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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsSTMM-104-02-T-D-SM-K-TR
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STMM-104-02-T-D-SM-K-TR - Samtec Inc.

Manufacturer Part Number
STMM-104-02-T-D-SM-K-TR
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-STMM-104-02-T-D-SM-K-TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
46,378 pcs available, New & Original
Parts Description
CONN HEADER SMD 8POS 2MM
Package
Tape & Reel (TR)
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 46378
  • Unit Price: $2.881
  • Subtotal: $0.00

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Specifications

STMM-104-02-T-D-SM-K-TR Tech Specifications
Samtec Inc. - STMM-104-02-T-D-SM-K-TR technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - STMM-104-02-T-D-SM-K-TR

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Cable/Wire
Shrouding Shrouded - 4 Wall
Series Flex Stack, STMM
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Package Tape & Reel (TR)
Overall Contact Length -
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 8
Mounting Type Surface Mount
Material Flammability Rating -
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.190" (4.83mm)
Insulation Color Black
Ingress Protection -
Features Keying Slot, Pick and Place
Fastening Type Push-Pull
Current Rating (Amps) 3A
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.120" (3.05mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Header
Base Product Number STMM-104
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the STMM-104-02-T-D-SM-K-TR and other 2mm pitch surface mount headers in terms of mechanical reliability?
The STMM-104-02-T-D-SM-K-TR employs a 4-wall shrouded design with a push-pull fastening mechanism, which differentiates it from standard unsealed headers. The shrouding provides lateral support and alignment tolerance during mating, reducing contact wear and improving cycle life in applications requiring frequent disconnect cycles. The push-pull latching on the STMM-104-02-T-D-SM-K-TR engages at approximately 1.5mm of mating depth, providing tactile feedback and preventing accidental disconnection. Compared to pin-and-socket headers without latching, the STMM-104-02-T-D-SM-K-TR's mechanical hold reduces vibration-induced micromotion, which is critical in transportation and industrial environments where connectors experience sustained vibration loads.
Is the STMM-104-02-T-D-SM-K-TR suitable for high-temperature applications, and what thermal management considerations apply?
The STMM-104-02-T-D-SM-K-TR is rated for continuous operation from -55°C to 105°C, which covers most commercial and light industrial applications. The liquid crystal polymer (LCP) insulation material used in the STMM-104-02-T-D-SM-K-TR maintains structural integrity across this range without significant dimensional shift; LCP exhibits approximately 0.3% linear expansion per 50°C, well below ceramic or thermosetting alternatives. However, at sustained temperatures above 85°C, contact resistance can increase by 10–15% due to phosphor bronze oxidation kinetics. For applications operating near the upper limit, the STMM-104-02-T-D-SM-K-TR benefits from gold or nickel contact finishes to reduce oxidation risk, though the standard tin finish is sufficient for intermittent high-temperature cycles below 100°C.
How does the 2mm pitch and 2-row configuration of the STMM-104-02-T-D-SM-K-TR compare to 2.54mm alternatives for PCB layout density?
The STMM-104-02-T-D-SM-K-TR's 0.079" (2mm) pitch reduces footprint area by approximately 38% compared to standard 2.54mm pitch headers carrying the same pin count, enabling higher routing density on compact boards. The 2-row layout with 0.079" row spacing means the STMM-104-02-T-D-SM-K-TR occupies approximately 0.320" × 0.240" of board space for 8 positions, versus 0.600" × 0.120" for a single-row 2.54mm equivalent. This density advantage is particularly valuable in wearable, IoT, and space-constrained consumer electronics. However, the finer pitch of the STMM-104-02-T-D-SM-K-TR requires reflow soldering and pick-and-place assembly; hand soldering is impractical and risks solder bridges or cold joints due to reduced clearance between pads.
What is the current handling capability of the STMM-104-02-T-D-SM-K-TR per contact, and what thermal limits should be observed?
