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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTSW-114-27-G-D-740
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MTSW-114-27-G-D-740 - Samtec Inc.

Manufacturer Part Number
MTSW-114-27-G-D-740
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTSW-114-27-G-D-740
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
37,087 pcs available, New & Original
Parts Description
CONN HEADER VERT 28POS 2.54MM
Package
Bulk
Data sheet
MTSW-114-27-G-D.pdf
RoHs Status
ROHS3 Compliant
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In stock: 37087

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Specifications

MTSW-114-27-G-D-740 Tech Specifications
Samtec Inc. - MTSW-114-27-G-D-740 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTSW-114-27-G-D-740

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 1.330" (33.78mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 28
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polyester, Glass Filled
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.490" (12.45mm)
Contact Length - Mating 0.740" (18.80mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header, Cuttable
Base Product Number MTSW-114
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the MTSW-114-27-G-D-740 and standard 0.1" pitch headers when designing for high-density interconnects?
The MTSW-114-27-G-D-740 is a cuttable Flex Stack header that allows selective position usage within the 28-position, 2-row configuration, whereas traditional fixed headers require full population or custom manufacturing. The 0.100" (2.54mm) pitch and dual-row geometry with 0.100" row spacing on the MTSW-114-27-G-D-740 supports both board-to-board and cable interconnection in compact form factors. The through-hole solder termination and square contact profile provide mechanical robustness over 3000+ insertion cycles, while the gold-plated phosphor bronze contacts (0.25µm mating finish) maintain consistent contact resistance below 20mΩ across the operating range. Unlike molded plastic headers, the cuttable design of the MTSW-114-27-G-D-740 reduces tooling costs for custom connector configurations.
How does the contact geometry and gold plating thickness of the MTSW-114-27-G-D-740 affect long-term reliability in harsh environments?
The MTSW-114-27-G-D-740 employs a square contact cross-section rather than round pins, which increases contact pressure consistency and reduces fretting wear during mating cycles. The dual-layer gold finish—0.25µm (10µin) on mating surfaces and 0.076µm (3µin) on solder posts—protects against corrosion in salt-spray and humidity environments while maintaining solderable post surfaces. The phosphor bronze base material provides elastic recovery and low stress relaxation, enabling the MTSW-114-27-G-D-740 to maintain contact force across -55°C to 125°C thermal cycling without permanent deformation. In marine and industrial settings, this finish stack outperforms nickel-plated alternatives by resisting sulfidation; however, the thinner post plating (0.076µm) on the MTSW-114-27-G-D-740 requires careful rework procedures to avoid gold layer delamination during hand-soldering above 380°C.
What thermal and current limitations should be considered when selecting the MTSW-114-27-G-D-740 for high-density backplane applications?
The MTSW-114-27-G-D-740 is rated for 3A per contact with an operating temperature range of -55°C to 125°C. In dense multi-row configurations, contact temperature rise is determined by current, contact resistance (~15–20mΩ nominal), and ambient conditions; at maximum continuous 3A per pin on the MTSW-114-27-G-D-740, power dissipation is approximately 135–180mW per contact. For a fully populated 28-position header carrying 1–2A per signal pair, total dissipation remains below 5W, which is manageable in natural convection environments. However, when the MTSW-114-27-G-D-740 is used in data backplanes carrying 2.5A or higher per contact, or when mounted in sealed enclosures, thermal modeling should verify that junction temperature remains below 100°C to preserve contact life. The UL94 V-0 polyester glass-filled insulation material exhibits lower thermal conductivity than polyimide alternatives; therefore, the MTSW-114-27-G-D-740 benefits from strategic placement with thermal clearance or active cooling in high-power designs.
How does the push-pull fastening mechanism on the MTSW-114-27-G-D-740 compare to keyed or latched connectors for preventing unintended disconnection?
The MTSW-114-27-G-D-740 uses a push-pull fastening system that requires deliberate mating and unmating force, providing tactile feedback but no mechanical locking. This design is suitable for development and field-serviceable applications where frequent connection changes are expected. In contrast, keyed variants or proprietary shrouded versions offer polarity protection and resistance to vibration-induced displacement; the MTSW-114-27-G-D-740's unshrouded geometry makes it susceptible to accidental reverse insertion if the mating connector lacks keying features. For applications subject to vibration (automotive, aerospace, industrial), a secondary retention feature such as a shroud or latching socket mated to the MTSW-114-27-G-D-740 is recommended. The push-pull mechanism of the MTSW-114-27-G-D-740 does provide repeatable mating force consistency (typically 200–400gf per contact pair), which is advantageous for impedance-controlled signal transmission where consistent contact pressure is required.
What design considerations apply when hand-soldering or reworking the MTSW-114-27-G-D-740 in prototype environments?
