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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)FW-07-05-F-D-400-080
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FW-07-05-F-D-400-080 - Samtec, Inc.

Manufacturer Part Number
FW-07-05-F-D-400-080
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-FW-07-05-F-D-400-080
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,929 pcs available, New & Original
Parts Description
.050'' BOARD SPACERS
Package
Data sheet
FW-07-05-F-D-40.pdf
RoHs Status
Lead free / RoHS Compliant
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Our certification
In stock: 39929
  • Unit Price: $2.58
  • Subtotal: $0.00

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1+ $2.58 $2.58
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Specifications

FW-07-05-F-D-400-080 Tech Specifications
Samtec, Inc. - FW-07-05-F-D-400-080 technical specifications, attributes, parameters and parts with similar specifications to Samtec, Inc. - FW-07-05-F-D-400-080

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, FW
Row Spacing 0.050" (1.27mm)
Pitch 0.050" (1.27mm)
Packaging Bulk
Number of Rows 2
Number of Positions 14
Mounting Type Surface Mount
Manufacturer Standard Lead Time 3 Weeks
Product Attribute Attribute Value
Length - Tail -
Length - Stack Height 0.400" (10.160mm)
Length - Post (Mating) 0.080" (2.032mm)
Length - Overall Pin 0.480" (12.192mm)
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Detailed Description 14 Position Header Spacer Connector 0.050" (1.27mm) Gold Surface Mount
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status Lead free / RoHS Compliant

Frequently Asked Questions(FAQ)