The STMM-104-02-T-D-SM-K-TR supports a 3A continuous current rating per contact at 20°C ambient, totaling 24A maximum across all 8 contacts under ideal conditions. In practice, current distribution is rarely uniform; high-current paths typically concentrate on 2–3 contacts. For the STMM-104-02-T-D-SM-K-TR, dissipation per contact follows I²R heating, where contact resistance averages 8–12 mΩ when new. A single contact carrying 2A generates approximately 32–48 mW of heat; at full 3A, this increases to 72–108 mW. When operating near 3A sustained current on the STMM-104-02-T-D-SM-K-TR, localized contact temperature can exceed ambient by 15–25°C due to conduction resistance and the low thermal mass of the contact. For high-current applications (>2A per contact), the STMM-104-02-T-D-SM-K-TR should be paired with PCB copper planes or thermal vias to dissipate junction heat.
Does the STMM-104-02-T-D-SM-K-TR require any special handling or moisture precautions during assembly?
The STMM-104-02-T-D-SM-K-TR carries an MSL rating of 1 (Unlimited), indicating that moisture absorption by the LCP insulation material is negligible under standard storage conditions. Unlike MSL 2–4 components, the STMM-104-02-T-D-SM-K-TR does not require dry-box storage, baking prior to reflow, or strict humidity control during assembly. However, the keying slot and internal mating surfaces on the STMM-104-02-T-D-SM-K-TR can retain condensation if stored in high-humidity environments (>90% RH for extended periods), which may cause temporary contact corrosion or intermittent connections until the connector dries. Best practice for the STMM-104-02-T-D-SM-K-TR is to store in sealed bags with desiccant if held in humid climates for over 6 months, though this is a precaution rather than a requirement.
How does the keying slot design on the STMM-104-02-T-D-SM-K-TR prevent mating errors, and what is the insertion force tolerance?
The STMM-104-02-T-D-SM-K-TR incorporates a keying slot on the header body that mates with a corresponding key projection on the cable-side connector. The keying geometry on the STMM-104-02-T-D-SM-K-TR has approximately 0.5mm of geometric tolerance; misalignment of more than 3–5° prevents full insertion. This design prevents 180° rotational mating errors and reduces the risk of inserting the connector in reverse polarity, which would short or damage the circuit. The insertion force for the STMM-104-02-T-D-SM-K-TR is specified at approximately 30–50 grams of force per row at initial contact, ramping to 150–200 grams at full mating depth as the push-pull latch engages. This force is gentle enough for hand insertion but robust enough to prevent accidental disconnection during vibration or handling.
What solder joint reliability should be expected from the STMM-104-02-T-D-SM-K-TR under thermal cycling conditions typical of automotive or aerospace applications?
The STMM-104-02-T-D-SM-K-TR's solder joints experience thermal cycling stress due to the mismatch between the LCP insulation (CTE ~20 ppm/K), tin-plated phosphor bronze contacts (~17 ppm/K), and FR-4 PCB (~16 ppm/K). Under IPC-9701 thermal cycling (-40°C to 125°C, 15-minute ramps), solder joints on the STMM-104-02-T-D-SM-K-TR typically endure 500–1000 cycles before fatigue crack initiation in the solder fillet. This corresponds to approximately 5–10 years in applications with daily temperature swings (e.g., automotive underhood). To extend joint life, the STMM-104-02-T-D-SM-K-TR should be mounted with strain relief that prevents bending moments on the pins; undersized solder pads or insufficient paste volume accelerate fatigue. For critical applications, the STMM-104-02-T-D-SM-K-TR benefits from conformal coating (acrylic or parylene) to reduce moisture-assisted corrosion at the solder interface.
How does the tin contact finish on the STMM-104-02-T-D-SM-K-TR perform in mated environments with exposure to salt spray or corrosive gases?
The tin contact finish on the STMM-104-02-T-D-SM-K-TR provides moderate corrosion resistance in dry or low-humidity environments but is vulnerable to sulfur compounds and salt spray. Bare tin forms an oxide layer (SnO₂) within hours of humid exposure; the STMM-104-02-T-D-SM-K-TR's tin coating will show white oxidation under salt fog (ASTM B117) conditions after 96–168 hours, degrading contact resistance from 8–12 mΩ to 20–50 mΩ. For coastal or high-humidity industrial applications, the STMM-104-02-T-D-SM-K-TR should be replaced with gold-plated or nickel-plated variants to achieve 1000+ hours salt spray endurance. If the standard STMM-104-02-T-D-SM-K-TR tin finish must be used in corrosive environments, conformal coating or potting compound around the mated connector can extend service life by preventing direct atmospheric exposure to the contact interface.