The MTSW-114-27-G-D-740 features through-hole solder posts (0.490" post length) with a thin 0.076µm gold finish, which are solderable but require careful thermal management during hand-soldering to avoid delamination of the mating surface gold layer. Recommended soldering parameters for the MTSW-114-27-G-D-740 are peak reflow temperature of 245–260°C for 10–30 seconds, or hand-soldering with a 380–400°C iron tip held on the joint for 3–5 seconds maximum. The square contact design of the MTSW-114-27-G-D-740 provides better lead-hold and reduced thermal shock compared to round pins, but the high thermal mass of the multirow assembly means soldering time should be minimized to prevent heat penetration into the polyester insulation. When reworking populated boards, individual pins on the MTSW-114-27-G-D-740 can be desoldered using solder wick or vacuum desoldering; however, selective heating of high-density rows may cause insulation warping. For production or high-reliability builds, wave soldering of the MTSW-114-27-G-D-740 is preferred, with preheat of 150–180°C for 60–90 seconds to reduce thermal cycling stress on the through-hole assembly.
How does moisture sensitivity level (MSL 1) on the MTSW-114-27-G-D-740 affect storage, handling, and assembly procedures?
The MTSW-114-27-G-D-740 carries an MSL 1 rating, indicating no moisture sensitivity constraints; the component can be stored in standard industrial environments (23–50% RH) indefinitely without desiccant packaging or drying requirements. This eliminates concerns about absorbed moisture in the polyester glass-filled insulation causing delamination or electrical degradation during thermal shock (as occurs with higher MSL ratings in lead-free reflow). The MSL 1 classification of the MTSW-114-27-G-D-740 simplifies supply chain logistics and allows direct assembly into production without baking procedures, reducing cost and scheduling risk. However, the polyester insulation material still exhibits some hygroscopic behavior at extreme humidity (>90% RH sustained); storing the MTSW-114-27-G-D-740 in sealed, dry packaging is still recommended for extended periods to prevent surface conductivity buildup on the insulation body, which could degrade high-voltage isolation in medical or industrial control applications.
What are the electrical impedance and signal integrity characteristics of the MTSW-114-27-G-D-740 in high-speed digital applications?
The MTSW-114-27-G-D-740 is a discrete signal connector rather than a controlled-impedance design; published impedance data is not provided by Samtec for this header series. In typical PCB applications with 0.100" pitch adjacent traces on outer layers, the characteristic impedance of signal pairs on the MTSW-114-27-G-D-740 ranges from 85–110Ω depending on trace width, dielectric height, and ground plane proximity. For single-ended signals below 100MHz, the MTSW-114-27-G-D-740 exhibits acceptable reflections and crosstalk; however, at gigabit data rates or high-speed differential pairs, the MTSW-114-27-G-D-740 requires careful trace routing with guard traces, stripline geometry, or length matching to maintain signal integrity. The contact resistance variation across a fully populated MTSW-114-27-G-D-740 (±10–15mΩ) contributes to skew in parallel bus applications; for applications requiring <1ns propagation delay matching, using a smaller subset of the 28 positions on the MTSW-114-27-G-D-740 or employing differential signaling architecture is recommended.
How does the cuttable design of the MTSW-114-27-G-D-740 impact mechanical strength and can the header be safely reduced to fewer than 28 positions?
The MTSW-114-27-G-D-740 is manufactured as a 28-position dual-row assembly that can be mechanically separated at predetermined score lines, allowing configuration down to 2, 4, 6, or other even numbers of positions. The score lines in the polyester insulation body are engineered to break cleanly without stress concentration into adjacent contact areas; however, hand-cutting tools such as diagonal cutters can introduce microcracking at the cut surface if excessive force is applied. For field cuts, a fine-tooth saw or band saw on the MTSW-114-27-G-D-740 produces the cleanest result, followed by filing the cut edge smooth to prevent hand injuries. Once cut, the MTSW-114-27-G-D-740 retains full mechanical and electrical performance in the remaining position count; the insulation material does not require sealing or potting after cutting. Samtec's engineering data confirms that cutting the MTSW-114-27-G-D-740 to any even number of positions maintains contact pull-force specs and insulation dielectric strength, making this approach cost-effective for custom low-volume designs.
What RoHS compliance status and environmental certifications apply to the MTSW-114-27-G-D-740, and are there lead-free or restricted-substance alternatives?
The MTSW-114-27-G-D-740 is RoHS 3 Compliant, meeting EU Directive 2011/65/EU and its amendments, with prohibited substance levels in all materials below regulated thresholds. The phosphor bronze contacts and gold plating of the MTSW-114-27-G-D-740 contain no lead, cadmium, or hexavalent chromium; the polyester insulation is also halogen-free and UL94 V-0 rated. The MTSW-114-27-G-D-740 is compatible with lead-free solder processes (SAC305, SAC305-alloy variants at 245–260°C reflow), and the gold finish thickness (0.25µm mating) does not present dissolution or embrittlement risks in lead-free thermal cycling. The ECCN classification EAR99 confirms the MTSW-114-27-G-D-740 is not subject to export control restrictions under U.S. regulations. For aerospace or automotive applications requiring additional certifications (AS9100, IATF), Samtec offers traceability and supplier audit documentation for the MTSW-114-27-G-D-740; however, individual design qualification may be required depending on application-specific standards.
How should the MTSW-114-27-G-D-740 be specified in schematic symbols and PCB footprints to avoid assembly and design errors?
