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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Receptacles, Female SocketsMMS-113-02-S-DH
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MMS-113-02-S-DH - Samtec Inc.

Manufacturer Part Number
MMS-113-02-S-DH
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MMS-113-02-S-DH
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,795 pcs available, New & Original
Parts Description
CONN RCPT 26P 0.079 GOLD SMD R/A
Package
Tube
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 44795
  • Unit Price: $13.77
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Specifications

MMS-113-02-S-DH Tech Specifications
Samtec Inc. - MMS-113-02-S-DH technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MMS-113-02-S-DH

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Series MMS
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Package Tube
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 26
Mounting Type Surface Mount, Right Angle
Material Flammability Rating -
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.157" (4.00mm)
Product Attribute Attribute Value
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3.9A per Contact
Contact Type Female Socket
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Receptacle
Base Product Number MMS-113
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the MMS-113-02-S-DH and standard 0.1" pitch board-to-board connectors for high-density applications?
The MMS-113-02-S-DH operates at 0.079" (2.00mm) pitch compared to the common 0.1" standard, enabling approximately 36% higher pin density in the same footprint space. This finer pitch allows designers to route more signal and power paths on space-constrained PCBs, making the MMS-113-02-S-DH particularly suited for applications where board real estate is limited. The 26-position, 2-row configuration with 0.079" row spacing maintains consistent contact registration while supporting the compact mating geometry. For applications requiring density without sacrificing contact reliability, the MMS-113-02-S-DH presents a practical step up from 0.1" alternatives, though it requires more precise PCB layout and assembly control.
How does the gold plating specification on the MMS-113-02-S-DH mating contacts affect reliability in corrosive or humid environments?
The MMS-113-02-S-DH features 30.0µin (0.76µm) gold on the mating contacts, a thickness that balances corrosion resistance with cost efficiency. This gold layer protects the underlying phosphor bronze from oxidation and provides low contact resistance during mating cycles. In humid or salt-spray environments, the gold finish on the MMS-113-02-S-DH helps maintain stable contact resistance over extended service intervals. However, this thickness is moderate compared to thicker gold platings (≥50µin) used in high-reliability aerospace applications. For indoor industrial or commercial environments with standard humidity levels, the MMS-113-02-S-DH's gold specification is adequate. In marine or chemical processing environments, designers should verify that the 30.0µin finish, combined with the LCP insulation material's moisture resistance (MSL 1), meets long-term reliability targets through environmental stress testing or supplier datasheets.
Can the MMS-113-02-S-DH be used interchangeably with other Samtec MMS series connectors, and what design considerations apply?
The MMS-113-02-S-DH is part of the MMS series and shares the same 0.079" (2.00mm) pitch, mating geometry, and push-pull fastening mechanism with other MMS-series variants. Interchangeability depends on matching the specific contact configuration and loading pattern. The MMS-113-02-S-DH is a 26-position receptacle with all positions loaded, so it mates only with corresponding 26-pin MMS plugs or compatible board-to-board headers. When designing modular systems, verify that pin assignments, signal routing, and current distribution align across all interconnected MMS-113-02-S-DH assemblies. The surface-mount right-angle form factor of the MMS-113-02-S-DH differs from vertical or cable-mount variants, so mechanical clearance and PCB layout must be validated before substituting alternative MMS configurations.
What is the practical current-carrying capacity when multiple MMS-113-02-S-DH connectors are paralleled on a single power rail?
Each individual contact on the MMS-113-02-S-DH is rated for 3.9A, meaning a fully loaded 26-position receptacle can theoretically carry 101.4A if every contact were dedicated to a single power rail. In practice, the MMS-113-02-S-DH typically carries mixed signal and power traffic, so not all contacts deliver current simultaneously. If power distribution requires higher density, designers often dedicate multiple contact positions to parallel power paths within a single MMS-113-02-S-DH connector, reducing contact resistance and heat dissipation per pin. Alternatively, multiple MMS-113-02-S-DH connectors can be paralleled on the same PCB to increase total current capacity. Critical design considerations include contact resistance contributions (especially with 0.079" pitch density), thermal gradients across the connector body, and mating cycle wear on high-current contacts. For applications exceeding 15–20A on a single MMS-113-02-S-DH, thermal analysis and contact plating durability testing are recommended.
How does the Liquid Crystal Polymer (LCP) insulation material of the MMS-113-02-S-DH influence PCB assembly and solder reflow processes?
The MMS-113-02-S-DH uses LCP insulation, a material chosen for its low moisture absorption, dimensional stability, and thermal resistance. LCP's glass-transition temperature supports standard lead-free solder reflow profiles (typically 250–260°C peak), and the MSL 1 rating (unlimited moisture sensitivity) means the MMS-113-02-S-DH requires no dry-pack storage or baking before assembly. During reflow, LCP maintains dimensional accuracy better than standard polyimide or polycarbonate materials, reducing the risk of solder joint misalignment or contact distortion. The MMS-113-02-S-DH's right-angle surface-mount configuration places the connector body parallel to the PCB, requiring adequate solder fillet formation on all termination pins. LCP's lower coefficient of thermal expansion compared to FR-4 PCB material can create slight mechanical stress at the solder joint interface during thermal cycling. For applications operating between -55°C and +125°C, the MMS-113-02-S-DH's LCP insulation and phosphor bronze contacts are designed to accommodate this range, though designers should validate PCB layout and solder joint stress through finite-element thermal analysis in demanding temperature-cycling environments.
