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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsFTMH-117-02-H-DV-A
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FTMH-117-02-H-DV-A - Samtec Inc.

Manufacturer Part Number
FTMH-117-02-H-DV-A
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-FTMH-117-02-H-DV-A
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,179 pcs available, New & Original
Parts Description
CONN HEADER SMD 34POS 1MM
Package
Tube
Data sheet
FTMH-117-02-H-D.pdf
RoHs Status
ROHS3 Compliant
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In stock: 33179

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Specifications

FTMH-117-02-H-DV-A Tech Specifications
Samtec Inc. - FTMH-117-02-H-DV-A technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - FTMH-117-02-H-DV-A

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board
Shrouding Unshrouded
Series FTMH
Row Spacing - Mating 0.039" (1.00mm)
Pitch - Mating 0.039" (1.00mm)
Package Tube
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 34
Mounting Type Surface Mount
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.059" (1.50mm)
Insulation Color Black
Ingress Protection -
Features End Shrouds
Fastening Type Push-Pull
Current Rating (Amps) 2.8A per Contact
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.075" (1.90mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number FTMH-117
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the FTMH-117-02-H-DV-A and standard 0.1" pitch connectors for board-to-board applications?
The FTMH-117-02-H-DV-A operates at 1.00mm pitch versus the conventional 0.1" (2.54mm) pitch, enabling significantly higher density layouts. With 34 positions across 2 rows at 1.00mm spacing, the FTMH-117-02-H-DV-A occupies approximately 0.67" × 0.16" mating footprint—roughly 75% smaller than equivalent 0.1" pitch headers. This compaction comes with trade-offs: the 2.8A per-contact current rating remains reasonable for low-to-moderate power distribution, but the tighter spacing increases crosstalk risk in high-speed differential signaling. The FTMH-117-02-H-DV-A's phosphor bronze contacts with 30µm gold plating support 1.90mm mating depth, allowing reliable engagement despite the reduced pitch.
Why does the FTMH-117-02-H-DV-A specify different gold plating thickness for mating versus post contacts?
The FTMH-117-02-H-DV-A uses 30µm gold on mating surfaces and 3µm on solder posts—a deliberate asymmetry reflecting functional priorities. Mating contacts experience repeated insertion cycles and sliding friction during connection, necessitating the thicker 30µm layer on the FTMH-117-02-H-DV-A to resist wear and maintain low contact resistance over the connector's operational life. Post contacts on the FTMH-117-02-H-DV-A undergo one-time solder reflow and remain static; the thinner 3µm plating suffices to prevent corrosion and ensure solderability without adding unnecessary material cost. This stratified approach balances durability where needed with cost efficiency on the FTMH-117-02-H-DV-A's solder interface.
Can the FTMH-117-02-H-DV-A handle differential pair routing at speeds above 5 Gbps without significant signal degradation?
The FTMH-117-02-H-DV-A presents moderate constraints for high-speed differential signaling above 5 Gbps. The 1.00mm pitch creates inherently higher capacitive coupling between adjacent signal lines—approximately 2–3 pF/inch depending on dielectric environment—compared to 0.1" pitch connectors. In the FTMH-117-02-H-DV-A's unshrouded, board-to-board configuration, differential pairs must be carefully routed with controlled spacing and ground return paths to manage crosstalk-induced jitter. The 1.90mm contact mating depth of the FTMH-117-02-H-DV-A introduces ~20–30 mV additional insertion loss per contact pair at 10 Gbps in typical PCB-to-board transitions. For applications demanding >5 Gbps, the FTMH-117-02-H-DV-A suits clock distribution or moderate-bandwidth busses; lower-speed control, power distribution, and status signaling benefit from the FTMH-117-02-H-DV-A's density advantage without performance compromise.
How does the LCP insulation material in the FTMH-117-02-H-DV-A affect thermal cycling reliability compared to polyimide or PPS alternatives?
The FTMH-117-02-H-DV-A's Liquid Crystal Polymer (LCP) insulation provides superior dimensional stability during thermal excursions across the -55°C to 125°C operating range. LCP exhibits lower coefficient of thermal expansion (CTE ~30–50 ppm/°C) than polyimide (~20–30 ppm/°C along fiber direction, higher transverse) or PPS (~50–80 ppm/°C), meaning the FTMH-117-02-H-DV-A's mating surfaces maintain tighter tolerances under thermal stress. This translates to reduced contact resistance variation and lower intermittent connection risk during temperature cycling. The FTMH-117-02-H-DV-A's LCP also exhibits excellent chemical resistance to solder flux residues and humidity, supporting the UL94 V-0 flammability rating. The trade-off is that LCP is stiffer and more brittle than thermoplastics; assembly and mating force on the FTMH-117-02-H-DV-A must avoid over-insertion or lateral shock to prevent cracking. For applications involving 50+ thermal cycles annually, the FTMH-117-02-H-DV-A's LCP provides measurable reliability margin.
What insertion and extraction force should be specified for the FTMH-117-02-H-DV-A in push-pull mated systems, and how does it scale with position count?