What is the actual mating depth required when designing a PCB with the FW-07-05-F-D-400-080 connector, and how does the 0.080" post length affect board-to-board spacing calculations?
The FW-07-05-F-D-400-080 provides a 0.080" (2.032mm) mating post length, which represents the engagement distance into a complementary socket. This post dimension is critical for calculating the minimum separation between your primary PCB surface and any mating connector or daughterboard. Since the FW-07-05-F-D-400-080 is configured with a 0.400" stack height and 14 positions arranged in 2 rows at 0.050" pitch, the total vertical profile from PCB to component top reaches approximately 0.480" including the post. When integrating multiple stacked stages, account for the full 0.400" stack height per FW-07-05-F-D-400-080 unit to avoid encroachment into adjacent layers or mechanical interference with shielding cans or thermal management components.
How does the 0.050" (1.27mm) pitch of the FW-07-05-F-D-400-080 compare to standard 0.1" pitch connectors in terms of PCB routing density and assembly complexity?
The FW-07-05-F-D-400-080 operates at a 0.050" pitch, which is half the traditional 0.1" spacing found in legacy connector families. This 2:1 density improvement allows 14 positions to occupy approximately 0.650" of linear PCB edge space compared to roughly 1.300" for equivalent 0.1" pitch designs. The tighter pitch on the FW-07-05-F-D-400-080 demands increased via density beneath the connector footprint and may require controlled impedance trace routing in high-speed applications. Assembly tolerances become more sensitive—pick-and-place equipment must maintain ±0.010" placement accuracy for reliable solder joint formation on all 14 positions of the FW-07-05-F-D-400-080. The 0.050" row spacing on the FW-07-05-F-D-400-080 creates a compact 2-row grid that simplifies signal routing compared to wider pitch alternatives but necessitates careful thermal management if power traces are routed through the connector region.
What is the practical current-carrying capacity per contact in the FW-07-05-F-D-400-080, and how should power distribution be managed across the 14 positions?
Samtec's Flex Stack FW series, including the FW-07-05-F-D-400-080, is designed for signal-level interconnect rather than heavy power distribution. While exact current ratings depend on the mating socket selection, each contact in the FW-07-05-F-D-400-080 typically supports 1–2 amperes under continuous operation when soldered to standard 1-ounce copper PCB traces. For power-critical applications, consolidate current paths by designating multiple FW-07-05-F-D-400-080 positions as parallel power or ground conductors, allowing thermal distribution across several contacts rather than concentrating current through single positions. The 0.050" pitch inherently limits trace cross-section beneath each pad, so external power delivery via thicker traces routed away from the connector footprint is recommended when total system current exceeds 5–10 amperes through the FW-07-05-F-D-400-080.
Does the FW-07-05-F-D-400-080 support stacking multiple connector stages, and what are the mechanical and electrical implications?
Yes, the FW-07-05-F-D-400-080 is part of Samtec's Flex Stack family, which inherently supports modular stacking. The 0.400" stack height is the registered dimension allowing predictable alignment when multiple FW-07-05-F-D-400-080 units are vertically cascaded. Each stage adds 0.400" to the total assembly height, which must be verified against enclosure clearances and mechanical constraints. Electrically, stacked FW-07-05-F-D-400-080 connectors do not interact—each operates independently, though cumulative solder thermal mass and rework difficulty increase with each added stage. When stacking, ensure all FW-07-05-F-D-400-080 connectors are aligned to the same datum to maintain coplanarity of mounting surfaces; misalignment exceeding ±0.010" can produce binding during mating or incomplete seating.
How does the gold plating thickness on the FW-07-05-F-D-400-080 affect long-term reliability in corrosive or high-humidity environments?
The FW-07-05-F-D-400-080 features 3.00µin (0.076µm) gold plating on the mating post surface, which is a moderate thickness within commercial connector specifications. This gold layer provides corrosion resistance and contact wiping action during mating cycles, but the thin 3.00µin coating on the FW-07-05-F-D-400-080 relies on adequate underlayer nickel to prevent base-metal diffusion and fretting corrosion over multi-year operating windows. In environments with salt spray, condensing humidity, or thermal cycling, specify periodic contact cleaning or ensure the FW-07-05-F-D-400-080 is protected by conformal coating or hermetic sealing. The 3.00µin gold on the FW-07-05-F-D-400-080 is sufficient for indoor industrial and consumer applications but may require supplemental protection if deployed in marine, automotive underhood, or other harsh-duty scenarios where contact resistance stability is mission-critical.
What are the thermal expansion mismatches between the FW-07-05-F-D-400-080 connector body and typical PCB materials, and how should thermal cycling be evaluated?
The FW-07-05-F-D-400-080 connector housing is molded in phenolic or polyimide composite with a coefficient of thermal expansion (CTE) typically around 15–25 ppm/°C, while standard FR-4 PCB material exhibits CTE values near 15–17 ppm/°C in the X–Y plane and 70–80 ppm/°C through Z thickness. This mismatch, though modest in the lateral plane, creates localized stress concentration at the solder joints connecting the FW-07-05-F-D-400-080 posts to PCB pads during wide thermal swings (e.g., −20°C to +85°C). Surface-mount termination on the FW-07-05-F-D-400-080 distributes stress across the full solder fillet rather than point-contact through-hole termination, improving fatigue life. However, designs subjecting the FW-07-05-F-D-400-080 to repeated temperature cycling across >50°C differentials should specify solder alloy and reflow profile validation to confirm solder joint integrity after 500–1000 thermal cycles.
How should the FW-07-05-F-D-400-080 be handled during assembly to prevent moisture absorption or electrostatic damage, given its MSL 1 classification?
The FW-07-05-F-D-400-080 carries Moisture Sensitivity Level (MSL) 1 classification, indicating unlimited shelf life without specialized dry-bag storage—one of the most relaxed moisture requirements in the connector category. This MSL 1 rating on the FW-07-05-F-D-400-080 means the component can be stored at ambient temperature and humidity indefinitely without risk of moisture-induced popcorning or pad cratering during reflow. Despite this low risk, the FW-07-05-F-D-400-080 remains susceptible to electrostatic discharge (ESD) during pick-and-place and manual handling. Maintain standard ESD-safe assembly protocols: grounded workstations, wrist straps, and ESD-shielded trays for the FW-07-05-F-D-400-080 are recommended to prevent latent ESD failures in sensitive signal traces. The MSL 1 status of the FW-07-05-F-D-400-080 does not eliminate ESD risk; it only simplifies storage logistics.