What push-pull fastening mechanism is used on the MMS-113-02-S-DH, and how does it compare to traditional latched connectors?
The MMS-113-02-S-DH employs a push-pull fastening system, where connectors are mated by pressing together and separated by pulling apart, without requiring supplementary clips or levers. This design simplifies field replacement and maintenance workflows, especially in densely populated backplanes or cable-harness environments. Push-pull fastening reduces the mechanical footprint and allows closer connector spacing compared to latched designs that require locking lever clearance. For the MMS-113-02-S-DH, the push-pull mechanism is integrated into the connector body geometry and relies on positive contact force maintenance during mating and unmating cycles. Repeated plug-unplug cycles can gradually reduce mating force if contact springs fatigue, so the MMS-113-02-S-DH is best suited for systems with infrequent disconnection or factory-installed field-service applications. If frequent hot-swap or rapid changeover is required, field testing of mating force retention after 50–100 cycles is advisable to ensure the MMS-113-02-S-DH remains within acceptable contact reliability margins.
How does the 0.079" pitch and 2-row configuration of the MMS-113-02-S-DH affect PCB routing density and trace width constraints?
The MMS-113-02-S-DH's 0.079" (2.00mm) pitch creates a contact-to-contact spacing that supports traces routed between pin rows on inner PCB layers, typically allowing 2–3 mil traces and 2–3 mil clearances in high-density designs. The 2-row configuration with 0.079" row spacing (identical to column pitch) creates a roughly square footprint, optimizing breakout routing on both sides of the connector. For the MMS-113-02-S-DH, fanout typically requires 4–6 PCB layers to separate all 26 signals without via congestion or signal integrity degradation. Layer stackup planning must account for return paths under the MMS-113-02-S-DH receptacle to maintain impedance control and minimize crosstalk between adjacent high-speed signals. When routing from the MMS-113-02-S-DH on a 4-layer board, designers often use two interior planes for power and ground, forcing differential pairs or high-speed signals to coexist on outer layers with tight spacing constraints. Simulation of crosstalk and delay skew across the MMS-113-02-S-DH fanout region becomes critical for data rates exceeding 500 Mbps.
What are the thermal implications of the MMS-113-02-S-DH's 3.9A per-contact rating in high-density power distribution scenarios?
At 3.9A per contact, each MMS-113-02-S-DH pin dissipates resistive heat proportional to contact resistance and current squared. Typical contact resistance for the MMS-113-02-S-DH is in the range of 2–5 milliohms when freshly mated, yielding heat dissipation of approximately 30–60 mW per contact at full rating. In a 26-position connector fully loaded with power, cumulative dissipation could reach 0.8–1.6W if all contacts carry rated current. This localized heating can raise the MMS-113-02-S-DH connector body temperature 10–20°C above ambient, potentially affecting solder joint durability and adjacent board-level components. Thermal management strategies include thermal-interface materials between the MMS-113-02-S-DH and PCB, distributing current across multiple contact sets, or derating individual contacts below 3.9A in high-ambient-temperature applications. For designs where the MMS-113-02-S-DH operates continuously at or near full power rating in enclosed environments, temperature monitoring or active cooling should be evaluated.
Is the MMS-113-02-S-DH suitable for mixed-signal applications with both low-level analog and high-speed digital signals in adjacent contact positions?
The MMS-113-02-S-DH's compact 0.079" pitch and shared ground/return architecture create significant crosstalk coupling risks when low-level analog signals and fast-edge digital signals occupy adjacent positions. The phosphor bronze contacts and gold plating provide consistent impedance characteristics across all 26 positions, but the close geometric spacing means capacitive and inductive coupling between adjacent pairs is higher than in larger-pitch connectors. For mixed-signal applications using the MMS-113-02-S-DH, layout strategies include segregating analog and digital signal groups spatially within the 26-position array, using interleaved ground contacts for shielding, and designing the mating PCB or cable to include guard traces or twisted-pair routing around sensitive analog lines. High-speed digital edges (>500 MHz) routed through the MMS-113-02-S-DH alongside millivolt-level analog signals require careful termination, return-path planning, and potentially differential-pair geometry to limit crosstalk-induced noise below acceptable SNR thresholds. Pre-layout electromagnetic simulation of the MMS-113-02-S-DH pin array with expected signal assignments is strongly recommended before first-pass PCB design.
What are the storage and handling guidelines for the MMS-113-02-S-DH, and do special precautions apply to the gold-plated contacts?
The MMS-113-02-S-DH carries an MSL 1 (unlimited) moisture-sensitivity rating, meaning it does not require dry-pack storage or pre-assembly baking. The LCP insulation material's inherent low moisture absorption and the gold plating on mating contacts both contribute to stable shelf life and assembly-process robustness. However, the 30.0µin gold finish on the MMS-113-02-S-DH's mating surfaces can accumulate fingerprint oils, dust, or oxidation if stored in corrosive environments or exposed to high humidity for extended periods. Best practice includes storing the MMS-113-02-S-DH in sealed anti-static bags at room temperature and ambient humidity below 60% RH. Contact wiping with lint-free, isopropyl-alcohol-dampened wipes immediately before mating is recommended for connectors stored longer than 6 months. The push-pull fastening mechanism of the MMS-113-02-S-DH should be exercised gently during incoming inspection to verify proper function, though excessive mating-cycle testing in storage can prematurely fatigue contact springs. For high-reliability applications, Samtec typically provides detailed handling and storage documentation specific to the MMS-113-02-S-DH; designers should consult the connector supplier's shelf-life and material-compatibility notes if the MMS-113-02-S-DH will be stored under non-standard conditions or integrated into sensitive systems.
