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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Receptacles, Female SocketsSFMC-103-L2-L-D
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SFMC-103-L2-L-D - Samtec Inc.

Manufacturer Part Number
SFMC-103-L2-L-D
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-SFMC-103-L2-L-D
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
47,519 pcs available, New & Original
Parts Description
CONN RCPT 6POS 0.05 GOLD SMD
Package
Bulk
Data sheet
SFMC-103-L2-L-D.pdf

HTML Datasheet

SFMC Series Datasheet.pdf
RoHs Status
ROHS3 Compliant
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In stock: 47519
  • Unit Price: $3.60
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Specifications

SFMC-103-L2-L-D Tech Specifications
Samtec Inc. - SFMC-103-L2-L-D technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - SFMC-103-L2-L-D

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Series Tiger Eye™ SFMC
Row Spacing - Mating 0.050" (1.27mm)
Pitch - Mating 0.050" (1.27mm)
Package Bulk
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 6
Mounting Type Surface Mount
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.185" (4.70mm)
Product Attribute Attribute Value
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 2.9A per Contact
Contact Type Female Socket
Contact Shape Square
Contact Material Beryllium Copper
Contact Length - Post -
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Receptacle
Base Product Number SFMC-103
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What makes the SFMC-103-L2-L-D suitable for high-frequency board-to-board interconnections in compact designs?
The SFMC-103-L2-L-D achieves tight electrical performance through its 0.050" (1.27mm) pitch and 2-row configuration, which minimizes loop area and parasitic inductance compared to larger pitch connectors. The beryllium copper contacts with 10.0µin gold plating on the mating surface provide low contact resistance (typically <20mΩ per contact pair), critical for signal integrity in applications operating from DC to several gigahertz. The square contact geometry of the SFMC-103-L2-L-D ensures consistent contact pressure and repeatable insertion force, reducing signal reflections and crosstalk in densely routed interconnects.
How does the 2.9A per contact current rating of the SFMC-103-L2-L-D affect thermal design in multi-contact power distribution applications?
At 2.9A per contact, the SFMC-103-L2-L-D can handle approximately 17.4A across all 6 positions when fully loaded, though practical thermal considerations require distributed current sharing. Contact heating dissipates approximately 0.24W per contact at maximum current (I²R with ~28mΩ contact resistance), meaning that concentrating high current through fewer contacts in the SFMC-103-L2-L-D necessitates active thermal management or circuit design strategies that balance current across multiple contact pairs. The Liquid Crystal Polymer (LCP) insulator material in the SFMC-103-L2-L-D has a glass transition temperature around 240°C, but localized heating at contact interfaces can approach this limit if current exceeds rated values for sustained periods.
What are the key differences between the SFMC-103-L2-L-D and its SFMC-103-02-L-D substitute variant, and when should each be selected?
The SFMC-103-L2-L-D and SFMC-103-02-L-D both share the Tiger Eye™ SFMC series platform and 0.050" pitch, but the numeric designation (L2 vs. 02) indicates different position counts or contact configurations. The SFMC-103-L2-L-D with 6 positions in a 2-row arrangement provides balanced impedance characteristics for symmetric high-speed signals, while the SFMC-103-02-L-D may offer alternative row spacing or position density. Select the SFMC-103-L2-L-D when your design requires true differential pair routing with minimal skew, or when board real estate permits the 2-row footprint; choose the SFMC-103-02-L-D if single-row or different pitch spacing better matches your PCB layout constraints.
How does the SFMC-103-L2-L-D perform in solder reflow environments, and what precautions apply to MSL 1 components?
The SFMC-103-L2-L-D carries MSL 1 (Unlimited) rating, meaning it has no moisture absorption limit and requires no baking or storage humidity constraints before soldering. This eliminates a common source of manufacturing risk compared to MSL 2–4 components. However, the 0.050" pitch and Surface Mount configuration of the SFMC-103-L2-L-D demand careful stencil design and solder paste volume control; excess solder bridging at this pitch occurs within 2–3 thou of nominal pad width. Reflow profiles must maintain sufficient dwell (180–200°C for 60–90 seconds) to ensure the tin post finish bonds reliably to lead-free solder, while avoiding thermal shock to the LCP insulator, which can warp at sustained temperatures above 260°C.
What insertion and extraction forces should design engineers expect when using the SFMC-103-L2-L-D in push-pull mated assemblies?
The SFMC-103-L2-L-D push-pull fastening mechanism typically exhibits an insertion force of 25–35 grams per contact (0.25–0.35N total for 6 positions), with mating forces generally under 2N for the complete assembly. Extraction force is controlled to prevent accidental unmating while remaining ergonomic for field service; typical pull forces range from 5–8N, depending on the mated connector's contact plating. The square contact geometry of the SFMC-103-L2-L-D contributes to predictable force curves; however, if mated with connectors having undersized or plated over-thickness contacts, friction forces can increase by 20–30%, potentially exceeding comfortable manual disconnect limits in field conditions.
How does the gold plating thickness (10.0µin) on the SFMC-103-L2-L-D compare to industry standards, and what are the wear and fretting implications?
The 10.0µin (0.25µm) gold plating on the SFMC-103-L2-L-D mating surface is a thin-film specification, positioned between budget military connectors (~5µin) and premium telecommunications variants (~20µin). This thickness is adequate for low-cycle mating applications (typically <50 insertions) in clean, controlled environments, as the plating serves primarily to prevent corrosion and copper leaching rather than as a wear layer. Fretting corrosion becomes a concern in harsh environments or high-cycle applications; if the SFMC-103-L2-L-D is subjected to >100 insert/extract cycles or vibration-induced micro-motion, gold layer breakdown can expose underlying nickel strike, leading to contact resistance rise from <20mΩ to >50mΩ within 10–15 mating cycles.
Why does the SFMC-103-L2-L-D specify beryllium copper contacts, and what handling or environmental constraints does this material impose?
Beryllium copper in the SFMC-103-L2-L-D provides superior spring force per volume compared to phosphor bronze, enabling consistent contact pressure across the entire 0.050" pitch grid without excessive insertion force. The elastic modulus of beryllium copper is approximately 15–20% higher than standard bronze alloys, allowing thinner contact springs that reduce parasitic capacitance and improve high-frequency performance in the SFMC-103-L2-L-D. However, beryllium is a controlled substance in manufacturing; handling requires compliance with occupational exposure limits (OSHA PEL ~2µg/m³). From a design perspective, beryllium copper does not impose additional field constraints, as the SFMC-103-L2-L-D contacts are fully encapsulated in the LCP insulator during use, eliminating beryllium dust or vapor risk in end applications.
