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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-G-T-300
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HMTSW-104-08-G-T-300 - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-G-T-300
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-G-T-300
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,924 pcs available, New & Original
Parts Description
CONN HEADER VERT 12POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-G-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 36924

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Specifications

HMTSW-104-08-G-T-300 Tech Specifications
Samtec Inc. - HMTSW-104-08-G-T-300 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-G-T-300

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.530" (13.46mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 3
Number of Positions Loaded All
Number of Positions 12
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.130" (3.30mm)
Contact Length - Mating 0.300" (7.62mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the HMTSW-104-08-G-T-300 and standard 2.54mm pitch headers when designing for high-reliability board-to-board interconnects?
The HMTSW-104-08-G-T-300 uses a 3-row configuration with 0.100" (2.54mm) row spacing and incorporates a push-pull fastening mechanism not found in passive headers. The phosphor bronze contacts with 10.0µin gold plating on the mating surface provide enhanced durability against mechanical wear cycles compared to standard gold-plated headers. The 0.300" (7.62mm) mating contact length combined with LCP insulation rated UL94 V-0 enables the HMTSW-104-08-G-T-300 to maintain signal integrity across the full -55°C to 125°C operating range without performance degradation. Push-pull fastening distinguishes this connector from push-fit alternatives, offering positive mechanical engagement verification during assembly.
Can the HMTSW-104-08-G-T-300 handle continuous 3A current on all 12 positions simultaneously without thermal concerns?
The HMTSW-104-08-G-T-300 is rated for 3A per contact, but simultaneous maximum-current operation across all 12 positions would dissipate substantial heat in the solder posts and contact interfaces. In practical designs, sustained 3A loading is typically distributed across multiple contacts rather than concentrated on a single position. The phosphor bronze material and thin gold finish (10.0µin mating, 3.0µin post) support this current rating, but thermal management becomes critical in confined PCB spaces. For applications requiring full 12-position utilization near 3A per pin, circuit designers should verify that board copper weight and via density can dissipate the cumulative I²R losses without exceeding the LCP insulation material's thermal limits near 125°C ambient conditions.
How does the HMTSW-104-08-G-T-300 compare to Molex or TE Connectivity alternatives in terms of mating cycle life and contact resistance stability?
The HMTSW-104-08-G-T-300 employs push-pull fastening with square contact geometry, whereas many TE and Molex board-to-board headers use friction-fit or keyed retention. The push-pull mechanism of the HMTSW-104-08-G-T-300 provides definitive engagement feedback and generally exhibits lower contact resistance drift over repeated mating cycles because the positive lock prevents micro-motion that can accelerate fretting corrosion. The 10.0µin gold plating on mating surfaces and phosphor bronze base material of the HMTSW-104-08-G-T-300 are comparable to premium alternatives, though Samtec's specification of contact length (0.300" mating) allows for deeper engagement overlap, reducing effective contact resistance. Without published cycle-life test data comparing specific competitors, engineers should request application notes from Samtec or conduct in-house durability testing if mating cycle count exceeds 50 cycles annually.
What is the practical impact of the HMTSW-104-08-G-T-300's 0.100" insulation height on PCB layout density and signal routing?
The 0.100" (2.54mm) insulation height of the HMTSW-104-08-G-T-300 establishes a hard constraint on vertical clearance above the PCB. In multi-layer designs, this dimension directly limits routing channels and component placement near the connector footprint. The overall contact length (0.530") means that the HMTSW-104-08-G-T-300 extends approximately 0.400" below the board surface when fully mated, requiring through-hole via clearance and solder pad spacing. For compact designs, the 0.130" post length of the HMTSW-104-08-G-T-300 must be factored into via hole diameter and copper ring sizing to avoid solder joint stress concentration. In applications with height constraints below 0.200", the HMTSW-104-08-G-T-300 becomes impractical; surface-mount alternatives would be required.
Is the HMTSW-104-08-G-T-300 suitable for automotive or aerospace applications given its LCP insulation and RoHS3 compliance status?
The HMTSW-104-08-G-T-300 meets RoHS3 compliance and carries a UL94 V-0 flammability rating, demonstrating material quality suitable for safety-critical environments. However, the HMTSW-104-08-G-T-300 lacks explicit automotive qualification documents (AEC-Q200) or aerospace certifications (AS9100) in published specifications. Aerospace applications often require additional screening, traceability, and environmental stress screening (ESS) protocols not typically applied to standard commercial stock of the HMTSW-104-08-G-T-300. Automotive designs using the HMTSW-104-08-G-T-300 should verify that Samtec offers AEC-Q200 qualification and can provide lot traceability documentation. For military or space applications, the HMTSW-104-08-G-T-300 would require explicit engineering approval and may necessitate custom qualification testing.
How does the HMTSW-104-08-G-T-300's contact finish thickness (10.0µin mating, 3.0µin post) affect long-term reliability in humid or corrosive environments?
The 10.0µin (0.25µm) gold plating on mating contacts of the HMTSW-104-08-G-T-300 provides corrosion resistance for the signal path, but the 3.0µin (0.076µm) post finish is relatively thin for extended environmental exposure. Phosphor bronze substrate beneath the HMTSW-104-08-G-T-300's finish can exhibit galvanic corrosion if moisture penetrates the plating layer, particularly in high-humidity (>85% RH) or salt-spray environments. LCP insulation on the HMTSW-104-08-G-T-300 resists moisture absorption better than phenolic or FR-4 alternatives, but the connector body itself is not sealed or conformally coated at the factory. For harsh environments, end-users should specify conformal coating over the assembled HMTSW-104-08-G-T-300 or select sealed connector variants. Accelerated salt-spray testing (ASTM B117) should be performed if the HMTSW-104-08-G-T-300 will operate in marine, coastal, or industrial chemical exposure scenarios.
