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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsHMTSW-132-11-G-D-325
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HMTSW-132-11-G-D-325 - Samtec Inc.

Manufacturer Part Number
HMTSW-132-11-G-D-325
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HMTSW-132-11-G-D-325
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
30,994 pcs available, New & Original
Parts Description
CONN HEADER VERT 64POS 2.54MM
Package
Bulk
Data sheet
HMTSW-132-11-G-.pdf
RoHs Status
ROHS3 Compliant
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In stock: 30994

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Specifications

HMTSW-132-11-G-D-325 Tech Specifications
Samtec Inc. - HMTSW-132-11-G-D-325 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HMTSW-132-11-G-D-325

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, HMTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.930" (23.62mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 64
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Natural
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.505" (12.83mm)
Contact Length - Mating 0.325" (8.26mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number HMTSW-132
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the HMTSW-132-11-G-D-325 and single-row 0.100" pitch headers for high-density PCB layouts?
The HMTSW-132-11-G-D-325 provides a 2-row configuration with 32 positions per row and 0.100" row spacing, enabling compact board-to-board connectivity in applications requiring parallel signal distribution or split ground/power planes. Single-row alternatives reduce PCB footprint but require sequential signal routing, increasing trace complexity and propagation delay skew. The HMTSW-132-11-G-D-325's dual-row architecture allows simultaneous routing of differential pairs or closely-spaced signal clusters, reducing EMI coupling and simplifying layer stackup planning for mixed-signal designs.
Can the HMTSW-132-11-G-D-325 be used in applications requiring frequent mating cycles, and what contact wear considerations apply?
The HMTSW-132-11-G-D-325 employs phosphor bronze contacts with 10.0µin gold plating on mating surfaces and 3.0µin thickness on solder posts, designed for moderate-cycle board-to-board connections rather than high-frequency mating. Push-pull fastening provides mechanical stability during insertion, but gold contact finish thins progressively with each mating cycle due to abrasion and wiping action. For applications exceeding 50 mating cycles annually, contact resistance rises gradually; designs requiring frequent reconfiguration should specify lower contact resistance budgets or consider keyed variants to prevent misalignment wear.
How does the 0.325" mating contact length of the HMTSW-132-11-G-D-325 affect electrical performance in high-speed digital applications?
The HMTSW-132-11-G-D-325's 0.325" (8.26mm) mating contact length creates a stub transmission line at the connection interface, introducing characteristic impedance discontinuities in signal paths above 100 MHz. For DDR3/DDR4 memory interfaces or 1+ GHz clock distribution, the contact stub generates reflections and insertion loss; eye diagram closure typically ranges 5–15% depending on trace geometry. Applications with strict timing margins should implement controlled-impedance traces terminating directly at connector leads, or transition to lower-profile 0.050" pitch alternatives with proportionally shorter contact stubs.
What is the thermal performance difference between the HMTSW-132-11-G-D-325 and cable-based interconnects for distributed 3A loads across all 64 positions?
The HMTSW-132-11-G-D-325 rated at 3A per contact sustains 192A aggregate current if all 64 positions conduct simultaneously, generating junction heating at solder joints and through-hole vias. Solid connector mounting on rigid PCBs dissipates heat through copper planes and board material (typically 0.5–1.0 W/°C for 2-layer boards), maintaining contact temperature within operating range (-55°C to 125°C) under continuous load. Flex cable interconnects with identical contact ratings suffer 15–25% higher thermal resistance due to limited heat spreading in thin cable insulation, making cable harnesses unsuitable for dense, full-position current distribution; distributed power planes on PCB-mounted headers provide superior thermal performance.
Is the HMTSW-132-11-G-D-325 suitable for high-reliability applications requiring connectors certified to MIL-DTL or IEC standards?
The HMTSW-132-11-G-D-325 is a commercial-grade through-hole header without published MIL-DTL qualification or IEC 60512 contact-resistance cycling certification. Aerospace, medical, or automotive fault-tolerant designs requiring formal reliability qualification should specify alternatives with documented environmental stress screening, contact resistance stability after thermal shock, or sealed variants meeting IP67 ingress protection. The HMTSW-132-11-G-D-325's UL94 V-0 liquid crystal polymer insulation and RoHS3 compliance address industrial EMC and halogen-free requirements, but do not substitute for formal reliability qualification in high-consequence applications.
How do the 0.100" pitch and unshrouded design of the HMTSW-132-11-G-D-325 influence PCB routing density and crosstalk management?
The HMTSW-132-11-G-D-325's 0.100" (2.54mm) pitch supports trace widths of 8–12 mils with 8–10 mil clearances in standard PCB manufacturing, enabling 2–3 signal traces between adjacent contact pads. Unshrouded header geometry exposes traces directly above connector leads to adjacent PCB routing; differential pair spacing must maintain 1.5× trace width separation to limit crosstalk below -30 dB coupling. Designs using the HMTSW-132-11-G-D-325 typically reserve outer rows for ground return paths, relegating sensitive differential signals to inner positions; this topology reduces trace crossings but occupies additional board real estate compared to shrouded variants with built-in ground planes.
What solder joint reliability factors apply to the HMTSW-132-11-G-D-325 when subjected to thermal cycling and mechanical vibration in industrial environments?
The HMTSW-132-11-G-D-325 termination pins exhibit 0.505" (12.83mm) post length with square cross-section, creating solder fillet geometry prone to crack initiation under thermal cycling (-55°C to 125°C). Cycling stress concentrates at the inner pad corner due to CTE mismatch between phosphor bronze posts (12 ppm/K), LCP insulation (30–40 ppm/K), and FR-4 substrate (16–18 ppm/K). Mechanical vibration (5–500 Hz, 2–5g acceleration) amplifies fatigue by inducing repetitive shear strain; life expectancy drops 40–60% in high-vibration environments. Solder pad design should use teardrop traces and mechanical anchors; underfill or potting improves fatigue life by 2–3× for mission-critical boards.
How does the HMTSW-132-11-G-D-325's 0.100" row spacing compare to alternatives when designing compact stacked connectors or daisy-chained board configurations?