How does the right-angle surface-mount orientation of the MMS-113-02-S-DH affect mechanical stress on solder joints and PCB edge clearance requirements?
The MMS-113-02-S-DH's right-angle, surface-mount configuration positions the connector body parallel to the PCB, with mating faces at 90° to the board surface. This geometry concentrates mechanical stress at the solder-joint interface between the connector's pin tails and the PCB pads, making vibration resistance and thermal-cycling durability dependent on solder-fillet geometry and PCB substrate thickness. The 0.157" (4.00mm) insulation height of the MMS-113-02-S-DH places the connector body relatively close to the PCB surface, limiting available clearance for internal components or return traces directly beneath the footprint. When the MMS-113-02-S-DH is installed near a PCB edge, designers must reserve at least 0.25–0.5" clearance from the board perimeter to accommodate insertion and withdrawal forces without damaging edge traces or laminate layers. Solder-joint stress can be mitigated through careful PCB stack-up (sufficient copper thickness under the MMS-113-02-S-DH footprint), strain-relief design on the mating connector half, and finite-element stress analysis during vibration or thermal-cycling test planning. For applications in military or aerospace domains, mechanical qualification testing of the MMS-113-02-S-DH solder-joint assembly is often required before production release.
What contact-resistance stability can be expected from the MMS-113-02-S-DH over repeated mating cycles, and how does this impact system reliability in test or field-service environments?
The MMS-113-02-S-DH's phosphor bronze contacts with 30.0µin gold plating typically exhibit stable contact resistance below 5 milliohms for the first 50–100 mating cycles, with gradual degradation as surface microscopy changes and minor wear occurs. After 500–1000 cycles, contact resistance may increase to 8–12 milliohms if contacts are not re-cleaned or if environmental contamination accumulates. For applications where the MMS-113-02-S-DH undergoes frequent field disconnection—such as test fixtures, reconfigurable backplanes, or hot-swap scenarios—designers should establish a maintenance interval or cycle-count limit. Thermal cycling (-55°C to +125°C) applied to the MMS-113-02-S-DH in parallel with mechanical mating cycles accelerates contact degradation by promoting micro-oxidation and alloying-layer migration. Systems relying on the MMS-113-02-S-DH for critical power or precision analog applications should incorporate contact-resistance monitoring through periodic measurement or telemetry to detect approaching failure thresholds. If the MMS-113-02-S-DH is used in a test-and-measure environment with 10+ mating cycles per day, supplier datasheets or accelerated life-test data should be reviewed to validate that contact-life expectations align with operational demands.
How do RoHS3 compliance and the tin finish on the MMS-113-02-S-DH contact posts affect long-term solder-joint reliability?
The MMS-113-02-S-DH is RoHS3 compliant, confirming the absence of restricted substances (lead, cadmium, mercury, hexavalent chromium, PBBs, PBDEs) in all components including the insulation, plating, and solder terminations. The tin finish on the MMS-113-02-S-DH's post contacts provides good wettability with lead-free solder (SAC305, SAC305+, SN100C variants commonly used in PCB assembly). However, tin finish introduces tin whisker growth risk if the connector is used in high-reliability aerospace or military applications where tin whisker mitigation strategies are required by specification. For commercial and industrial applications, the MMS-113-02-S-DH's tin post finish is adequate and compatible with standard lead-free assembly processes. The gold-plated mating side of the MMS-113-02-S-DH and tin-plated post side represent a galvanic couple, but the thin tin layer and internal phosphor bronze conductor minimize corrosion risk. In high-humidity or salt-fog environments, long-term solder-joint creep and electromigration around the MMS-113-02-S-DH termination zone should be addressed through conformal coating or potting if the PCB will be exposed to condensation or salt spray.
What design trade-offs should be evaluated when choosing the MMS-113-02-S-DH over higher-pitch alternatives for board-to-board interconnection?
Selecting the MMS-113-02-S-DH at 0.079" pitch instead of 0.1", 0.125", or larger standard pitches presents distinct trade-offs. The primary advantage is density: the MMS-113-02-S-DH enables more signal and power paths in compact form factors, reducing overall system size and weight. However, the finer pitch introduces higher crosstalk sensitivity, stricter PCB layout tolerances, more complex fanout routing, and increased assembly-process risk (e.g., solder bridges, misalignment). The MMS-113-02-S-DH's 3.9A per-contact rating is competitive with standard-pitch alternatives, so raw current capacity does not increase with density. If thermal dissipation, crosstalk, or PCB routing complexity become limiting factors, a larger-pitch connector alternative may offer a more favorable cost-benefit trade-off despite requiring additional board space. For new designs, the decision to adopt the MMS-113-02-S-DH should be guided by application requirements: space-constrained systems benefit substantially; systems with abundant board area and stringent signal integrity requirements may favor traditional larger-pitch connectors. Benchmark cost comparisons, assembly yields, and field-reliability data from Samtec or historical designs using the MMS-113-02-S-DH should inform the final connector selection.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MMS-113-02-S-DH