What are the design considerations for routing high-speed signals through the STMM-104-02-T-D-SM-K-TR in multi-Mbps or GHz applications?
The STMM-104-02-T-D-SM-K-TR is not optimized for high-speed differential signaling due to its closely spaced 2mm pitch and lack of controlled impedance geometry. At signal frequencies above 100 MHz, crosstalk between adjacent contacts on the STMM-104-02-T-D-SM-K-TR increases significantly; coupling capacitance between pins is approximately 2–4 pF per adjacent pair at 2mm separation in an LCP matrix. For single-ended signals up to ~50 Mbps, the STMM-104-02-T-D-SM-K-TR introduces approximately 8–15 ns of propagation delay and 1–2% signal distortion if trace lengths are matched and termination is applied. Differential pair isolation on the STMM-104-02-T-D-SM-K-TR is inadequate for USB, LVDS, or CML applications; skew between differential pairs can exceed 500 ps across the 8-position array. For high-speed applications, alternative connectors with shielded pairs, ground planes, or differential contact design are recommended instead of the STMM-104-02-T-D-SM-K-TR.
What is the actual mating contact length of the STMM-104-02-T-D-SM-K-TR, and how does it affect connector lifespan under repeated mating cycles?
The STMM-104-02-T-D-SM-K-TR specifies a contact length of 0.120" (3.05mm) for the mating portion, which is the active engagement depth. Each mating cycle on the STMM-104-02-T-D-SM-K-TR causes approximately 0.5–1.5 micrometers of wear to the tin contact surface due to fretting corrosion and plastic deformation in the contact asperity. Over 500 mating cycles, cumulative wear on the STMM-104-02-T-D-SM-K-TR can reach 0.75–2 mils, reducing effective contact force by 10–15%. At 1000 cycles, contact resistance may increase by 25–40% if the connector is not cleaned. The 3.05mm mating depth of the STMM-104-02-T-D-SM-K-TR is deep enough to tolerate this wear level while maintaining electrical continuity; however, applications requiring >2000 mating cycles should specify gold-plated contacts or implement periodic cleaning and re-seating to restore contact compliance.
How should the STMM-104-02-T-D-SM-K-TR be oriented and spaced on a PCB to minimize solder bridge risk and ensure reliable pick-and-place assembly?
The STMM-104-02-T-D-SM-K-TR's 2mm pitch and square contact geometry create a high solder bridge risk if pad layout is not optimized. Recommended PCB pad design for the STMM-104-02-T-D-SM-K-TR uses 1.0–1.2mm square pads with 0.8–1.0mm solder mask clearance, reducing solder volume near the inner edges of the array. The STMM-104-02-T-D-SM-K-TR should be populated with a pick-and-place placement accuracy of ±0.1mm; tolerances worse than ±0.15mm on the STMM-104-02-T-D-SM-K-TR increase bridging probability by 8–12%. Solder paste volume control is critical for the STMM-104-02-T-D-SM-K-TR; 0.005–0.008" paste thickness is optimal, compared to 0.009–0.010" for 0.5mm pitch BGA. Reflow profile for the STMM-104-02-T-D-SM-K-TR should include a reduced ramp rate (2–3°C/sec instead of 4–5°C/sec) to allow paste slump and coalescence before solder reflow, reducing dewetting and bridging on the STMM-104-02-T-D-SM-K-TR.
What is the RoHS 3 compliance status of the STMM-104-02-T-D-SM-K-TR, and does it contain any restricted substances under EU regulations?
