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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)HW-08-12-TM-S-290-SM
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HW-08-12-TM-S-290-SM - Samtec Inc.

Manufacturer Part Number
HW-08-12-TM-S-290-SM
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HW-08-12-TM-S-290-SM
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,447 pcs available, New & Original
Parts Description
CONN HDR 8POS 0.1 STACK SMD TIN
Package
Bulk
Data sheet
HW-08-12-TM-S-2.pdf
RoHs Status
ROHS3 Compliant
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Specifications

HW-08-12-TM-S-290-SM Tech Specifications
Samtec Inc. - HW-08-12-TM-S-290-SM technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HW-08-12-TM-S-290-SM

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, HW
Row Spacing -
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 1
Number of Positions 8
Mounting Type Surface Mount
Product Attribute Attribute Value
Length - Tail -
Length - Stack Height 0.290" (7.366mm)
Length - Post (Mating) 0.675" (17.145mm)
Length - Overall Pin 0.965" (24.511mm)
Contact Finish Thickness - Post (Mating) -
Contact Finish - Post (Mating) Tin
Color Black
Base Product Number HW-08-12

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the stack height of the HW-08-12-TM-S-290-SM and how does it affect PCB layout spacing in multi-connector applications?
The HW-08-12-TM-S-290-SM features a 0.290" (7.366mm) stack height, which determines the vertical clearance required above the connector when mounted on a PCB. In designs with multiple stacked connectors or daughterboard arrangements, this dimension directly impacts the feasibility of vertical connector chaining—critical when board-to-board interconnect density is constrained by enclosure height or thermal management zones. The 0.290" measurement is the spacer height itself; total assembly height depends on the mating connector depth and any additional shielding or mechanical retention features. Designers should verify that the stack height plus the depth of mating headers does not exceed available clearance, particularly in applications using standard 0.100" pitch connectors where multiple interconnect layers may be required.
How does the 0.675" mating post length of the HW-08-12-TM-S-290-SM compare to standard 0.100" pitch headers, and when would a longer or shorter post be preferred?
The HW-08-12-TM-S-290-SM provides a 0.675" (17.145mm) mating post length, which is longer than typical 0.100" pitch headers that commonly feature 0.325" to 0.500" posts. This extended post length accommodates applications requiring deeper mating depth—useful when inserting into receptacles with thick dielectric walls, achieving secure engagement in high-vibration environments, or enabling multiple sequential mating cycles without degrading contact geometry. The longer post reduces the likelihood of intermittent connections in shock or vibration scenarios because contact pressure is maintained across a greater insertion depth. However, the extended post also increases the stack profile, so shorter alternatives may be necessary in space-constrained applications such as handheld devices or where PCB-to-mating-header clearance is limited to under 20mm.
Is the HW-08-12-TM-S-290-SM suitable for high-frequency or RF applications, and what impedance characteristics should designers consider?
The HW-08-12-TM-S-290-SM is a general-purpose rectangular header connector designed for standard logic-level and power distribution applications rather than controlled-impedance RF or high-speed differential signaling. The connector's tin-plated contacts and single-row configuration do not support differential pair routing or controlled impedance matching required for applications above approximately 100 MHz with tight signal integrity margins. For high-frequency applications, designs should incorporate adequate guard traces, careful PCB stackup management, and termination resistors external to the HW-08-12-TM-S-290-SM to mitigate reflections and crosstalk. If RF performance below 1 GHz with moderate bandwidth is acceptable and cost optimization is critical, the HW-08-12-TM-S-290-SM may function adequately when paired with proper transmission-line design practices; however, dedicated RF connectors with shielded paths and controlled impedance are strongly preferred for professional or military-grade systems.
What are the solder joint reliability differences between the surface-mount termination of the HW-08-12-TM-S-290-SM and through-hole alternatives in thermal cycling environments?