What solder joint stress factors should be considered when designing PCBs with the HMTSW-104-08-G-T-300 through-hole posts in thermal cycling environments?
The HMTSW-104-08-G-T-300 features a 0.130" (3.30mm) post length with a specified overall contact length of 0.530", creating a significant lever arm between the solder joint and the mating interface. Thermal cycling from -55°C to 125°C induces CTE (coefficient of thermal expansion) mismatch stress between the phosphor bronze posts of the HMTSW-104-08-G-T-300 and both the PCB copper and solder. To mitigate fatigue cracking, PCB layout should incorporate substantial copper pads (minimum 0.200" square for the HMTSW-104-08-G-T-300) and avoid routing traces within 0.100" of the post perimeter. Via placement near the HMTSW-104-08-G-T-300 posts increases stress concentration; vias should be positioned at least 0.150" away. For applications exceeding 200 thermal cycles, finite element analysis (FEA) of the joint geometry is recommended to validate that solder strain remains within acceptable limits (typically <5% plastic strain).
How should the HMTSW-104-08-G-T-300's 3-row configuration be utilized in high-density interconnect designs without crosstalk or signal integrity degradation?
The HMTSW-104-08-G-T-300's 3-row layout (12 positions total, 4 per row) creates a rectangular footprint approximately 0.400" × 0.300" on the PCB. This geometry allows flexible signal assignment but introduces crosstalk risk if all rows carry high-frequency signals. Row spacing (0.100" between rows) limits isolation; the HMTSW-104-08-G-T-300 should not be used for parallel data buses or differential pairs on adjacent rows without ground return paths interspersed. Best practice uses the center row of the HMTSW-104-08-G-T-300 for ground connections to create shielding between signal rows. For signals exceeding 50 MHz, controlled-impedance routing to each HMTSW-104-08-G-T-300 contact is essential; trace widths and layer stackup should be designed to maintain 50Ω or 100Ω differential impedance. Return paths should route directly under or adjacent to signal traces of the HMTSW-104-08-G-T-300 to minimize loop inductance.
What assembly process tolerances and solder paste inspection criteria should be applied specifically to the HMTSW-104-08-G-T-300?
The HMTSW-104-08-G-T-300 is a through-hole connector with a 0.130" post length, making it suitable for wave soldering or selective solder processes rather than reflow. The LCP insulation material (UL94 V-0) can tolerate brief reflow temperatures (approximately 260°C peak), but typical wave solder parameters (245–260°C dwell) are preferable for through-hole assembly. Post diameter tolerance on the HMTSW-104-08-G-T-300 is typically ±0.010", requiring hole sizes of approximately 0.040"–0.045" to allow proper solder wetting without bridging between posts. Solder fillet formation on the HMTSW-104-08-G-T-300 should be visually inspected for complete coverage around the base of each post and verified to avoid sharp re-entrant angles that concentrate mechanical stress. X-ray inspection is not typically required for the HMTSW-104-08-G-T-300 unless high reliability qualification demands it, but cross-section validation of a first-article sample is recommended to confirm solder void content remains below 5% of the joint volume.
Can the HMTSW-104-08-G-T-300 be reliably hand-soldered or does it require automated assembly for production consistency?
The HMTSW-104-08-G-T-300 can be hand-soldered in prototyping or repair scenarios, but consistency suffers compared to automated processes. The 12-position configuration and 0.100" pitch of the HMTSW-104-08-G-T-300 make hand-soldering error-prone; adjacent posts are prone to bridging if excessive solder is applied. Manual rework of the HMTSW-104-08-G-T-300 requires careful temperature control (soldering iron tip temperature 350–380°C) and flux application to avoid thermal stress on the LCP insulation. For production volumes above 500 units annually, automated wave or selective soldering of the HMTSW-104-08-G-T-300 is strongly recommended to ensure repeatable fillet geometry and joint quality. Touch-up of the HMTSW-104-08-G-T-300 after automated soldering should be minimized; dry-joint or cold-joint defects from hand correction often exceed the defect rate of initial automated assembly and complicate field diagnostics.
What is the effective mating force and unmating force for the HMTSW-104-08-G-T-300, and how does it impact connector design-in for removable vs. fixed applications?
The HMTSW-104-08-G-T-300 employs a push-pull fastening mechanism, which typically requires 10–20 lbf engagement force (approximately 4.5–9 kg) depending on housing geometry and contact compliance. Exact mating force specifications for the HMTSW-104-08-G-T-300 should be verified in the detailed connector datasheet, as force varies with contact count and post spring characteristics. For removable applications, this force level is acceptable for manual disconnection but may require mechanical guidance or keying features in the mating connector to prevent misalignment. The push-pull design of the HMTSW-104-08-G-T-300 is superior to friction-fit headers for repeatability; users can confirm positive engagement by audible/tactile feedback. Fixed applications using the HMTSW-104-08-G-T-300 (board-to-board assembly during manufacturing) benefit from push-pull assurance that the connector is fully seated before production test, reducing field failures from partial connections.
How should the HMTSW-104-08-G-T-300 be specified in a design-in request to ensure supply chain continuity and manufacturability across contract manufacturers?
When specifying the HMTSW-104-08-G-T-300 in procurement documents or manufacturing drawings, include the full part number (HMTSW-104-08-G-T-300) along with base product series (Flex Stack, HMTSW) to enable contract manufacturers to cross-reference equivalent SKUs or buffer stock variants. The HMTSW-104-08-G-T-300's RoHS3 compliance and EAR99 export classification should be noted in supply agreements to avoid delays. Provide the connector orientation (vertical through-hole mounting) and solder process specification (wave or selective solder, not reflow) explicitly in assembly documentation. Alternate sources for the HMTSW-104-08-G-T-300 should be evaluated early in design validation; Samtec maintains consistent specifications for Flex Stack series across manufacturing locations, reducing design revision risk. If long-term volume commitments exceed 100k units annually, negotiate supply agreements with the HMTSW-104-08-G-T-300 supplier to secure preferred pricing and establish minimum inventory buffers.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-G-T-300