Product Attribute MMS-113-02-S-DH-LC-TR MMS-113-02-S-DV-A-K MMS-113-02-S-DV-M-A-TR MMS-113-02-S-DV-P-TR
Part Number MMS-113-02-S-DH-LC-TR MMS-113-02-S-DV-A-K MMS-113-02-S-DV-M-A-TR MMS-113-02-S-DV-P-TR
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Mated Stacking Heights - - - -
Contact Finish Thickness - Mating - - - -
Style - - - -
Series - - - -
Insulation Material - - - -
Insulation Height - - - -
Contact Finish Thickness - Post - - - -
Contact Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Base Product Number - DAC34H84 MAX500 ADS62P42
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Material Flammability Rating - - - -
Contact Length - Post - - - -
Current Rating (Amps) - - - -
Contact Finish - Mating - - - -
Applications - - - -
Number of Positions Loaded - - - -
Contact Shape - - - -
Voltage Rating - - - -
Insulation Color - - - -
Pitch - Mating - - - -
Termination - - - -
Contact Material - - - -
Row Spacing - Mating - - - -
Features - - - Simultaneous Sampling
Connector Type - - - -
Number of Rows - - - -
Ingress Protection - - - -
Contact Finish - Post - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Fastening Type - - - -
Number of Positions - - - -

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MMS-113-02-S-DH Image

MMS-113-02-S-DH

Samtec Inc.
98D-MMS-113-02-S-DH

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