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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsMTSW-120-21-T-D-300
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MTSW-120-21-T-D-300 - Samtec Inc.

Manufacturer Part Number
MTSW-120-21-T-D-300
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-MTSW-120-21-T-D-300
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
33,429 pcs available, New & Original
Parts Description
CONN HEADER VERT 40POS 2.54MM
Package
Bulk
Data sheet
MTSW-120-21-T-D.pdf
RoHs Status
ROHS3 Compliant
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Specifications

MTSW-120-21-T-D-300 Tech Specifications
Samtec Inc. - MTSW-120-21-T-D-300 technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - MTSW-120-21-T-D-300

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series Flex Stack, MTSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 1.430" (36.32mm)
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 40
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polyester, Glass Filled
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 1.030" (26.16mm)
Contact Length - Mating 0.300" (7.62mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Header, Cuttable
Base Product Number MTSW-120
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What makes the MTSW-120-21-T-D-300 suitable for applications requiring frequent mating and unmating cycles compared to standard 0.100" headers?
The MTSW-120-21-T-D-300 features a push-pull fastening mechanism and phosphor bronze contacts with tin plating, which together provide repeatable engagement without degradation across many connection cycles. The 0.300" (7.62mm) mating contact length and square contact geometry of the MTSW-120-21-T-D-300 distribute insertion force more evenly than round-pin designs, reducing localized wear on individual contacts. This mechanical design, combined with the glass-filled polyester insulation rated UL94 V-0, makes the MTSW-120-21-T-D-300 well-suited for test fixtures, modular systems, and applications where connectors are regularly disconnected and reconnected without experiencing premature contact degradation.
How does the 0.100" row spacing on the MTSW-120-21-T-D-300 affect PCB layout density and signal integrity in high-speed digital applications?
The MTSW-120-21-T-D-300 maintains 0.100" (2.54mm) spacing between rows, which constrains the minimum trace width and clearance rules on the landing side of the connector. For high-speed digital signals, this tight spacing creates a trade-off: while the MTSW-120-21-T-D-300 delivers compact form factor with 40 positions across only 0.200" of board space, the proximity of return paths and signal traces may require careful impedance control and layer stackup planning. The through-hole solder termination of the MTSW-120-21-T-D-300 introduces via inductance that can affect signal timing on traces faster than 50 MHz; designers should verify that the effective loop inductance of the MTSW-120-21-T-D-300 mounting holes remains within budget for their specific rise times and noise margins.
Can the MTSW-120-21-T-D-300 be field-modified or cut to a smaller pin count, and what precautions apply if partial depopulation is required?
The MTSW-120-21-T-D-300 is specified as a cuttable connector, meaning the header can be mechanically separated into smaller segments without compromising the remaining positions. However, cutting the MTSW-120-21-T-D-300 requires precision tooling to avoid splintering the glass-filled polyester insulation or misaligning the contact rows. After cutting, the cut edge of the MTSW-120-21-T-D-300 should be inspected under magnification for burrs or fractured insulation that could compromise creepage distances or create shorts between rows. If field modification of the MTSW-120-21-T-D-300 is anticipated, it is advisable to specify pre-cut variants or use individual header strips rather than attempting to section the full 40-position assembly, as this preserves mechanical integrity and simplifies assembly validation.
What is the thermal derating profile for the MTSW-120-21-T-D-300 when operating at the upper limit of its -55°C to 105°C temperature range?
The MTSW-120-21-T-D-300 is rated for 3A continuous current at nominal ambient conditions, but no explicit derating curve is provided in standard datasheets. At 105°C operating temperature, the contact resistance of the MTSW-120-21-T-D-300 increases due to reduced tin plating elasticity and higher bulk resistivity of the phosphor bronze conductor. Practical design guidance suggests reducing the MTSW-120-21-T-D-300 continuous current by approximately 10–15% for every 20°C rise above 50°C ambient, particularly in high-density configurations where airflow across the connector is limited. The insulation material of the MTSW-120-21-T-D-300 (glass-filled polyester) maintains its UL94 V-0 rating throughout the specified temperature range, but the transition from 85°C to 105°C represents the region where creep and relaxation of the insulation become more pronounced; connector retention force should be verified after thermal cycling if the MTSW-120-21-T-D-300 is used in applications with sustained elevated temperature.
How does the MTSW-120-21-T-D-300 compare to shrouded alternatives in terms of ESD susceptibility and cross-talk isolation?