Product Attribute HMTSW-104-08-G-T-340 HMTSW-104-08-G-T-008-RA HMTSW-104-08-G-S-300 HMTSW-104-08-G-S-340
Part Number HMTSW-104-08-G-T-340 HMTSW-104-08-G-T-008-RA HMTSW-104-08-G-S-300 HMTSW-104-08-G-S-340
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Applications - - - -
Shrouding - - - -
Insulation Height - - - -
Contact Material - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination - - - -
Current Rating (Amps) - - - -
Contact Type - - - -
Contact Shape - - - -
Pitch - Mating - - - -
Contact Finish Thickness - Post - - - -
Mated Stacking Heights - - - -
Row Spacing - Mating - - - -
Style - - - -
Voltage Rating - - - -
Ingress Protection - - - -
Contact Length - Post - - - -
Number of Positions - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Connector Type - - - -
Contact Finish Thickness - Mating - - - -
Overall Contact Length - - - -
Contact Finish - Mating - - - -
Material Flammability Rating - - - -
Insulation Color - - - -
Contact Length - Mating - - - -
Fastening Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Insulation Material - - - -
Series - - - -
Features - - - Simultaneous Sampling
Number of Rows - - - -
Contact Finish - Post - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Positions Loaded - - - -

HMTSW-104-08-G-T-300 Datasheet PDF

Download HMTSW-104-08-G-T-300 pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-G-T-300 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-G-T-300

Samtec Inc.
98D-HMTSW-104-08-G-T-300

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