What PCB footprint tolerances and solder mask opening dimensions are required for reliable assembly of the FW-07-05-F-D-400-080?
The FW-07-05-F-D-400-080 surface-mount pads must follow Samtec's published footprint guidelines, typically specifying pad sizes of 0.030" × 0.050" for each of the 14 contact positions arranged in a 2-row array at 0.050" pitch. Solder mask opening should be sized 0.008"–0.012" larger than pad dimensions to ensure complete wetting without paste bridging between adjacent FW-07-05-F-D-400-080 positions. Via placement beneath the FW-07-05-F-D-400-080 footprint should maintain minimum 0.020" clearance from pad edges to prevent solder wicking during reflow. Stencil thickness for the FW-07-05-F-D-400-080 should be 0.004"–0.006" with area-ratio-compensated apertures to ensure consistent solder paste volume across all 14 positions; underprinting on the outer rows of the FW-07-05-F-D-400-080 is a common assembly defect when stencil design is not optimized for the 0.050" pitch.
How does the FW-07-05-F-D-400-080 compare to pin-and-socket alternatives in terms of board-to-board interconnect reliability and insertion-force requirements?
The FW-07-05-F-D-400-080 is a header (socket-receiving) connector with 0.080" mating posts, designed to accept spring-contact sockets or compliant pin connectors. Compared to traditional board-to-board pin-and-socket pairs (e.g., 0.100" pitch headers), the FW-07-05-F-D-400-080 offers tighter spacing and lower insertion force due to its 0.050" pitch geometry and Samtec's optimized contact spring design. The FW-07-05-F-D-400-080 insertion force is typically 50–80 grams per position, resulting in total mating force under 5 pounds for all 14 positions—substantially lower than 0.1" pitch alternatives. This reduced insertion force on the FW-07-05-F-D-400-080 minimizes PCB deflection and solder joint stress during mating, improving reliability in repeated disconnect/reconnect scenarios. However, the lower force tolerance on the FW-07-05-F-D-400-080 requires precision-molded socket contacts and tighter tolerances on the 0.050" pitch to maintain consistent contact pressure across all 14 positions.
What signal integrity and crosstalk considerations apply when routing high-speed differential pairs through the FW-07-05-F-D-400-080?
The FW-07-05-F-D-400-080 accommodates 14 positions in a compact 2-row configuration at 0.050" pitch, allowing potential accommodation of differential pair signaling for USB, LVDS, or other high-speed protocols. However, the tight 0.050" pitch on the FW-07-05-F-D-400-080 creates mutual capacitive coupling between adjacent traces, increasing crosstalk and differential impedance variation. For signals exceeding 100 MHz, route dedicated ground positions adjacent to sensitive differential pairs within the FW-07-05-F-D-400-080 footprint to establish impedance control and shield crosstalk sources. Controlled-impedance design for the FW-07-05-F-D-400-080 requires field-solver analysis (e.g., 2D cross-section modeling) to determine trace geometry and layer stackup, as the tightly-pitched 14-position layout cannot tolerate standard microstrip assumptions. Limit FW-07-05-F-D-400-080 trace lengths to under 2–3 inches for uncompensated gigabit-class signaling to avoid accumulated skew and impedance mismatch.
Is the FW-07-05-F-D-400-080 suitable for automotive or aerospace applications, and what additional qualification or testing is recommended?
The FW-07-05-F-D-400-080 carries ECCN EAR99 and standard RoHS3 compliance, indicating general commercial-grade design without explicit automotive (AEC-Q200) or aerospace (AS9100) qualification. Deployment of the FW-07-05-F-D-400-080 in automotive underhood or aerospace environments requires supplemental validation including thermal cycling (−40°C to +125°C or wider), vibration endurance per MIL-STD-810 or automotive standards, and salt-spray corrosion testing of the 3.00µin gold plating. The phenolic/polyimide housing material of the FW-07-05-F-D-400-080 has not undergone high-altitude vacuum outgassing qualification (NASA AMSN 7000 series), limiting suitability for deep-space or satellite thermal-vacuum applications. For automotive tier-1 supplier integration, request Samtec documentation of design margins and solder-joint fatigue analysis specific to the FW-07-05-F-D-400-080 to satisfy OEM design assurance requirements.
What is the expected service life and replacement/rework strategy for the FW-07-05-F-D-400-080 in field-serviceable systems?
The FW-07-05-F-D-400-080 surface-mount termination simplifies field rework compared to through-hole alternatives—the connector can be desoldered using standard SMD rework equipment (hot-air or IR reflow stations) without specialized fixtures. However, the 14 closely-spaced solder joints on the FW-07-05-F-D-400-080 demand careful thermal management during desoldering to prevent pad lift or conductor trace damage, particularly if routed on inner layers. Samtec does not publish specific MTBF (Mean Time Between Failure) data for the FW-07-05-F-D-400-080, but contact cycling life (mating/unmating cycles) typically exceeds 100 cycles for static pressure-fit socket connectors. If field replacement of the FW-07-05-F-D-400-080 is anticipated, specify keyed or polarized socket designs to prevent reversed mating. Thermal cycling and vibration are the primary failure modes for the FW-07-05-F-D-400-080 in extended service; predictive maintenance should focus on visual inspection of solder joints for cracking or cold-solder appearance after thermal stress events.
How should the FW-07-05-F-D-400-080 be tested during design validation to ensure solder joint reliability and mating contact integrity?
Design validation testing for the FW-07-05-F-D-400-080 should include (1) functional continuity testing of all 14 contact paths with low-resistance measurement (<100 milliohms per position); (2) thermal shock cycling (−20°C to +85°C, 10–15 cycles minimum) with electrical continuity verification between cycles to detect cold-solder or crack initiation; (3) visual cross-section (destructive sampling) of 2–3 representative FW-07-05-F-D-400-080 units to confirm solder fillet geometry, void content <20%, and pad wetting >95% surface coverage; and (4) insertion-force measurement using calibrated test fixtures to confirm mating force remains within 50–80 grams per position after 50+ mating cycles. High-speed designs routing signals through the FW-07-05-F-D-400-080 should include impedance profiling and eye-diagram analysis at the connector interface to validate signal integrity margins. Production acceptance testing should include 100% continuity scanning and parametric measurement of contact resistance to detect assembly defects in the FW-07-05-F-D-400-080 before field deployment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec, Inc. FW-07-05-F-D-400-080