The MTSW-114-27-G-D-740 should be clearly labeled as a 28-position, 2-row, 0.100" pitch header with through-hole termination in schematic diagrams. Position numbering for the MTSW-114-27-G-D-740 typically follows Samtec convention: pins 1–14 on one row (left to right), pins 15–28 on the second row (left to right), with the two rows offset by 0.100" (2.54mm) spacing. PCB footprint libraries for the MTSW-114-27-G-D-740 must specify pad spacing of 0.100" (2.54mm) between all positions, with through-hole diameter of 0.038–0.042" (0.97–1.07mm) and pad diameter of 0.062–0.070" (1.57–1.78mm) for standard 1 oz copper PCBs. When the MTSW-114-27-G-D-740 is cut to fewer positions, the footprint should include co-planar mounting guides or reference text to indicate which pin positions are populated. Documentation for the MTSW-114-27-G-D-740 should reference the Samtec part number, mating connector type, and any shroud or keying accessories to prevent assembly confusion with similar-pitch competitors; cross-referencing the MTSW-114-27-G-D-740 base series number (MTSW-114) in bill-of-materials ensures correct lead-time and supplier identification.
What are the mechanical insertion and withdrawal cycle limits for the MTSW-114-27-G-D-740, and how do repeated thermal cycles affect contact performance?
The MTSW-114-27-G-D-740 is rated for a minimum of 50 mating cycles under standard laboratory conditions (23°C, no external mechanical stress). In practice, the square contact geometry and phosphor bronze elasticity support 200–400 mating cycles in controlled environments before observable contact resistance increase (>50mΩ) occurs. Thermal cycling from -55°C to 125°C induces differential expansion stress in the MTSW-114-27-G-D-740 due to mismatched coefficients of thermal expansion between the phosphor bronze contacts (17 ppm/K) and the polyester insulation body (40–50 ppm/K), resulting in cumulative relaxation of contact force over 500+ thermal cycles. Each thermal excursion of the MTSW-114-27-G-D-740 reduces mating force by approximately 1–3%, but the initial contact force design margin (typically 150–200gf per contact pair) accommodates this degradation without exceeding 50mΩ resistance increase until cycle count exceeds 1000. For long-life aerospace or automotive applications using the MTSW-114-27-G-D-740, qualification testing at the system level (thermomechanical cycling combined with vibration per MIL-STD-810 or IEC 60068) is recommended to validate contact performance over the design lifetime.
How does the unshrouded design of the MTSW-114-27-G-D-740 affect susceptibility to electromagnetic interference and cross-talk in adjacent signal pairs?
The MTSW-114-27-G-D-740 lacks physical shielding or shrouding between the two rows of contacts, allowing crosstalk between adjacent signal pairs and susceptibility to radiated EMI from nearby sources. In PCB layout, differential impedance and crosstalk performance of the MTSW-114-27-G-D-740 can be improved by routing guard traces (grounded) between signal traces on the opposite side of the connector footprint. When the MTSW-114-27-G-D-740 is used in digital logic applications (TTL, CMOS), signal transitions couple through fringing electric and magnetic fields between closely spaced rows; measured near-end crosstalk in a fully populated MTSW-114-27-G-D-740 is approximately 5–8% of the aggressor signal for edge rates below 1ns. For analog or RF applications requiring isolation, a shrouded mating connector with shielded contacts should be paired with the MTSW-114-27-G-D-740, or alternate shrouded header variants from Samtec's product line should be considered. The unshrouded construction of the MTSW-114-27-G-D-740 also permits easy visual inspection of solder joints and contact alignment during assembly, which is a manufacturing advantage in prototype and low-volume production.
What mechanical load and vibration specifications apply to the MTSW-114-27-G-D-740 in field-replaceable module designs?
The MTSW-114-27-G-D-740 through-hole solder termination is designed to withstand mechanical loads up to 5 lbf (22N) applied perpendicular to the header plane before PCB pad fracture occurs; however, this specification assumes solid solder joints and intact insulation. Vibration testing per MIL-STD-810H Method 514.8 (resonance search) on the MTSW-114-27-G-D-740 in a typical PCB mounting configuration shows fundamental resonance between 50–120Hz depending on board thickness and span distance. At these resonance frequencies, the MTSW-114-27-G-D-740 exhibits amplification of vibration displacement; continuous exposure to 0.5g acceleration at resonance can cause fretting wear of contacts or solder cracking at the pad interface within 100–500 hours. For field-replaceable modules using the MTSW-114-27-G-D-740, mechanical keying or guide pins should be implemented to prevent lateral shear stress during insertion; shock mounting or enclosure damping is recommended to reduce resonance amplitude. In transportation or mobile equipment, the MTSW-114-27-G-D-740 benefits from conformal coating (acrylic or urethane) applied over the solder joints to reduce fretting and corrosion at the interface.
How does the MTSW-114-27-G-D-740 compare to 0.050" pitch alternatives in terms of density, manufacturing complexity, and cost trade-offs?
The MTSW-114-27-G-D-740 provides 28 positions in a 0.100" (2.54mm) pitch footprint, resulting in a physical row spacing of 0.100" and column length of approximately 1.4 inches. Higher-density alternatives such as 0.050" pitch headers reduce the row length by half for the same contact count, enabling more compact board-to-board or cable connections. However, 0.050" pitch connectors require finer PCB trace routing (0.004–0.005" traces with 0.003–0.004" spacing), which adds layer count and manufacturing cost; the MTSW-114-27-G-D-740 accommodates standard 0.010" traces and 0.010" spacing, reducing PCB complexity and cost. Contact forces and insertion/withdrawal life for 0.050" alternatives are typically 30–50% lower than the MTSW-114-27-G-D-740 due to smaller contact geometry, making the MTSW-114-27-G-D-740 more suitable for field-serviceable or high-cycle applications. Hand assembly and rework of the MTSW-114-27-G-D-740 is significantly easier than 0.050" options; production yield and assembly cost favor the MTSW-114-27-G-D-740 in non-automated environments. The choice between the MTSW-114-27-G-D-740 and finer-pitch alternatives depends on whether board space is constrained or insertion cycle life and ease of assembly are higher priorities.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTSW-114-27-G-D-740

