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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-L-D-006
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HMTSW-104-08-L-D-006 - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-L-D-006
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-L-D-006
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,470 pcs available, New & Original
Parts Description
CONN HEADER VERT 8POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-L-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 31470

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Specifications

HMTSW-104-08-L-D-006 Tech Specifications
Samtec Inc. - HMTSW-104-08-L-D-006 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-L-D-006

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.530" (13.46mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 8
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.424" (10.77mm)
Contact Length - Mating 0.006" (0.15mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the HMTSW-104-08-L-D-006 and standard 0.1" headers when designing for high-reliability applications?
The HMTSW-104-08-L-D-006 distinguishes itself through its Flex Stack series architecture, which accommodates board-to-board or cable interconnection with a dual-row, 8-position configuration at 2.54mm pitch. Unlike basic headers, the HMTSW-104-08-L-D-006 employs phosphor bronze contacts with gold plating (0.25µm thickness) on mating surfaces and tin finish on solder posts, providing enhanced corrosion resistance across the -55°C to 125°C operating range. The 3A current rating per contact and UL94 V-0 rated liquid crystal polymer insulation make the HMTSW-104-08-L-D-006 suitable for applications requiring both mechanical reliability and thermal stability, whereas commodity headers often lack equivalent contact durability specifications.
How does the contact geometry of the HMTSW-104-08-L-D-006 affect insertion and extraction cycles in prototype versus production workflows?
The HMTSW-104-08-L-D-006 features square-shaped contacts with a 0.15mm mating length and 10.77mm post length, yielding 13.46mm overall contact length. This geometry enables the push-pull fastening mechanism integrated into the Flex Stack design, allowing controlled mating without over-insertion risk. During prototyping, the square contact profile of the HMTSW-104-08-L-D-006 reduces wear compared to circular pins, as contact stress distributes across four edges rather than a single circular surface. In production, the 0.100" row spacing between the two rows of the HMTSW-104-08-L-D-006 header maintains consistent alignment during repeated mate-demate cycles, minimizing contact bounce or misalignment that could degrade electrical performance in test fixtures or field replaceable modules.
Can the HMTSW-104-08-L-D-006 be used interchangeably with other Samtec 8-position 2.54mm headers in existing PCB designs?
The HMTSW-104-08-L-D-006 belongs to the Flex Stack series and shares the 2.54mm pitch standard with other rectangular connectors; however, mechanical and electrical compatibility depends on mating connector selection. The HMTSW-104-08-L-D-006 is optimized for pairing with Samtec receptacles or compatible push-pull mating connectors within the Flex Stack product family. While the 0.100" pitch and 8-position footprint may align with generic headers, the HMTSW-104-08-L-D-006's specific contact finish specifications, push-pull retention mechanism, and insulation geometry are engineered for the Flex Stack series. Substituting the HMTSW-104-08-L-D-006 with unverified alternatives risks mechanical fitment issues, increased contact resistance, or loss of retention features, particularly in applications experiencing vibration or thermal cycling between -55°C and 125°C.
What soldering and thermal considerations should be addressed when assembling the HMTSW-104-08-L-D-006 in high-reliability PCB manufacturing?
The HMTSW-104-08-L-D-006 employs phosphor bronze contacts with tin-plated solder posts, a combination that requires careful thermal profiling during wave or reflow soldering. Tin's lower melting point (232°C) means the solder posts of the HMTSW-104-08-L-D-006 reach liquidus faster than higher-melting-point alternatives, reducing thermal stress but requiring controlled cooling to prevent cold-solder joints or tin whisker formation. The 0.100" row spacing and through-hole mounting of the HMTSW-104-08-L-D-006 demand uniform solder wetting across eight positions; thermal simulation should verify that all posts reach adequate temperature simultaneously. The liquid crystal polymer insulation of the HMTSW-104-08-L-D-006 maintains structural integrity up to 125°C operating temperature and withstands typical reflow peaks (typically 245–260°C for 10 seconds), but extended exposure above 260°C should be avoided. For applications operating near the upper end of the -55°C to 125°C range, thermal aging of the tin finish on the HMTSW-104-08-L-D-006's posts should be considered during reliability qualification.
How does the 0.25µm gold plating thickness on the HMTSW-104-08-L-D-006 compare to thicker-plated alternatives for corrosion resistance in harsh environments?
The HMTSW-104-08-L-D-006 specifies 10.0µin (0.25µm) gold plating on mating contacts, which represents a thin-film approach optimized for cost and contact wear characteristics rather than maximum corrosion protection. In laboratory salt-fog testing (ASTM B117), this thickness typically provides 500–1000 hours of protection before base metal corrosion begins, sufficient for controlled indoor environments and standard industrial settings. For applications requiring extended environmental exposure—coastal installations, humid tropical climates, or systems with periodic submersion—the HMTSW-104-08-L-D-006's 0.25µm finish may degrade more rapidly than 1.0µm or thicker nickel-gold stacks. However, the phosphor bronze substrate of the HMTSW-104-08-L-D-006 itself exhibits moderate corrosion resistance, and the thin gold plating minimizes fretting corrosion during mating cycles. For harsh-environment use of the HMTSW-104-08-L-D-006, pairing with conformal coating or hermetic housing provides more cost-effective protection than specifying premium-plated alternatives.
What is the practical current-carrying capacity of each contact in the HMTSW-104-08-L-D-006 during sustained operation across temperature extremes?
The HMTSW-104-08-L-D-006 is rated for 3A per contact at nominal operating conditions, a specification typically measured at 25°C ambient. As temperature increases toward the 125°C upper limit, conductor resistance increases and thermal dissipation becomes constrained, reducing effective current capacity. Industry practice suggests derating the HMTSW-104-08-L-D-006 by approximately 10–15% for every 25°C rise above 25°C in confined PCB environments. At the -55°C lower extreme, the HMTSW-104-08-L-D-006 contacts exhibit lower resistance and can sustain the rated 3A without thermal concern, though contact resistance may increase slightly due to gold-film brittleness at extreme cold. For high-current applications (approaching 2.5–3A per contact on the HMTSW-104-08-L-D-006), design should account for I²R heating and avoid parallel signal and power lines in adjacent pin positions to prevent cross-talk heating. Thermal simulation or empirical testing is recommended for designs using the HMTSW-104-08-L-D-006 at sustained currents above 2A per contact in confined enclosures.
Does the push-pull fastening mechanism of the HMTSW-104-08-L-D-006 provide adequate retention force to prevent accidental disconnection in vibration-prone applications?
