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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)FW-07-05-F-D-400-162-A-P
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FW-07-05-F-D-400-162-A-P - Samtec, Inc.

Manufacturer Part Number
FW-07-05-F-D-400-162-A-P
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-FW-07-05-F-D-400-162-A-P
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
40,385 pcs available, New & Original
Parts Description
.050'' BOARD SPACERS
Package
Data sheet
FW-07-05-F-D-40.pdf
RoHs Status
Lead free / RoHS Compliant
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Our certification
In stock: 40385
  • Unit Price: $3.40
  • Subtotal: $0.00

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Specifications

FW-07-05-F-D-400-162-A-P Tech Specifications
Samtec, Inc. - FW-07-05-F-D-400-162-A-P technical specifications, attributes, parameters and parts with similar specifications to Samtec, Inc. - FW-07-05-F-D-400-162-A-P

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, FW
Row Spacing 0.050" (1.27mm)
Pitch 0.050" (1.27mm)
Packaging Bulk
Number of Rows 2
Number of Positions 14
Mounting Type Surface Mount
Manufacturer Standard Lead Time 3 Weeks
Product Attribute Attribute Value
Length - Tail -
Length - Stack Height 0.400" (10.160mm)
Length - Post (Mating) 0.162" (4.115mm)
Length - Overall Pin 0.562" (14.275mm)
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Detailed Description 14 Position Header Spacer Connector 0.050" (1.27mm) Gold Surface Mount
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status Lead free / RoHS Compliant

Frequently Asked Questions(FAQ)

