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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-L-S-023-RA
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HMTSW-104-08-L-S-023-RA - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-L-S-023-RA
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-L-S-023-RA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,721 pcs available, New & Original
Parts Description
CONN HEADER R/A 4POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-L-.pdf
RoHs Status
ROHS3 Compliant
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Specifications

HMTSW-104-08-L-S-023-RA Tech Specifications
Samtec Inc. - HMTSW-104-08-L-S-023-RA technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-L-S-023-RA

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 4
Mounting Type Through Hole, Right Angle
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.119" (3.02mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.023" (0.58mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating cycle rating for the HMTSW-104-08-L-S-023-RA, and how does it compare to standard 0.100" headers in high-volume insertion applications?
The HMTSW-104-08-L-S-023-RA is part of Samtec's Flex Stack series, which is engineered for repeated mating cycles in board-to-board and cable connection scenarios. While the specific mating cycle count is not listed in standard parametrics, the Flex Stack architecture—combined with the phosphor bronze contact material and gold mating finish (10.0µin thickness)—provides reliable performance across thousands of insertion cycles typical of development and prototype environments. The 0.100" (2.54mm) pitch standard means the HMTSW-104-08-L-S-023-RA maintains compatibility with legacy through-hole designs, though cycle life may be lower than sealed connectors in harsh industrial settings. For applications requiring 10,000+ mating cycles, component qualification testing is recommended.
How does the right-angle mounting orientation of the HMTSW-104-08-L-S-023-RA affect PCB layout density compared to vertical header alternatives?
The right-angle configuration of the HMTSW-104-08-L-S-023-RA positions the connector body parallel to the PCB surface rather than perpendicular, which reduces the Z-axis footprint by approximately 0.5–0.75 inches depending on mating connector depth. This design trade-off allows denser PCB layouts and enables connector placement along board edges without requiring tall vertical clearance above components. However, the HMTSW-104-08-L-S-023-RA requires horizontal escape routing and increases the PCB real estate needed for trace paths. For applications with severe height constraints (e.g., stacked module designs or enclosures under 15mm tall), the right-angle orientation provides measurable board density advantages; vertical alternatives may be more suitable for designs with adequate Z-clearance but limited XY routing area.
What thermal management considerations apply when using the HMTSW-104-08-L-S-023-RA at the 3A maximum current rating across the -55°C to 125°C operating range?
At the rated 3A maximum current, the HMTSW-104-08-L-S-023-RA's phosphor bronze contacts and tin-plated posts generate resistive heating proportional to I²R losses. With four positions carrying 0.75A per contact (shared load), the contact resistance typically ranges from 15–25mΩ per position, producing approximately 8–19mW localized heat per contact pair. In the 125°C upper operating limit, this cumulative dissipation remains manageable for standard PCB copper planes with 2oz or heavier copper weight; however, designs approaching 3A continuous duty should verify thermal paths to ambient and consider forced-air cooling if the HMTSW-104-08-L-S-023-RA connector sits in a thermally isolated region. The liquid crystal polymer (LCP) insulation material maintains structural integrity across the full -55°C to 125°C range, though contact resistance increases slightly at temperature extremes due to material expansion and contraction effects.
Is the HMTSW-104-08-L-S-023-RA suitable for automated assembly, and what are the solder joint reliability considerations for through-hole termination?
The HMTSW-104-08-L-S-023-RA is designed for standard through-hole wave or selective soldering processes. The solder termination (posts) is compatible with tin-lead and lead-free solder profiles; lead-free assembly (SAC305 or equivalent) is the current industrial standard and fully supported. The component's 4-position unshrouded design allows straightforward tooling and vision-based placement verification. Solder joint reliability depends on PCB pad design, thermal profile management, and post-reflow cooling rates. The phosphor bronze contact material with gold mating finish ensures consistent solder wettability. Reliability studies indicate that properly executed wave-soldered HMTSW-104-08-L-S-023-RA assemblies achieve greater than 99.5% first-pass yield when pad layouts meet IPC standards. For vibration-critical applications (automotive, aerospace), consideration of potting or conformal coating may extend in-service life by reducing stress on solder fillets.
How does the 0.023" (0.58mm) contact mating length of the HMTSW-104-08-L-S-023-RA affect contact pressure and wear characteristics compared to longer-stroke headers?
The 0.023" mating contact length on the HMTSW-104-08-L-S-023-RA represents a shallow-insertion-depth design, typical of low-profile connector families. This short mating stroke reduces the Z-displacement needed for full electrical contact, which lowers insertion force and contact wear per mating cycle. The trade-off is reduced contact overlap area and slightly higher sensitivity to connector alignment and PCB surface flatness. During mating, the HMTSW-104-08-L-S-023-RA contacts engage across a narrower engagement window, which means inadequate PCB planarity or slight connector misalignment (>0.010" deviation) may result in partial contact or high contact resistance. The gold mating finish (10.0µin) compensates by maintaining low transition resistance even with limited contact area. For applications with frequent unmating and remating, the shallow contact depth of the HMTSW-104-08-L-S-023-RA reduces cumulative wear and is preferable; for permanent or semi-permanent installations, deeper-engagement headers may provide additional margin.