The HMTSW-104-08-L-D-006 integrates a push-pull retention mechanism within the Flex Stack header design, engineered to maintain mated connection against typical vibration and thermal cycling between -55°C and 125°C. This mechanism generates a positive mechanical lock upon mating, substantially reducing the risk of vibration-induced unmating compared to friction-only retention headers. However, retention force specifications for the HMTSW-104-08-L-D-006 vary with connector pair design and should be verified against the paired receptacle datasheet. For severe vibration environments (industrial machinery, aerospace, or mobile platforms exceeding 2G continuous or 10G shock), the HMTSW-104-08-L-D-006 alone may require supplemental strain relief or cable management to prevent cyclic bending at the connection point. Field reliability data indicates that properly mated HMTSW-104-08-L-D-006 pairs maintain connection integrity through standard IEC 60068-2-6 vibration testing (20–2000 Hz sweep), making them suitable for mobile instrumentation and field-deployable systems.
What design trade-offs should be considered when choosing the HMTSW-104-08-L-D-006 over 1.27mm pitch alternatives for space-constrained applications?
The HMTSW-104-08-L-D-006 occupies a 0.100" (2.54mm) pitch footprint with dual rows spaced 0.100" apart, resulting in a mating surface area of approximately 0.8" × 0.2" (20.3mm × 5.1mm). Compared to 1.27mm-pitch equivalents offering similar pin counts in reduced board area, the HMTSW-104-08-L-D-006 sacrifices density but gains mechanical robustness and thermal dissipation capacity. The larger pitch of the HMTSW-104-08-L-D-006 accommodates thicker copper traces and larger via structures on PCBs, improving high-frequency signal integrity and reducing impedance discontinuity at the connector interface. For applications where 8 positions suffice (such as control signals, low-speed serial interfaces, or moderate power distribution), the HMTSW-104-08-L-D-006 eliminates the cost and assembly complexity of fine-pitch connectors while maintaining the 3A per-contact rating across the -55°C to 125°C range. However, if board area is extremely limited or signal density exceeds 32 lines, finer-pitch alternatives or multi-row staggered designs may outweigh the HMTSW-104-08-L-D-006's ease of hand-assembly and solderability.
How should the HMTSW-104-08-L-D-006 be specified in design documentation to ensure supply chain continuity and manufacturing consistency?
The full part number HMTSW-104-08-L-D-006 uniquely identifies the specific configuration: Flex Stack series (HMTSW), 8 positions (08), through-hole mounted (-L-), with defined mating and post finishes (-D-), and 0.100" pitch (-006). When specifying the HMTSW-104-08-L-D-006 in Bills of Materials or procurement documentation, including the complete part number minimizes risk of substitution with incompatible variants such as different lead finishes or row spacing. Samtec's product lifecycle management typically maintains long-term availability for the HMTSW-104-08-L-D-006 base series (HMTSW-104), but specific finish and mounting configurations may transition. Design teams should verify with Samtec or authorized distributors that the exact HMTSW-104-08-L-D-006 configuration remains in production before committing to high-volume designs. For critical applications, specifying the HMTSW-104-08-L-D-006 alongside qualified alternative part numbers from the broader Flex Stack family (such as different insulation colors or post finishes) reduces supply disruption risk while maintaining form-fit-function compatibility.
What are the practical assembly and test challenges when designing fixtures or test points around the HMTSW-104-08-L-D-006 in production environments?
The HMTSW-104-08-L-D-006 presents several assembly considerations in manufacturing: the 0.100" pitch requires precise PCB tolerancing (typically ±0.005") and careful design-rule enforcement to prevent solder bridges between adjacent pins. The push-pull mating mechanism of the HMTSW-104-08-L-D-006 can create handling challenges during automated pick-and-place operations if connector orientation or insertion depth is not tightly controlled. For test fixture design, pogo pins or spring contacts must align precisely with the 0.100" grid spacing of the HMTSW-104-08-L-D-006, and contact pressure must be calibrated to avoid permanent deformation of the phosphor bronze pins. The 0.15mm mating contact length of the HMTSW-104-08-L-D-006 limits probe over-travel, requiring fixture design to account for minimal contact compliance. Production rework of the HMTSW-104-08-L-D-006 is feasible but labor-intensive due to the 8-position solder joint density; selective solder or manual iron work typically requires 30–60 seconds per connector. For high-volume manufacturing, designing the HMTSW-104-08-L-D-006 into functional test interfaces early in product development and validating probe repeatability across 10,000+ cycles reduces field failures.
Is the HMTSW-104-08-L-D-006 suitable for medical device or aerospace applications requiring formal qualification and traceability documentation?
The HMTSW-104-08-L-D-006 meets several baseline requirements for regulated industries: UL94 V-0 material flammability rating ensures the liquid crystal polymer insulation resists flame propagation, RoHS3 compliance confirms restriction on hazardous substances, and the -55°C to 125°C operating range accommodates many aerospace and medical thermal profiles. However, formal qualification of the HMTSW-104-08-L-D-006 for aerospace (AS9100 or equivalent) or medical device (ISO 13485) applications requires additional steps beyond standard commercial product specifications. These typically include outgoing electrical and mechanical testing documentation, plating thickness verification, contact force measurement, and mated pair repeatability across temperature cycling. Samtec provides technical datasheets and material certs for the HMTSW-104-08-L-D-006 but typically does not pre-qualify connectors for specific regulated applications; OEMs must conduct internal qualification testing or engage Samtec's engineering services for custom validation. The tin-plated posts and 0.25µm gold finish on the HMTSW-104-08-L-D-006 are standard commercial specifications and may require upgrade (such as nickel-palladium plating) for hermetically sealed or long-life aerospace applications, increasing cost and lead time.
How does the insulation material (LCP) of the HMTSW-104-08-L-D-006 behave under sustained exposure to mechanical stress and thermal cycling?
The liquid crystal polymer insulation of the HMTSW-104-08-L-D-006 offers excellent dimensional stability and low moisture absorption compared to traditional phenolic or epoxy materials, making it well-suited for thermal cycling between -55°C and 125°C. LCP's crystalline structure provides high stiffness and creep resistance, meaning the insulation walls of the HMTSW-104-08-L-D-006 maintain their 0.100" row spacing and contact alignment even after repeated thermal shock or sustained load. However, LCP is more brittle than softer polymers, and the HMTSW-104-08-L-D-006 insulation can crack under sharp mechanical impact or excessive insertion force if mating surfaces are misaligned. Accelerated aging studies on comparable LCP connectors show minimal property degradation after 1000 thermal cycles from -55°C to 125°C, indicating the HMTSW-104-08-L-D-006 is appropriate for applications requiring multi-year field operation in varying climates. The natural (undyed) insulation color of the HMTSW-104-08-L-D-006 means it may become discolored or brittle under prolonged UV exposure if used in outdoor applications without protective housing; for such use cases, conformal coating or UV-stabilized housings are recommended.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-L-D-006

