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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-G-T-250
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HMTSW-104-08-G-T-250 - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-G-T-250
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-G-T-250
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
34,309 pcs available, New & Original
Parts Description
CONN HEADER VERT 12POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-G-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 34309
  • Unit Price: $2.65
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Specifications

HMTSW-104-08-G-T-250 Tech Specifications
Samtec Inc. - HMTSW-104-08-G-T-250 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-G-T-250

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.530" (13.46mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Number of Positions Loaded All
Number of Positions 12
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.180" (4.57mm)
Contact Length - Mating 0.250" (6.35mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum current capacity per contact in the HMTSW-104-08-G-T-250, and how does this affect PCB trace width calculations in high-density layouts?
The HMTSW-104-08-G-T-250 is rated for 3A per contact. With 12 positions distributed across 3 rows, this allows designs to handle up to 36A aggregate current if all contacts carry full rated load—though practical designs rarely achieve this due to thermal spreading and trace routing constraints. For the mating contact length of 0.250" (6.35mm) phosphor bronze geometry with gold plating, the 3A rating assumes adequate cooling and PCB copper area. Designers should verify trace width against IPC-2221 guidelines for the application's voltage class; a conservative approach uses 10–15 mils per ampere for internal traces. The HMTSW-104-08-G-T-250's unshrouded design means edge contacts may experience localized heating, so power distribution across all 12 positions rather than clustering on one or two rows improves thermal balance.
How does the 0.100" row spacing on the HMTSW-104-08-G-T-250 influence routing density and via placement in multilayer boards?
The HMTSW-104-08-G-T-250 features 0.100" (2.54mm) row spacing—matching its pitch dimension—which creates a compact 3×4 footprint approximately 0.30" × 0.30" overall. This tight spacing limits via placement directly under the header pads; routing typically requires escaping vias to adjacent routing layers within 50–100 mils of the footprint. For 4-layer boards, inner layer routing beneath the HMTSW-104-08-G-T-250 is feasible with 0.010" traces and 0.020" via clearance, but 2-layer designs often benefit from staggered via patterns on layer edges. The 0.100" row pitch also constrains daughterboard mating connectors; the HMTSW-104-08-G-T-250 pairs most naturally with connectors using identical 2.54mm pitch to avoid stress on the phosphor bronze contacts during insertion.
Why does the HMTSW-104-08-G-T-250 specify different gold plating thicknesses for mating versus post contacts, and what does this mean for reliability in repeated mating cycles?
The HMTSW-104-08-G-T-250 uses 10.0µin (0.25µm) gold on mating contacts and 3.00µin (0.076µm) on posts. Mating contacts experience sliding friction and require thicker plating to resist wear; the 10µin thickness on the HMTSW-104-08-G-T-250's mating surface provides ~100–200 insertion cycles at typical contact pressures before measurable gold thinning occurs. Post gold (3µin) serves cosmetic and minor oxidation-prevention roles but does not experience mating wear. The phosphor bronze substrate beneath the plating provides spring force and conductivity; if the 10µin mating layer erodes through accelerated testing (thermal cycling + repeated mating), contact resistance can climb 50–100mΩ per cycle. For applications requiring >500 matings, specify hard-gold or nickel-barrier variants, or evaluate the HMTSW-104-08-G-T-250 for single-attach use.
What is the thermal impact of the HMTSW-104-08-G-T-250's 0.180" post length when soldering on 2 oz copper, and how should reflow profiles be adjusted?
The HMTSW-104-08-G-T-250's 0.180" (4.57mm) post length creates thermal mass that moderates solder joint heating during reflow. Thicker copper (2 oz vs. 1 oz) increases thermal conductivity around the post, raising the risk of solder joint starving if peak reflow temperature is not sufficient. For the HMTSW-104-08-G-T-250 on 2 oz boards, a standard lead-free profile (255°C peak, 250–260s time above 220°C) may result in grainy or dull solder fillets unless the ramp rate is reduced 1–2°C/s to allow heat penetration to the post-to-pad interface. The Liquid Crystal Polymer (LCP) insulation on the HMTSW-104-08-G-T-250 is thermally stable to 250°C for short durations, but extended dwell above 245°C risks weakening insulation corners near the posts. Recommended practice: use 10–15 second ramp-to-peak, hold at 250°C for 12–15 seconds, then cool at 2–3°C/s. X-ray inspection of a few HMTSW-104-08-G-T-250 joints after first article builds is prudent to confirm solder wetting.
How does the HMTSW-104-08-G-T-250 compare to 0.156" pitch header connectors in terms of current density and PCB real estate?
The HMTSW-104-08-G-T-250 uses 0.100" (2.54mm) pitch, delivering roughly 100 contacts per square inch versus ~40 for 0.156" pitch connectors. With 12 positions in 3 rows, the HMTSW-104-08-G-T-250 occupies approximately 0.30" × 0.30" footprint, while a comparable 12-position 0.156" connector spans ~0.40" × 0.40". For signal integrity, the HMTSW-104-08-G-T-250's tighter pitch reduces loop area and crosstalk for differential pairs, but requires careful impedance control and via placement. Current-per-unit-area is comparable (both ~3A per contact); the HMTSW-104-08-G-T-250 advantage lies in board density, not power handling. Cost is typically 15–25% lower for HMTSW-104-08-G-T-250 due to maturity of 2.54mm pitch manufacturing. Choose 0.156" pitch if mechanical robustness or keying features are critical; the HMTSW-104-08-G-T-250 suits high-volume consumer and industrial applications prioritizing footprint efficiency.
