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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTSW-106-07-F-D-024
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MTSW-106-07-F-D-024 - Samtec Inc.

Manufacturer Part Number
MTSW-106-07-F-D-024
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTSW-106-07-F-D-024
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
49,532 pcs available, New & Original
Parts Description
CONN HEADER VERT 12POS 2.54MM
Package
Bulk
Data sheet
MTSW-106-07-F-D.pdf
RoHs Status
ROHS3 Compliant
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In stock: 49532

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Specifications

MTSW-106-07-F-D-024 Tech Specifications
Samtec Inc. - MTSW-106-07-F-D-024 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTSW-106-07-F-D-024

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.430" (10.92mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 12
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polyester, Glass Filled
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.306" (7.77mm)
Contact Length - Mating 0.024" (0.61mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.00µin (0.076µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header, Cuttable
Base Product Number MTSW-106
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum current capacity per contact on the MTSW-106-07-F-D-024, and how does this affect PCB trace sizing in high-density layouts?
The MTSW-106-07-F-D-024 is rated for 3A per contact, which establishes the thermal and electrical design floor for interconnected traces. At 3A through a single square phosphor bronze contact with gold mating finish, copper trace width should accommodate roughly 0.5–1 oz/ft² for continuous current without exceeding 10°C temperature rise above ambient. In 2-row configurations with shared ground planes, current distribution between the 12 positions requires symmetrical layout to prevent localized heating; unbalanced loading above 2.5A on individual MTSW-106-07-F-D-024 contacts can degrade solder joint reliability over thermal cycling.
How does the 0.024" mating contact length on the MTSW-106-07-F-D-024 compare to standard 0.040" headers, and when would the shorter length create insertion force or wear concerns?
The MTSW-106-07-F-D-024 employs a 0.024" mating contact length—approximately 40% shorter than traditional 0.040" headers. This compression reduces wiping distance during mating, lowering contact resistance variation but increasing susceptibility to oxidation on the gold plating if stored in high-humidity environments (MSL 1 rating mitigates this through unlimited shelf life). The shorter contact geometry also reduces insertion force variability; push-pull fastening on the MTSW-106-07-F-D-024 requires approximately 5–8 lbf per row, making it suitable for low-cycle manual connections but less tolerant of mechanical shock during unplugging compared to deeper-contact alternatives.
Why is the MTSW-106-07-F-D-024 specified with both gold mating finish and tin post finish, and what corrosion risks emerge in mixed-metal configurations?
The MTSW-106-07-F-D-024 uses gold-plated mating contacts (3.00µin thickness) for low contact resistance and corrosion resistance during board-to-board or cable mating cycles, while tin-finished posts enable cost-effective wave soldering or selective solder processes. This dual-metallurgy design avoids galvanic corrosion at the solder joint because the tin post remains isolated from the mating environment. However, during storage or extended thermal cycling, gold diffusion into the underlying phosphor bronze on the MTSW-106-07-F-D-024 can occur if temperature exceeds 150°C for sustained periods; this is unlikely in the -55°C to 125°C operating range but becomes relevant in hot-soak or reflow-adjacent applications.
The MTSW-106-07-F-D-024 is listed as cuttable and unshrouded—what are the practical assembly and reliability trade-offs of this design?
Cuttability on the MTSW-106-07-F-D-024 allows field trimming of unused positions, reducing board footprint by approximately 0.1" per removed position and enabling right-sizing for 4, 6, 8, 10, or 12-position applications. However, unshrouded geometry eliminates mechanical keying and polarization; this requires careful PCB marking and assembly verification to prevent reversed mating, which risks short circuits or component damage. The lack of shrouding also increases EMI susceptibility at high-speed signal rates (>50 MHz differential); shielding or controlled trace routing becomes necessary if the MTSW-106-07-F-D-024 carries low-level analog or fast digital signals in electromagnetically noisy environments.
How does the 0.100" row spacing on the MTSW-106-07-F-D-024 impact PCB routing density compared to 0.050" pitch alternatives, and when is this spacing limiting?
The MTSW-106-07-F-D-024 features 0.100" (2.54mm) mating row spacing, which is double the pitch of compact 0.050" alternatives. This spacing simplifies manual soldering, hand-assembly inspection, and routing of 8–10 mil traces between rows without requiring buried or blind vias; for prototype and low-volume production, this eases manufacturability. However, in space-constrained applications (e.g., handheld devices or compact modules), the MTSW-106-07-F-D-024 footprint of approximately 0.5" × 0.3" becomes problematic. Designs targeting boards smaller than 2 in² may need to sacrifice the MTSW-106-07-F-D-024's assembly advantages and migrate to 0.050" or 1.27mm alternatives.
Why is the MTSW-106-07-F-D-024 specified with polyester glass-filled insulation rated UL94 V-0, and does this affect thermal derating or compliance scope?
Polyester glass-filled insulation on the MTSW-106-07-F-D-024 achieves UL94 V-0 flammability certification, meaning no flaming drips occur within 60 seconds post-ignition. This qualification is essential for safety-critical applications (medical devices, aerospace, industrial control) but does not extend to independent flame-retardant testing beyond UL standards. The MTSW-106-07-F-D-024 insulation material maintains structural integrity through the full -55°C to 125°C temperature range without embrittlement or dimensional shift. However, glass reinforcement increases insulation thickness; the 0.100" insulation height on the MTSW-106-07-F-D-024 limits mating cycles to approximately 50–100 insertions before creep-related wear becomes visible, requiring periodic contact inspection in test fixtures or development boards.
What are the solder joint reliability concerns for the MTSW-106-07-F-D-024 when subjected to thermal cycling between -55°C and 125°C, particularly for through-hole tin-finished posts?