The HMTSW-132-11-G-D-325 provides 0.100" (2.54mm) row-to-row spacing with mating contact length of 0.325", resulting in a mated stack height of approximately 0.55–0.65" (14–16.5mm) when paired with a matching socket. Daisy-chained configurations (connector-to-board-to-connector) require clearance for cable routing between stages; minimum 0.75" vertical spacing becomes necessary to prevent cable pinch-off. Higher-density 0.050" pitch alternatives reduce mated stack height to 0.35–0.40", saving 0.2" per stage; application constraints around PCB layer count, signal timing, and mechanical assembly footprint determine whether the HMTSW-132-11-G-D-325's looser spacing justifies simplified layout or whether compact density takes priority.
What moisture ingress and long-term storage considerations apply to the HMTSW-132-11-G-D-325 given its Liquid Crystal Polymer insulation and Not Applicable MSL rating?
The HMTSW-132-11-G-D-325 employs liquid crystal polymer (LCP) insulation rated UL94 V-0, which exhibits low moisture absorption (< 0.05% by weight at 23°C/50% RH) compared to standard polyimide or phenolic materials. Unshrouded geometry and solder-joint exposure mean that environmental moisture primarily accumulates at PCB surfaces rather than within connector cavities. The Not Applicable MSL classification indicates the HMTSW-132-11-G-D-325 does not require bake-out prior to reflow soldering; however, condensation during thermal shock (-55°C to +125°C transitions) can form temporary water films on exposed trace surfaces, degrading insulation resistance to 1–10 MΩ until evaporated. Boards intended for high-humidity storage (> 85% RH, extended periods) should apply conformal coating over header regions to maintain insulation resistance above 100 MΩ.
How should the HMTSW-132-11-G-D-325 be specified and verified when designing for compliance with RoHS3 and REACH regulations across different geographic markets?
The HMTSW-132-11-G-D-325 is marked RoHS3 compliant, indicating phosphor bronze contacts, gold finish, and LCP insulation meet EU Directive 2011/65/EU restrictions on lead, cadmium, mercury, hexavalent chromium, and brominated flame retardants. REACH Annex XIV (authorization list) and SVHC candidate list compliance depends on supplier-provided declarations; phosphor bronze alloys may contain tin (exempt) or trace additives requiring vendor documentation. When designing for automotive (IATF 16949) or medical (ISO 13485) supply chains, obtain Material Declaration Forms (MDFs) and test reports confirming absence of restricted substances; RoHS3 marking alone does not guarantee REACH registration or geographic market eligibility in China (RoHS), Japan (JIS C 0950), or India (E-Waste Rules).
What are the practical design tradeoffs between through-hole mounting of the HMTSW-132-11-G-D-325 and surface-mount alternatives when optimizing PCB assembly cost and signal integrity?
The HMTSW-132-11-G-D-325 through-hole mounting requires plated via drilling (0.040"–0.050" typical) and solder wave or selective reflow processing, adding 15–25% to assembly labor versus surface-mount headers. Through-hole termination provides superior mechanical robustness and reworkability; solder joint pull-strength exceeds 200 lbf compared to 50–80 lbf for 0.050" pitch SMD alternatives. However, plated vias create multiple layer connections that increase parasitic inductance (0.3–0.5 nH per via pair); high-speed applications (> 500 MHz) benefit from surface-mount headers with reduced via stubs. Cost crossover typically occurs at production volumes > 50k units/year when SMD assembly tooling justifies lower per-unit processing; lower-volume designs favor the HMTSW-132-11-G-D-325 despite higher assembly touch labor.
Can the HMTSW-132-11-G-D-325 be reliably used in applications requiring push-pull mating/unmating cycles at outdoor temperatures (-55°C to +125°C) without degrading mechanical retention?
The HMTSW-132-11-G-D-325 incorporates push-pull fastening with LCP shroud and phosphor bronze springs designed to maintain contact normal force (50–80 grams-force per contact) across full temperature range. LCP dimensional stability remains within ±0.5% across -55°C to +125°C, but phosphor bronze spring rate decreases ~0.15% per °C at elevated temperature; contact retention force drops approximately 12% when transitioning from +25°C ambient to +125°C operating condition. At -55°C, contact retention increases 12%, but manual disconnect force may exceed operator capability (typically < 5 lbf threshold). Designs requiring frequent outdoor mating should test connector retention force at application temperature extremes, particularly if user-disconnection is expected during field operation; locking variants or keyed housings eliminate accidental separation risk.
What signal routing and impedance-controlled trace design guidelines apply to the HMTSW-132-11-G-D-325 when routing high-speed differential pairs through mixed-signal or RF applications?
The HMTSW-132-11-G-D-325's square contact geometry and 0.100" pitch support differential pair routing with 0.1–0.15" trace separation, yielding differential impedance of 80–100 Ω in standard 1-oz copper/FR-4 stackups. Unshrouded header design introduces ground plane discontinuities; routing differential pairs through outer rows (near connector housing) improves return-path closure and reduces emission by 8–12 dB compared to inner-position routing. For applications > 1 GHz, implement guard traces (grounded copper) on adjacent unused positions to suppress crosstalk into neighboring signal pairs; simulation-based impedance extraction using actual via models reduces insertion loss prediction error by 25–40% versus rule-of-thumb calculations. Connector lead length (0.325" mating + 0.505" post) introduces approximately 0.8–1.2 nH series inductance per differential pair; this stub inductance limits rise-time performance and may require capacitive de-embedding on receiver input stages.
How does the gold plating thickness specification (10.0µin mating surface, 3.0µin post) of the HMTSW-132-11-G-D-325 affect long-term corrosion resistance and contact reliability in harsh marine or chemical environments?
The HMTSW-132-11-G-D-325 specifies 10.0µin (0.25µm) gold on mating surfaces and 3.0µin (0.076µm) on solder posts. Mating-surface plating thickness exceeds ASTM B488 Class 1C minimum (3µin), providing 3–5 year corrosion protection in salt-fog (ASTM B117) exposure without protective conformal coating. Solder-post plating (3.0µin) is minimal; copper substrate exposure at solder voids or damaged areas initiates rapid galvanic corrosion in marine or chemical-plant atmospheres within 6–12 months. For harsh environments, specify conformal acrylic or silicone coating (1.5–2.5 mil thickness) over all exposed connector metallization; alternative materials include nickel underplate (1.0–2.0µin) beneath gold to extend corrosion life beyond 10 years. Applications in coastal, offshore, or chemically aggressive locations should budget for periodic inspection and connector replacement cycles; uncoated HMTSW-132-11-G-D-325 headers are unsuitable for > 2 year mission durations without environmental protection or redundancy.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HMTSW-132-11-G-D-325

