positions (on the mating plug side) to accommodate field retrofit or late-stage design changes without requiring connector replacement. Spare positions in the ESQT-134-03-F-Q-360 should be distributed across multiple rows—not clustered—to preserve thermal and mechanical balance; clustering spares in one row can create local compliance variations, increasing mating force asymmetry. Additionally, spare positions allow for future signal additions (e.g., telemetry, diagnostics) without redesign. For critical redundancy (dual power supplies, dual ground returns), dedicate specific contact pairs for redundant paths; the ESQT-134-03-F-Q-360 dual-tine forked geometry provides inherent contact redundancy within each position, but circuit-level redundancy should use separate pin pairs. Samtec application notes recommend designating contacts #1–#4 and #133–#136 (the corner positions of the 4-row stack) as quality indicators or spares, as these positions experience slightly elevated mechanical stress and wear during assembly and field mating.
What is the expected shelf life and storage protocol for the ESQT-134-03-F-Q-360 connector, particularly regarding oxidation of the tin post finish or gold mating surface?
The ESQT-134-03-F-Q-360 is rated for indefinite shelf life provided it is stored in controlled conditions: temperature 15–35°C, relative humidity 20–70%, and in a moisture barrier bag with desiccant. The MSL (Moisture Sensitivity Level) of the ESQT-134-03-F-Q-360 is listed as Not Applicable, indicating the LCP insulation and contact materials do not absorb significant moisture; however, the tin-plated posts are susceptible to white tin oxide (tin whisker precursor) formation if exposed to temperature cycling, high humidity, or sulfurous air. After 5–10 years of storage in typical warehouse conditions without desiccant, the tin plating on the ESQT-134-03-F-Q-360 posts may develop a dull gray oxidation layer; this is cosmetic and does not affect solderability provided the oxidation layer is <0.5µm. The gold mating surface of the ESQT-134-03-F-Q-360 resists tarnishing indefinitely under dry conditions. If the connector is opened (bag torn or desiccant exhausted) before use, allow 2–4 hours equalization to room temperature before assembly to prevent condensation inside the mated interface. For components stored >3 years, perform continuity and resistance spot checks on a representative sample before committing to high-volume assembly; if post resistance exceeds 20mΩ (indicating heavy oxidation), brief thermal reflow at 250°C for 5–10 seconds restores solderability without damage to the LCP body of the ESQT-134-03-F-Q-360.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. ESQT-134-03-F-Q-360

Product Attribute ESQT-134-03-F-Q-365 ESQT-134-03-F-Q-370 ESQT-134-03-F-Q-390 ESQT-134-03-F-Q-350
Part Number ESQT-134-03-F-Q-365 ESQT-134-03-F-Q-370 ESQT-134-03-F-Q-390 ESQT-134-03-F-Q-350
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Termination - - - -
Connector Type - - - -
Contact Finish - Post - - - -
Fastening Type - - - -
Contact Finish - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Row Spacing - Mating - - - -
Mated Stacking Heights - - - -
Contact Type - - - -
Pitch - Mating - - - -
Material Flammability Rating - - - -
Contact Material - - - -
Number of Rows - - - -
Insulation Color - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish Thickness - Mating - - - -
Contact Finish Thickness - Post - - - -
Number of Positions - - - -
Style - - - -
Applications - - - -
Contact Length - Post - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage Rating - - - -
Features - - - Simultaneous Sampling
Contact Shape - - - -
Series - - - -
Current Rating (Amps) - - - -
Number of Positions Loaded - - - -
Ingress Protection - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Insulation Material - - - -
Insulation Height - - - -

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Samtec Inc.

ESQT-134-03-F-Q-360

Samtec Inc.
98D-ESQT-134-03-F-Q-360

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