The MTSW-120-21-T-D-300 is an unshrouded header, which means adjacent rows and individual pins have no electromagnetic shielding between them. This design choice reduces cost and assembly complexity but increases the risk of capacitive coupling and radiated noise between signal traces routed adjacent to the MTSW-120-21-T-D-300. In contrast, shrouded connectors reduce cross-talk by partitioning rows and providing partial Faraday shielding. For applications with sensitive analog or low-level signal paths, the MTSW-120-21-T-D-300 requires deliberate layer stackup planning (e.g., ground plane directly beneath the connector landing area) and trace routing discipline to minimize coupling. ESD stress applied to one pin of the MTSW-120-21-T-D-300 propagates more readily through the PCB to adjacent pins; designs using the MTSW-120-21-T-D-300 should incorporate series resistors or ferrite filters on entry points to protect sensitive downstream circuitry, or consider shrouded variants if the application involves high ESD event probability.
What soldering challenges are specific to the MTSW-120-21-T-D-300 through-hole pins, and how do lead length and landing pad design influence yield?
The MTSW-120-21-T-D-300 features 1.030" (26.16mm) post length, which extends significantly below the PCB surface and requires careful wave-solder or hand-solder process control. Excessive solder wicking up the post of the MTSW-120-21-T-D-300 reduces mechanical strength at the PCB interface and can cause brittle joints if the connector is subjected to mechanical stress or vibration. Conversely, insufficient solder on the MTSW-120-21-T-D-300 creates cold joints or voids that increase contact resistance and reduce pull-out strength. Landing pad size for the MTSW-120-21-T-D-300 should follow IPC-7351 guidelines for through-hole terminations: typically 0.045"–0.055" diameter with 0.010" annular ring to accommodate solder reflow and thermal cycling. The glass-filled polyester insulation of the MTSW-120-21-T-D-300 is hygroscopic at MSL 1 rating, meaning unlimited shelf life in normal conditions, but post-soldering inspection of the MTSW-120-21-T-D-300 should include thermal stress testing (heating to 125°C for 10 minutes) to verify solder joint integrity before system integration.
Does the MTSW-120-21-T-D-300 accommodate both push-pull and latch-based retention, or is the fastening type fixed to push-pull only?
The MTSW-120-21-T-D-300 is specified with fixed push-pull fastening and does not offer interchangeable or field-convertible retention mechanisms. The push-pull design of the MTSW-120-21-T-D-300 provides tactile feedback during mating and is well-suited for frequently accessed test points or removable modules. However, if an application requires keyed alignment, polarization, or latched retention to prevent accidental disconnection during vibration or mechanical shock, the MTSW-120-21-T-D-300 is not suitable without external mechanical retention hardware (such as guide rails or cable restraints). Samtec offers related products in the Flex Stack series with alternative fastening types, but the MTSW-120-21-T-D-300 specifically locks the design choice to push-pull; attempting to retrofit latching hardware onto the MTSW-120-21-T-D-300 post-manufacturing is not recommended and may compromise the contact alignment or insulation integrity of the connector.
What is the expected contact resistance of the MTSW-120-21-T-D-300 after thermal cycling, and does it remain within typical < 10 mΩ specifications?
The tin-plated phosphor bronze contacts of the MTSW-120-21-T-D-300 exhibit initial contact resistance in the range of 3–8 mΩ per contact pair under 3A nominal load at room temperature. After thermal cycling between -55°C and 105°C, the tin plating on the MTSW-120-21-T-D-300 may develop micro-cracks or lose elasticity, causing contact resistance to drift upward by 20–40% in worst-case scenarios. Repeated thermal stress cycles on the MTSW-120-21-T-D-300 can degrade the mating interface if the connector is unmated and remated during temperature excursions; contact resistance stability of the MTSW-120-21-T-D-300 is best preserved by keeping the connector mated throughout thermal transients. For applications where the MTSW-120-21-T-D-300 must remain unmated during thermal cycling (e.g., stored at -40°C, then used at 85°C ambient), periodic contact cleaning or a pre-mating contact wiping cycle is recommended to remove oxidation films that accumulate on the tin plating and restore the contact resistance of the MTSW-120-21-T-D-300 to baseline.
How does the square contact geometry of the MTSW-120-21-T-D-300 affect mating force and alignment tolerance compared to round-pin headers?
The square contact cross-section of the MTSW-120-21-T-D-300 provides four edge-bearing surfaces, which distributes insertion force more uniformly and reduces the peak stress on any single contact point compared to round-pin designs. This geometry of the MTSW-120-21-T-D-300 allows for tighter manufacturing tolerances on the mating receptacle without requiring excessive insertion force; typical mating force for the MTSW-120-21-T-D-300 is in the range of 1.5–3 lbf per row (roughly 7–13 N total for a 40-position header). However, the square pin geometry of the MTSW-120-21-T-D-300 is less forgiving of angular misalignment during insertion; if the mating receptacle on a cable or daughter board is tilted more than 1–2 degrees during insertion, the edges of the MTSW-120-21-T-D-300 square contacts may bind or scrape the receptacle contact springs, potentially deforming the receptacle or damaging the tin plating of the MTSW-120-21-T-D-300. Designs using the MTSW-120-21-T-D-300 should incorporate alignment features (such as keying slots or guide posts) to ensure perpendicular mating and prevent edge-loading that would prematurely wear the contacts.
