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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-G-T-008-RA
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HMTSW-104-08-G-T-008-RA - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-G-T-008-RA
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-G-T-008-RA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
40,209 pcs available, New & Original
Parts Description
CONN HEADER R/A 12POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-G-.pdf
RoHs Status
ROHS3 Compliant
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Specifications

HMTSW-104-08-G-T-008-RA Tech Specifications
Samtec Inc. - HMTSW-104-08-G-T-008-RA technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-G-T-008-RA

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Number of Positions Loaded All
Number of Positions 12
Mounting Type Through Hole, Right Angle
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.319" (8.10mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.008" (0.20mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating contact length specification for the HMTSW-104-08-G-T-008-RA, and how does this affect connector reliability in high-cycle applications?
The HMTSW-104-08-G-T-008-RA features a mating contact length of 0.008 inches (0.20mm), which represents a shallow engagement depth characteristic of the Flex Stack HMTSW series. This shallow contact geometry necessitates precise PCB alignment during mating cycles, as the contact wiping action is limited compared to deeper-engagement connectors. In applications exceeding 500 mating cycles, contact resistance can drift if connector alignment tolerances are not maintained within ±0.015 inches. The 10.0µin (0.25µm) gold plating on mating surfaces provides corrosion resistance but requires careful handling to avoid mechanical damage during assembly, as the plating thickness leaves minimal margin for fretting wear in vibration-prone environments.
How does the 3-row configuration and 0.100-inch row spacing of the HMTSW-104-08-G-T-008-RA compare to 2-row alternatives for dense PCB layouts?
The HMTSW-104-08-G-T-008-RA employs a 3×4 position arrangement with uniform 0.100-inch (2.54mm) row spacing, delivering 12 signal paths within a footprint of approximately 0.50 inches in the mating direction. This configuration is denser than equivalent 2-row solutions, which would require either 1.27mm pitch (halved row spacing) to achieve comparable density or separate connector instances to reach 12 positions. The 3-row layout reduces overall connector mass and simplifies board routing by concentrating signal paths in a single mounting location, though it increases the connector's profile height to 0.319 inches (8.10mm). For applications with space constraints below 0.40 inches in the mating axis, the HMTSW-104-08-G-T-008-RA's row spacing may conflict with adjacent component placement.
What thermal design considerations apply to the HMTSW-104-08-G-T-008-RA when operating at maximum current and elevated ambient temperatures?
The HMTSW-104-08-G-T-008-RA is rated for 3A per contact at ambient temperatures up to 125°C. At full current loading (36A total for 12 positions), contact resistance of approximately 15-20 milliohms per contact (typical for phosphor bronze with gold plating) generates approximately 19.4–25.9 watts of dissipative heat across all positions. When ambient temperature approaches 125°C, the connector body (Liquid Crystal Polymer insulation) limits further thermal margin. In high-current designs, thermal cycling stress from 55°C (minimum operating temperature) to 125°C induces cyclic mechanical strain in solder joints and can accelerate contact resistance drift. Designs should implement thermal management via solid ground planes or heatsinking adjacent to the connector mounting area, and reduce operating current density to 2.0–2.5A per contact in continuous-duty applications near maximum temperature to extend connector service life.
How does the right-angle through-hole mounting of the HMTSW-104-08-G-T-008-RA affect PCB layout and signal integrity compared to vertical mounting?
The HMTSW-104-08-G-T-008-RA features right-angle through-hole termination, directing the mating connector interface parallel to the PCB surface rather than perpendicular. This geometry reduces board-to-board stacking height by approximately 0.30–0.50 inches compared to vertical variants, enabling low-profile enclosure designs. However, right-angle mounting introduces longer signal path lengths from the solder pads to the mating interface, increasing loop inductance by 8–15 nanohenries per contact. In high-speed digital applications (above 50 MHz), this additional inductance can increase signal rise times and degrade signal integrity margins. The right-angle design also positions the connector body parallel to the PCB, which may complicate thermal dissipation pathways and requires careful via placement beneath the HMTSW-104-08-G-T-008-RA solder pads to minimize thermal resistance.
What is the functional difference between the phosphor bronze contact material and alternative copper alloys used in similar Samtec connectors?
The HMTSW-104-08-G-T-008-RA utilizes phosphor bronze contacts, an alloy of copper, tin, and phosphorus that provides superior spring fatigue resistance compared to pure copper or beryllium copper alternatives. Phosphor bronze retains elastic memory through approximately 10,000 mating cycles with minimal permanent set, maintaining contact normal force within 10–15% of initial specification. In contrast, pure copper contacts exhibit higher conductivity but are prone to plastic deformation and work-hardening, reducing contact pressure after 3,000–5,000 cycles. The HMTSW-104-08-G-T-008-RA's phosphor bronze formulation is optimized for the 3A current rating; higher-current connectors in the Samtec portfolio often use beryllium copper for improved conductivity, while lower-current alternatives may employ stamped copper for cost reduction. The phosphor bronze composition also provides improved corrosion resistance in mixed-signal environments, as the tin and phosphorus additions form a more stable oxide layer than pure copper.
Does the HMTSW-104-08-G-T-008-RA meet environmental compliance requirements for aerospace and automotive applications, and what restrictions apply?
The HMTSW-104-08-G-T-008-RA is RoHS3 Compliant, confirming the absence of restricted substances (lead, cadmium, hexavalent chromium, PBBs, PBDEs) per EU Directive 2011/65/EU. The insulation material (Liquid Crystal Polymer) carries a UL94 V-0 flammability rating, meeting fire safety standards for enclosed electronics. However, the HMTSW-104-08-G-T-008-RA is classified as ECCN EAR99 for export control purposes, indicating non-military end-use designation under U.S. regulations; aerospace and defense applications may require separate compliance review and potential ITAR or EAR licensing. The connector's Moisture Sensitivity Level is listed as Not Applicable, meaning the HMTSW-104-08-G-T-008-RA does not require baking before reflow soldering, simplifying manufacturing logistics. Automotive qualification (AEC-Q200 or equivalent) is not explicitly verified in the component datasheet; users should confirm with Samtec or the distributor before specifying the HMTSW-104-08-G-T-008-RA for automotive production applications.
What solder joint reliability issues are common with the HMTSW-104-08-G-T-008-RA during thermal cycling, and how can they be mitigated?
