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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)FW-07-05-F-D-394-065
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FW-07-05-F-D-394-065 - Samtec Inc.

Manufacturer Part Number
FW-07-05-F-D-394-065
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-FW-07-05-F-D-394-065
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
38,959 pcs available, New & Original
Parts Description
CONN HDR 14POS 0.05 STACK SMD
Package
Bulk
Data sheet
FW-07-05-F-D-39.pdf
RoHs Status
ROHS3 Compliant
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In stock: 38959

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Specifications

FW-07-05-F-D-394-065 Tech Specifications
Samtec Inc. - FW-07-05-F-D-394-065 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - FW-07-05-F-D-394-065

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, FW
Row Spacing 0.050" (1.27mm)
Pitch 0.050" (1.27mm)
Package Bulk
Number of Rows 2
Number of Positions 14
Mounting Type Surface Mount
Product Attribute Attribute Value
Length - Tail -
Length - Stack Height 0.394" (10.008mm)
Length - Post (Mating) 0.065" (1.651mm)
Length - Overall Pin 0.459" (11.659mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number FW-07-05

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the FW-07-05-F-D-394-065 and standard 0.1" pitch connectors for high-density PCB layouts?
The FW-07-05-F-D-394-065 operates at 0.050" (1.27mm) pitch versus the traditional 0.1" pitch, enabling roughly 4× higher connection density in the same board footprint. This 0.050" pitch specification on the FW-07-05-F-D-394-065 is critical for applications where space constraints drive routing complexity, such as stacked board assemblies or compact instrumentation. The trade-off involves tighter manufacturing tolerances, more demanding soldering processes, and reduced accessibility for manual rework. For designs where PCB real estate is not a limiting factor, the 0.1" pitch alternative offers easier assembly and troubleshooting at the cost of a larger footprint.
How does the 0.394" stack height of the FW-07-05-F-D-394-065 affect board-to-board spacing in multi-layer assemblies?
The FW-07-05-F-D-394-065 specifies a stack height of 0.394" (10.008mm), which represents the vertical distance from the PCB surface to the top of the connector body. In applications using stacked boards—such as modular RF modules, data acquisition daughter cards, or industrial measurement systems—this stack height directly determines the minimum clearance required between adjacent PCB layers. When multiple FW-07-05-F-D-394-065 units are daisy-chained or when the connector must mate with a corresponding receptacle, the 0.065" mating post length must be factored into the overall assembly height budget. Systems with height constraints under 12mm typically cannot accommodate the FW-07-05-F-D-394-065 without redesigning the mechanical envelope.
What surface mount assembly considerations are specific to the FW-07-05-F-D-394-065 given its 2-row configuration and 0.050" pitch?
The FW-07-05-F-D-394-065 features a 2-row arrangement at 0.050" spacing, creating a compact 14-position footprint approximately 0.7" × 0.1" (depending on exact layout). During reflow soldering, the fine pitch and high lead count create localized thermal gradients that can result in non-wetting or solder bridging if solder paste volume and stencil thickness are not precisely calibrated. Assembly houses typically recommend stencil apertures of 80–90% of pad area for the FW-07-05-F-D-394-065 to prevent excess paste, which improves yield. The MSL 1 rating (unlimited moisture exposure) on the FW-07-05-F-D-394-065 eliminates the need for baking before assembly, reducing manufacturing cycle time compared to moisture-sensitive connectors.
How does the 3.00µin gold plating on the FW-07-05-F-D-394-065 mating posts compare to thicker gold finishes in terms of wear resistance and contact reliability?
The FW-07-05-F-D-394-065 specifies 3.00µin (0.076µm) gold thickness on the mating post, which is a thin, hard-gold specification typical of high-density connectors. This thickness level balances contact resistance performance with cost and is suitable for low-to-moderate mating cycle applications (typically under 50 disconnects). In environments requiring higher mating cycle counts (100+ cycles), thicker gold platings (12–50µin) offer superior wear resistance and more stable contact resistance over the connector lifetime. The thin gold on the FW-07-05-F-D-394-065 is particularly effective for permanent or semi-permanent installations where the connector is mated once during assembly and remains undisturbed. For test fixtures, development boards, or field-replaceable modules, specify higher gold thickness or consider gold-over-nickel systems for extended reliability.
Can the FW-07-05-F-D-394-065 be reliably hand-soldered, or does it require automated reflow and selective wave processing?