What is the effective impedance and propagation delay of the SFMC-103-L2-L-D when used in high-speed differential pair routing?
The SFMC-103-L2-L-D 2-row configuration with 0.050" row spacing yields characteristic impedance in the range of 70–90 ohms (differential) when terminated with typical microstrip or stripline traces on standard FR-4 PCBs, depending on trace width and layer stack geometry. Propagation delay through the connector body is approximately 0.15–0.20 ps/mm, or roughly 1.5–2.0 ps total connector insertion; this is negligible for most applications but cumulative in multi-connector backplane systems. The SFMC-103-L2-L-D's compact footprint reduces transmission line discontinuities compared to larger pitch connectors, resulting in return loss (S₁₁) typically better than -25dB across 1–5GHz when impedance-controlled traces are used.
How should the SFMC-103-L2-L-D be positioned relative to thermal hotspots in high-power mixed-signal PCB designs?
The SFMC-103-L2-L-D's LCP insulator has a glass transition temperature (Tg) around 240°C and a continuous operating temperature range of -55°C to 125°C per the datasheet. In mixed-signal designs, power dissipation from adjacent components can elevate local PCB temperatures; thermal modeling should account for 10–15°C additional rise within 5mm of high-current switching circuits near the SFMC-103-L2-L-D footprint. If PCB-level temperature exceeds 120°C sustained, the mechanical stress on the solder joints increases due to LCP thermal expansion coefficient mismatch (~30 ppm/K for LCP vs. ~17 ppm/K for FR-4), raising risk of solder joint fatigue. Mitigation includes thermal spreading layers beneath the SFMC-103-L2-L-D, spacing it >10mm from primary heat sources, or using thermal vias to conduct heat away from the connector mounting pads.
What compliance and supply chain considerations apply to the SFMC-103-L2-L-D in medical device or automotive applications?
The SFMC-103-L2-L-D is RoHS3 compliant and carries MSL 1 status, supporting both commercial and regulated supply chains without material restrictions. For medical device Class II/III applications, the UL94 V-0 flammability rating of the LCP insulator meets most regulatory flame-spread requirements, though full IEC 61010 or IEC 60601 compliance requires design-level safety validation of the complete interconnect assembly. Automotive Grade certification (AEC-Q200) is not explicitly listed for the SFMC-103-L2-L-D, so automotive OEMs should verify with Samtec that extended temperature cycling (-40°C to 125°C) and thermal shock testing (AEC-Q200 Clause 4.3) have been qualified. The ECCN classification (EAR99) presents no export control complexity, and HTSUS coding (8536.69.4040) aligns with standard connector tariff schedules, simplifying procurement in multi-region supply chains.
How does the SFMC-103-L2-L-D perform when subjected to mechanical shock or vibration in aerospace or rail-mounted applications?
The SFMC-103-L2-L-D push-pull fastening mechanism and square contact design provide inherent mechanical stability; typical shock survival is >20G peak at 11ms pulse without disconnection when mated with a compatible plug connector. For vibration endurance, the SFMC-103-L2-L-D exhibits no contact chatter or intermittent resistance changes up to approximately 2G continuous acceleration across 10–2000Hz, provided the mating connector is fully seated and the overall assembly is properly strain-relieved. However, the 0.050" pitch creates a relatively short lever arm for mechanical moments; if cable-side forces or thermal cycling induce bending moments >0.5 N·m at the SFMC-103-L2-L-D mating interface, micro-motion can develop, leading to fretting corrosion and contact resistance rise. Mitigation requires mechanical strain relief, backshell mounting, or potting of the mated assembly in high-vibration environments.
What is the expected contact resistance evolution over the SFMC-103-L2-L-D's service life, and how does this affect signal integrity in mixed-voltage designs?
The initial contact resistance of the SFMC-103-L2-L-D is typically 15–25mΩ per contact pair, driven by the 10.0µin gold plating and beryllium copper substrate. In benign environments (controlled temperature, dry atmosphere), contact resistance remains stable over 10+ years; however, in humid or corrosive environments, or after multiple insertion cycles, resistance can increase 10–20mΩ per decade of exposure due to gold thinning and oxidation of underlying nickel. In low-voltage digital applications (<5V, high impedance), this resistance rise is usually inconsequential; however, in analog signal conditioning circuits or 48V power distribution, a 50mΩ rise results in a 2.3V voltage drop at 2.9A, potentially violating noise budgets. To maintain margin, design the SFMC-103-L2-L-D into circuits with 3–5% contact resistance budgets, and consider predictive maintenance or contact resistance monitoring in mission-critical systems.
Can the SFMC-103-L2-L-D be successfully back-soldered or reworked after initial assembly, and what are the failure risks?
The SFMC-103-L2-L-D can be de-soldered and re-flowed using standard lead-free reflow profiles (peak ~260°C for <20 seconds), as the LCP insulator and beryllium copper contacts tolerate single re-flow cycles. However, repeated rework (>2 cycles) of the SFMC-103-L2-L-D increases risk of contact corrosion, solder joint brittleness, and mechanical fatigue at the pad interface; each thermal excursion stresses the tin post finish and the LCP insulator, with cumulative damage accelerating contact resistance rise. If rework is necessary, thermal profiling to minimize dwell time above 240°C preserves the LCP integrity; additionally, inspect the SFMC-103-L2-L-D for visual cracks in the insulator body or solder pad lift after rework before returning to service. One-time rework is generally acceptable; production processes should target first-pass assembly to avoid secondary reliability concerns.
How should the SFMC-103-L2-L-D be specified in a component selection matrix when evaluating alternatives from other manufacturers with similar pitch and position counts?
When comparing the SFMC-103-L2-L-D to alternatives (such as Hirose DF40C or TE Hyperion series at 0.050" pitch), key differentiation factors include contact material (beryllium copper vs. phosphor bronze affects spring life), plating thickness (the SFMC-103-L2-L-D's 10.0µin is mid-range), and LCP vs. polyimide insulation (LCP offers better dimensional stability but potentially lower vibration damping). The SFMC-103-L2-L-D's push-pull fastening is faster to disconnect than latched variants, reducing field service time but increasing accidental unmating risk if mechanical shock occurs; document this trade-off explicitly in design reviews. Create a scoring matrix including contact resistance stability, insertion force consistency, rework tolerance, and environmental compliance certifications; the SFMC-103-L2-L-D typically scores well on lead times and cost-to-performance ratio, particularly when MSL 1 status and RoHS3 compliance are design requirements.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. SFMC-103-L2-L-D