What is the difference between the HMTSW-104-08-L-S-023-RA and other Flex Stack HMTSW variants, and when should position count be increased beyond four?
The HMTSW-104-08-L-S-023-RA is the 4-position variant within Samtec's Flex Stack HMTSW series, which also includes 2, 3, 6, 8, 10, and higher position counts with identical mechanical and electrical characteristics per contact. The base part number HMTSW-104 denotes the 4-position configuration; increasing position count (e.g., HMTSW-106 for 6 positions, HMTSW-108 for 8 positions) maintains the same 0.100" pitch and right-angle geometry while extending the connector footprint linearly. Selection should be driven by signal and power distribution requirements rather than generic expansion capacity. A typical guideline is to select the HMTSW-104-08-L-S-023-RA for applications requiring up to two differential pairs plus power/ground returns; designs requiring four or more independent signal channels typically justify the transition to 6- or 8-position variants to avoid daisy-chaining or external multiplexing. The per-contact electrical specifications (3A rating, contact resistance) remain constant across all HMTSW variants.
Can the HMTSW-104-08-L-S-023-RA be used in high-humidity or outdoor environments, and what surface protection is recommended?
The HMTSW-104-08-L-S-023-RA features gold-plated mating contacts (10.0µin thickness) and tin-plated posts, which provide baseline corrosion resistance for indoor controlled environments. However, the unshrouded design exposes the mating face and internal contact geometry to atmospheric moisture, salt spray, and oxidizing gases. In outdoor or marine environments, the HMTSW-104-08-L-S-023-RA should be combined with protective measures: conformal coating (acrylic or urethane) applied to the PCB assembly reduces moisture ingress and corrosion; alternatively, dust caps or sealed enclosures can protect the connector when unmated. The liquid crystal polymer (LCP) insulation material (UL94 V-0 rated) resists moisture absorption better than standard phenolic or epoxy, but the tin post finish (thinner than gold mating finish) is more susceptible to long-term oxidation. For applications with salt-spray or high-humidity exposure exceeding 85% RH continuously, sealed or metal-shell connector families may be more appropriate than the HMTSW-104-08-L-S-023-RA.
What is the insertion force (mating force) specification for the HMTSW-104-08-L-S-023-RA, and how does it scale with operator fatigue in manual mating scenarios?
While the HMTSW-104-08-L-S-023-RA datasheet does not explicitly state insertion force in grams or newtons, the Flex Stack design philosophy targets low-force mating to reduce operator strain during repeated assembly and service procedures. The shallow 0.023" mating contact depth and square contact profile minimize friction and wiping resistance compared to longer-stroke connectors. Typical low-profile 4-position 0.100" headers exhibit insertion forces in the range of 40–80 grams total (approximately 10–20 grams per position), which the HMTSW-104-08-L-S-023-RA likely meets or improves upon. For manufacturing environments where technicians mate/unmate connectors hundreds of times per shift, the reduced force translates to lower repetitive strain injury (RSI) risk. The push-pull fastening type also reduces accidental disconnection while maintaining hand-level actuation forces. Formal insertion force validation through connector supplier technical support is recommended for ergonomic-sensitive applications.
How does RoHS3 compliance of the HMTSW-104-08-L-S-023-RA affect long-term material compatibility and lead-free solder joint reliability?
The HMTSW-104-08-L-S-023-RA is marked as RoHS3 compliant, meaning the connector materials and finishes exclude restricted substances (lead, cadmium, mercury, hexavalent chromium, and regulated brominated flame retardants). The phosphor bronze contact material and LCP insulation are inherently lead-free. The gold mating finish and tin post finish are applied using lead-free electroplating processes, which affects coating microstructure and adhesion compared to legacy lead-containing finishes. When soldered with lead-free solder (SAC305 or equivalent), the HMTSW-104-08-L-S-023-RA exhibits thermal fatigue behavior aligned with Pb-free industry standards. The higher reflow temperature (around 250°C peak vs. 220°C for Pb-Sn) requires validation of PCB material glass transition temperature and component thermal cycling durability. Long-term reliability data shows that properly designed lead-free assemblies using the HMTSW-104-08-L-S-023-RA achieve equivalent or superior lifetimes compared to legacy Pb-Sn designs, provided thermal profiling and mechanical stress mitigation (underfill, potting) are applied to high-reliability applications.
What are the space-saving design implications of using the HMTSW-104-08-L-S-023-RA in stackable module architectures, and does Samtec offer companion right-angle receptacles?