Product Attribute HMTSW-132-11-G-D-320 HMTSW-132-11-G-D-315 HMTSW-132-11-G-D-415 HMTSW-132-11-G-D-455
Part Number HMTSW-132-11-G-D-320 HMTSW-132-11-G-D-315 HMTSW-132-11-G-D-415 HMTSW-132-11-G-D-455
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Connector Type - - - -
Material Flammability Rating - - - -
Contact Material - - - -
Number of Rows - - - -
Applications - - - -
Overall Contact Length - - - -
Number of Positions Loaded - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current Rating (Amps) - - - -
Fastening Type - - - -
Mated Stacking Heights - - - -
Contact Type - - - -
Row Spacing - Mating - - - -
Number of Positions - - - -
Contact Finish Thickness - Mating - - - -
Contact Shape - - - -
Contact Finish - Mating - - - -
Insulation Color - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Ingress Protection - - - -
Pitch - Mating - - - -
Contact Length - Mating - - - -
Termination - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage Rating - - - -
Contact Length - Post - - - -
Style - - - -
Insulation Material - - - -
Series - - - -
Features - - - Simultaneous Sampling
Contact Finish Thickness - Post - - - -
Contact Finish - Post - - - -
Insulation Height - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Shrouding - - - -

HMTSW-132-11-G-D-325 Datasheet PDF

Download HMTSW-132-11-G-D-325 pdf datasheets and Samtec Inc. documentation for HMTSW-132-11-G-D-325 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

HMTSW-132-11-G-D-325

Samtec Inc.
98D-HMTSW-132-11-G-D-325

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