The FW-07-05-F-D-394-065 is a surface mount connector with a 0.050" pitch and 14 positions, making hand soldering extremely challenging and not recommended for production. The fine pitch creates a high risk of bridging between adjacent leads, and manual thermal control is insufficient to ensure consistent solder joint quality across all 14 pads simultaneously. The FW-07-05-F-D-394-065 is designed for automated assembly workflows using solder reflow ovens with controlled temperature profiles. For low-volume prototyping or repair, selective wave soldering or focused heat tools (like micro-soldering irons with temperature feedback) can work on the FW-07-05-F-D-394-065, but validation and visual inspection under magnification are mandatory. Hand rework of the FW-07-05-F-D-394-065 after initial assembly requires skilled technicians and specialized equipment to avoid thermal damage to adjacent components or the PCB.
What is the typical current and voltage rating for each contact on the FW-07-05-F-D-394-065, and how is thermal management affected by the compact 0.050" pitch?
While the FW-07-05-F-D-394-065 datasheet typically specifies per-contact ratings (commonly 1–2 amps at 12V for similar Samtec flex headers), thermal dissipation in the FW-07-05-F-D-394-065 is constrained by the tight 0.050" pitch spacing, which limits heat dissipation paths between adjacent contacts. High-current applications (above 1A per contact) on the FW-07-05-F-D-394-065 require careful current distribution to avoid localized hot spots and contact heating that accelerates contact resistance drift. For designs carrying sustained currents above 3–5 amps across multiple contacts, the FW-07-05-F-D-394-065 should be supplemented with dedicated power and ground planes in the PCB, or consider lower-pitch, higher-current connector families. The compact form factor of the FW-07-05-F-D-394-065 makes it suitable for low-power signal distribution (logic levels, analog signals, differential pairs) rather than bulk power delivery.
How does the FW-07-05-F-D-394-065 perform in high-speed digital applications, and what impedance considerations apply?
The FW-07-05-F-D-394-065 is a header connector with limited transmission line characteristics, making it unsuitable for high-speed serial buses without careful design. The 0.050" pitch on the FW-07-05-F-D-394-065 allows close physical spacing, but the connector's open-frame geometry and lack of shielding between individual contacts introduce cross-talk risk for parallel signal groups. When using the FW-07-05-F-D-394-065 in applications with signal frequencies above 100 MHz, alternate high and low (ground) contacts to create effective shielding between critical signal lines. For USB, PCIe, DDR memory stacking, or other impedance-controlled links, the FW-07-05-F-D-394-065 is not the appropriate choice; instead, specify blind-mated micro-connectors or shielded flex headers with controlled impedance. The FW-07-05-F-D-394-065 excels in moderate-speed applications (I²C, SPI, low-speed digital control) where impedance matching is non-critical.
What are the key differences between the FW-07-05-F-D-394-065 and micro-pitch ball-grid-array (BGA) or fine-pitch QFP alternatives for dense interconnect applications?
The FW-07-05-F-D-394-065 is a discrete header connector with 0.050" pitch, whereas BGA and fine-pitch QFP are integrated component packages with 0.4–0.8mm pitch. The FW-07-05-F-D-394-065 offers advantages in reparability—individual signal paths can be probed, reworked, or replaced—whereas BGA and QFP are permanent solder interfaces. The FW-07-05-F-D-394-065 is preferred for modular or stackable designs where mechanical disconnection is intentional; BGA and QFP are better for fixed high-density ICs where parasitic inductance from long traces to connectors is undesirable. The FW-07-05-F-D-394-065 introduces additional board-to-board spacing and height, so applications with strict vertical constraints favor direct solder connections. For mixed applications combining the FW-07-05-F-D-394-065 with high-speed ICs, isolate the connector in a low-frequency (supply, control) region of the PCB.
Is the FW-07-05-F-D-394-065 suitable for applications requiring frequent mating and de-mating, such as test sockets or field-replaceable modules?
The FW-07-05-F-D-394-065 is rated for limited mating cycles due to its thin 3.00µin gold finish and fine contact geometry. Typical flex-stack connectors similar to the FW-07-05-F-D-394-065 are specified for 20–50 mating cycles before contact resistance degradation becomes noticeable. For field-replaceable or frequently accessed applications, the FW-07-05-F-D-394-065 is not recommended; instead, specify purpose-built test connectors with thick gold plating, resilient contact springs, and ratings of 100+ cycles. The FW-07-05-F-D-394-065 is optimized for permanent board-to-board stacking in embedded systems, instrumentation, and modular products where the connector is mated once during assembly and remains stable throughout the product lifetime. If a design requires frequent disconnection for troubleshooting or reconfiguration, redesign to use the FW-07-05-F-D-394-065 in a non-critical signal path, or incorporate a keyed receptacle with improved mechanical retention.
What are the environmental and regulatory compliance implications of selecting the FW-07-05-F-D-394-065 for consumer versus industrial applications?