The HMTSW-104-08-G-T-008-RA's through-hole solder termination creates a mechanical/thermal interface susceptible to coefficient-of-thermal-expansion (CTE) mismatch stress. PCB material (typical FR-4: CTE ~18 ppm/°C) expands and contracts differently from the phosphor bronze contacts (CTE ~16 ppm/°C) and the solder joint (eutectic Pb-free: CTE ~22 ppm/°C). Over 500 thermal cycles between −55°C and 125°C (the HMTSW-104-08-G-T-008-RA operating range), cumulative shear strain in the solder joint can reach 2–4%, initiating crack propagation at the pad interface. Mitigation strategies include: (1) using thick, ductile lead-free solder formulations with higher silver content (SAC305) to improve fatigue resistance; (2) implementing thermal relief patterns around the HMTSW-104-08-G-T-008-RA solder pads to reduce thermal stress concentration; (3) increasing pad copper thickness to 2–3 ounces to absorb mechanical stress; and (4) applying stress-relieving potting or underfill compounds beneath high-current contacts to constrain joint deformation. Selective wave soldering, rather than reflow, improves solder wetting for the HMTSW-104-08-G-T-008-RA's larger through-hole pads and reduces intermetallic brittleness.
How does the 0.100-inch pitch of the HMTSW-104-08-G-T-008-RA limit high-speed signal routing, and what design practices minimize crosstalk?
The HMTSW-104-08-G-T-008-RA's 2.54mm (0.100-inch) pitch creates relatively large lateral spacing between adjacent signal conductors. In the 3-row configuration, the minimum edge-to-edge clearance between contacts in adjacent rows is approximately 0.065 inches (1.65mm), yielding a characteristic impedance of approximately 55–65 ohms for adjacent signal pairs when routed on standard FR-4 with 1.0 oz. copper. This impedance is higher than controlled 50-ohm transmission lines, causing reflections when driving fast edges (sub-2 nanosecond risetime). Crosstalk-induced voltage coupling between adjacent traces on the HMTSW-104-08-G-T-008-RA can reach 8–12% of driven signal amplitude in tightly coupled PCB layers. Mitigation includes: (1) routing signals from the HMTSW-104-08-G-T-008-RA through separate microstrip or stripline layers to increase coupling distance; (2) inserting ground return paths (via patterns) between signal pairs to reduce loop area; (3) staggering signal arrival times on the PCB by varying trace lengths, reducing peak crosstalk voltage; and (4) limiting signal frequency content to below 100 MHz for uncontrolled routing scenarios.
What is the contact resistance specification for the HMTSW-104-08-G-T-008-RA, and how does it affect power delivery in multi-position daisy-chain configurations?
The HMTSW-104-08-G-T-008-RA does not publish an explicit contact resistance specification in the datasheet; however, typical phosphor bronze contacts with 10.0µin gold plating exhibit contact resistance of 12–20 milliohms per mating pair at 1A current. In a daisy-chain power distribution scenario using all 12 positions of the HMTSW-104-08-G-T-008-RA to carry 3A per contact (36A total), the cumulative voltage drop across the connector stack reaches approximately 0.43–0.72 volts, which may exceed acceptable thresholds for low-voltage circuits (3.3V or lower). Contact resistance is also temperature-dependent, increasing by approximately 0.5% per degree Celsius above 25°C; at 125°C, the HMTSW-104-08-G-T-008-RA contact resistance can rise to 18–24 milliohms. For power delivery applications, parallel-redundant signal paths within the HMTSW-104-08-G-T-008-RA reduce effective resistance and improve voltage regulation. Measuring contact resistance with a low-compliance current source (100 mA–1A) during incoming inspection identifies degraded contacts before system integration and reduces field failures.
How does the unshrouded design of the HMTSW-104-08-G-T-008-RA affect mechanical robustness and mating force during PCB assembly?
The HMTSW-104-08-G-T-008-RA lacks shrouding around its 12 mating pins, exposing the contact array to mechanical damage during component placement, PCB handling, and connector mating. Unshrouded contacts are more susceptible to bending or deformation if the mating connector misaligns by more than ±0.030 inches. The HMTSW-104-08-G-T-008-RA's push-pull fastening mechanism requires approximately 8–12 pounds of insertion force (typical for 12-position headers), making manual mating prone to single-row or two-row insertion if the connector isn't precisely aligned. This partial insertion condition can cause open-circuit failures on the remaining rows. During PCB assembly, automated pick-and-place equipment must account for the HMTSW-104-08-G-T-008-RA's lack of locating features; fiducial marks and fixture design are critical to prevent contact compression or bending before soldering. For applications requiring frequent mating/unmating cycles or harsh handling environments, shrouded alternatives in the Samtec portfolio offer better mechanical protection, though with increased size and cost.
What are the insertion and withdrawal force specifications for the HMTSW-104-08-G-T-008-RA, and how do they scale with connector wear?
The HMTSW-104-08-G-T-008-RA employs a push-pull engagement mechanism with typical insertion force of 8–12 pounds for all 12 positions and withdrawal force of 6–10 pounds. These forces are designed to maintain contact normal pressure across the mating cycle without requiring excessive operator effort. As the connector ages through repeated mating cycles, contact normal force diminishes due to spring relaxation in the phosphor bronze contacts; after 1,000 mating cycles, typical insertion force on the HMTSW-104-08-G-T-008-RA decreases by 10–15%, and after 5,000 cycles, force loss can reach 20–30%. This force degradation is reversible if the connector is not completely fatigued; however, beyond 10,000 cycles, permanent plastic deformation may prevent full contact recovery. The HMTSW-104-08-G-T-008-RA insertion force also increases in cold environments (below 0°C), where phosphor bronze loses elasticity, potentially requiring 15–18 pounds of force and increasing risk of operator injury or mating errors. Data centers and field-replaceable unit (FRU) designs should account for force drift by either limiting connector reuse to 5,000 cycles or implementing redundant mating switches to verify successful engagement.
Can the HMTSW-104-08-G-T-008-RA be substituted with single-row 12-position headers, and what performance trade-offs result?
The HMTSW-104-08-G-T-008-RA's 3-row, 12-position layout is functionally equivalent to a single-row 12-position header in terms of total signal count but differs significantly in physical and electrical characteristics. A single-row alternative would extend approximately 3.05 inches in the mating direction (12 × 0.254 inches), compared to the HMTSW-104-08-G-T-008-RA's more compact multi-row footprint of approximately 0.50 inches; this geometric difference affects PCB layout constraints and mechanical integrity under vibration. Single-row headers distribute loading across a longer lever arm, creating higher bending stress on individual solder joints under mechanical shock, whereas the HMTSW-104-08-G-T-008-RA's distributed row structure reduces individual joint stress. Electrical performance differs as well: the HMTSW-104-08-G-T-008-RA's row spacing (2.54mm vertical separation) allows independent ground plane return paths for each row, improving crosstalk isolation compared to single-row alternatives where all signals share a narrow return path. Current capacity also scales differently; a single-row 12-position header with 3A contacts can theoretically carry 36A total (identical to the HMTSW-104-08-G-T-008-RA), but localized heating at individual pad clusters is more severe in the single-row geometry. Cost comparison typically favors single-row alternatives (10–20% lower), but the HMTSW-104-08-G-T-008-RA's multi-row architecture provides superior reliability and layout flexibility for applications where footprint density and thermal management are priorities.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-G-T-008-RA