Is the MTSW-120-21-T-D-300 RoHS3 compliant, and what are the implications for lead-free solder compatibility?
The MTSW-120-21-T-D-300 is RoHS3 compliant, meaning it is free from restricted substances (lead, cadmium, mercury, etc.) and manufactured without brominated flame retardants in the insulation. The tin plating on the MTSW-120-21-T-D-300 posts is compatible with both lead-free (SAC305, SAC387) and lead-containing solder processes, though lead-free solder reflow of the MTSW-120-21-T-D-300 requires higher peak temperatures (245–260°C vs. 220–230°C for leaded processes). The phosphor bronze material of the MTSW-120-21-T-D-300 exhibits good wettability with lead-free solder but may show slightly increased bridging risk if solder paste volume is not carefully controlled, as the lead-free solder composition has different surface tension and flow characteristics. For high-volume production of boards using the MTSW-120-21-T-D-300, process validation should include solder wetting angle measurements and cross-section analysis to confirm that lead-free solder flows adequately into the joint between the MTSW-120-21-T-D-300 post and the PCB landing pad, particularly if wave-soldering is used for cost optimization.
What board-level stress or vibration conditions might cause intermittent contact failures in the MTSW-120-21-T-D-300, and how can mechanical support design prevent this?
The MTSW-120-21-T-D-300 relies on spring tension in the mating receptacle to maintain contact pressure; if the PCB flexes or vibrates at frequencies near the mechanical resonance of the connector (typically 50–150 Hz for a typical 2-row header), the contact normal force may cycle above and below the threshold for reliable signal transmission. Intermittent contact opens on the MTSW-120-21-T-D-300 often appear as transient noise spikes on high-speed signals or dropout events on power distribution lines. To mitigate this risk, the MTSW-120-21-T-D-300 should be supported by mechanical bracing or strain relief near the mated connector interface; a small bracket or cable tie-down point immediately adjacent to the MTSW-120-21-T-D-300 can reduce effective deflection by 50–70%. Additionally, the MTSW-120-21-T-D-300 landing area should include a ground plane layer directly beneath the solder joints to reduce localized PCB bending; a 0.5" × 1.5" ground island under the MTSW-120-21-T-D-300 footprint is typically sufficient to improve stiffness. Systems using the MTSW-120-21-T-D-300 in mobile or shock-prone applications should validate connector integrity through random vibration testing per MIL-STD-810 or IEC 60068-2-64, using insertion loss or contact resistance monitoring to detect early signs of mechanical loosening.
How does the 2.54mm pitch of the MTSW-120-21-T-D-300 compare to finer-pitch alternatives, and when is the MTSW-120-21-T-D-300 pitch optimal versus limiting?
The MTSW-120-21-T-D-300 operates at 0.100" (2.54mm) pitch, which is the legacy standard for discrete header rows and permits relatively simple, low-cost manufacturing of both the connector and mating receptacles. This pitch of the MTSW-120-21-T-D-300 is optimal for applications with moderate signal count and relaxed layout constraints, such as I/O breakout boards, prototype expansion headers, and test interfaces where hand-assembly or field modification is anticipated. However, the 2.54mm pitch of the MTSW-120-21-T-D-300 becomes limiting in compact embedded systems where 20+ signal paths must route into a single edge connector area; finer-pitch alternatives (1.27mm, 1.0mm, 0.8mm) reduce the connector footprint on the PCB but increase cost, require automated assembly, and complicate rework. The MTSW-120-21-T-D-300 represents the upper bound of practical pitch for through-hole headers; if a design requires fewer than 20 connected pins in a compact space, the MTSW-120-21-T-D-300 is often oversized, whereas if more than 60 pins are needed within a similar area, the MTSW-120-21-T-D-300 is insufficient and a fine-pitch surface-mount connector becomes necessary.
What is the moisture absorption and outgassing profile of the MTSW-120-21-T-D-300 in high-altitude or low-pressure aerospace applications?
The MTSW-120-21-T-D-300 features an MSL (Moisture Sensitivity Level) rating of 1 (unlimited shelf life), which means the glass-filled polyester insulation absorbs moisture slowly under normal ambient humidity and does not require desiccant baking before assembly. However, in aerospace or high-altitude applications where ambient pressure drops significantly, outgassing from the MTSW-120-21-T-D-300 insulation material can occur at around 5–10 mmHg (corresponding to altitudes above 80,000 feet), releasing absorbed water vapor and trapped volatiles. This outgassing of the MTSW-120-21-T-D-300 can deposit thin films on nearby electronic components or degrade hermetic seals on sensitive devices. For systems designed to operate above 50,000 feet altitude or in vacuum chambers, the MTSW-120-21-T-D-300 should be pre-conditioned (heated under reduced pressure for 2–4 hours at 80–100°C and < 1 mmHg) to remove residual moisture before final assembly, or the connector should be sealed with silicone potting or conformal coating to suppress outgassing of the MTSW-120-21-T-D-300 during flight or vacuum operation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. MTSW-120-21-T-D-300