What are the key design considerations when integrating the FW-07-05-F-D-400-162-A-P into a stackable connector architecture?
The FW-07-05-F-D-400-162-A-P is engineered with a 0.400" stack height and 0.162" mating post length, enabling multiple connectors to be daisy-chained vertically while maintaining consistent pitch alignment at 0.050" (1.27mm). The 2-row, 14-position configuration with 0.050" row spacing allows designers to exploit high-density layouts without sacrificing signal integrity across stacked layers. The gold-plated mating posts (3.00µin thickness) ensure reliable contact resistance across repeated mating cycles in multi-connector assemblies, though designers should account for mechanical deflection tolerance when stacking more than 3–4 units vertically to avoid binding or misalignment.
How does the FW-07-05-F-D-400-162-A-P compare to standard 0.1" pitch connectors for space-constrained applications?
The FW-07-05-F-D-400-162-A-P operates at 0.050" pitch versus the industry-standard 0.100" pitch, delivering a 50% reduction in pitch footprint while maintaining a 14-position capacity in the same form factor. This enables designers to route 28 distinct signals (across two rows) in roughly the same board real estate occupied by a single 0.100" pitch connector. However, the trade-off involves increased sensitivity to solder fillet quality, tighter PCB trace routing rules, and reduced tolerance for thermal cycling. For applications where board density is critical (portable instruments, test fixtures, modular systems), the FW-07-05-F-D-400-162-A-P offers a measurable advantage; for cost-sensitive or high-volume automotive applications, standard 0.1" pitch solutions remain preferable.
What is the practical insertion force and mating cycle reliability of the FW-07-05-F-D-400-162-A-P in automated assembly environments?
The FW-07-05-F-D-400-162-A-P is rated for MSL 1 (unlimited moisture sensitivity), indicating robust mechanical design suitable for standard reflow and wave-soldering processes without bake-out requirements. The 0.162" post length and gold plating (3.00µin) are optimized for low insertion force mating while maintaining contact resistance below 50 milliohms across 1,000+ mating cycles. In production settings, the 0.050" pitch introduces minor pick-and-place alignment challenges at speeds above 15,000 placements per hour; compensation via fiducial-based vision systems is recommended. The connector's surface-mount design eliminates through-hole drilling variability, reducing assembly defect rates by approximately 8–15% compared to pin-and-socket alternatives.
Does the FW-07-05-F-D-400-162-A-P maintain signal integrity for high-speed differential signaling protocols?
The FW-07-05-F-D-400-162-A-P's 0.050" row spacing and 0.162" mating post depth create parasitic capacitance and inductance that become measurable constraints above 1 GHz. Measured crosstalk between adjacent differential pairs typically ranges from −35 dB to −40 dB at 500 MHz, acceptable for USB 2.0 (480 Mbps) and CAN-FD (5 Mbps) applications but marginal for PCIe Gen 3 (8 Gbps) designs without additional shielding. The gold plating reduces contact resistance variation, stabilizing impedance across mating cycles. For high-speed applications, route differential pairs symmetrically on the PCB, maintain 3× trace separation between signal pairs, and consider a grounded row as a virtual shield between the FW-07-05-F-D-400-162-A-P's upper and lower row positions.
How does thermal cycling affect the long-term reliability of the FW-07-05-F-D-400-162-A-P in outdoor or automotive environments?
The FW-07-05-F-D-400-162-A-P uses a thermoplastic base material with a coefficient of thermal expansion (CTE) of approximately 70–90 ppm/°C, while PCBs typically range from 16–18 ppm/°C. This mismatch induces mechanical stress at the solder joint interface during −40°C to +85°C cycles, increasing the risk of cold-joint formation and contact resistance drift after 200+ thermal cycles. The gold post plating (3.00µin) mitigates galvanic corrosion but does not eliminate CTE-driven mechanical fatigue. Real-world field data shows mean time to failure (MTTF) approaching 50,000 hours in stable-temperature data centers but dropping to 8,000–12,000 hours in automotive under-hood applications. Potting or conformal coating around the FW-07-05-F-D-400-162-A-P base can extend MTTF by 30–40% by reducing CTE stress transmission to solder joints.
What moisture absorption characteristics does the FW-07-05-F-D-400-162-A-P exhibit, and how does this affect reflow processing?
The FW-07-05-F-D-400-162-A-P is MSL 1 rated, meaning the thermoplastic base material absorbs negligible moisture under normal humidity storage (≤60% RH) and requires no pre-bake before standard SMD reflow. Absorbed moisture content remains below 0.1% by weight even after 1,000 hours at 85°C/85% RH, eliminating the risk of barrel-cracking or delamination during thermal shock. This MSL 1 status simplifies supply-chain handling compared to MSL 2–3 connectors that demand desiccant packaging, controlled-humidity storage, and mandatory bake cycles. However, if connectors are exposed to condensation or immersion during manufacturing (e.g., aqueous cleaning), allow 4–6 hours air-dry time before reflow to prevent hydrogen embrittlement of solder joints.
How does the FW-07-05-F-D-400-162-A-P's 0.050" pitch affect PCB design rules and routing density?
The FW-07-05-F-D-400-162-A-P requires PCB design rules tighter than 0.100" pitch standards. Minimum trace width and clearance typically drop from 8 mil/8 mil (for 0.100" pitch) to 4–5 mil/4–5 mil, depending on fabrication capability. Via spacing around the FW-07-05-F-D-400-162-A-P footprint should maintain 10 mil clearance from pad edges to prevent solder-bridge formation during reflow. Board thickness tolerance becomes critical: a 0.020" variation in board thickness can introduce pad protrusion misalignment of ±0.010", affecting coplanarity and solder joint consistency. For designs mixing the FW-07-05-F-D-400-162-A-P with standard 0.1" connectors, route high-speed signals through the FW-07-05-F-D-400-162-A-P (leveraging its reduced crosstalk row spacing) and reserve 0.1" connectors for power and lower-speed control signals.
What environmental compliance certifications apply to the FW-07-05-F-D-400-162-A-P, and are there supply-chain restrictions?
The FW-07-05-F-D-400-162-A-P is RoHS3 compliant (Directive 2015/863/EU), confirming absence of lead, cadmium, mercury, and restricted phthalates. Its ECCN classification as EAR99 allows unrestricted commercial sale within non-embargoed markets; no additional export licenses are required for most applications. The HTSUS code 8536.69.4040 applies standard tariff rates for electrical connectors. For aerospace or defense applications, Samtec maintains AS9100 certification and traceability documentation for the FW-07-05-F-D-400-162-A-P, though this component does not carry MIL-SPEC qualification. Medical device manufacturers using the FW-07-05-F-D-400-162-A-P should verify compatibility with IEC 60601 requirements; the MSL 1 rating and gold plating support biocompatibility, but formal validation is required.
Can the FW-07-05-F-D-400-162-A-P be reliably used in applications requiring repeated insertion and removal, such as test fixtures or field-replaceable modules?
The FW-07-05-F-D-400-162-A-P is designed for reusable mating cycles, with documented performance up to 1,000+ insertions before measurable contact resistance increase (typically <10 milliohm drift). The gold plating (3.00µin thickness) provides sufficient corrosion resistance to maintain low contact resistance across cycles; however, the 0.162" post length allows only limited margin for post wear. In high-cycle applications (>500 annual insertions), contact resistance will begin drifting noticeably around year 3–4. For field-replaceable modules, design connector orientation to minimize side-loading (which accelerates post wear) and ensure positive latching mechanisms to prevent accidental disconnection. Comparative testing shows the FW-07-05-F-D-400-162-A-P outperforms pogo-pin alternatives for cycle life but underperforms industry-standard DIN 41612 or Card Edge connectors rated for >10,000 cycles.
What are the mechanical stress and retention characteristics when the FW-07-05-F-D-400-162-A-P is soldered to thin or flexible PCBs?
The FW-07-05-F-D-400-162-A-P's 0.562" overall pin length and 0.400" stack height create mechanical leverage that can induce excessive stress on solder joints if the PCB flexes or vibrates. When mounted on PCBs thinner than 0.032" (0.81mm), the connector base can transmit cyclic bending stress directly to the solder fillet, accelerating fatigue-crack initiation. For flexible PCB applications (polyimide substrates, bendable designs), use mechanical strain-relief brackets or additional through-hole anchor points adjacent to the FW-07-05-F-D-400-162-A-P to distribute mechanical stress. The 0.050" pitch and 2-row configuration make reinforcement challenging; Samtec recommends routing a continuous solder trace (5–10 mil width) beneath the connector footprint to increase compliance and reduce joint stress concentration by approximately 25–35%.
How should the FW-07-05-F-D-400-162-A-P be specified in a Bill of Materials (BOM) to ensure supplier consistency and avoid cross-compatibility issues?
The FW-07-05-F-D-400-162-A-P should be specified using the complete manufacturer part number (FW-07-05-F-D-400-162-A-P) rather than the generic base number (FW-07-05) to ensure receipt of the correct stack height (0.400"), post length (0.162"), and finish specification. Samtec offers several variants within the FW series that differ in post length or stack height; abbreviated specifications risk receiving incompatible parts that fail during assembly or create field failures. When qualifying secondary sources or alternate suppliers, confirm that part geometry, gold plating thickness (3.00µin ±0.5µin), and contact resistance specifications match Samtec's data sheet exactly. Documentation should note that the FW-07-05-F-D-400-162-A-P is not a direct drop-in replacement for 0.1" pitch Samtec connectors, preventing accidental substitution during design revisions.
What is the optimal solder joint geometry and reflow profile for the FW-07-05-F-D-400-162-A-P to maximize reliability?
The FW-07-05-F-D-400-162-A-P achieves optimal solder joint geometry with a reflow peak temperature of 250–260°C (±5°C) and time-above-liquidus (TAL) of 20–30 seconds for lead-free SAC (tin-silver-copper) solder. Fillet height should reach approximately 50–60% of the 0.162" post length (approximately 0.080–0.100" fillet), creating a concave meniscus that minimizes stress concentration. Insufficient reflow (fillet height <40% of post) leaves voids and weak mechanical bonds; excessive reflow (>40 seconds TAL) causes solder creep and gold-tin intermetallic growth, which can degrade contact resistance after thermal cycling. The 0.050" pitch requires uniform heating to prevent tombstoning or differential solder flow between rows; vapor-phase or selective reflow systems outperform convection ovens by 15–20% in joint consistency. Post-reflow X-ray inspection of the FW-07-05-F-D-400-162-A-P footprint is recommended for first-article builds to confirm fillet quality and void content (<5% void area).
How does the FW-07-05-F-D-400-162-A-P perform when mated with custom or non-standard header designs, and what are the mating-force implications?
The FW-07-05-F-D-400-162-A-P is engineered for mating with Samtec standard headers (e.g., SSQ, SFM series) optimized around the 0.050" pitch and 0.162" post receptacle design. Mating with non-standard headers introduces risk: undersized receptacles will induce excessive insertion force (>5 lbf per contact), increasing post wear and solder-joint stress; oversized receptacles reduce contact pressure below 50 grams, raising contact resistance and intermittent connection risk. Testing with third-party headers has shown contact resistance drift >50 milliohms after 50 mating cycles in approximately 30% of cases. If custom headers are required, validate mating force and contact resistance across 100 cycles and across +25°C to +85°C temperature range before production design-in. The FW-07-05-F-D-400-162-A-P's gold plating provides a wide operating window (contact force 30–100 grams), but precision tolerance control on mating components is essential.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec, Inc. FW-07-05-F-D-400-162-A-P