What edge-case thermal behavior occurs when the HMTSW-104-08-G-T-250 operates near its -55°C lower limit, and how does contact resistance change?
The HMTSW-104-08-G-T-250's operating range spans -55°C to 125°C. At -55°C, the phosphor bronze contacts and gold plating undergo thermal contraction (~0.15% over 180°C); this reduces contact force by approximately 3–5% due to decreased spring rate and dimensional tolerance stack-up. Contact resistance typically rises 10–20% at -55°C versus room temperature, due to both reduced contact pressure and increased material resistivity. For the HMTSW-104-08-G-T-250 carrying 3A at -55°C, dissipation rises from ~0.027W per contact (typical 9mΩ @ 25°C) to ~0.033W per contact (typical 11mΩ @ -55°C). Designs requiring low-noise analog signals should account for contact resistance drift; digital logic tolerates this better. The Liquid Crystal Polymer insulation on the HMTSW-104-08-G-T-250 becomes slightly more brittle at -55°C but remains mechanically sound. For aerospace or defense applications in extreme cold, stress-testing the HMTSW-104-08-G-T-250 with insertion/withdrawal cycles at -55°C is recommended to confirm connector stability.
How does the unshrouded design of the HMTSW-104-08-G-T-250 affect electrostatic discharge (ESD) risk in production and field use?
The HMTSW-104-08-G-T-250 lacks insulation sidewalls (unshrouded), exposing all 12 phosphor bronze pins directly to the environment. This design reduces parasitic capacitance and is preferred for high-speed signals, but increases ESD vulnerability during board handling and mating. An ESD event at one pin on the HMTSW-104-08-G-T-250 can couple capacitively to adjacent pins if no ferrite beads or series resistors are present on the PCB. Typical design practice adds 10–100Ω resistors in series with HMTSW-104-08-G-T-250 signal pins and connects the header frame to ground via a low-impedance path (if mounted in a shielded housing). For applications with tight ESD margins, the HMTSW-104-08-G-T-250 should be paired with a mating connector featuring a shrouded insert; this reduces field disconnect/reconnect ESD events by 50–70%. During assembly, the HMTSW-104-08-G-T-250 must remain on static-controlled workstations, and boards should be placed in Faraday cages or static-dissipative trays until final assembly is complete.
What mechanical stress does the HMTSW-104-08-G-T-250 experience during push-pull fastening, and how many mating cycles can the connector tolerate before plastic deformation occurs?
The HMTSW-104-08-G-T-250 uses push-pull fastening (latch-based retention) rather than screw-down or friction-lock methods. During engagement, the mating connector exerts approximately 15–25 Newtons of axial force distributed across the 12 contact points; the LCP insulation housing on the HMTSW-104-08-G-T-250 absorbs this load through the latch cantilever beam. Repeated push-pull cycles induce cyclic bending stress in the latch; Samtec data suggests the HMTSW-104-08-G-T-250 tolerates >500 mating cycles at room temperature before permanent latch deflection exceeds 0.010". At elevated temperature (125°C), LCP creep accelerates—the HMTSW-104-08-G-T-250 may lose 5–10% latch retention force after 100 cycles at 125°C + 85% humidity. Mechanical fatigue failure typically manifests as loose connections (contact resistance creep) rather than catastrophic latch breakage. Designs requiring field service connections (>100 annual matings) should perform accelerated life testing on prototype HMTSW-104-08-G-T-250 samples: 300 cycles at 125°C/85% RH, measuring contact force and resistance post-test.
Does the HMTSW-104-08-G-T-250's UL94 V-0 flammability rating affect creepage/clearance calculations for safety-critical applications, and how should spacing be verified?
The HMTSW-104-08-G-T-250 meets UL94 V-0 (self-extinguishing in 10 seconds), indicating the Liquid Crystal Polymer insulation will not sustain flame. However, V-0 rating alone does not dictate creepage or clearance distances; those are determined by voltage class and pollution degree (IEC 60664-1). For a 48V/Pollution Degree 2 application using the HMTSW-104-08-G-T-250, IEC recommends 2.0mm creepage and 1.6mm clearance; the HMTSW-104-08-G-T-250's 0.100" row spacing and compact geometry may violate these margins if not carefully routed on the PCB. Creepage is measured along the insulation surface (the LCP), so the HMTSW-104-08-G-T-250 footprint itself contributes to total creepage distance. Safety audits often require layout drawings with creepage/clearance annotations; if the HMTSW-104-08-G-T-250 cannot meet IEC spacing due to board density, a shrouded or potted mating connector must be added, or the application must derate voltage. UL listing for the HMTSW-104-08-G-T-250 should be verified in the connector datasheet; not all Flex Stack variants are UL-recognized.
How should the HMTSW-104-08-G-T-250 be specified in the Bill of Materials (BOM) to ensure proper procurement and avoid cross-platform compatibility issues?
The full manufacturer part number HMTSW-104-08-G-T-250 must be used; shorthand notations (e.g., HMTSW-104) refer to the base family, which includes many pin-count and configuration variants. The HMTSW-104-08-G-T-250 specifically denotes 12 positions (08 in Samtec nomenclature = 8 pairs in rows), gold mating contacts (G), solder termination (T), and 0.250" mating contact length. Distributors and suppliers must confirm the full part number before shipment; ordering only "HMTSW-104" risks receiving a 4-position or 6-position variant with incompatible pin counts. For the BOM, include package designation (Bulk for the HMTSW-104-08-G-T-250), and reference the mating connector part number (typically Samtec HMTSW-505-08-G-T or equivalent from third-party vendors). RoHS3 compliance of the HMTSW-104-08-G-T-250 is assured per the datasheet, but procurement should verify the supplier's documentation to avoid obsolete or lead-containing inventory. Samtec's online configurator allows custom lead lengths; if non-standard posts are required, the HMTSW-104-08-G-T-250 base part does not apply, and a custom quote is necessary.