Product Attribute HMTSW-104-08-L-D-008 HMTSW-104-08-L-S-000 HMTSW-104-08-L-S-007 HMTSW-104-08-L-D-340
Part Number HMTSW-104-08-L-D-008 HMTSW-104-08-L-S-000 HMTSW-104-08-L-S-007 HMTSW-104-08-L-D-340
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Number of Positions Loaded - - - -
Termination - - - -
Mated Stacking Heights - - - -
Series - - - -
Contact Type - - - -
Contact Finish - Mating - - - -
Shrouding - - - -
Material Flammability Rating - - - -
Voltage Rating - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish - Post - - - -
Contact Finish Thickness - Post - - - -
Ingress Protection - - - -
Insulation Material - - - -
Contact Finish Thickness - Mating - - - -
Pitch - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Row Spacing - Mating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Rows - - - -
Contact Shape - - - -
Connector Type - - - -
Features - - - Simultaneous Sampling
Contact Length - Post - - - -
Insulation Height - - - -
Style - - - -
Overall Contact Length - - - -
Contact Material - - - -
Contact Length - Mating - - - -
Insulation Color - - - -
Number of Positions - - - -
Current Rating (Amps) - - - -
Fastening Type - - - -
Applications - - - -

HMTSW-104-08-L-D-006 Datasheet PDF

Download HMTSW-104-08-L-D-006 pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-L-D-006 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-L-D-006

Samtec Inc.
98D-HMTSW-104-08-L-D-006

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