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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTSW-113-24-L-D-290
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MTSW-113-24-L-D-290 - Samtec Inc.

Manufacturer Part Number
MTSW-113-24-L-D-290
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTSW-113-24-L-D-290
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
47,537 pcs available, New & Original
Parts Description
CONN HEADER VERT 26POS 2.54MM
Package
Bulk
Data sheet
MTSW-113-24-L-D.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 47537
  • Unit Price: $3.79
  • Subtotal: $0.00

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Specifications

MTSW-113-24-L-D-290 Tech Specifications
Samtec Inc. - MTSW-113-24-L-D-290 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTSW-113-24-L-D-290

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.480" (12.19mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 26
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polyester, Glass Filled
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.090" (2.29mm)
Contact Length - Mating 0.290" (7.37mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header, Cuttable
Base Product Number MTSW-113
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the MTSW-113-24-L-D-290 and standard 0.100" pitch headers when designing for high-temperature applications?
The MTSW-113-24-L-D-290 operates across -55°C to 125°C, making it suitable for automotive and industrial environments where temperature cycling stress occurs. The phosphor bronze contact material with gold mating finish (10.0µin thickness) resists oxidation better than unfinished alternatives across this temperature range. The 0.290" mating contact length provides robust engagement despite thermal expansion/contraction cycles. Standard headers often use shorter contact lengths or inferior finishes, which can develop high contact resistance at temperature extremes. The MTSW-113-24-L-D-290's through-hole mounting and solder termination distribute thermal stress more evenly than surface-mount alternatives, reducing localized heating at the contact interface during high-current transients.
How does the 26-position, 2-row configuration of the MTSW-113-24-L-D-290 affect signal integrity in mixed-signal PCB layouts?
The MTSW-113-24-L-D-290 presents 26 pins in a compact 2-row arrangement with 0.100" pitch spacing in both directions. This density requires careful ground plane management; the dual-row format creates asymmetric current return paths compared to single-row headers. Designers should interleave ground pins between signal pairs on the MTSW-113-24-L-D-290 to minimize crosstalk, particularly when high-speed or sensitive analog signals share adjacent pins. The 0.100" row spacing (2.54mm) is tighter than many professional connectors, so differential pair skew within the MTSW-113-24-L-D-290 can impact signals above 50 MHz. For mixed-signal applications, segregating power, ground, and signal groups across the connector's 26 positions reduces EMI coupling between domains.
Can the MTSW-113-24-L-D-290 be field-configured by cutting unwanted sections, and what reliability trade-offs apply?
The MTSW-113-24-L-D-290 is listed as cuttable, allowing users to reduce the 26-position header to fewer positions for prototyping or low-volume builds. Cutting introduces two reliability considerations: first, the cut edge exposes the insulation material (polyester, glass-filled) and underlying contact structures to moisture ingress if not sealed; second, the solder joints near the cut area experience altered stress distribution during thermal cycling, as the load is no longer evenly distributed across all positions. If cutting the MTSW-113-24-L-D-290, apply conformal coating or potting around cut ends to maintain moisture barrier integrity, especially in high-humidity or outdoor environments. For production designs, custom-length versions are preferable to field-cut MTSW-113-24-L-D-290 headers to avoid latent field failures.
What is the current-handling capability of individual pins in the MTSW-113-24-L-D-290, and how does pin-to-pin current sharing affect thermal design?
The MTSW-113-24-L-D-290 is rated for 3A total current across the connector. With 26 positions available, this translates to approximately 115 mA per pin if current distributes evenly, though real designs rarely achieve perfect distribution. If the MTSW-113-24-L-D-290 carries power rails on multiple pins, unequal current sharing occurs due to solder joint resistance variance (typically ±10%); pins with lower contact resistance draw proportionally more current and dissipate more heat. For a single 3A rail on the MTSW-113-24-L-D-290, use multiple pins in parallel (3–4 positions) to reduce I²R losses and prevent localized hot spots that accelerate contact corrosion. The phosphor bronze contact material and tin post finish of the MTSW-113-24-L-D-290 tolerate sustained 2–2.5A on a single pin within the -55°C to 125°C operating range, but thermal modeling is essential for currents above 1.5A to avoid exceeding the 125°C ambient limit at the mating interface.
How does the gold mating surface finish on the MTSW-113-24-L-D-290 compare to tin or nickel finishes for long-term contact resistance stability?
