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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTLW-103-05-F-S-200
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MTLW-103-05-F-S-200 - Samtec Inc.

Manufacturer Part Number
MTLW-103-05-F-S-200
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTLW-103-05-F-S-200
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
35,066 pcs available, New & Original
Parts Description
CONN HEADER VERT 3POS 2.54MM
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 35066
  • Unit Price: $0.76
  • Subtotal: $0.00

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1+ $0.76 $0.76
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Specifications

MTLW-103-05-F-S-200 Tech Specifications
Samtec Inc. - MTLW-103-05-F-S-200 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTLW-103-05-F-S-200

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTLW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.335" (8.51mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 3
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.060" (1.52mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 5.2A per Contact
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.075" (1.91mm)
Contact Length - Mating 0.200" (5.08mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.00µin (0.076µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number MTLW-103
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating cycle life expectancy for the MTLW-103-05-F-S-200, and how does repeated insertion and removal affect gold contact reliability?
The MTLW-103-05-F-S-200 is designed for standard board-to-board or cable interconnect applications with typical mating cycle ratings in the range of 30–50 cycles for push-pull fastening systems in this connector class. Gold plating at 3.00µin (0.076µm) thickness on the mating contacts provides corrosion resistance and maintains low contact resistance across repeated cycles. However, the thin gold layer means that abrasive insertion techniques or misaligned mating can accelerate wear, exposing the underlying phosphor bronze substrate. For applications requiring >50 mating cycles, consider the connector's push-pull design as a fatigue point; ensure mating force is evenly distributed and that PCB alignment fixtures are used to prevent edge loading on the MTLW-103-05-F-S-200 header pins.
Can the MTLW-103-05-F-S-200 be safely operated at the full 5.2A per contact rating in a compact 3-position configuration without thermal derating?
The MTLW-103-05-F-S-200 carries a 5.2A per-contact current rating under standard thermal conditions (typically 25°C ambient, unimpeded airflow). In a 3-position header layout, all three contacts are positioned on a 2.54mm pitch with minimal spacing between insulation barriers, which limits convective cooling and increases localized heating. Operating all three contacts at maximum current (15.6A total) simultaneously will produce resistive heating; the LCP insulation material (UL94 V-0 rated) maintains structural integrity up to 125°C ambient operation, but sustained high current may approach this thermal limit if cooling is passive. For designs requiring continuous full-load operation, either derate to 80% of nominal current per contact, improve PCB thermal management around the header footprint, or distribute current unevenly across contacts based on circuit requirements. The MTLW-103-05-F-S-200 datasheet should be consulted for thermal modeling in your specific assembly context.
How does the 0.075" (1.91mm) solder post length of the MTLW-103-05-F-S-200 affect PCB assembly yield and rework procedures?
The MTLW-103-05-F-S-200 features a 0.075" post length, which is relatively shallow for through-hole termination and creates specific assembly constraints. During wave or reflow soldering, the short post provides reduced solder fillet volume, limiting mechanical strength and thermal mass at the solder joint. This design favors lower thermal stress during soldering but demands precise control of solder paste volume and reflow temperature profiles; excessive solder can bridge adjacent MTLW-103-05-F-S-200 pins on the tight 2.54mm pitch. Rework is challenging because desoldering the header without damage requires controlled heat application and gentle mechanical extraction; the short post and thin insulation increase risk of pad lift on the PCB substrate. For high-reliability applications, consider test coupons to validate your solder process parameters before production runs of MTLW-103-05-F-S-200 assemblies.
What is the difference in performance between the MTLW-103-05-F-S-200 unshrouded design and shrouded alternatives, and when should each be specified?
The MTLW-103-05-F-S-200 is an unshrouded header, meaning the insulation barrier (1.52mm tall, LCP material) provides only vertical protection of the mating interface; the top and sides of the contact pins remain exposed. Unshrouded designs offer lower cost, reduced PCB footprint, and easier visual inspection during assembly and debug. However, they lack protection against accidental finger contact or conductive debris during system integration or field maintenance. The MTLW-103-05-F-S-200 unshrouded configuration is suitable for internal connector applications, laboratory development, or where the connector is recessed on the final product. Shrouded alternatives (such as the MTLW-103-05-D-S-200) add a plastic housing that fully encloses the mating contacts, preventing unintended shorts and improving mechanical robustness but increasing size and cost. Select unshrouded MTLW-103-05-F-S-200 for cost-sensitive or space-constrained designs where contact exposure is manageable; choose shrouded headers for consumer products, outdoor equipment, or high-reliability systems.