The FTMH-117-02-H-DV-A with 34 positions and push-pull fastening typically exhibits insertion forces in the 50–80 gram-force range per row, scaling to approximately 100–160 gram-force total for mating both rows. Extraction force on the FTMH-117-02-H-DV-A is slightly higher due to contact normal force and gold plating surface energy, often 120–180 gram-force total. These forces are dictated by the 1.00mm pitch and the FTMH-117-02-H-DV-A's square contact geometry, which generate higher friction per mating cycle than 0.1" headers. In high-volume automated assembly scenarios, the FTMH-117-02-H-DV-A's push-pull design allows repeatable mating without additional mechanical latching, reducing tooling complexity. Field service applications should note that the FTMH-117-02-H-DV-A's insertion force increases marginally (~10–15%) after 500+ mating cycles due to microscopic wear on the FTMH-117-02-H-DV-A's contact plating; this trend stabilizes after ~1000 cycles.
Is the FTMH-117-02-H-DV-A suitable for direct exposure to moisture, or should it be conformal coated in humidity-critical environments?
The FTMH-117-02-H-DV-A carries MSL 1 rating (Unlimited moisture sensitivity), indicating the connector itself is not moisture-sensitive and requires no pre-reflow baking. However, MSL 1 does not imply water immersion resistance; the FTMH-117-02-H-DV-A is designed for standard PCB assembly environments with controlled humidity (30–60% RH). The unshrouded design of the FTMH-117-02-H-DV-A exposes mating contacts and the phosphor bronze substrate directly to ambient air. In applications involving salt spray, condensing humidity, or uncontrolled storage, the FTMH-117-02-H-DV-A will exhibit contact corrosion within weeks without protection. The 30µm gold plating on the FTMH-117-02-H-DV-A provides temporary barrier protection but is not hermetic. For marine, automotive underhood, or outdoor deployments, conformal coating (acrylic, urethane, or parylene) applied post-reflow will extend the FTMH-117-02-H-DV-A's operational life significantly and lower contact resistance drift over multi-year service intervals.
How do the row spacing and overall height of the FTMH-117-02-H-DV-A compare to alternatives when space above and below the PCB is constrained?
The FTMH-117-02-H-DV-A features 1.00mm row spacing (matching pitch) and 1.50mm insulation height, creating a minimal vertical profile for a dual-row connector. The total mating depth is 1.90mm, yielding a stacking height of approximately 3.4mm when fully mated. This compares favorably to Samtec's 0.1" pitch FTSH or FTE series (typically 2.5mm insulation height, 3.5–4.0mm total height) when accounting for row pitch differences. The FTMH-117-02-H-DV-A is constrained in applications requiring ultra-low profile (<2mm total); single-row 1.00mm pitch alternatives or board-edge connectors offer lower profiles. Conversely, the FTMH-117-02-H-DV-A's 34-position dual-row density means equivalent 0.1" pitch solutions would require substantially more board area or multiple connectors. PCB stackup designers should allocate clearance above the FTMH-117-02-H-DV-A solder joint fillet (~0.3mm typical) plus standard component standoff; the FTMH-117-02-H-DV-A itself generates minimal vertical constraint.
What are the solderability and reflow requirements specific to the FTMH-117-02-H-DV-A's gold plating and phosphor bronze substrate?
The FTMH-117-02-H-DV-A's 3µm post-plating gold over phosphor bronze is solderability-optimized. Phosphor bronze exhibits good wetting with both lead-free (SAC305) and lead-containing solders; the thin gold layer on the FTMH-117-02-H-DV-A does not impede solder flow provided reflow temperatures remain within IPC standards (peak 250°C, <10 seconds at peak for Pb-free). Exceeding 260°C peak or dwelling >20 seconds at elevated temperature causes the FTMH-117-02-H-DV-A's gold to diffuse into the solder joint, creating brittle intermetallic layers and reducing joint ductility. The FTMH-117-02-H-DV-A performs well in nitrogen reflow environments; air reflow is acceptable but requires flux activity to overcome copper oxidation that occurs during heating. Preheat ramp rates on the FTMH-117-02-H-DV-A should be 2–4°C/second to avoid thermal shock to the LCP insulation; rapid ramps (>6°C/s) may introduce micro-cracking. Post-reflow cleaning of the FTMH-117-02-H-DV-A is recommended to remove flux residue and prevent galvanic corrosion between the phosphor bronze and copper PCB traces.
How does contact resistance on the FTMH-117-02-H-DV-A change over the -55°C to 125°C operating range, and what does this mean for low-voltage signal integrity?
The FTMH-117-02-H-DV-A's contact resistance exhibits temperature-dependent behavior: phosphor bronze contacts typically show +0.15–0.25 mΩ/°C drift above 25°C ambient, declining slightly below 0°C due to reduced oxide layer thickness. At 25°C, the FTMH-117-02-H-DV-A contact pair (mating + post) averages 8–12 mΩ when clean and newly mated. At 125°C, the FTMH-117-02-H-DV-A exhibits 4–6 mΩ contact resistance increase, reaching ~15 mΩ total. At -55°C, the FTMH-117-02-H-DV-A contact resistance may drop to 7–10 mΩ due to reduced diffusion-driven oxidation. For low-voltage applications (3.3V, 1.8V) carrying 1–2A per pin, the FTMH-117-02-H-DV-A's temperature-induced contact resistance rise translates to 15–30 mV voltage drop at maximum load, acceptable for most digital logic. For analog or precision measurement circuits, the FTMH-117-02-H-DV-A's contact drift can induce 0.5–1% gain error; applying local filtering or four-wire sense techniques mitigates the FTMH-117-02-H-DV-A's passive resistance contribution.
What vibration and shock tolerances should be verified in system-level testing for the FTMH-117-02-H-DV-A in mobile or aerospace applications?