The MTSW-113-24-L-D-290 uses 10.0µin (0.25µm) gold on the mating contact surface, which provides superior fretting corrosion resistance compared to tin or bare copper across humidity and thermal cycling. Gold's noble properties resist sulfide tarnishing and maintain lower contact resistance during thousands of mating cycles. However, the thin 0.25µm gold layer on the MTSW-113-24-L-D-290 is susceptible to mechanical wear-through if mated connectors experience lateral misalignment or excessive insertion force; exposure of the underlying nickel or copper creates galvanic corrosion risk. Tin-plated alternatives (such as the post finish of the MTSW-113-24-L-D-290) are cheaper but develop oxide layers under thermal stress, increasing contact resistance by 10–50% over 5–10 years in industrial environments. For mission-critical or long-life applications where contact resistance stability exceeds cost concerns, the MTSW-113-24-L-D-290's gold finish warrants the premium; for consumer or short-lifecycle products, tin-finish variants may suffice if contact resistance budgets are relaxed.
What are the insertion force and mating cycle limits for the MTSW-113-24-L-D-290, and how do these affect connector selection for frequently reconfigured test fixtures?
The MTSW-113-24-L-D-290 datasheet does not explicitly specify insertion force or guaranteed mating cycle counts. For 0.100" pitch headers with similar geometry, industry norms suggest 50–100 gf insertion force per pin (1.3–2.6 N total for 26 positions). Mating cycle endurance for unshrouded headers like the MTSW-113-24-L-D-290 typically ranges from 50–200 cycles before contact wear becomes noticeable. If a design requires frequent mating (>100 cycles), contact Samtec for accelerated life test data specific to the MTSW-113-24-L-D-290. Test fixtures and development boards should pair the MTSW-113-24-L-D-290 with keyed mating connectors or polarization features to prevent misalignment wear; unguided insertion dramatically reduces effective cycle life. For permanent or infrequent connections, the MTSW-113-24-L-D-290 is adequate; for high-cycle applications, consider shrouded or latched variants with defined engagement geometry.
How does the 0.290" mating contact length of the MTSW-113-24-L-D-290 affect PCB trace routing and ground plane continuity near the connector footprint?
The MTSW-113-24-L-D-290 specifies 0.290" (7.37mm) mating contact length, meaning the pin extends 7.37mm above the PCB surface. This extended reach accommodates thicker PCBs (up to ~6mm) or stacked assemblies without losing electrical contact, but it also extends the effective trace length from the mating point to the solder joint. For high-speed signals routed through the MTSW-113-24-L-D-290, this 7.37mm air gap between mating contact and PCB acts as a transmission line stub, increasing signal reflections at frequencies above 50–100 MHz. Ground plane under the MTSW-113-24-L-D-290 connector should be continuous, and ground pins distributed throughout the 26-position array minimize return path length. The long contact of the MTSW-113-24-L-D-290 also allows insertion of wire leads or flexible connector shells; designers can route signals immediately below the mating plane, reducing trace inductance compared to designs where signal traces must serpentine around the connector body.
What enclosure design constraints apply when integrating the MTSW-113-24-L-D-290 into sealed or potted assemblies?
The MTSW-113-24-L-D-290 is unshrouded, meaning the polyester glass-filled insulation and contacts are exposed. In sealed enclosures, conformal coating or potting compound must be applied carefully to avoid trapping moisture between the coating and the header body. The MTSW-113-24-L-D-290's polyester insulation material has moisture absorption rates of 0.8–1.2% by weight; if potted without drying, absorbed moisture can cause contact resistance drift or insulation failure during thermal cycling. For fully potted designs, pre-bake the assembled PCB with the MTSW-113-24-L-D-290 at 80–90°C for 4–8 hours to drive off absorbed moisture before potting. The UL94 V-0 flammability rating of the MTSW-113-24-L-D-290 allows use in potting compounds rated V-0 or higher; incompatible potting chemistries may dissolve or soften the polyester insulation. Sealed designs using the MTSW-113-24-L-D-290 should include desiccant breathers or vents during curing to allow solvent evaporation without trapping pressure.
How do the square contact pins of the MTSW-113-24-L-D-290 simplify PCB layout compared to round pin alternatives?
The MTSW-113-24-L-D-290 features square contact pins rather than circular, which reduces the via hole diameter required for through-hole mounting. Square pins of the MTSW-113-24-L-D-290 typically allow 0.036–0.040" drilled holes versus 0.045–0.050" for equivalent round pins, freeing up PCB routing density and reducing breakout trace congestion around the connector footprint. The square geometry of the MTSW-113-24-L-D-290 also provides mechanical keying benefits: with careful design, a mating connector can be precision-molded to align with square pin geometry, reducing insertion misalignment risk compared to round pins. However, square pin solder fillets on the MTSW-113-24-L-D-290 can exhibit stress concentration at corners during thermal cycling; PCB designers should ensure adequate solder fillet coverage at all four edges of each square pin to distribute thermal fatigue stress uniformly.