The FW-07-05-F-D-394-065 is RoHS3 Compliant and classified as EAR99 (unrestricted export), making it suitable for both consumer and industrial markets without regulatory barriers. The MSL 1 rating (unlimited moisture sensitivity level) on the FW-07-05-F-D-394-065 simplifies supply chain handling compared to MSL 3–4 components, reducing storage and baking costs in manufacturing. For industrial applications in harsh environments (temperature cycling, vibration, humidity extremes), the FW-07-05-F-D-394-065 should be supplemented with conformal coating or potting to prevent moisture ingress and corrosion around the fine-pitch contacts. The black color designation on the FW-07-05-F-D-394-065 indicates standard material (phenolic or polyimide base), which offers good mechanical rigidity but limited thermal performance above 85°C continuous. For automotive or military applications, verify that the specific batch of FW-07-05-F-D-394-065 meets AEC-Q or MIL-grade requirements; standard commercial grades may not provide necessary traceability or screening.
How should the FW-07-05-F-D-394-065 be integrated into impedance-controlled stackup designs for mixed-signal PCBs?
The FW-07-05-F-D-394-065 is a connector rather than a controlled-impedance component, so its integration into signal integrity-critical designs requires careful planning. For mixed-signal PCBs using the FW-07-05-F-D-394-065, reserve the connector for power distribution (VCC, GND planes) and low-frequency control signals (clocks below 50 MHz, SPI, I²C). Dedicate inner layers of the PCB to continuous ground and power planes, then route signal traces from the FW-07-05-F-D-394-065 pads directly to those planes with minimal stub length—ideally under 100 mils. The 0.050" pitch of the FW-07-05-F-D-394-065 allows interleaving signal and ground contacts; use ground contacts as return paths for differential pairs and high-speed single-ended signals routed through the FW-07-05-F-D-394-065. For analog circuits sensitive to crosstalk, partition the FW-07-05-F-D-394-065 so that analog signals occupy one end and digital signals the other, minimizing coupling between domains.
What are the solderability and lead-free compatibility characteristics of the FW-07-05-F-D-394-065?
The FW-07-05-F-D-394-065 features gold-plated mating posts and a standard tin-lead or lead-free PCB pad finish, making it compatible with both lead-free (SAC305) and lead-based solder processes. The gold plating on the FW-07-05-F-D-394-065 provides excellent solderability across solder alloy families. For lead-free assembly, the FW-07-05-F-D-394-065 requires slightly elevated reflow temperatures (245–260°C peak) compared to lead-based processes, and assembly data from Samtec should be consulted for specific thermal profiles. The FW-07-05-F-D-394-065 exhibits good wetting characteristics, but residual flux around the fine-pitch contacts can trap moisture or conductive ions if not properly cleaned. Post-reflow cleaning (aqueous or no-clean flux systems) is recommended for the FW-07-05-F-D-394-065 in moisture-sensitive or high-reliability applications. The MSL 1 rating of the FW-07-05-F-D-394-065 simplifies lead-free process integration by eliminating bake-out steps.
How do mechanical tolerances and coplanarity on the FW-07-05-F-D-394-065 landing pads affect assembly yield and first-pass success rates?
The FW-07-05-F-D-394-065 specifies tight mechanical tolerances due to its 0.050" pitch; typical PCB pad coplanarity must be held to ±0.005" (±0.127mm) to ensure consistent solder joint formation across all 14 contacts. If PCB surface flatness or pad coplanarity drifts beyond this tolerance, solder bridges or non-wet joints appear on the FW-07-05-F-D-394-065, increasing rework rates. Assembly yield for the FW-07-05-F-D-394-065 is highly dependent on PCB fabrication quality; specify IPC-A-600 Class 2 or 3 and request coplanarity data from the PCB vendor before high-volume production. Solder paste thickness variation (±0.002") and stencil-to-PCB contact pressure uniformity are critical for the FW-07-05-F-D-394-065; use solder paste suppliers experienced with fine-pitch connectors and validate paste volume with X-ray inspection on first articles. Mechanical stress during the FW-07-05-F-D-394-065 assembly can be minimized by supporting the connector with a locator frame or mechanical stops to prevent lateral shift during reflow.
What is the typical cost premium of the FW-07-05-F-D-394-065 compared to standard 0.1" pitch alternatives, and how should this affect design trade-offs?
The FW-07-05-F-D-394-065, with its 0.050" pitch and Samtec Flex Stack heritage, typically commands a 20–40% cost premium over commodity 0.1" pitch headers due to tighter manufacturing tolerances and lower production volumes. When evaluating the FW-07-05-F-D-394-065 cost, factor in assembly complexity—the fine pitch increases rework costs and may require process adjustments, offsetting raw component savings. For high-volume consumer products (>10k units/year), the FW-07-05-F-D-394-065 cost amortizes well if PCB real estate savings enable a smaller form factor or fewer layers. For low-volume or prototype applications, the FW-07-05-F-D-394-065 cost is secondary to design flexibility and reworkability. Lifecycle cost comparison should include field repair rates: the FW-07-05-F-D-394-065 is less prone to solder joint fatigue than larger connectors in vibration-prone environments, potentially reducing warranty costs. Break-even analysis typically shows the FW-07-05-F-D-394-065 is cost-effective when board area savings exceed 15–20% or when connector density directly enables a reduction in overall product dimensions or layer count.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. FW-07-05-F-D-394-065

