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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTSW-106-09-F-D-475
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MTSW-106-09-F-D-475 - Samtec Inc.

Manufacturer Part Number
MTSW-106-09-F-D-475
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTSW-106-09-F-D-475
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,061 pcs available, New & Original
Parts Description
CONN HEADER VERT 12POS 2.54MM
Package
Bulk
Data sheet
MTSW-106-09-F-D.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 33061

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Specifications

MTSW-106-09-F-D-475 Tech Specifications
Samtec Inc. - MTSW-106-09-F-D-475 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTSW-106-09-F-D-475

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.730" (18.54mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 12
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polyester, Glass Filled
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.155" (3.94mm)
Contact Length - Mating 0.475" (12.07mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 3.00µin (0.076µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header, Cuttable
Base Product Number MTSW-106
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

Can the MTSW-106-09-F-D-475 be used in applications requiring repeated mating and unmating cycles, and how does the gold-plated contact finish support reliability?
The MTSW-106-09-F-D-475 is designed for board-to-board or cable interconnection with push-pull fastening, supporting repeated connection cycles. The 3.00µin gold mating contact finish on phosphor bronze provides oxidation resistance and low contact resistance across thermal cycling from -55°C to 125°C. Gold plating minimizes fretting corrosion that occurs during repeated mating, whereas tin-plated posts ensure reliable solder joints during assembly. This dual-finish approach in the MTSW-106-09-F-D-475 balances signal integrity during insertion/removal with assembly robustness, making it suitable for development platforms, modular test fixtures, and field-replaceable interconnects where connection cycles exceed 50 cycles.
How does the 0.100" (2.54mm) pitch and 2-row configuration of the MTSW-106-09-F-D-475 affect PCB layout density and signal routing compared to 0.050" pitch alternatives?
The MTSW-106-09-F-D-475 occupies a 12-position header with 2-row, 0.100" pitch geometry, resulting in a footprint of approximately 0.300" × 0.200" (excluding the insulation body). This 0.100" pitch is the industry standard for through-hole connectors and allows PCB trace routing between adjacent signal pins without requiring microvia technology. Compared to 0.050" alternatives, the MTSW-106-09-F-D-475 demands less PCB density but simplifies manufacturing and reduces crosstalk in low-frequency applications (under 100 MHz). The 0.100" row spacing in the MTSW-106-09-F-D-475 permits insertion of standard 0.100" connector headers from the opposite side, enabling compact dual-connector designs on single-layer or 2-layer boards where space trade-offs favor simplicity over miniaturization.
What are the thermal stress considerations when using the MTSW-106-09-F-D-475 in applications transitioning between -55°C and 125°C operating extremes?
The MTSW-106-09-F-D-475 employs polyester glass-filled insulation rated UL94 V-0, which maintains structural integrity across the -55°C to 125°C operating range with a coefficient of thermal expansion approximately 25–35 ppm/K. The phosphor bronze contact material and tin-plated post termination experience dimensional changes that can stress solder connections at thermal extremes. In the MTSW-106-09-F-D-475, the 0.155" post length (3.94 mm) provides mechanical compliance that absorbs thermal stress without excessive strain on solder joints. High-reliability applications should incorporate mechanical strain relief near the connector base and verify thermal cycling performance through IPC 9701 qualification testing, particularly if the MTSW-106-09-F-D-475 interfaces with rigid assemblies or high-modulus substrates.
Is the MTSW-106-09-F-D-475 suitable for high-speed digital signals, and what impedance or insertion loss characteristics should be expected?
The MTSW-106-09-F-D-475 is optimized for standard logic and power distribution rather than controlled-impedance high-speed applications. With 12 positions in a 2-row unshrouded configuration, the MTSW-106-09-F-D-475 exhibits parasitic capacitance and inductance that can introduce measurable attenuation and reflections above 50 MHz. Gold-plated mating contacts minimize skin-effect losses, but the 0.100" pitch spacing generates approximately 10–15 pF of inter-pin capacitance. For digital signals below 10 MHz, the MTSW-106-09-F-D-475 performs reliably with typical insertion loss under 0.1 dB. For applications requiring differential signaling or clock speeds exceeding 100 MHz, alternative shielded or lower-profile connectors with impedance control are recommended; the MTSW-106-09-F-D-475 should be reserved for single-ended, low-frequency applications or power interconnects.
How does the cuttable header design of the MTSW-106-09-F-D-475 reduce assembly tooling costs compared to individual pre-cut connector housings?
The MTSW-106-09-F-D-475 is part of the Flex Stack series, offering a cuttable header design that allows manufacturers to purchase long connector strips and trim to exact position counts on-demand. Instead of stocking 12 discrete SKUs (2-position through 12-position variants), a single long strip of MTSW-106-09-F-D-475 can be cut to 2, 4, 6, 8, 10, or 12 positions using standard PCB routing or bandsaw equipment. This reduces inventory complexity and allows custom configuration post-design. The polyester glass-filled insulation body in the MTSW-106-09-F-D-475 is rigid enough to maintain dimensional tolerances during cutting without delamination or contact damage. For contract manufacturers or OEMs producing multiple variants from a common platform, the cuttable header feature can reduce connector-specific tooling costs by 20–30% compared to molded single-position housings.
What soldering profile and reflow temperature considerations apply to the MTSW-106-09-F-D-475, and are there risks of tin whisker formation from the tin-plated posts?
The MTSW-106-09-F-D-475 employs tin-plated phosphor bronze posts designed for wave or reflow soldering within standard IPC-A-610 profiles (peak temperature 245–260°C). The tin plating thickness is not specified in the datasheet but typically ranges 1–3µm, adequate for lead-free solder compatibility without brittleness. Tin whisker formation is a theoretical risk when pure tin plating exceeds 5µm and is stored at elevated humidity for extended periods; the MTSW-106-09-F-D-475 at typical plating thickness poses minimal whisker risk if stored at controlled humidity (below 60% RH) and soldered within 12–18 months of manufacture. Moisture sensitivity level (MSL) 1 rating for the MTSW-106-09-F-D-475 indicates unlimited shelf life without baking, reducing pre-assembly preparation time compared to MSL 2–3 connectors. For military or aerospace applications sensitive to whisker formation, nickel-barrier plating specification options should be evaluated during connector selection.
How does the 3A current rating of the MTSW-106-09-F-D-475 scale across the 12 positions, and what thermal management strategies apply to high-current density scenarios?