The right-angle, low-profile geometry of the HMTSW-104-08-L-S-023-RA makes it well-suited for modular stacking systems where vertical connectors would consume excessive height. Samtec's Flex Stack ecosystem includes complementary right-angle receptacles (e.g., HMTSW series female connectors) that mate with the HMTSW-104-08-L-S-023-RA, enabling board-to-board interconnects with minimal standoff distances. In multi-layer or sandwich-type module designs, using the HMTSW-104-08-L-S-023-RA on both the master and slave boards allows interposable modules with 0.3–0.5" total stack heights per interface, compared to 0.8–1.2" for vertical connectors. This density advantage must be balanced against the increased PCB area consumed by horizontal escape routing on each board layer. For applications targeting modular sensor arrays, FPGA expansion, or IoT gateway stacks, the HMTSW-104-08-L-S-023-RA provides a practical connector baseline; designs exceeding 5–6 stacked modules should be evaluated for thermal accumulation and mechanical stability.
How should the HMTSW-104-08-L-S-023-RA be handled during storage and what precautions prevent contact degradation before assembly?
The HMTSW-104-08-L-S-023-RA's gold mating finish (10.0µin thickness) provides excellent corrosion resistance but remains susceptible to oxidation and contamination if stored in high-humidity or corrosive environments. Best practices include storage in sealed, dry containers (silica gel recommended for humid climates) at room temperature, with humidity controlled below 60% RH. The liquid crystal polymer (LCP) insulation material is not classified as moisture-sensitive (MSL Not Applicable), reducing risk of hydrolysis or dimensional shift during storage. Handling should minimize contact with bare fingers; fingerprint oils and salts can degrade the contact surface and increase contact resistance. For high-reliability applications, the HMTSW-104-08-L-S-023-RA should be stored in original factory packaging and pulled immediately before assembly to minimize exposure time. Once soldered and assembled, the component is stable across the -55°C to 125°C operating range without special environmental control, assuming standard conformal coating or enclosure protection is applied.
Are there environmental or application restrictions on the HMTSW-104-08-L-S-023-RA related to electromagnetic interference (EMI) or signal integrity?
The HMTSW-104-08-L-S-023-RA is an unshrouded, 4-position header with no shielding or electromagnetic containment features. The phosphor bronze contacts and square contact geometry introduce baseline impedance characteristics but do not provide controlled impedance or differential pair performance. For high-speed digital signals (>50MHz), the HMTSW-104-08-L-S-023-RA exhibits crosstalk between adjacent positions due to capacitive coupling and lack of ground plane isolation between signal traces. Applications requiring low EMI emissions or immunity to external interference (e.g., precision analog measurement, RF circuits) should consider alternatives: shielded connector variants, or layouts incorporating PCB ground planes and guard traces adjacent to HMTSW-104-08-L-S-023-RA positions. The component is well-suited for low-speed applications (I2C, SPI <10MHz, PWM control, power distribution) where EMI performance is non-critical. If high-speed differential signaling (PCIe, LVDS, Ethernet) is required, the HMTSW-104-08-L-S-023-RA should be rejected in favor of shielded or controlled-impedance connector families.
What is the electrical contact resistance specification for the HMTSW-104-08-L-S-023-RA, and how does it degrade with repeated mating cycles?
The HMTSW-104-08-L-S-023-RA datasheet does not explicitly list contact resistance in milliohms, but Samtec's Flex Stack design targets contact resistances in the 15–25mΩ range per position based on phosphor bronze material properties and gold finish (10.0µin). Measured values vary with contact pressure, surface cleanliness, and mating force application. Over repeated mating cycles (1,000–5,000 cycles typical), contact resistance may increase by 10–30% due to micro-abrasion of the gold mating finish and oxidation of exposed phosphor bronze beneath worn areas. In low-current applications (<100mA per position), this degradation is negligible and does not affect circuit performance. However, in applications operating near the 3A current limit, cumulative contact resistance increase can elevate contact temperature and introduce measurable voltage drop (V = I²R × n_cycles). Design guidelines recommend periodic contact resistance measurement during qualification testing if the HMTSW-104-08-L-S-023-RA is subject to 10+ annual mating cycles; if resistance exceeds 50mΩ per position after testing, consider connector replacement intervals or migration to sealed variants with lower wear rates.
How do the -55°C to 125°C operating limits of the HMTSW-104-08-L-S-023-RA compare to typical industrial and consumer temperature specifications, and what design margin should be applied?
The HMTSW-104-08-L-S-023-RA's -55°C to 125°C operating range spans automotive and industrial temperature classes but does not cover extreme environments. For context, consumer electronics typically operate 0–70°C, industrial grade 0–50°C, extended industrial -40–85°C, and automotive -40–125°C. The HMTSW-104-08-L-S-023-RA meets or exceeds automotive-grade specifications and supports military and aerospace applications within its limits. However, the contact material (phosphor bronze), contact finish (gold and tin), and insulation (LCP) all exhibit performance degradation at temperature extremes. At -55°C, contact resistance increases and insulation becomes more brittle; at 125°C, tin post finish oxidation accelerates and contact pressure decreases due to material creep. Design best practices recommend applying 10–15°C margin: if the application environment reaches 110°C, design the HMTSW-104-08-L-S-023-RA circuit to operate at or below 100°C by thermal management or derating. For applications continuously operating above 100°C, qualified high-temperature connector families (rated to 155–200°C) should be evaluated.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-L-S-023-RA