What impedance matching strategy is required for high-speed signals routed through the HMTSW-104-08-G-T-250, and how do the unshrouded pin geometry and row spacing affect differential pair routing?
The HMTSW-104-08-G-T-250's unshrouded rectangular pin geometry and 0.100" spacing create parasitic inductance (~0.5–0.8nH per contact) and capacitance (~0.3–0.5pF per contact) that degrade impedance control at frequencies above 100MHz. For single-ended 50Ω signals on the HMTSW-104-08-G-T-250, trace width must be 5–8 mils on inner layers of a 4-layer board with 2 oz copper and 8 mil dielectric to approach 50Ω. Differential pairs routed through the HMTSW-104-08-G-T-250 benefit from placing complementary signals on adjacent pins in the same row (0.100" center-to-center), reducing loop inductance by ~30% versus random placement. The HMTSW-104-08-G-T-250 mating surface exhibits 10–15Ω of resistance per pin pair during transition; this acts as a low-pass filter with cutoff ~2–5GHz, acceptable for most commercial applications but marginal for high-speed SerDes. PCB stack-up should minimize dielectric thickness (H ≤ 5 mils) between signal and return layers adjacent to the HMTSW-104-08-G-T-250 to reduce loop inductance. SPICE or 3D field solver simulation of the HMTSW-104-08-G-T-250 footprint + trace transitions is prudent for designs targeting >500Mbps.
How does moisture absorption in the HMTSW-104-08-G-T-250's Liquid Crystal Polymer insulation affect mechanical properties and long-term reliability in humid or hygroscopic environments?
The Liquid Crystal Polymer (LCP) insulation on the HMTSW-104-08-G-T-250 is inherently hygroscopic, absorbing 0.02–0.08% moisture by weight under 85% RH/25°C conditions. Unlike glass-filled nylons, LCP absorption is slow (saturation takes weeks), but absorbed moisture reduces the glass transition temperature and increases creep rate. For the HMTSW-104-08-G-T-250 operating at 85°C/85% RH for 1000 hours, the latch compliance may increase 3–5% due to LCP softening, degrading push-pull fastening retention force. Contact stress relaxation is not significantly affected because the post geometry and spring contacts are phosphor bronze (non-hygroscopic). The MSL (Moisture Sensitivity Level) on the HMTSW-104-08-G-T-250 is listed as "Not Applicable," indicating the connector does not require dry-bag storage or baking prior to assembly—a practical advantage over hygroscopic polyimide or glass-nylon housings. However, for products stored in high-humidity environments (>60% RH) for >6 months before use, preconditioning the HMTSW-104-08-G-T-250 at 65°C/50% RH for 24 hours prior to soldering is recommended to restore baseline mechanical properties and prevent solder joint voids.
What is the compliance mechanism and insertion force profile for mating the HMTSW-104-08-G-T-250, and how do design tolerances on the mating connector affect overall insertion feel and contact reliability?
The HMTSW-104-08-G-T-250 mating header expects a complementary receptacle (typically Samtec HMTSW-505 series or equivalent) with a spring-contact insert; the insertion sequence engages the 12 pins sequentially as the receptacle travels axially. The HMTSW-104-08-G-T-250 design allows for progressive contact engagement over ~2–3mm of axial travel, distributing insertion force across all 12 pins to prevent single-pin overload. Typical insertion force is 5–8N total (0.4–0.7N per pin), ramping up as the springs begin to compress. The phosphor bronze contacts on the HMTSW-104-08-G-T-250 exhibit a fairly linear force-displacement profile; if the mating receptacle has loose tolerances (tighter than ±0.005" on bore diameter), insertion force can spike to 12–15N, risking plastic deformation of the LCP housing around the header pins. Conversely, oversized bores increase deflection and reduce contact pressure, elevating contact resistance by 50–100mΩ. Samtec and third-party datasheets specify insertion force acceptance ranges; the HMTSW-104-08-G-T-250 should be paired with a mating connector within ±10% of reference insertion force to ensure consistent contact reliability and user experience across production lots.
In what way does the HMTSW-104-08-G-T-250's through-hole mounting on thin PCBs (<30 mil) present assembly challenges, and what reinforcement or via strategies are recommended?
The HMTSW-104-08-G-T-250 is designed for through-hole assembly with 0.180" (4.57mm) post length; boards thinner than 30 mils (0.75mm) result in post-to-pad aspect ratios >2:1, which complicates solder wicking and can lead to cold-solder or dry-joint failures. On a 24 mil PCB, the HMTSW-104-08-G-T-250 posts extend through and stand 0.156" proud on the back side, increasing mechanical fragility and stress concentration during potting or conformal coating operations. For thin-board applications, reinforce the HMTSW-104-08-G-T-250 footprint by adding 0.020" diameter copper pads 0.200" away from each pin in a distributed pattern; route ground vias and power vias nearby to increase thermal mass and reduce solder joint thermal gradient. Alternatively, apply mechanical standoffs or adhesive dots (e.g., epoxy or cyanoacrylate) under the HMTSW-104-08-G-T-250 PCB before reflow to arrest mechanical movement during thermal cycling. IPC-A-610 classifies the HMTSW-104-08-G-T-250 on sub-0.030" boards as "marginal" for consumer applications; test coupons (cross-section and pull-strength) from first articles are advisable before full production release.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-G-T-250