What precautions apply when using the MTSW-113-24-L-D-290 in RoHS3 compliant assemblies, and are there compatibility issues with lead-free solder reflow profiles?
The MTSW-113-24-L-D-290 is marked RoHS3 compliant, confirming that mating surfaces and termination materials meet lead-free cadmium, lead, and other restricted substance limits. The tin post finish of the MTSW-113-24-L-D-290 is fully compatible with lead-free solder (SAC305, SN100C) reflow at 250–260°C peak temperatures. The phosphor bronze contact material of the MTSW-113-24-L-D-290 does not embrittle under lead-free reflow conditions. However, the thin 0.25µm gold mating finish of the MTSW-113-24-L-D-290 can suffer thermal shock if peak reflow temperature exceeds 260°C or ramp rates exceed 6°C/s; the gold layer may temporarily soften and allow copper diffusion, creating contact resistance anomalies post-reflow. For the MTSW-113-24-L-D-290, validate that reflow oven profiles maintain peak temperatures below 255°C and cooling ramps below 5°C/s. Post-reflow solder joint inspection of the MTSW-113-24-L-D-290 should confirm full wetting of the tin post finish and check for solder voiding, which increases resistance under thermal cycling.
How do ambient humidity and storage conditions affect the MTSW-113-24-L-D-290 before assembly, and what MSL equivalents should be assumed for supply chain planning?
The MTSW-113-24-L-D-290 lists Moisture Sensitivity Level (MSL) as "Not Applicable," indicating that the connector is not subject to the reflow-triggered moisture desorption failures that plague IC packages. The MTSW-113-24-L-D-290 can be stored in standard warehouse conditions (23°C, 40–60% RH) without baking before assembly. However, the polyester glass-filled insulation of the MTSW-113-24-L-D-290 absorbs ambient moisture over months of storage; long-term exposure (>6 months in high-humidity environments) can increase electrical leakage between adjacent pins on the MTSW-113-24-L-D-290 from <10^11 Ω to 10^9–10^10 Ω. For high-voltage designs (>48V) or sensitive analog circuits where leakage current becomes a concern, store the MTSW-113-24-L-D-290 in dry-pack bags with desiccant for extended shelf life. Before hand-assembly of the MTSW-113-24-L-D-290 into prototypes, brief room-temperature bake (60°C for 2 hours) is optional but not critical; production wave-solder or reflow temperatures naturally dry the polyester insulation of the MTSW-113-24-L-D-290.
What are the electrical leakage and insulation resistance specifications of the MTSW-113-24-L-D-290, and how do these parameters degrade under combined temperature and humidity stress?
The MTSW-113-24-L-D-290 datasheet does not quantify insulation resistance between adjacent pins or to ground. For unshrouded 0.100" pitch headers, industry baselines suggest >10^11 Ω initial insulation resistance at 25°C, 50% RH. The MTSW-113-24-L-D-290's polyester glass-filled insulation degrades under combined thermal and humidity stress (85°C / 85% RH): insulation resistance typically drops 1–2 orders of magnitude over 500–1000 hours due to moisture-induced leakage paths forming in the hygroscopic insulation material. For applications where leakage current must remain <1 µA (such as precision analog sensors or high-impedance signal chains), the MTSW-113-24-L-D-290 should operate at temperatures below 60°C and humidity below 50% RH, or alternately, designs should tolerate expected leakage degradation. Conformal coating of the MTSW-113-24-L-D-290 assembly with parylene or acrylic reduces moisture ingress and stabilizes insulation resistance over product life. Request insulation resistance test data from Samtec for specific humidity profiles if the MTSW-113-24-L-D-290 design margins are tight.
How does the push-pull fastening mechanism of the MTSW-113-24-L-D-290 simplify disconnection under PCB space constraints compared to shrouded alternatives?
The MTSW-113-24-L-D-290 employs push-pull fastening, meaning the mating connector engages by pushing straight onto the header pins and disengages by pulling straight away. This design eliminates latch arms, shrouds, or side-release mechanisms that protrude beyond the connector body footprint. In confined PCB layouts where adjacent components leave minimal access space, the MTSW-113-24-L-D-290's minimal lateral envelope (determined solely by the 26-pin 0.100" pitch array) allows personnel to disconnect and reconnect with only straight-line access from above. Conversely, the push-pull mechanism of the MTSW-113-24-L-D-290 offers no mechanical retention; accidental vibration or repeated thermal expansion can cause partial disengagement, creating intermittent contacts. For vibration-prone environments (industrial machinery, aerospace), the MTSW-113-24-L-D-290 should be supplemented with mechanical strain relief or adhesive bonding; designers cannot rely solely on friction fit. Test fixtures and laboratory development boards benefit most from the MTSW-113-24-L-D-290's simple engagement; production systems should consider latched or keyed connector variants to prevent inadvertent disconnection.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTSW-113-24-L-D-290

