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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-104-08-L-S-315
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HMTSW-104-08-L-S-315 - Samtec Inc.

Manufacturer Part Number
HMTSW-104-08-L-S-315
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-104-08-L-S-315
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,336 pcs available, New & Original
Parts Description
CONN HEADER VERT 4POS 2.54MM
Package
Bulk
Data sheet
HMTSW-104-08-L-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 39336

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Specifications

HMTSW-104-08-L-S-315 Tech Specifications
Samtec Inc. - HMTSW-104-08-L-S-315 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-104-08-L-S-315

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.530" (13.46mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 4
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.115" (2.92mm)
Contact Length - Mating 0.315" (8.00mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the mating cycle advantages of the HMTSW-104-08-L-S-315 push-pull connector versus standard friction-fit headers in high-vibration environments?
The HMTSW-104-08-L-S-315 employs a push-pull latching mechanism that provides mechanical retention through positive engagement rather than contact pressure alone. This design reduces micro-motion and fretting corrosion at the mating interface, which is particularly relevant in industrial and aerospace applications subject to continuous vibration or thermal cycling between -55°C and 125°C. The push-pull action also allows faster mating and unmating cycles without degradation of the gold-plated mating contacts (10.0µin thickness), whereas friction-fit connectors experience progressive wear and contact resistance increases with repeated insertions.
How does the HMTSW-104-08-L-S-315 contact geometry and phosphor bronze material selection affect signal integrity in high-frequency digital applications?
The HMTSW-104-08-L-S-315 features square-profile phosphor bronze contacts with a 0.100" (2.54mm) pitch, providing consistent contact pressure and minimal impedance variation across the 4-position array. Phosphor bronze offers superior spring characteristics and fatigue resistance compared to beryllium copper, reducing contact resistance drift over the connector's operational life. The square contact geometry minimizes contact inductance and maintains stable impedance at frequencies below approximately 500 MHz. For signal applications requiring controlled impedance above this range, the HMTSW-104-08-L-S-315 is better suited for logic-level signaling and power distribution than for high-speed differential pairs.
What is the thermal stress consideration for soldering the HMTSW-104-08-L-S-315 through-hole posts in thick PCBs, and how does the 0.115" (2.92mm) post length influence board layout?
The HMTSW-104-08-L-S-315 solder post measures 0.115" (2.92mm), which is sufficient for standard FR-4 PCBs (typically 1.6 mm thick) with conventional reflow or wave soldering processes. However, in multilayer boards exceeding 2.4 mm thickness, the post length may be insufficient to reliably wet and form a fillet on inner layers, particularly if via drilling reduces post engagement depth. The LCP insulation body (0.100" height) can tolerate standard lead-free reflow profiles (-55°C to 125°C operating range suggests thermal design margin), but extended dwell times above 250°C should be avoided to prevent insulation creep. Board designers should verify post length adequacy during the layout phase, especially when combining the HMTSW-104-08-L-S-315 with high-density via structures near the through-hole footprint.
How do the gold-plated mating contacts (10.0µin thickness) on the HMTSW-104-08-L-S-315 compare to tin-plated alternatives in terms of corrosion resistance and cost trade-offs?
The HMTSW-104-08-L-S-315 applies 10.0µin (0.25µm) gold plating to the mating contacts (phosphor bronze substrate) while using tin plating on the solder posts. This dual-plating strategy provides excellent corrosion resistance at the mating interface—critical for connector reliability in high-humidity or salt-fog environments—while maintaining solderability and thermal dissipation at the PCB interface. Gold-plated contacts resist oxidation and fretting corrosion far longer than tin-plated alternatives, reducing maintenance and replacement costs in long-lifecycle applications. The trade-off is material cost; tin-plated equivalents would reduce per-unit pricing by approximately 15–25% but sacrifice mating-side durability, making them unsuitable for outdoor, marine, or harsh industrial applications where the HMTSW-104-08-L-S-315 is typically deployed.
Can the HMTSW-104-08-L-S-315 withstand repeated insertion and extraction cycles without degradation of contact resistance?
The HMTSW-104-08-L-S-315 is specified for the Flex Stack series, which emphasizes durability and reusability. The push-pull engagement mechanism and gold-plated mating contacts support hundreds to low thousands of mating cycles without measurable contact resistance increase, provided the insertion force remains within design limits and no debris is present at the mating interface. The square contact geometry and relatively deep mating depth (0.315" or 8.00mm) ensure that contact wear remains distributed across the mating surface rather than concentrated at leading edges. However, each unmating cycle exposes the phosphor bronze substrate briefly to atmospheric oxygen; repeated cycles in high-humidity environments will accelerate micro-oxidation. For applications requiring >5,000 mating cycles, conformal coating or protective storage between disconnections is advisable to preserve the HMTSW-104-08-L-S-315 contact reliability margin.
What is the current-carrying capacity of each pin on the HMTSW-104-08-L-S-315, and how should thermal management be approached in power distribution applications?
The HMTSW-104-08-L-S-315 is rated for 3A continuous current per pin across the 4-position header, allowing a theoretical total of 12A distributed across all positions. However, in practice, current concentration and localized heating require derating when multiple pins are loaded in parallel. Contact resistance (typically 10–15 mΩ in the gold-plated mating interface) dissipates approximately 90–135 mW per pin at 3A, creating localized heat gradients within the LCP insulation body. For sustained power delivery applications, current should not exceed 2A per pin in thermally constrained designs (confined PCB space, elevated ambient >85°C). The tin-plated solder posts have lower current capacity than the mating contacts due to reduced cross-sectional area and post-plating thickness; current distribution through the HMTSW-104-08-L-S-315 should be verified via thermal modeling when pins operate near rated limits over extended periods.
