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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-L-S-000
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HMTSW-104-08-L-S-000 - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-L-S-000
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-L-S-000
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
49,115 pcs available, New & Original
Parts Description
CONN HEADER VERT 4POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-L-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 49115

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Specifications

HMTSW-104-08-L-S-000 Tech Specifications
Samtec Inc. - HMTSW-104-08-L-S-000 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-L-S-000

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.530" (13.46mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 4
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.430" (10.92mm)
Contact Length - Mating -
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating pitch tolerance and alignment consideration when using the HMTSW-104-08-L-S-000 in a high-density PCB layout?
The HMTSW-104-08-L-S-000 operates at a 0.100" (2.54mm) standard pitch, which is one of the most widely used spacing intervals in through-hole connector design. This pitch was established to balance mechanical robustness with density constraints on typical FR-4 boards. When laying out multiple HMTSW-104-08-L-S-000 headers, maintain consistent trace routing from the 0.430" (10.92mm) post length to your signal layer, as uneven solder joint stress can accumulate with tighter board spacing. The square contact geometry of the HMTSW-104-08-L-S-000 provides positive key alignment during mating, reducing the risk of skew that would occur with round pins in close pitch applications.
How does the 10.0µin gold plating on the HMTSW-104-08-L-S-000 mating surface compare to thin-film finishes in terms of contact resistance stability?
The HMTSW-104-08-L-S-000 features 10.0µin (0.25µm) gold plating on mating contacts, which is a mid-range thickness that balances cost and durability for industrial applications. This thickness provides approximately 50–100 insertion cycles before visible wear under normal handling, compared to thinner finishes (2–5µin) which may show contact resistance drift after 20–30 cycles. The gold layer on the HMTSW-104-08-L-S-000 acts as an oxidation barrier over the phosphor bronze substrate, maintaining contact resistance below 20mΩ at 3A through the operational temperature range. Tin plating on the solder post of the HMTSW-104-08-L-S-000 ensures reliable wetting without creating galvanic corrosion concerns, as tin and gold are electrochemically compatible in typical PCB environments.
Can the HMTSW-104-08-L-S-000 reliably handle transient current spikes above its 3A continuous rating?
The HMTSW-104-08-L-S-000 is rated for continuous operation at 3A, but instantaneous current surges can exceed this rating if duration is brief. The phosphor bronze contacts and gold finish of the HMTSW-104-08-L-S-000 can tolerate inrush currents of 5–7A for pulse durations under 100ms without measurable contact degradation. However, repeated transients or sustained current above 4A will accelerate contact erosion on the HMTSW-104-08-L-S-000 due to localized heating at asperities. For applications with predictable surge current, calculate the I²t (current-time integral) and verify it remains below the material's thermal capacity. The push-pull fastening mechanism on the HMTSW-104-08-L-S-000 does not engage high-force wiping during mating, so contact conditioning from repeated insertions is limited compared to sliding contacts.
What thermal considerations should guide PCB layout when multiple HMTSW-104-08-L-S-000 headers carry current at the upper temperature limit?
The HMTSW-104-08-L-S-000 is rated for operation from -55°C to 125°C, with contact resistance increasing approximately 0.05mΩ per °C above 25°C. At 125°C ambient and 3A load, the self-heating of the HMTSW-104-08-L-S-000 contact resistance (typically 15–18mΩ at 125°C) will dissipate approximately 135–160mW. This thermal contribution is marginal for a single HMTSW-104-08-L-S-000 header but becomes significant when four or more headers operate in parallel on the same board region. Place the HMTSW-104-08-L-S-000 headers at least 10mm apart and avoid locating them directly above high-dissipation components. The Liquid Crystal Polymer (LCP) insulation on the HMTSW-104-08-L-S-000 maintains mechanical stability at 125°C, but avoid routing high-speed signals within 5mm of the header body to prevent crosstalk into thermally-induced noise.
How does the unshrouded design of the HMTSW-104-08-L-S-000 affect electromagnetic shielding in mixed-signal applications?
The HMTSW-104-08-L-S-000 is an unshrouded header, which means the contacts are exposed without metal shielding. This design reduces parasitic capacitance (approximately 2–3pF per contact compared to shrouded variants) but eliminates Faraday cage protection around the mating interface. In mixed-signal designs, the HMTSW-104-08-L-S-000 can act as a radiator or receiver of EMI depending on signal frequency and impedance of connected traces. If routing analog or precision signals through the HMTSW-104-08-L-S-000, keep these traces separate from power distribution runs by at least 15mm and consider a ground plane directly beneath the header. For high-frequency digital signals (>50MHz) through the HMTSW-104-08-L-S-000, differential pair routing with controlled impedance is recommended to minimize radiation. The square contact geometry of the HMTSW-104-08-L-S-000 does not introduce field concentration hot spots typical of sharp-edge contact geometries.
What is the expected board life cycle when using solder-attached HMTSW-104-08-L-S-000 headers in thermal cycling between -55°C and 125°C?
The HMTSW-104-08-L-S-000 has a 0.530" (13.46mm) overall contact length with a 0.430" (10.92mm) solder post, creating a compliant moment arm that flexes during thermal expansion and contraction cycles. Over 500 thermal cycles spanning -55°C to 125°C, the solder joint stress on the HMTSW-104-08-L-S-000 will accumulate due to CTE mismatch between copper trace, solder, and the phosphor bronze post. Using SAC305 solder (lead-free) with the HMTSW-104-08-L-S-000 provides approximately 1,200–1,500 equivalent cycles to failure under JEDEC conditions; this is reduced to 400–600 cycles if the HMTSW-104-08-L-S-000 is positioned on a thin substrate (0.062") with minimal pad copper area. Mechanically anchor the HMTSW-104-08-L-S-000 with a strain relief clamp on mated cables to reduce stress transfer to the solder joint during vibration.
How do the push-pull fastening characteristics of the HMTSW-104-08-L-S-000 differ from latched connector designs in field maintenance scenarios?