The MTSW-106-09-F-D-475 is rated 3A per contact, implying a total connector current capacity of 36A if all 12 positions carry full current simultaneously. In practice, current distribution is rarely uniform; typical power distribution designs allocate parallel pins to high-current signals while reserving individual pins for low-current logic or sensing. The phosphor bronze contact resistance is approximately 5–15 mΩ per mated pair, producing localized heating at I²R losses. A single MTSW-106-09-F-D-475 contact carrying 2A continuous current in a 70°C ambient environment generates approximately 20–60 mW dissipation, manageable without forced convection. For designs requiring sustained currents near 3A per pin (e.g., motor drive or battery interconnects), the MTSW-106-09-F-D-475 should be evaluated for voltage drop (approximately 15–45 mV at 3A) and paired with parallel pins or higher-rated connectors if total interconnect voltage loss exceeds 5% of supply rails. Thermal imaging during prototype validation is recommended for any continuous current scenario above 2A per pin.
What are the maintenance or cleaning requirements for the MTSW-106-09-F-D-475 in field or laboratory environments where connectors may be repeatedly mated in dusty or humid conditions?
The MTSW-106-09-F-D-475 is unshrouded, exposing gold-plated mating contacts directly to environmental contamination. In controlled laboratory or indoor environments, minimal maintenance is required; the gold finish resists oxidation and provides long-term reliability without active cleaning. In field environments with elevated dust, salt spray, or humidity, periodic inspection and dry compressed air cleaning (80–100 psi, no liquids) can remove particulate contamination that may increase contact resistance over time. The MSL 1 rating of the MTSW-106-09-F-D-475 indicates low moisture absorption by the polyester glass-filled insulation, reducing risk of electrical leakage paths between adjacent positions. For marine, outdoor, or high-humidity applications, protective caps or conformal coating over the connector assembly are recommended to minimize corrosion of exposed phosphor bronze contact tails and reduce environmental ingress. Mating cycle intervals and contact inspection schedules should follow application-specific reliability requirements; connectors with visible corrosion or insertion resistance exceeding nominal force should be replaced.
How does the MTSW-106-09-F-D-475 compare to traditional DIP or IDC header connectors in terms of ease of assembly and rework accessibility?
The MTSW-106-09-F-D-475 through-hole design contrasts with surface-mount alternatives in assembly accessibility. Through-hole posts on the MTSW-106-09-F-D-475 are longer (0.155" / 3.94 mm post length) than typical SMD footprints, allowing visual inspection of solder joint quality from the board underside and facilitating hand soldering or repair with standard iron temperatures (350–375°C). The 0.100" pitch of the MTSW-106-09-F-D-475 permits insertion of standard 0.1" pitch desoldering braid or solder wick, enabling rapid rework without specialized vacuum equipment. Compared to IDC (insulation-displacement) connectors, the MTSW-106-09-F-D-475 requires individual pin soldering but eliminates the risk of incomplete wire seating or contact corrosion inherent to IDC designs. The push-pull fastening on the MTSW-106-09-F-D-475 allows quick mechanical disconnection for field replacement without de-soldering, making it preferable to permanently soldered alternatives in prototyping and low-volume production environments.
What EMI or crosstalk concerns apply when routing signal and power pins in proximity on the MTSW-106-09-F-D-475, and are signal integrity measures recommended for mixed-signal designs?
The MTSW-106-09-F-D-475 unshrouded header design provides no electromagnetic shielding between adjacent positions, resulting in capacitive and inductive coupling between signal paths. On a 2-row 12-position header like the MTSW-106-09-F-D-475, adjacent pins (0.100" spacing) experience cross-talk of approximately 10–30 pF of inter-pin capacitance, sufficient to couple high-speed switching transients between nearby traces. In mixed-signal designs, ground pins should be strategically placed in the MTSW-106-09-F-D-475 between analog and digital signal groups to act as shields and reduce capacitive coupling. Routing differential pairs symmetrically through the MTSW-106-09-F-D-475 (if the application supports it) minimizes common-mode noise injection. For applications sensitive to EMI (e.g., precision analog measurement or wireless transceivers), the MTSW-106-09-F-D-475 is best paired with shielded cables and ferrite suppression at the board interface. Simulations or empirical measurements using network analyzer or time-domain reflectometry (TDR) are recommended for validation in noise-critical designs.
Does the MTSW-106-09-F-D-475 support panelization or automated pick-and-place assembly, and what are the dimensional tolerances for machine vision registration?
The MTSW-106-09-F-D-475 is a through-hole component with a rigid polyester glass-filled insulation body, making it compatible with automated insertion equipment (AXE) rather than pick-and-place SMD handling. The overall contact length of 0.730" (18.54 mm) and 0.100" (2.54 mm) insulation height provide sufficient mechanical registration for standard lead-forming and insertion tooling. For panelized PCB arrays, the MTSW-106-09-F-D-475 can be inserted in continuous strips without special fixturing. Machine vision registration tolerances for the MTSW-106-09-F-D-475 depend on lead spacing accuracy; with 0.100" nominal pitch and typical PCB tolerance of ±0.010", insertion machines can achieve consistent seating within ±0.050" of nominal insertion depth. The cuttable header feature of the MTSW-106-09-F-D-475 complicates high-volume panelization if custom lengths are required per product variant; standardized 12-position configurations simplify automation and reduce setup complexity.
What cost and supplier continuity advantages does the MTSW-106-09-F-D-475 offer compared to proprietary or niche connector ecosystems, and how does RoHS3 compliance affect sourcing?
The MTSW-106-09-F-D-475 is manufactured by Samtec Inc., a high-volume connector supplier with multi-factory production capacity and established distribution through major electronics distributors. The 0.100" pitch and 2-row standard geometry ensure broad compatibility with industry-standard mating headers and aftermarket alternatives, reducing lock-in risk compared to proprietary connectors. RoHS3 compliance of the MTSW-106-09-F-D-475 confirms lead-free solder compatibility and compliance with EU directive 2015/863/EU, eliminating uncertainty in supply chain certification and reducing qualification burden for OEMs supplying European or regulated markets. Samtec's published datasheets and wide availability make design documentation and long-term sourcing predictable; the MTSW-106-09-F-D-475 is unlikely to experience obsolescence in the medium term (5–10 years) due to commodity demand. MSL 1 status of the MTSW-106-09-F-D-475 further reduces supply chain complexity by eliminating bake-out requirements and enabling flexible warehouse storage, lowering total cost of ownership compared to MSL 3 components requiring climate-controlled storage.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTSW-106-09-F-D-475