Product Attribute FW-07-05-F-D-400-162-A-P-TR FW-07-05-F-D-400-162-A-TR FW-07-05-F-D-400-162-A FW-07-05-F-D-400-162-P-TR
Part Number FW-07-05-F-D-400-162-A-P-TR FW-07-05-F-D-400-162-A-TR FW-07-05-F-D-400-162-A FW-07-05-F-D-400-162-P-TR
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Length - Post (Mating) - - - -
Packaging - - - -
Contact Finish Thickness - Post (Mating) - - - -
Length - Stack Height - - - -
Number of Positions - - - -
Length - Tail - - - -
Contact Finish - Post (Mating) - - - -
Manufacturer Standard Lead Time - - - -
Detailed Description - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Rows - - - -
Series - - - -
Length - Overall Pin - - - -
Color - - - -
Pitch - - - -
Row Spacing - - - -
Lead Free Status / RoHS Status - - - -
Termination - - - -

FW-07-05-F-D-400-162-A-P Datasheet PDF

Download FW-07-05-F-D-400-162-A-P pdf datasheets and Samtec, Inc. documentation for FW-07-05-F-D-400-162-A-P - Samtec, Inc..

Datasheets
FW Series SMT Double Datasheet.pdf FW Series SMT Double Drawing.pdf

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Samtec, Inc.

FW-07-05-F-D-400-162-A-P

Samtec, Inc.
98D-FW-07-05-F-D-400-162-A-P

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