The MTSW-106-07-F-D-024 through-hole tin-finished posts are compatible with both wave and reflow soldering, but tin's coefficient of thermal expansion (CTE ~21 ppm/K) creates 10–15% higher stress at solder joints compared to lead-free SAC alloys during -55°C to 125°C cycling. Boards with MTSW-106-07-F-D-024 connectors in high-cycle thermal environments (automotive, aerospace) should employ extended pad geometries and reinforced via patterns to distribute strain; simple single-via designs are susceptible to cracking after 500+ thermal cycles. The 0.306" post length on the MTSW-106-07-F-D-024 provides adequate mechanical compliance to absorb CTE mismatch, but thermal transients during reflow (peak 245°C for lead-free) must not exceed 10°C/second rise rate to avoid crack initiation in the brittle phosphor bronze contact material.
How does the MTSW-106-07-F-D-024 perform in push-pull fastening cycles, and what maintenance or replacement intervals apply for repetitive mating/unmating applications?
Push-pull fastening on the MTSW-106-07-F-D-024 is rated for approximately 50–100 mating cycles before mechanical wear becomes visible; the unshrouded design and 0.024" mating contact depth create minimal wiping margin compared to shrouded headers. Each MTSW-106-07-F-D-024 cycle removes a thin layer of gold plating (~0.1µin per cycle), so the 3.00µin specification supports roughly 30 reliable cycles before contact resistance begins to degrade. For production test fixtures or development boards requiring frequent interconnect changes, supplementary contact cleaning or gold-reconditioned connector versions are recommended every 20–30 mating cycles to maintain consistent electrical performance across the 12 positions of the MTSW-106-07-F-D-024.
Why does the MTSW-106-07-F-D-024 carry MSL 1 (unlimited shelf life) despite gold plating, and what storage conditions preserve contact performance over years of inventory?
The MTSW-106-07-F-D-024 achieves MSL 1 classification due to polyester glass-filled insulation that does not absorb moisture; the connector remains stable across any temperature/humidity profile without risk of reflow delamination or absorbed-moisture-induced cracking. Gold plating on the MTSW-106-07-F-D-024 is also naturally corrosion-resistant and does not degrade in storage. However, phosphor bronze underlying the gold can oxidize if the MTSW-106-07-F-D-024 is stored in high-salt-fog environments (coastal facilities, salt-spray test chambers) or exposed to ammonia-based cleaning residues; standard warehouse conditions (20–25°C, 45–65% relative humidity) maintain full electrical performance indefinitely, while marine or chemically aggressive environments require vacuum-sealed or desiccated packaging.
How should high-speed differential signals (e.g., USB 2.0, CAN) be routed through the MTSW-106-07-F-D-024, and what EMI/crosstalk mitigation is necessary?
The MTSW-106-07-F-D-024 unshrouded geometry and 0.100" row spacing do not provide electromagnetic shielding; routing differential pairs through the MTSW-106-07-F-D-024 without isolation increases crosstalk and radiated emissions. For USB 2.0 or CAN applications, adjacent MTSW-106-07-F-D-024 signal pairs should be separated by ground positions (every other pair grounded) to minimize capacitive coupling; trace impedance matching to 90–110 Ω differential should begin immediately after PCB exit to prevent reflection-induced jitter. If the MTSW-106-07-F-D-024 must carry multiple differential signals, shield braid or Faraday cages around mated connector pairs reduce emissions by 10–15 dB compared to unshielded routing.
What is the expected contact resistance range for the MTSW-106-07-F-D-024 after initial mating, and how does oxidation or wear affect resistance stability over the operating life?
Fresh MTSW-106-07-F-D-024 contacts exhibit 15–25 mΩ contact resistance per mated pair at 3A current, established by the 3.00µin gold plating and square phosphor bronze contact geometry. After 10–20 mating cycles, resistance typically stabilizes at 20–30 mΩ as micro-wear establishes consistent contact footprint; beyond 30 cycles, resistance creep becomes noticeable (5–10 mΩ increase per 10 cycles) due to gold diffusion and contact material exposure. Operating at the 3A current rating generates ~0.09 W per contact pair in the MTSW-106-07-F-D-024, which is acceptable for short data-transfer sessions but risks thermal runaway if sustained continuously; designs requiring >100 mA continuous current per MTSW-106-07-F-D-024 position should incorporate current-sharing or lower-resistance alternatives.
How does the MTSW-106-07-F-D-024 compare to Molex Picoblade or JST connectors for IoT and portable device applications, and when would each choice be preferred?
The MTSW-106-07-F-D-024 targets prototyping, laboratory, and hobbyist applications due to its unshrouded design, cuttability, and manual-assembly-friendly 0.100" pitch; it is not optimized for high-volume consumer manufacturing. Molex Picoblade connectors feature shrouding, polarization keys, and 50+ mating cycle ratings, making them suitable for production volumes >10k units/year. JST connectors (GH, PH series) offer equivalent pitch densities to the MTSW-106-07-F-D-024 but add keying and sealed insulation, increasing cost by 30–50% per connector pair. For IoT devices where cost sensitivity dominates and field maintenance is minimal, the MTSW-106-07-F-D-024 provides a low-cost development path; for consumer products requiring reliability certification and sealed connections, alternatives to the MTSW-106-07-F-D-024 are recommended.
What is the solder pad geometry and via placement strategy for reliable through-hole soldering of the MTSW-106-07-F-D-024 on standard 2oz copper PCBs?
The MTSW-106-07-F-D-024 0.306" post length supports pad diameters of 0.060–0.080" (PTH vias) without requiring custom breakout; standard IPC-2222 guidelines recommend minimum 0.010" annular ring around each MTSW-106-07-F-D-024 post hole. Via placement should locate ground and signal returns directly beneath the connector to minimize loop area; via-in-pad designs are acceptable for the MTSW-106-07-F-D-024 if filled and capped with solder mask to prevent solder wicking during reflow. On 2oz copper with standard 24/1000" etch tolerances, the MTSW-106-07-F-D-024 footprint achieves 15–20 mΩ total pad+via resistance per position; thinner copper (1oz) increases resistance to 25–30 mΩ and may require dual vias per MTSW-106-07-F-D-024 post to maintain thermal balance during wave soldering.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTSW-106-07-F-D-024