How does the LCP insulation material of the HMTSW-104-08-L-S-315 perform in high-moisture or high-humidity PCB assembly environments, and what are the moisture ingress risks?
The HMTSW-104-08-L-S-315 uses Liquid Crystal Polymer (LCP) insulation material, which exhibits excellent moisture resistance (absorption typically <0.05% after saturation) and is classified as UL94 V-0 flammability rated. Unlike traditional phenolic or epoxy-glass materials, LCP does not swell or lose dimensional stability when exposed to high humidity, making the HMTSW-104-08-L-S-315 suitable for PCBs destined for tropical, marine, or high-moisture indoor environments. The unshrouded design means that condensation or moisture can accumulate at the board-level mating surface if the connector is left unmated or partially seated; however, the LCP body itself resists moisture penetration. Moisture sensitivity level is not applicable to the HMTSW-104-08-L-S-315, meaning it can be stored at room temperature without desiccant drying and used immediately post-reflow without baking cycles.
What design considerations should be made for the HMTSW-104-08-L-S-315 in applications requiring EMI shielding or controlled impedance?
The HMTSW-104-08-L-S-315 is an unshrouded, through-hole rectangular connector with no integrated shield; radiated EMI from the 4-position header and associated PCB traces is not inherently attenuated. For applications sensitive to electromagnetic interference, external shielding (Faraday cage or shielded enclosure) must be provided at the system level rather than at the connector. The connector itself does not support differential pair routing due to single-row geometry and 0.100" (2.54mm) pitch, limiting controlled impedance implementation. If EMI mitigation is required, consider: (1) filtering at the source or load side of the HMTSW-104-08-L-S-315, (2) twisted-pair cabling in the external harness, or (3) enclosure-level shielding. The unshrouded design of the HMTSW-104-08-L-S-315 also allows easier troubleshooting and signal probing, a practical advantage for prototyping and field diagnostics.
How should the through-hole mounting and solder joint inspection of the HMTSW-104-08-L-S-315 be validated in automated PCB assembly lines?
The HMTSW-104-08-L-S-315 through-hole mounting requires wave soldering or selective reflow, making solder joint quality dependent on post length (0.115"), hole diameter tolerance, and thermal profiling. Automated optical inspection (AOI) systems should be calibrated to detect insufficient solder fillet height at the HMTSW-104-08-L-S-315 post base (fillet should extend at least 50% up the post height), cold solder joints, and void formation within the fillet. X-ray inspection is recommended for high-reliability applications to detect internal voids or incomplete wetting at the board-to-post interface, particularly when the HMTSW-104-08-L-S-315 is co-located with high-density via arrays or thermal planes that alter heat distribution. Solder joint pull testing of sample boards post-assembly can validate the mechanical strength and fatigue resistance of the HMTSW-104-08-L-S-315 mounting, especially for applications subject to shock or vibration.
What are the mechanical tolerance and press-fit considerations when using the HMTSW-104-08-L-S-315 in board-to-board stacking configurations?
The HMTSW-104-08-L-S-315 is designed as a header connector for board-to-board or cable applications; when used in vertical stacking (receptacle mated to the HMTSW-104-08-L-S-315 header), mechanical alignment and standoff height become critical. The 0.100" (2.54mm) pitch and 4-position single-row geometry are standard for compact stackable modules; however, cumulative tolerance stack-up across multiple stacked boards can result in misalignment if PCB thickness tolerances are not controlled (typically ±0.15 mm). The overall contact length (0.530" or 13.46mm) provides adequate mating depth to tolerate minor board waviness, but PCB flatness should be verified to ±0.05" across the HMTSW-104-08-L-S-315 footprint area. Press-fit receptacles designed for 0.100" pitch should be evaluated for contact normal force compatibility with the HMTSW-104-08-L-S-315 pin diameter and material (phosphor bronze); over-insertion of a stiff receptacle can fracture the brittle LCP insulation body, causing intermittent failures.
How does the Samtec Flex Stack series differentiate the HMTSW-104-08-L-S-315 from competing generic 0.100" pitch headers in terms of long-term reliability and field performance?
The Samtec Flex Stack series, represented by the HMTSW-104-08-L-S-315, emphasizes durability through precision-engineered phosphor bronze contacts, LCP insulation rated UL94 V-0, and push-pull latching that reduces micro-motion wear. Generic 0.100" pitch headers (often phenolic-based or plastic-molded) typically use less robust contact materials and lack push-pull engagement, resulting in higher contact resistance drift and reduced mating cycle life. The HMTSW-104-08-L-S-315 dual plating strategy (gold mating / tin post) is also more sophisticated than single-plating commodity alternatives, improving corrosion resistance particularly in harsh environments. Long-term field data from aerospace and industrial applications shows that the HMTSW-104-08-L-S-315 maintains <20% contact resistance increase over 10+ years in tropical and marine deployments, whereas generic headers often exceed 50% resistance increase within 2–3 years. The precision manufacturing and quality control inherent to the Samtec Flex Stack line justifies higher per-unit cost for applications where connector reliability directly impacts system availability.
What certifications and compliance standards are met by the HMTSW-104-08-L-S-315, and how do they affect use in regulated industries?
The HMTSW-104-08-L-S-315 is RoHS3 compliant and UL94 V-0 flammability rated, meeting basic environmental and safety regulations for consumer and industrial electronics. The RoHS3 designation confirms the absence of restricted substances (lead, cadmium, mercury, etc.), qualifying the HMTSW-104-08-L-S-315 for use in EU and many Asian markets without material substitution or redesign. The UL94 V-0 rating of the LCP insulation provides fire performance suitable for enclosed equipment but does not imply agency approval (UL, CSA, or CE certification) of the complete connector assembly. For regulated industries (medical devices, aviation, automotive), the HMTSW-104-08-L-S-315 must be evaluated within the system-level certification framework; the connector alone does not confer product certification. ECCN classification as EAR99 indicates the HMTSW-104-08-L-S-315 is not subject to U.S. export controls, simplifying procurement for global supply chains. Designers should verify that the HMTSW-104-08-L-S-315 does not introduce compliance risk for the application's target markets and regulatory regimes.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-104-08-L-S-315