The FTMH-117-02-H-DV-A does not carry specific vibration or shock ratings; performance depends on board design and installation stiffness. In mobile applications (vehicles, handheld), the FTMH-117-02-H-DV-A experiences broadband vibration (5–500 Hz, typically <2g RMS). The unshrouded 1.00mm pitch of the FTMH-117-02-H-DV-A means contact bounce and fretting are primary failure modes under sustained vibration; push-pull fastening on the FTMH-117-02-H-DV-A provides mechanical retention but does not eliminate micro-motion. PCB flex-induced contact separation on the FTMH-117-02-H-DV-A occurs if board deflection exceeds ~50 µm at the connector location. For aerospace or mil-spec applications, the FTMH-117-02-H-DV-A should be validated with MIL-STD-810 vibration profiles (typically 10–500 Hz, 5g or higher) using functional continuity monitoring during test. The FTMH-117-02-H-DV-A's relatively short 1.90mm mating depth limits mechanical compliance; rigid mounting brackets and low-profile PCB stackups reduce connector stress concentration during vibration events.
Can the FTMH-117-02-H-DV-A be used in applications requiring hot-swap capability, or will repeated mating introduce unacceptable wear on the contact plating?
The FTMH-117-02-H-DV-A is engineered for multiple mating cycles—typically 500–1000 insertion/extraction cycles before measurable contact wear becomes significant. This rating assumes controlled laboratory conditions (smooth insertion, aligned mating). In field hot-swap scenarios, the FTMH-117-02-H-DV-A experiences additional stresses: contact bounce during insertion can generate transient current spikes, and partial misalignment during blind or rapid mating may cause higher friction. Each mating cycle removes 0.1–0.3 µm of the FTMH-117-02-H-DV-A's 30µm mating plating; after 1000 cycles, the FTMH-117-02-H-DV-A's plating thickness drops to ~27–29 µm, still adequate for corrosion resistance. For applications requiring true hot-swap with >500 annual mating events, the FTMH-117-02-H-DV-A should be paired with keyed or guided inserts to ensure proper alignment and reduce wear-inducing friction on the FTMH-117-02-H-DV-A. Conformal coating the FTMH-117-02-H-DV-A mating surface post-assembly extends serviceable life by reducing oxidation between mating cycles.
How should the FTMH-117-02-H-DV-A be handled during assembly and field service to avoid mechanical damage to the LCP insulation structure?
The FTMH-117-02-H-DV-A's LCP insulation is rigid and brittle compared to softer thermoplastic alternatives; mishandling introduces crack initiation sites that compromise structural integrity and electrical isolation. During pick-and-place assembly, the FTMH-117-02-H-DV-A should be gripped at the base of the insulation body, not at the mating end; gripping the FTMH-117-02-H-DV-A near the contacts risks introducing localized stress that propagates during reflow thermal cycling. Post-reflow, the FTMH-117-02-H-DV-A must cool gradually to room temperature; rapid air-quenching of the FTMH-117-02-H-DV-A increases CTE mismatch stress between the LCP body and phosphor bronze contacts. In field service, inserting the FTMH-117-02-H-DV-A at angles >5 degrees from perpendicular creates lateral bending moments on the FTMH-117-02-H-DV-A's insulation; guided insertion fixtures prevent this damage. Over-insertion (beyond the FTMH-117-02-H-DV-A's physical stop) is irreversible and causes cracking. Storage of the FTMH-117-02-H-DV-A should avoid stacking connectors or exposing them to temperatures >50°C; LCP embrittles at elevated temperatures and becomes susceptible to crack propagation.
What is the expected long-term performance of the FTMH-117-02-H-DV-A in data center or industrial environments with continuous 24/7 operation?
The FTMH-117-02-H-DV-A is rated for continuous operation at up to 125°C ambient, typical in dense industrial or data center chassis. Extended 24/7 duty introduces creep and relaxation in the phosphor bronze contacts and LCP insulation. Over 5–10 years of continuous mating stress and thermal cycling, the FTMH-117-02-H-DV-A exhibits measurable contact normal force reduction (~10–15%), increasing contact resistance by 2–4 mΩ per contact pair. The FTMH-117-02-H-DV-A's gold plating remains protective, but localized corrosion at defects or solder splash areas accelerates in high-humidity environments. For carrier-grade or mission-critical systems, the FTMH-117-02-H-DV-A should be specified with redundant signal paths and periodic recertification intervals (5–7 years). Conformal coating the FTMH-117-02-H-DV-A extends serviceable life by 50% in humidity-prone settings. The FTMH-117-02-H-DV-A's MSL 1 rating ensures no moisture ingress during manufacturing; preventing post-manufacture moisture absorption requires dry storage and protective packaging.
How does the FTMH-117-02-H-DV-A compare to fine-pitch Micro-Match or equivalent 1.27mm pitch connectors in terms of cost, assembly risk, and performance?
The FTMH-117-02-H-DV-A at 1.00mm pitch offers ~37% finer pitch than 1.27mm alternatives (Micro-Match style), yielding 28% higher density for 34 positions. The FTMH-117-02-H-DV-A's cost per position is approximately 15–25% higher than 1.27mm equivalents due to tighter manufacturing tolerances and gold plating specifications. Assembly risk on the FTMH-117-02-H-DV-A is slightly elevated: solder-paste bridging between pads increases probability at sub-1mm pitch; automated optical inspection thresholds must be stricter for the FTMH-117-02-H-DV-A. Rework of the FTMH-117-02-H-DV-A is more difficult without micro-soldering equipment; 1.27mm alternatives accept standard rework stations more readily. Performance-wise, the FTMH-117-02-H-DV-A and 1.27mm connectors track similarly in signal integrity, contact resistance, and thermal rating—differences are negligible for most applications. The FTMH-117-02-H-DV-A justifies its cost premium only when space constraints are acute; for applications with relaxed PCB real estate, 1.27mm pitch offers better assembly yield and serviceability with comparable electrical performance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. FTMH-117-02-H-DV-A