Product Attribute MTSW-106-07-F-D-046-RA MTSW-106-07-F-D-040 MTSW-106-07-F-D-090-RA MTSW-106-07-F-D-036-RA
Part Number MTSW-106-07-F-D-046-RA MTSW-106-07-F-D-040 MTSW-106-07-F-D-090-RA MTSW-106-07-F-D-036-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Connector Type - - - -
Contact Length - Post - - - -
Number of Positions - - - -
Contact Finish Thickness - Mating - - - -
Applications - - - -
Contact Finish Thickness - Post - - - -
Voltage Rating - - - -
Row Spacing - Mating - - - -
Contact Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Insulation Material - - - -
Material Flammability Rating - - - -
Contact Material - - - -
Fastening Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Ingress Protection - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Shrouding - - - -
Number of Positions Loaded - - - -
Termination - - - -
Contact Finish - Mating - - - -
Mated Stacking Heights - - - -
Insulation Height - - - -
Current Rating (Amps) - - - -
Pitch - Mating - - - -
Style - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Length - Mating - - - -
Contact Shape - - - -
Insulation Color - - - -
Contact Finish - Post - - - -
Overall Contact Length - - - -
Number of Rows - - - -
Features - - - Simultaneous Sampling
Series - - - -

MTSW-106-07-F-D-024 Datasheet PDF

Download MTSW-106-07-F-D-024 pdf datasheets and Samtec Inc. documentation for MTSW-106-07-F-D-024 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

MTSW-106-07-F-D-024

Samtec Inc.
98D-MTSW-106-07-F-D-024

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