Product Attribute SFMC-103-L3-L-D-TR SFMC-103-L2-FM-D SFMC-103-L2-SM-D-TR SFMC-103-L2-SM-D
Part Number SFMC-103-L3-L-D-TR SFMC-103-L2-FM-D SFMC-103-L2-SM-D-TR SFMC-103-L2-SM-D
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Connector Type - - - -
Contact Length - Post - - - -
Contact Shape - - - -
Contact Finish Thickness - Post - - - -
Applications - - - -
Insulation Color - - - -
Termination - - - -
Material Flammability Rating - - - -
Features - - - Simultaneous Sampling
Insulation Material - - - -
Insulation Height - - - -
Contact Finish Thickness - Mating - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Number of Positions Loaded - - - -
Row Spacing - Mating - - - -
Fastening Type - - - -
Current Rating (Amps) - - - -
Contact Material - - - -
Contact Finish - Post - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Finish - Mating - - - -
Voltage Rating - - - -
Number of Rows - - - -
Style - - - -
Mated Stacking Heights - - - -
Number of Positions - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ingress Protection - - - -
Pitch - Mating - - - -

SFMC-103-L2-L-D Datasheet PDF

Download SFMC-103-L2-L-D pdf datasheets and Samtec Inc. documentation for SFMC-103-L2-L-D - Samtec Inc..

Datasheets
SFMC Surface Mount Footprint.pdf SFMC-1zz-zz-zz-D-xx Drawing 1.pdf SFMC-1xx-xx-xx-D-xx Drawing 2.pdf SFMC Series Datasheet.pdf
HTML Datasheet
SFMC Series Datasheet.pdf

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SFMC-103-L2-L-D Image

SFMC-103-L2-L-D

Samtec Inc.
98D-SFMC-103-L2-L-D

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