The HMTSW-104-08-L-S-000 uses a push-pull fastening mechanism, which means insertion and removal are controlled by axial force only, with no latching arms or snap features. This design simplifies single-handed mating and reduces the risk of incomplete seating that can occur with multi-stage latch systems. However, the push-pull mechanism on the HMTSW-104-08-L-S-000 provides no mechanical retention, so vibration or accidental contact can cause partial withdrawal. In field maintenance, mark the mated HMTSW-104-08-L-S-000 connectors with witness marks to detect unplanned disconnection. The force curve for the HMTSW-104-08-L-S-000 is approximately 15–20N at full insertion, distributed across the four contacts; uneven insertion forces suggest contact misalignment and should prompt inspection of the mating connector.
What surface finish compatibility should be verified when pairing the HMTSW-104-08-L-S-000 with mating connectors from different manufacturers?
The HMTSW-104-08-L-S-000 has gold-plated mating contacts and tin-plated solder posts, which represents an asymmetric finish combination. When selecting a mating connector for the HMTSW-104-08-L-S-000, verify that the mating contact is also gold-plated or palladium-plated to avoid galvanic corrosion at the interface. Gold-to-nickel or gold-to-copper combinations create micro-galvanic couples that can degrade the HMTSW-104-08-L-S-000 contact resistance over time in humid environments. The tin post finish on the HMTSW-104-08-L-S-000 is compatible with lead-free solder assembly and with traditional lead-based solder, but mixing lead-free and lead-based solder in the same HMTSW-104-08-L-S-000 joint introduces an intermetallic layer that increases contact resistance by 5–15% over 12 months in field use.
Does the 4-position HMTSW-104-08-L-S-000 maintain signal integrity when all four contacts carry high-frequency differential pairs?
The HMTSW-104-08-L-S-000 in its standard 4-position, single-row configuration has insufficient contact separation for true differential-pair impedance control. If all four positions of the HMTSW-104-08-L-S-000 are used for two differential pairs, the inter-pair spacing is 0.100" (2.54mm), which is below the typical 0.150–0.200" separation needed for 50–100Ω controlled impedance at frequencies above 100MHz. The HMTSW-104-08-L-S-000 should be reserved for lower-speed digital (below 50MHz) or analog signal distribution. For higher-speed applications, consider using shrouded variants or multi-row derivatives of the Flex Stack series that provide better inter-pair isolation. The unshrouded design of the HMTSW-104-08-L-S-000 also permits stronger cross-talk coupling between adjacent traces exiting the header.
How does the Liquid Crystal Polymer (LCP) insulation material on the HMTSW-104-08-L-S-000 affect moisture absorption and insulation resistance in humid climates?
The HMTSW-104-08-L-S-000 uses Liquid Crystal Polymer (LCP) insulation, which exhibits water absorption below 0.08% by weight—among the lowest for thermoplastic insulation materials. This makes the HMTSW-104-08-L-S-000 suitable for outdoor and humid environments without special conformal coating. The insulation resistance of the HMTSW-104-08-L-S-000 remains above 1GΩ between adjacent contacts even after 500 hours of ASTM D2671 humidity testing at 85°C and 85% RH. The UL94 V-0 flammability rating of the HMTSW-104-08-L-S-000 is maintained because LCP does not soften significantly below 200°C, providing inherent flame resistance without halogenated additives. At high humidity, the solder joints on the HMTSW-104-08-L-S-000 are the failure point, not the connector body itself; use no-clean flux residues to minimize ionic contamination on the HMTSW-104-08-L-S-000 PCB area.
What is the expected plating wear rate on the HMTSW-104-08-L-S-000 contacts after 50 mating cycles in a test fixture environment?
The HMTSW-104-08-L-S-000 contacts experience mechanical wiping during each insertion, though push-pull fastening provides less wiping action than latched systems. After 50 insertion cycles, the 10.0µin gold plating on the HMTSW-104-08-L-S-000 will show localized wear at the peak asperities, reducing effective plating thickness to approximately 6–8µin in high-contact-pressure zones. This wear is visually detectable under magnification (5–10x) as dull spots on the HMTSW-104-08-L-S-000 contact surface. The contact resistance of the HMTSW-104-08-L-S-000 typically increases 10–20% after 50 cycles at 3A, primarily due to surface roughening rather than complete plating perforation. For connectors requiring >100 mating cycles in field service, specify a thicker gold plating or consider a hard-gold (25–50µin) variant of the Flex Stack series.
Can the HMTSW-104-08-L-S-000 be reliably used in automated assembly with pick-and-place equipment without risk of contact damage?
The HMTSW-104-08-L-S-000 is robust for standard surface-mount assembly processes when handled with appropriate pick-and-place vacuum or mechanical gripper pressures. The LCP insulation and phosphor bronze contacts on the HMTSW-104-08-L-S-000 withstand compressive forces up to 50N without permanent deformation. However, vacuum pickup of the HMTSW-104-08-L-S-000 directly on the contact pins is not recommended; apply vacuum to the insulation body or use mechanical pick fingers around the sides. The solder paste aperture under the HMTSW-104-08-L-S-000 should be sized to deposit 0.3–0.5mg of solder per contact, as under-solder can create intermittent connections and over-solder creates voiding and electrical leakage paths on the HMTSW-104-08-L-S-000. Perform a thermal profile simulation or test board run with the HMTSW-104-08-L-S-000 before full production release to verify solder wetting and post alignment.
What preventive measures are necessary when storing bulk inventory of HMTSW-104-08-L-S-000 headers to avoid contact oxidation?
The HMTSW-104-08-L-S-000 contacts are exposed in an unshrouded configuration, making them susceptible to oxidation during long-term storage. Although the 10.0µin gold plating on the HMTSW-104-08-L-S-000 provides oxidation resistance for 12–24 months in standard dry-box conditions (relative humidity <30%), the phosphor bronze substrate begins to oxidize at the contact edges if humidity exceeds 50%. Store the HMTSW-104-08-L-S-000 in sealed moisture-barrier bags with desiccant packets at humidity levels below 20% and ambient temperature 15–25°C. Inspect the HMTSW-104-08-L-S-000 visually after 18 months of storage; if contact surfaces show tarnishing (gray or dark discoloration), perform a contact-resistance measurement before board assembly. The HMTSW-104-08-L-S-000 stored in industrial facilities (>50% humidity without climate control) can experience 30–50% increase in contact resistance within 24 months, requiring pre-assembly contact cleaning or replacement of affected inventory.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-L-S-000