How should thermal cycling between -55°C and 125°C affect the long-term reliability of the MTLW-103-05-F-S-200 solder joints and LCP insulation?
The MTLW-103-05-F-S-200 is rated for operation across -55°C to 125°C, a 180°C range typical of aerospace and automotive environments. The liquid crystal polymer insulation maintains mechanical integrity throughout this range (UL94 V-0 rating confirms flame resistance and structural stability), but the insulation and phosphor bronze contact material have different coefficients of thermal expansion. Repeated thermal cycling induces mechanical stress at the solder interface where the MTLW-103-05-F-S-200 post meets the PCB copper pad; stress accumulation can eventually cause solder fatigue cracks or contact resistance increases. The tin plating on the solder post also exhibits thermal fatigue sensitivity. For applications requiring >100 thermal cycles in this temperature range, specify a conformally coated PCB assembly around the MTLW-103-05-F-S-200 footprint to reduce moisture ingress and mitigate electrochemical corrosion, and design the PCB layout to minimize mechanical flex near connector mounting points.
Is the MTLW-103-05-F-S-200 suitable for high-frequency signal applications, or should it be reserved for low-speed power and control signals?
The MTLW-103-05-F-S-200 is a simple push-pull rectangular header with no differential pair geometry or impedance control features. For signal integrity, the 2.54mm pitch and unshrouded open-air design introduce relatively high crosstalk and impedance discontinuities between adjacent pins. The MTLW-103-05-F-S-200 is appropriate for low-speed digital control signals (I2C, SPI up to ~10 MHz), power distribution, and analog sensor interfaces where signal rise times are >10 ns. For high-frequency applications (>50 MHz), high-speed serial protocols (LVDS, PCIe, USB), or low-jitter clock distribution, the MTLW-103-05-F-S-200 is not recommended due to uncontrolled impedance and cross-talk coupling. If interconnecting high-speed circuits, consider shielded or differential connectors with controlled trace routing; if MTLW-103-05-F-S-200 is already integrated into a design, add series termination resistors and length-match signal traces on the PCB to compensate.
What insertion force and mating alignment tolerances should be specified when designing a connector receptacle for the MTLW-103-05-F-S-200 male pin header?
The MTLW-103-05-F-S-200 features square-shaped male contact pins (0.200" mating length, 2.54mm pitch, 3 positions) designed for push-pull mating. The contact shape and phosphor bronze material provide reasonable stiffness to prevent bending during insertion, but the 5.08mm mating contact length and thin insulation walls create a relatively compliant structure. Typical insertion forces for this connector class range from 1.5–3.0 oz per contact pair (equivalent to 0.4–0.85 N total for the 3-position MTLW-103-05-F-S-200), depending on contact plating condition and wear state. Mating receptacles should be designed with alignment guides or keying features to ensure coaxial pin entry within ±0.5 mm lateral tolerance; misalignment beyond this range can cause side-loading that bends pins or damages the gold contact finish. The MTLW-103-05-F-S-200 unshrouded design relies entirely on PCB surface-to-surface alignment, so mechanical connector housings or alignment fixture jigs are recommended for high-volume assembly.
How does the MSL 1 (Unlimited) moisture sensitivity rating affect storage, handling, and reflow process conditions for MTLW-103-05-F-S-200 components?
The MTLW-103-05-F-S-200 carries an MSL (Moisture Sensitivity Level) rating of 1, which is the lowest moisture sensitivity category. This means the component can be stored indefinitely at standard room conditions (23°C ±2°C, 50% ±5% RH) without baking before solder reflow. The LCP insulation material and phosphor bronze contacts do not absorb significant moisture under normal warehouse or factory conditions. The MTLW-103-05-F-S-200 does not require a dry-pack container with desiccant, bake-out procedures before processing, or extended floor-life monitoring. This simplifies supply chain logistics and reduces manufacturing overhead, particularly for job-lot or prototype production where component inventory dwell times are unpredictable. However, if the populated PCB assembly is exposed to high humidity (>90% RH) or thermal shock after solder reflow (e.g., rapid cooling or condensation), moisture can still migrate into solder joints and degrade reliability; standard ESD-safe storage and reasonable humidity control during assembly remain recommended practice even for the MSL 1 MTLW-103-05-F-S-200.
What contact finish degradation or corrosion risks should be anticipated for the MTLW-103-05-F-S-200 in industrial or outdoor environments?
The MTLW-103-05-F-S-200 mating contacts are finished with 3.00µin (0.076µm) gold plating over phosphor bronze, a proven combination for standard indoor applications. Gold provides excellent corrosion resistance and low contact resistance, but the thin plating thickness means that mechanical wear, abrasion, or chemical exposure can expose the underlying bronze substrate within 100–200 mating cycles, depending on insertion technique. In industrial or outdoor environments with airborne sulfur, chloride, or humidity, exposed bronze areas will oxidize and increase contact resistance over time. The solder posts use tin plating, which is more susceptible to tin whisker growth and creep corrosion in high-humidity conditions. For environments with frequent thermal cycling (industrial ovens, marine applications), specify conformal coating on the PCB assembly near the MTLW-103-05-F-S-200 connector to provide a moisture and corrosion barrier. Alternatively, if the application permits, design a protective cover or connector shell around the MTLW-103-05-F-S-200 header to minimize environmental exposure.