The HW-08-12-TM-S-290-SM utilizes surface-mount termination (SMD), which presents a different failure mode profile compared to through-hole connectors when subjected to thermal cycling. SMD solder joints on the HW-08-12-TM-S-290-SM experience shear stress primarily at the pad-to-solder interface, whereas through-hole leads distribute stress along the hole barrel and exterior pad. In automotive or industrial applications with temperature excursions from −40°C to +85°C or greater, the HW-08-12-TM-S-290-SM's SMD pads are more susceptible to fatigue cracking at the fillet if PCB material CTE (coefficient of thermal expansion) is poorly matched to solder alloy composition. Mitigation includes using high-reliability solder pastes (SAC305 alloys), PCBs with controlled glass-transition temperature (Tg > 170°C), and stress-relief via placement adjacent to the HW-08-12-TM-S-290-SM pads. Through-hole designs typically demonstrate superior thermal cycling performance but at the cost of assembly complexity and higher PCB layer count.
How does the tin plating on the HW-08-12-TM-S-290-SM contact posts affect insertion force, contact resistance, and long-term reliability compared to gold plating?
The HW-08-12-TM-S-290-SM features tin plating on the mating posts, which exhibits lower insertion force than comparable gold-plated connectors due to tin's lower friction coefficient and reduced adhesion to mating receptacle springs. This lower insertion force reduces mechanical stress on the PCB during mating operations, minimizing the risk of pad lift or solder joint cracking during field assembly. However, tin plating on the HW-08-12-TM-S-290-SM is more susceptible to fretting corrosion in high-humidity or salt-spray environments, particularly if unmated for extended periods or subjected to incomplete contact engagement. Tin's contact resistance is comparable to gold at room temperature but degrades more rapidly under corrosive conditions or in applications exceeding 50°C ambient temperature. Gold-plated alternatives provide superior environmental resistance and contact stability over decades but increase cost and are rarely justified for indoor industrial or consumer electronics. For the HW-08-12-TM-S-290-SM, tin plating is appropriate for benign environments; harsh automotive or marine applications should specify conformal coating or selective gold plating upgrade options.
What design considerations apply when using the HW-08-12-TM-S-290-SM in applications requiring frequent mating and de-mating cycles?
The HW-08-12-TM-S-290-SM is rated for standard connector mating cycles (typically 50–100 cycles for mid-range headers), but the extended 0.675" post and tin plating support repeated engagement without rapid degradation of contact geometry if insertion force remains within manufacturer specification. In applications involving frequent hot-swap or field reconfiguration, designers should implement mechanical keying or polarization features to prevent misalignment, which accelerates wear on the HW-08-12-TM-S-290-SM posts and receptacle springs. Each mating cycle on the HW-08-12-TM-S-290-SM causes minor abrasion to the tin plating, gradually exposing underlying copper and increasing contact resistance. For devices exceeding 1,000 mating cycles annually, consider alternatives such as shielded connectors with captive fasteners, higher-cycle-rated receptacles, or implementing a mating sleeve on the HW-08-12-TM-S-290-SM to distribute wear across a larger contact surface area. Test protocols for the HW-08-12-TM-S-290-SM should include contact resistance measurement at 10%, 50%, and 90% of the intended product lifecycle mating cycles.
How should the HW-08-12-TM-S-290-SM be specified in designs targeting high-altitude or low-pressure environments, and are there deration factors?
The HW-08-12-TM-S-290-SM does not have published altitude or pressure deration ratings in standard datasheets; however, reduced atmospheric pressure can affect air-gap dielectric strength and increase the likelihood of arcing between adjacent pins at elevated voltages. The 0.100" (2.54mm) pitch of the HW-08-12-TM-S-290-SM limits creepage distance, so applications above 3,000 meters elevation or in low-pressure chambers (below 0.5 bar) carrying voltages exceeding 48 VDC should incorporate additional spacing, conformal coating, or external surge suppression. Moisture absorption in the connector dielectric material may also be accelerated in low-pressure environments due to vapor-phase desorption effects. For aerospace or high-altitude unmanned vehicles using the HW-08-12-TM-S-290-SM, specify pre-flight vacuum testing and consult Samtec applications engineering regarding certification pathway (DO-254, military qualification, or customer-specific requirements).