Product Attribute FW-07-05-F-D-400-065 FW-07-05-F-D-393-240-A FW-07-05-F-D-390-130-A FW-07-05-F-D-393-130-A
Part Number FW-07-05-F-D-400-065 FW-07-05-F-D-393-240-A FW-07-05-F-D-390-130-A FW-07-05-F-D-393-130-A
Manufacturer Samtec Inc. Samtec, Inc. Samtec, Inc. Samtec Inc.
Row Spacing - - - -
Series - - - -
Contact Finish Thickness - Post (Mating) - - - -
Termination - - - -
Number of Rows - - - -
Length - Post (Mating) - - - -
Contact Finish - Post (Mating) - - - -
Length - Tail - - - -
Length - Overall Pin - - - -
Color - - - -
Pitch - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Positions - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Length - Stack Height - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

FW-07-05-F-D-394-065 Datasheet PDF

Download FW-07-05-F-D-394-065 pdf datasheets and Samtec Inc. documentation for FW-07-05-F-D-394-065 - Samtec Inc..

HTML Datasheet
FW Series SMT Double Datasheet.pdf FW Series SMT Double Drawing.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

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    This product works considerably well. It secretly improves my basketball by a lot.

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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Samtec Inc.

FW-07-05-F-D-394-065

Samtec Inc.
98D-FW-07-05-F-D-394-065

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