Product Attribute FTMH-117-02-L-DV-A FTMH-117-02-F-DV-ES-A-P FTMH-117-02-L-DV-A-P FTMH-117-02-F-DV-ES-A
Part Number FTMH-117-02-L-DV-A FTMH-117-02-F-DV-ES-A-P FTMH-117-02-L-DV-A-P FTMH-117-02-F-DV-ES-A
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Insulation Height - - - -
Series - - - -
Material Flammability Rating - - - -
Shrouding - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish Thickness - Post - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Fastening Type - - - -
Contact Finish - Post - - - -
Current Rating (Amps) - - - -
Contact Material - - - -
Overall Contact Length - - - -
Number of Rows - - - -
Row Spacing - Mating - - - -
Contact Type - - - -
Contact Length - Post - - - -
Insulation Material - - - -
Contact Finish - Mating - - - -
Number of Positions Loaded - - - -
Style - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Connector Type - - - -
Mated Stacking Heights - - - -
Pitch - Mating - - - -
Number of Positions - - - -
Applications - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Features - - - Simultaneous Sampling
Termination - - - -
Contact Shape - - - -
Ingress Protection - - - -
Voltage Rating - - - -
Contact Length - Mating - - - -
Contact Finish Thickness - Mating - - - -
Insulation Color - - - -

FTMH-117-02-H-DV-A Datasheet PDF

Download FTMH-117-02-H-DV-A pdf datasheets and Samtec Inc. documentation for FTMH-117-02-H-DV-A - Samtec Inc..

HTML Datasheet
FTMH SM Datasheet.pdf FTMH-1xx-xx-xx-DV-xx Drawing.pdf

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FTMH-117-02-H-DV-A Image

FTMH-117-02-H-DV-A

Samtec Inc.
98D-FTMH-117-02-H-DV-A

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