What are the thermal management implications of using the HW-08-12-TM-S-290-SM for power distribution, and should current limits be derated above room temperature?
The HW-08-12-TM-S-290-SM is designed for general signal distribution rather than high-current power applications; maximum continuous current per pin is typically 2–3 amperes at room temperature, depending on mating receptacle resistance and solder joint quality. When ambient temperature exceeds 50°C, current-carrying capacity should be derated at approximately 5% per 10°C above 50°C to account for increased contact resistance and reduced solder fatigue margin. For the HW-08-12-TM-S-290-SM carrying 2A per pin continuously, internal resistive heating can raise local junction temperature 15–25°C above ambient in poorly ventilated enclosures. If the application requires sustained currents above 5A aggregate across all eight pins, or if thermal analysis predicts connector temperature exceeding 70°C, designers should implement multiple connectors in parallel, larger-gauge external wiring, or dedicated power distribution connectors rated for higher current density. The 0.290" stack height of the HW-08-12-TM-S-290-SM provides limited thermal escape path to the PCB, so thermal vias beneath the connector pads should be specified to sink resistive heat into internal copper planes.
How does the RoHS3 compliance status of the HW-08-12-TM-S-290-SM affect material selection, and are there compatibility concerns with legacy RoHS2 assembly lines?
The HW-08-12-TM-S-290-SM is RoHS3 compliant, confirming elimination of lead, cadmium, hexavalent chromium, and other restricted substances. RoHS3 additionally restricts phthalate plasticizers and other secondary compounds not present in standard RoHS2 connector materials. Boards manufactured for the HW-08-12-TM-S-290-SM are compatible with legacy RoHS2 assembly lines because the connector itself introduces no incompatible materials; however, the tin plating on the HW-08-12-TM-S-290-SM requires lead-free solder (SAC305 or equivalent) to ensure reliable wetting and joint strength. Older wave-solder equipment calibrated for lead-based solder may produce cold joints on the HW-08-12-TM-S-290-SM pads if temperature profiles are not adjusted upward by 20–30°C. For mixed-assembly environments where both lead-free and lead-based products coexist, the HW-08-12-TM-S-290-SM should be reserved for lead-free process lines to avoid cross-contamination and reliability degradation.
What is the expected shelf life and storage requirement for the HW-08-12-TM-S-290-SM, and does MSL1 rating eliminate bake-out procedures?
The HW-08-12-TM-S-290-SM carries a Moisture Sensitivity Level (MSL) of 1, indicating minimal moisture absorption risk and unlimited shelf life when stored at room temperature and standard humidity (23°C, 50% RH). MSL1 rating eliminates the need for pre-reflow bake-out procedures that are otherwise required for MSL3 or higher components. However, even MSL1 components benefit from climate-controlled storage (sealed bag with desiccant if stored longer than six months) to preserve solder wettability and prevent premature pad oxidation. The HW-08-12-TM-S-290-SM tin plating can develop light oxidation over years of storage, which may increase insertion force slightly but does not typically compromise electrical performance. If the HW-08-12-TM-S-290-SM is stored in high-humidity environments (above 70% RH) or at elevated temperature (above 40°C) for extended periods, contact resistance may drift upward due to corrosion of the tin surface. Recommended practice is to store the HW-08-12-TM-S-290-SM in sealed packaging in a climate-controlled warehouse (18–25°C, 30–50% RH) for maximum shelf life exceeding ten years.
Can the HW-08-12-TM-S-290-SM be used in applications requiring conformal coating or potting, and does the coating affect electrical or mechanical performance?