Product Attribute HMTSW-104-08-L-S-300 HMTSW-104-08-L-S-007 HMTSW-104-08-L-S-340 HMTSW-104-08-L-T-008-RA
Part Number HMTSW-104-08-L-S-300 HMTSW-104-08-L-S-007 HMTSW-104-08-L-S-340 HMTSW-104-08-L-T-008-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Overall Contact Length - - - -
Ingress Protection - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Voltage Rating - - - -
Insulation Height - - - -
Connector Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mated Stacking Heights - - - -
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Positions Loaded - - - -
Contact Finish - Post - - - -
Current Rating (Amps) - - - -
Fastening Type - - - -
Contact Length - Mating - - - -
Contact Shape - - - -
Material Flammability Rating - - - -
Termination - - - -
Style - - - -
Contact Finish Thickness - Post - - - -
Contact Finish - Mating - - - -
Pitch - Mating - - - -
Contact Finish Thickness - Mating - - - -
Contact Material - - - -
Series - - - -
Shrouding - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Rows - - - -
Contact Type - - - -
Features - - - Simultaneous Sampling
Insulation Color - - - -
Row Spacing - Mating - - - -
Insulation Material - - - -
Number of Positions - - - -
Contact Length - Post - - - -

HMTSW-104-08-L-S-000 Datasheet PDF

Download HMTSW-104-08-L-S-000 pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-L-S-000 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-L-S-000

Samtec Inc.
98D-HMTSW-104-08-L-S-000

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