Product Attribute FW-07-05-F-D-400-100-TR FW-07-05-F-D-400-100-A FW-07-05-F-D-400-090 FW-07-05-F-D-400-120
Part Number FW-07-05-F-D-400-100-TR FW-07-05-F-D-400-100-A FW-07-05-F-D-400-090 FW-07-05-F-D-400-120
Manufacturer Samtec Inc. Samtec, Inc. Samtec Inc. Samtec Inc.
Packaging - - - -
Length - Post (Mating) - - - -
Number of Rows - - - -
Series - - - -
Termination - - - -
Length - Tail - - - -
Lead Free Status / RoHS Status - - - -
Contact Finish - Post (Mating) - - - -
Length - Overall Pin - - - -
Length - Stack Height - - - -
Contact Finish Thickness - Post (Mating) - - - -
Number of Positions - - - -
Detailed Description - - - -
Row Spacing - - - -
Color - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Manufacturer Standard Lead Time - - - -
Pitch - - - -

FW-07-05-F-D-400-080 Datasheet PDF

Download FW-07-05-F-D-400-080 pdf datasheets and Samtec, Inc. documentation for FW-07-05-F-D-400-080 - Samtec, Inc..

Datasheets
FW Series SMT Double Datasheet.pdf FW Series SMT Double Drawing.pdf

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Samtec, Inc.

FW-07-05-F-D-400-080

Samtec, Inc.
98D-FW-07-05-F-D-400-080

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