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HomeProductsConnectors, InterconnectsRectangular Connectors - Board Spacers, Stackers (Board to Board)HW-19-09-F-S-460-SM
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HW-19-09-F-S-460-SM - Samtec Inc.

Manufacturer Part Number
HW-19-09-F-S-460-SM
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-HW-19-09-F-S-460-SM
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
30,355 pcs available, New & Original
Parts Description
CONN HDR 19POS 0.1 STACK SMD
Package
Bulk
Data sheet
HW-19-09-F-S-46.pdf
RoHs Status
ROHS3 Compliant
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In stock: 30355

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Specifications

HW-19-09-F-S-460-SM Tech Specifications
Samtec Inc. - HW-19-09-F-S-460-SM technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - HW-19-09-F-S-460-SM

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Termination Solder
Series Flex Stack, HW
Row Spacing -
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 1
Number of Positions 19
Mounting Type Surface Mount
Product Attribute Attribute Value
Length - Tail -
Length - Stack Height 0.460" (11.684mm)
Length - Post (Mating) 0.205" (5.207mm)
Length - Overall Pin 0.665" (16.891mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number HW-19-09

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating post length on the HW-19-09-F-S-460-SM, and how does this affect PCB stackup design?
The HW-19-09-F-S-460-SM features a mating post length of 0.205" (5.207mm), which defines the depth of engagement when a mating connector is inserted. This dimension is critical for stackup calculations because it determines the functional mating depth before the connector body makes contact with the PCB surface. During design-in, engineers must account for this post length when calculating the total height budget for stacked connector assemblies, especially in applications with height constraints or multi-layer daughterboard configurations. The post length also influences the force required for insertion and extraction, affecting mechanical reliability in frequent mate/unmate cycling scenarios.
How does the 0.460" stack height of the HW-19-09-F-S-460-SM compare to standard surface mount headers when planning vertical connector stacking?
The HW-19-09-F-S-460-SM is engineered as part of the Flex Stack series with a total stack height of 0.460" (11.684mm), which is significantly taller than conventional single-row surface mount headers (typically 0.200" to 0.300"). This elevated stack height is intentional for applications requiring vertical interconnect density—allowing multiple connector layers to be mounted in series without intermediate PCB material. When comparing the HW-19-09-F-S-460-SM to standard headers, the trade-off is clear: taller overall profile enables connector chaining but reduces available Z-axis clearance in compact enclosures. Applications such as modular test fixtures or reconfigurable harness systems benefit from this geometry, whereas space-constrained designs may require alternative low-profile connectors.
Why is the gold plating thickness on the HW-19-09-F-S-460-SM specified at 3.00µin, and what contact resistance implications does this create?
The HW-19-09-F-S-460-SM posts are plated with 3.00µin (0.076µm) of gold, which provides sufficient corrosion protection while minimizing cost relative to thicker plating strategies. This thickness is appropriate for general industrial and automotive environments but sits at the lower boundary for high-reliability applications. In mating cycles, the thin gold layer can wear through to the nickel underplating, particularly under sliding contact stress. For high-frequency or precision analog signal applications where contact resistance stability is critical, engineers should perform insertion-cycle testing or specify mechanical contact refresh methods. The 3.00µin specification assumes controlled-humidity storage (MSL 1 rating) and moderate contact forces typical of 0.1" pitch connectors.
How does the 19-position, single-row configuration of the HW-19-09-F-S-460-SM influence signal integrity in high-speed digital applications?
The HW-19-09-F-S-460-SM's 19-position single-row layout at 0.100" (2.54mm) pitch creates tight lateral coupling between adjacent pins, increasing capacitive crosstalk and ground return path complexity. In applications exceeding 100 MHz data rates, the single-row geometry limits ground pin placement flexibility—designers cannot easily intersperse signal and ground pins for optimal impedance control. High-speed protocols (USB, PCIe, DDR) typically require controlled impedance stubs and ground return paths incompatible with this connector's physical constraints. The HW-19-09-F-S-460-SM is better suited for power distribution, low-frequency analog, or moderate-speed legacy interfaces where crosstalk margins are relaxed. If high-speed signals must traverse the HW-19-09-F-S-460-SM, transmission line simulation and controlled PCB routing (short traces, dedicated ground planes) become mandatory design requirements.
What assembly and reliability considerations apply when soldering the HW-19-09-F-S-460-SM to a production PCB?
The HW-19-09-F-S-460-SM uses solder termination on 19 individual pins across a single row, requiring careful solder paste stencil design and reflow profile management. The connector's substantial height (0.460") relative to typical 0603 or 0402 passive components creates a thermal mass gradient during reflow, potentially leading to solder joint voids or incomplete wetting on interior pins if thermal profiling is inadequate. MSL 1 rating (unlimited moisture sensitivity) eliminates bake-out requirements but does not eliminate risk from thermal shock during rework. Mechanical stress on solder joints increases proportionally with the HW-19-09-F-S-460-SM's lever arm—vibration or deflection loads impart bending moments on the joint. Recommendations include: (1) thermal profiling validation, (2) X-ray inspection of solder fillet quality on pins 8–11 (center region, highest thermal lag), (3) conformal coating consideration if the assembly encounters thermal cycling or vibration environments.
Can the HW-19-09-F-S-460-SM be used in applications requiring frequent connector mating cycles, and what wear mechanisms should be monitored?