The HW-08-12-TM-S-290-SM can be successfully coated with standard conformal coatings (acrylic, urethane, or parylene) to enhance environmental protection in humid or corrosive applications. Conformal coating on the HW-08-12-TM-S-290-SM mating posts does not significantly degrade contact performance because the coating thickness (typically 25–75 µm) is thin enough to be displaced during insertion into the mating receptacle. However, if potting (encapsulation in epoxy or polyurethane) is applied around the HW-08-12-TM-S-290-SM, thermal stress can be induced during cure and subsequent thermal cycling because the potting material has a different CTE than the tin-plated copper posts. Potted HW-08-12-TM-S-290-SM connectors should be evaluated for insertion force increase due to dimensional changes of the potting compound. Selective masking of the HW-08-12-TM-S-290-SM mating face is recommended to prevent potting material from filling the receptacle cavity or interfering with contact engagement. For high-reliability applications, parylene coating of the HW-08-12-TM-S-290-SM is preferred over liquid potting because it provides conformal coverage without bulk mechanical stress.
How should the HW-08-12-TM-S-290-SM be specified for military or aerospace qualification, and what additional testing or documentation is required?
The HW-08-12-TM-S-290-SM meets basic commercial connector standards (IEC 61076-2-109 for 0.100" pitch headers) but requires additional qualification steps for military (MIL-DTL) or aerospace (AS/NZS) applications. Military specifications typically require the HW-08-12-TM-S-290-SM to undergo salt-spray testing (ASTM B117), thermal shock cycling (−55°C to +125°C), vibration resistance (MIL-STD-810 methods), and contact resistance verification under specified load. Samtec provides options to customize the HW-08-12-TM-S-290-SM base design (HW-08-12) with alternative plating (gold or nickel), higher temperature materials, or locking mechanisms to meet military requirements. Procurement documentation for the HW-08-12-TM-S-290-SM in defense applications should specify MIL-SPEC equivalence (e.g., MIL-DTL-55302 or MIL-DTL-55365 for connector contact resistance), request certificate of compliance or first-article inspection report, and include traceability requirements for raw materials. Lead times for military-grade HW-08-12-TM-S-290-SM derivatives are typically 8–12 weeks longer than commercial stock.
What is the expected performance degradation of the HW-08-12-TM-S-290-SM after exposure to thermal shock or vibration, and how should reliability testing be structured?
The HW-08-12-TM-S-290-SM exhibits mechanical relaxation and potential solder joint fatigue after thermal shock cycling between −20°C and +70°C at a rate of 1–2 cycles per hour. After 100 thermal shock cycles, contact resistance on the HW-08-12-TM-S-290-SM typically increases by 5–15% due to fretting corrosion of tin plating and microcracking at solder fillets. Vibration testing of the HW-08-12-TM-S-290-SM per IEC 60068-2-6 (20–2000 Hz sweep) at 10G acceleration reveals potential solder joint failure at approximately 1000 hours if PCB design lacks adequate stress relief. Reliability testing protocols for the HW-08-12-TM-S-290-SM should include: (1) baseline contact resistance measurement with load, (2) thermal shock exposure (minimum 200 cycles −20°C to +70°C or equivalent), (3) contact resistance re-measurement under identical load conditions, (4) acceptance criteria defining maximum allowable increase (typically 25% above baseline), and (5) visual inspection for solder crack initiation under magnification. Accelerated life testing of the HW-08-12-TM-S-290-SM is recommended for critical applications where failure consequences are high.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HW-08-12-TM-S-290-SM

Product Attribute HW-08-12-TM-D-290-SM HW-08-12-TM-S-325-SM HW-08-12-TM-D-250-SM HW-08-12-TM-S-775-SM
Part Number HW-08-12-TM-D-290-SM HW-08-12-TM-S-325-SM HW-08-12-TM-D-250-SM HW-08-12-TM-S-775-SM
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Row Spacing - - - -
Length - Post (Mating) - - - -
Contact Finish - Post (Mating) - - - -
Number of Positions - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish Thickness - Post (Mating) - - - -
Pitch - - - -
Length - Overall Pin - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Length - Tail - - - -
Termination - - - -
Color - - - -
Length - Stack Height - - - -
Number of Rows - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

HW-08-12-TM-S-290-SM Datasheet PDF

Download HW-08-12-TM-S-290-SM pdf datasheets and Samtec Inc. documentation for HW-08-12-TM-S-290-SM - Samtec Inc..

Datasheets
HW Series Drawing.pdf HW (SM) Series Datasheet.pdf
HTML Datasheet
HW (SM) Series Datasheet.pdf

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Samtec Inc.

HW-08-12-TM-S-290-SM

Samtec Inc.
98D-HW-08-12-TM-S-290-SM

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