Product Attribute MTSW-120-21-T-D-600 MTSW-120-21-T-D-340 MTSW-120-21-T-D-100 MTSW-120-21-T-D-200
Part Number MTSW-120-21-T-D-600 MTSW-120-21-T-D-340 MTSW-120-21-T-D-100 MTSW-120-21-T-D-200
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Finish - Post - - - -
Features - - - Simultaneous Sampling
Shrouding - - - -
Material Flammability Rating - - - -
Applications - - - -
Insulation Color - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current Rating (Amps) - - - -
Number of Rows - - - -
Contact Length - Mating - - - -
Contact Length - Post - - - -
Ingress Protection - - - -
Row Spacing - Mating - - - -
Insulation Height - - - -
Fastening Type - - - -
Series - - - -
Insulation Material - - - -
Pitch - Mating - - - -
Mated Stacking Heights - - - -
Voltage Rating - - - -
Contact Material - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Finish - Mating - - - -
Style - - - -
Contact Shape - - - -
Connector Type - - - -
Contact Finish Thickness - Mating - - - -
Number of Positions Loaded - - - -
Contact Finish Thickness - Post - - - -
Contact Type - - - -
Overall Contact Length - - - -
Termination - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions - - - -

MTSW-120-21-T-D-300 Datasheet PDF

Download MTSW-120-21-T-D-300 pdf datasheets and Samtec Inc. documentation for MTSW-120-21-T-D-300 - Samtec Inc..

Datasheets
MTSW, HMTSW Series Datasheet.pdf
HTML Datasheet
MTSW, HMTSW Series Datasheet.pdf

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Samtec Inc.

MTSW-120-21-T-D-300

Samtec Inc.
98D-MTSW-120-21-T-D-300

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