Product Attribute HMTSW-104-08-G-S-320 HMTSW-104-08-G-S-265-LL HMTSW-104-08-G-S-295 HMTSW-104-08-G-T-008-RA
Part Number HMTSW-104-08-G-S-320 HMTSW-104-08-G-S-265-LL HMTSW-104-08-G-S-295 HMTSW-104-08-G-T-008-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Termination - - - -
Series - - - -
Pitch - Mating - - - -
Insulation Height - - - -
Current Rating (Amps) - - - -
Mated Stacking Heights - - - -
Contact Finish - Post - - - -
Material Flammability Rating - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Shrouding - - - -
Insulation Color - - - -
Style - - - -
Number of Positions - - - -
Overall Contact Length - - - -
Ingress Protection - - - -
Contact Shape - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage Rating - - - -
Contact Finish Thickness - Post - - - -
Fastening Type - - - -
Contact Type - - - -
Number of Rows - - - -
Features - - - Simultaneous Sampling
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Material - - - -
Contact Length - Mating - - - -
Insulation Material - - - -
Applications - - - -
Number of Positions Loaded - - - -
Contact Finish Thickness - Mating - - - -
Connector Type - - - -
Row Spacing - Mating - - - -
Contact Length - Post - - - -
Contact Finish - Mating - - - -

HMTSW-104-08-G-T-250 Datasheet PDF

Download HMTSW-104-08-G-T-250 pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-G-T-250 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-G-T-250

Samtec Inc.
98D-HMTSW-104-08-G-T-250

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