How do the electrical and mechanical characteristics of the MTLW-103-05-F-S-200 compare to alternative 3-position 2.54mm pitch connector families such as Molex KK or Phoenix Contact headers?
The MTLW-103-05-F-S-200 (Samtec Flex Stack series) competes in the commodity 0.1" pitch header segment alongside Molex KK series (KK 254, KK 396), Phoenix Contact MC headers, and JST XH connectors. All share the standard 2.54mm (0.100") pitch and mating contact geometry. The MTLW-103-05-F-S-200 differentiates through its LCP insulation material (lower cost and better thermal performance than traditional nylon), compact unshrouded profile, and push-pull fastening (vs. friction-fit on KK or lever-lock on Phoenix Contact). The MTLW-103-05-F-S-200 5.2A per-contact rating is competitive with Molex KK connectors (typically 3–5A per contact), but lower than Phoenix Contact MC headers (up to 8A). Current-carrying capacity and thermal dissipation differ; the MTLW-103-05-F-S-200 is lighter duty for signal and low-power control, while Phoenix Contact MC headers suit industrial power distribution. For cost-optimized designs requiring simple 3-position interconnects with <5A current per pin, the MTLW-103-05-F-S-200 offers equivalent performance to KK-series alternatives at competitive pricing; for higher current or industrial robustness, Phoenix Contact may be preferable despite higher cost.
What design considerations apply when the MTLW-103-05-F-S-200 is used in a stacked or daisy-chained configuration with multiple connector headers?
The MTLW-103-05-F-S-200 can be mounted in adjacent positions on a PCB to create multi-connector assemblies, but stacking or daisy-chaining introduces cumulative electrical and mechanical constraints. Each MTLW-103-05-F-S-200 header occupies a 2.54mm pitch footprint; placing multiple headers side-by-side with minimal spacing (e.g., 1–2mm gap) creates thermal coupling—heat generated in one connector transfers to adjacent units, raising local board temperature and potentially exceeding the 125°C rating in high-current scenarios. Electrical coupling also increases: inter-connector crosstalk can degrade signal integrity on low-voltage control signals. Additionally, daisy-chained MTLW-103-05-F-S-200 connectors share PCB trace routing, so a fault (open or short circuit) in one connector can compromise the entire chain. Design guidelines recommend isolating each MTLW-103-05-F-S-200 with separate ground and supply planes, providing local bypass capacitors near each connector, and maintaining adequate spacing (≥5mm) between headers to allow natural convection cooling and reduce crosstalk coupling.
Is the MTLW-103-05-F-S-200 RoHS3 compliance status sufficient for compliance in all regulated markets, or are additional certifications required?
The MTLW-103-05-F-S-200 is RoHS3 compliant, indicating compliance with EU Directive 2011/65/EU (as amended by Directive 2015/863/EU), which restricts the use of hazardous substances including lead, cadmium, mercury, and certain brominated flame retardants in electrical and electronic equipment. RoHS3 compliance is mandatory for products sold in the EU, UK, and many other regulated markets. However, RoHS3 compliance alone does not guarantee market acceptance in all applications or regions. Aerospace, defense, and medical device applications may require additional certifications such as AS9100, IPC-A-610 workmanship standards, or sector-specific material or traceability documentation. China's RoHS (Management Methods for Restriction of Hazardous Substances in Electrical and Electronic Products) has overlapping but distinct substance restrictions. The MTLW-103-05-F-S-200 RoHS3 status should be verified against your target market's regulatory requirements; for highly regulated industries, contact Samtec directly to obtain detailed material composition reports, UL certifications (the LCP insulation is UL94 V-0 rated), and any conflict minerals declarations required by your supply chain.
What is the expected contact resistance stability of the MTLW-103-05-F-S-200 over its operational temperature range, and how should analog signal paths be designed to minimize thermoelectric noise?
The MTLW-103-05-F-S-200 mating contacts (gold-plated phosphor bronze) exhibit contact resistance in the range of 5–50 mΩ when new and properly mated, varying with contact force, plating condition, and environmental corrosion. Over the -55°C to 125°C operating range, contact resistance changes by approximately 5–10% due to thermal expansion of the contact material and changes in surface oxide formation at extreme temperatures. This thermal drift is generally acceptable for digital signals and power distribution but can introduce thermoelectric noise (Seebeck and Peltier effects) in analog and precision measurement circuits. For analog signal applications using the MTLW-103-05-F-S-200, use twisted-pair or coaxial routing for low-level signals, place filtering capacitors close to the connector to attenuate thermoelectric noise, and avoid asymmetrical current paths through the three-pin header. If differential analog measurement is required, dedicate separate MTLW-103-05-F-S-200 pins or external connectors for low-impedance reference and return paths, and perform on-board calibration to cancel residual offset voltage variations caused by thermal cycling of the MTLW-103-05-F-S-200 contact interface.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTLW-103-05-F-S-200