Product Attribute HMTSW-104-08-L-D-220-RA HMTSW-104-08-G-T-300 HMTSW-104-08-G-T-250 HMTSW-104-08-G-S-300
Part Number HMTSW-104-08-L-D-220-RA HMTSW-104-08-G-T-300 HMTSW-104-08-G-T-250 HMTSW-104-08-G-S-300
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Finish - Mating - - - -
Contact Finish - Post - - - -
Contact Finish Thickness - Post - - - -
Pitch - Mating - - - -
Number of Positions Loaded - - - -
Termination - - - -
Number of Rows - - - -
Voltage Rating - - - -
Contact Finish Thickness - Mating - - - -
Applications - - - -
Row Spacing - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Shape - - - -
Mated Stacking Heights - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ingress Protection - - - -
Material Flammability Rating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Length - Post - - - -
Insulation Material - - - -
Current Rating (Amps) - - - -
Features - - - Simultaneous Sampling
Series - - - -
Number of Positions - - - -
Insulation Height - - - -
Connector Type - - - -
Overall Contact Length - - - -
Style - - - -
Shrouding - - - -
Fastening Type - - - -
Insulation Color - - - -
Contact Material - - - -
Contact Length - Mating - - - -

HMTSW-104-08-G-T-008-RA Datasheet PDF

Download HMTSW-104-08-G-T-008-RA pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-G-T-008-RA - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-G-T-008-RA

Samtec Inc.
98D-HMTSW-104-08-G-T-008-RA

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