The HW-19-09-F-S-460-SM is designed for interconnect applications but lacks explicit mechanical life rating in standard datasheets, typically limiting real-world expectation to 50–100 mate/unmate cycles depending on insertion force and contact material durability. The thin gold plating (3.00µin) accelerates wear because each insertion cycle causes micro-abrasion that can penetrate to the nickel layer within 20–50 cycles under adverse contact pressure. Monitoring contact resistance across repeated mating events is essential; resistance rise above 50 mΩ (for typical power applications) or 100 mΩ (for signal applications) signals imminent failure. The HW-19-09-F-S-460-SM is well-suited for fixed-installation or low-cycle test fixture applications but unsuitable for plug-and-play end-user replaceable modules. If frequent mating is required, specify higher gold-plating thickness (10–15µin minimum) or select connector series with documented mechanical life ratings.
How should the HW-19-09-F-S-460-SM be integrated into a modular PCB stack design, and what are the electrical boundary conditions?
The HW-19-09-F-S-460-SM is architected for the Flex Stack ecosystem, enabling daisy-chaining of multiple PCB layers via vertically aligned connectors. When designing a stack with the HW-19-09-F-S-460-SM, each PCB layer requires mirror-image connector placement to maintain alignment through the stack depth. The 0.665" overall pin length allows sufficient material clearance for PCB thickness (typically 1.6mm) plus solder fillet volume, though tight tolerances demand precision drilling and plating. Electrical boundaries are defined by layer-to-layer signal routing: differential pairs, clock signals, and power distribution must maintain consistent trace impedance across connector transitions. The single-row geometry of the HW-19-09-F-S-460-SM necessitates external signal multiplexing on dense stacks; bandwidth-limited applications (serial buses, low-speed I2C) are better candidates than parallel data buses requiring many signal pins.
What environmental and storage conditions preserve the reliability of the HW-19-09-F-S-460-SM before soldering?
The HW-19-09-F-S-460-SM carries MSL 1 (unlimited) moisture sensitivity, meaning it can be stored indefinitely without moisture absorption risk—a significant advantage over MSL 3–4 connectors requiring bake-out cycles. Storage temperatures between 16–35°C and relative humidity 45–75% represent best practice; condensation or high-humidity environments (>85% RH) should be avoided even with MSL 1 rating because moisture can still deposit on gold contacts, potentially increasing contact resistance. The HW-19-09-F-S-460-SM's gold plating resists tarnish but can develop oxide film under prolonged exposure to hydrogen sulfide or sulfur compounds in industrial air. When stored in original sealed packaging with desiccant, the HW-19-09-F-S-460-SM remains stable for 2+ years. Upon removal from packaging, use the connector within 8 hours if ambient humidity exceeds 70%, or store in nitrogen or dry-air cabinets for production batches.
How does the HW-19-09-F-S-460-SM compare to alternatives when current-carrying capacity per pin is a design constraint?
The HW-19-09-F-S-460-SM uses 0.100" pitch gold-plated posts typical of general-purpose headers, with per-pin current capacity around 3–5A under continuous operation (depending on ambient temperature and PCB cooling). Comparison contexts: (1) vs. high-current alternatives (TE Connectivity, Phoenix Contact power connectors at 0.2" pitch or larger) offering 10–50A per pin—the HW-19-09-F-S-460-SM is unsuitable for primary power rails in high-power applications, (2) vs. fine-pitch connectors (0.050" pitch alternatives) offering reduced per-pin capacity but higher density, (3) vs. circular connectors (D-sub, M12) offering robust environmental sealing but bulkier profiles. If the HW-19-09-F-S-460-SM is selected for power distribution, parallel multiple pins to the same net to achieve aggregate current budgets. Thermal modeling should account for I²R losses in thin gold contacts; derating current by 10–20% below published maximums is conservative practice.
What RoHS3 compliance implications does the HW-19-09-F-S-460-SM carry for aerospace and automotive supply chains?
The HW-19-09-F-S-460-SM is RoHS3 compliant, confirming absence of lead, cadmium, hexavalent chromium, and restricted brominated flame retardants per EU Directive 2011/65/EU. This compliance status is essential for European OEMs and defense contractors operating under ITAR or EAR regulations; the HW-19-09-F-S-460-SM carries ECCN EAR99 classification (general-purpose electronics, no export restrictions to most countries). RoHS3 compliance does not guarantee suitability for aerospace applications under AS9100 or IPC-A-610 standards; additional requirements such as traceability documentation, incoming inspection protocols, and counterfeit-prevention measures apply separately. Automotive suppliers using the HW-19-09-F-S-460-SM must verify material compatibility with automotive thermal cycling profiles (typically −40°C to +125°C continuous) and confirm that solder joint reliability has been validated under AEC-Q200 or equivalent standards. The HTSUS code 8536.69.4040 applies for U.S. tariff classification; procurement teams should verify tariff obligations for jurisdictions outside standard trade agreements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. HW-19-09-F-S-460-SM

Product Attribute HW-19-09-F-S-420-SM HW-19-09-F-S-465-SM HW-19-09-F-S-480-SM HW-19-09-F-S-430-SM
Part Number HW-19-09-F-S-420-SM HW-19-09-F-S-465-SM HW-19-09-F-S-480-SM HW-19-09-F-S-430-SM
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Series - - - -
Contact Finish Thickness - Post (Mating) - - - -
Length - Overall Pin - - - -
Length - Post (Mating) - - - -
Pitch - - - -
Color - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination - - - -
Contact Finish - Post (Mating) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Length - Tail - - - -
Row Spacing - - - -
Number of Rows - - - -
Length - Stack Height - - - -

HW-19-09-F-S-460-SM Datasheet PDF

Download HW-19-09-F-S-460-SM pdf datasheets and Samtec Inc. documentation for HW-19-09-F-S-460-SM - Samtec Inc..

Datasheets
HW Series Drawing.pdf HW (SM) Series Datasheet.pdf
HTML Datasheet
HW (SM) Series Datasheet.pdf

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Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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Samtec Inc.

HW-19-09-F-S-460-SM

Samtec Inc.
98D-HW-19-09-F-S-460-SM

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