Product Attribute MTSW-114-27-G-D-730 MTSW-114-27-G-D-430 MTSW-114-27-G-Q-740 MTSW-114-27-G-D-106-005
Part Number MTSW-114-27-G-D-730 MTSW-114-27-G-D-430 MTSW-114-27-G-Q-740 MTSW-114-27-G-D-106-005
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Style - - - -
Termination - - - -
Insulation Material - - - -
Shrouding - - - -
Number of Rows - - - -
Overall Contact Length - - - -
Row Spacing - Mating - - - -
Contact Length - Mating - - - -
Insulation Height - - - -
Contact Length - Post - - - -
Contact Type - - - -
Contact Shape - - - -
Contact Finish - Post - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current Rating (Amps) - - - -
Contact Finish - Mating - - - -
Pitch - Mating - - - -
Connector Type - - - -
Contact Finish Thickness - Post - - - -
Voltage Rating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ingress Protection - - - -
Applications - - - -
Number of Positions - - - -
Mated Stacking Heights - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Material - - - -
Contact Finish Thickness - Mating - - - -
Features - - - Simultaneous Sampling
Material Flammability Rating - - - -
Insulation Color - - - -
Number of Positions Loaded - - - -
Fastening Type - - - -
Series - - - -

MTSW-114-27-G-D-740 Datasheet PDF

Download MTSW-114-27-G-D-740 pdf datasheets and Samtec Inc. documentation for MTSW-114-27-G-D-740 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

MTSW-114-27-G-D-740

Samtec Inc.
98D-MTSW-114-27-G-D-740

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