Product Attribute MTSW-106-09-F-D-400-RA MTSW-106-09-F-D-430-RA MTSW-106-09-F-D-530 MTSW-106-09-F-D-240-RA
Part Number MTSW-106-09-F-D-400-RA MTSW-106-09-F-D-430-RA MTSW-106-09-F-D-530 MTSW-106-09-F-D-240-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Series - - - -
Insulation Height - - - -
Contact Finish - Mating - - - -
Voltage Rating - - - -
Contact Type - - - -
Material Flammability Rating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish Thickness - Mating - - - -
Number of Positions - - - -
Termination - - - -
Ingress Protection - - - -
Number of Rows - - - -
Fastening Type - - - -
Contact Length - Mating - - - -
Mated Stacking Heights - - - -
Overall Contact Length - - - -
Insulation Color - - - -
Contact Length - Post - - - -
Number of Positions Loaded - - - -
Applications - - - -
Contact Shape - - - -
Contact Finish - Post - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Style - - - -
Insulation Material - - - -
Connector Type - - - -
Current Rating (Amps) - - - -
Row Spacing - Mating - - - -
Pitch - Mating - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - Post - - - -
Features - - - Simultaneous Sampling
Shrouding - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Material - - - -

MTSW-106-09-F-D-475 Datasheet PDF

Download MTSW-106-09-F-D-475 pdf datasheets and Samtec Inc. documentation for MTSW-106-09-F-D-475 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Samtec Inc.

MTSW-106-09-F-D-475

Samtec Inc.
98D-MTSW-106-09-F-D-475

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