Product Attribute MTSW-113-24-L-D-280 MTSW-113-24-L-D-250 MTSW-113-24-L-S-290-LL MTSW-113-24-L-D-260
Part Number MTSW-113-24-L-D-280 MTSW-113-24-L-D-250 MTSW-113-24-L-S-290-LL MTSW-113-24-L-D-260
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Type - - - -
Contact Finish Thickness - Mating - - - -
Contact Finish Thickness - Post - - - -
Contact Material - - - -
Number of Positions - - - -
Fastening Type - - - -
Contact Length - Mating - - - -
Overall Contact Length - - - -
Pitch - Mating - - - -
Material Flammability Rating - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current Rating (Amps) - - - -
Number of Positions Loaded - - - -
Mated Stacking Heights - - - -
Voltage Rating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Shrouding - - - -
Style - - - -
Insulation Color - - - -
Series - - - -
Connector Type - - - -
Termination - - - -
Insulation Material - - - -
Contact Finish - Mating - - - -
Features - - - Simultaneous Sampling
Row Spacing - Mating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish - Post - - - -
Applications - - - -
Contact Length - Post - - - -
Number of Rows - - - -
Ingress Protection - - - -
Insulation Height - - - -
Contact Shape - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

MTSW-113-24-L-D-290 Datasheet PDF

Download MTSW-113-24-L-D-290 pdf datasheets and Samtec Inc. documentation for MTSW-113-24-L-D-290 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Samtec Inc.

MTSW-113-24-L-D-290

Samtec Inc.
98D-MTSW-113-24-L-D-290

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