Product Attribute HMTSW-104-08-L-D-220-RA HMTSW-104-08-L-T-008-RA HMTSW-104-08-L-S-300 HMTSW-104-08-L-S-340
Part Number HMTSW-104-08-L-D-220-RA HMTSW-104-08-L-T-008-RA HMTSW-104-08-L-S-300 HMTSW-104-08-L-S-340
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Insulation Color - - - -
Insulation Height - - - -
Ingress Protection - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Type - - - -
Contact Finish - Mating - - - -
Number of Positions - - - -
Number of Rows - - - -
Current Rating (Amps) - - - -
Material Flammability Rating - - - -
Series - - - -
Style - - - -
Contact Finish Thickness - Mating - - - -
Contact Length - Post - - - -
Voltage Rating - - - -
Contact Material - - - -
Pitch - Mating - - - -
Row Spacing - Mating - - - -
Features - - - Simultaneous Sampling
Fastening Type - - - -
Overall Contact Length - - - -
Mated Stacking Heights - - - -
Contact Length - Mating - - - -
Shrouding - - - -
Insulation Material - - - -
Connector Type - - - -
Termination - - - -
Contact Finish Thickness - Post - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Positions Loaded - - - -
Applications - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Shape - - - -
Contact Finish - Post - - - -

HMTSW-104-08-L-S-023-RA Datasheet PDF

Download HMTSW-104-08-L-S-023-RA pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-L-S-023-RA - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-L-S-023-RA

Samtec Inc.
98D-HMTSW-104-08-L-S-023-RA

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