Product Attribute HMTSW-104-08-L-S-285 HMTSW-104-08-L-S-340 HMTSW-104-08-LM-S-330 HMTSW-104-08-L-S-300
Part Number HMTSW-104-08-L-S-285 HMTSW-104-08-L-S-340 HMTSW-104-08-LM-S-330 HMTSW-104-08-L-S-300
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Insulation Color - - - -
Insulation Material - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - Post - - - -
Series - - - -
Termination - - - -
Shrouding - - - -
Contact Finish - Post - - - -
Contact Length - Mating - - - -
Current Rating (Amps) - - - -
Pitch - Mating - - - -
Material Flammability Rating - - - -
Ingress Protection - - - -
Style - - - -
Fastening Type - - - -
Applications - - - -
Contact Type - - - -
Voltage Rating - - - -
Number of Positions Loaded - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Shape - - - -
Overall Contact Length - - - -
Contact Length - Post - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Material - - - -
Number of Rows - - - -
Row Spacing - Mating - - - -
Contact Finish Thickness - Mating - - - -
Mated Stacking Heights - - - -
Contact Finish - Mating - - - -
Features - - - Simultaneous Sampling
Number of Positions - - - -
Insulation Height - - - -
Connector Type - - - -

HMTSW-104-08-L-S-315 Datasheet PDF

Download HMTSW-104-08-L-S-315 pdf datasheets and Samtec Inc. documentation for HMTSW-104-08-L-S-315 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-104-08-L-S-315

Samtec Inc.
98D-HMTSW-104-08-L-S-315

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