Product Attribute MTLW-103-05-F-D-200 MTLW-103-05-F-D-240 MTLW-103-05-F-S-140 MTLW-103-05-F-S-180
Part Number MTLW-103-05-F-D-200 MTLW-103-05-F-D-240 MTLW-103-05-F-S-140 MTLW-103-05-F-S-180
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Length - Mating - - - -
Pitch - Mating - - - -
Number of Positions Loaded - - - -
Termination - - - -
Shrouding - - - -
Applications - - - -
Number of Positions - - - -
Voltage Rating - - - -
Contact Finish Thickness - Post - - - -
Number of Rows - - - -
Contact Shape - - - -
Contact Type - - - -
Contact Material - - - -
Insulation Height - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current Rating (Amps) - - - -
Series - - - -
Mated Stacking Heights - - - -
Style - - - -
Features - - - Simultaneous Sampling
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Fastening Type - - - -
Row Spacing - Mating - - - -
Contact Finish - Post - - - -
Connector Type - - - -
Contact Finish Thickness - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Overall Contact Length - - - -
Insulation Color - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Length - Post - - - -
Material Flammability Rating - - - -
Ingress Protection - - - -
Contact Finish - Mating - - - -
Insulation Material - - - -

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Samtec Inc.

MTLW-103-05-F-S-200

Samtec Inc.
98D-MTLW-103-05-F-S-200

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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