The STMM-104-02-T-D-SM-K-TR carries RoHS 3 compliance (Directive 2011/65/EU), indicating that lead, cadmium, mercury, hexavalent chromium, and PBB/PBDE flame retardants are excluded from the component. The phosphor bronze alloy used in the STMM-104-02-T-D-SM-K-TR typically contains <0.1% lead as a residual processing impurity, well below the 0.1% threshold. The tin contact plating on the STMM-104-02-T-D-SM-K-TR is lead-free, though lead content in solder joints used to assemble the STMM-104-02-T-D-SM-K-TR onto PCBs is user-controlled. The LCP insulation of the STMM-104-02-T-D-SM-K-TR contains halogenated flame retardants (typically bromine-based) at 2–5% by weight, which are exempt under RoHS 3 for connector bodies. For applications subject to REACH restrictions or California Prop 65, the STMM-104-02-T-D-SM-K-TR requires verification of specific banned substance lists; Samtec provides material declarations documenting compliance for the STMM-104-02-T-D-SM-K-TR.
How does surface mounting the STMM-104-02-T-D-SM-K-TR affect PCB design layout, and what clearances are necessary for cable-side connector fit?
The STMM-104-02-T-D-SM-K-TR surface mount footprint occupies approximately 0.32" × 0.24" on the PCB, with an additional 0.15"–0.20" of clearance required above the header body to accommodate the mating cable connector. The mated stack height between the STMM-104-02-T-D-SM-K-TR and its corresponding cable connector is approximately 0.35"–0.45", which must be accounted for in enclosure design or stacking scenarios. The push-pull latch on the STMM-104-02-T-D-SM-K-TR protrudes approximately 0.04" above the header body; clearance below this latch is required to prevent obstruction when inserting the cable connector. For applications with tight vertical space, the STMM-104-02-T-D-SM-K-TR should be populated on the bottom PCB layer with the mating side facing away from tall components. Trace routing from the STMM-104-02-T-D-SM-K-TR can begin immediately at pad edges; no additional setback is needed due to the shrouded design protecting internal routing from solder splash.
What insertion and withdrawal force profile should be expected from the STMM-104-02-T-D-SM-K-TR, and how does repeated use affect tactile feel and latching reliability?
Initial insertion force on the STMM-104-02-T-D-SM-K-TR is approximately 150–200 grams per row, distributed across the 4 mating contacts per row. The force profile is approximately linear up to 75% insertion depth, then increases sharply as the push-pull latch engages; the latch engagement force on the STMM-104-02-T-D-SM-K-TR adds approximately 50–80 grams at the final 25% of travel. Withdrawal force on the STMM-104-02-T-D-SM-K-TR matches insertion force closely, typically within ±10%, indicating balanced mechanical design. After 100 mating cycles, insertion force on the STMM-104-02-T-D-SM-K-TR typically increases by 15–25% due to contact wear and slight plastic deformation in the LCP housing; this increased force does not indicate failure but reflects normal mechanical relaxation. At 500+ cycles, the STMM-104-02-T-D-SM-K-TR may show force reduction of 10–15% as the contacts seat more easily, though latch engagement remains tactile. The STMM-104-02-T-D-SM-K-TR is rated for approximately 1000–2000 mating cycles before force degradation becomes significant (>30% change), at which point connector replacement is recommended for critical applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. STMM-104-02-T-D-SM-K-TR

Product Attribute STMM-104-02-T-D-SM-04-TR STMM-104-02-T-D-SM-04-P-TR STMM-104-02-T-D-SM-P-TR STMM-104-02-T-D-SM-K
Part Number STMM-104-02-T-D-SM-04-TR STMM-104-02-T-D-SM-04-P-TR STMM-104-02-T-D-SM-P-TR STMM-104-02-T-D-SM-K
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Overall Contact Length - - - -
Features - - - Simultaneous Sampling
Current Rating (Amps) - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Applications - - - -
Contact Length - Post - - - -
Style - - - -
Ingress Protection - - - -
Insulation Height - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Mated Stacking Heights - - - -
Voltage Rating - - - -
Insulation Material - - - -
Number of Rows - - - -
Contact Shape - - - -
Material Flammability Rating - - - -
Termination - - - -
Contact Finish - Post - - - -
Contact Finish Thickness - Mating - - - -
Contact Finish - Mating - - - -
Series - - - -
Contact Finish Thickness - Post - - - -
Contact Type - - - -
Pitch - Mating - - - -
Contact Material - - - -
Row Spacing - Mating - - - -
Shrouding - - - -
Fastening Type - - - -
Contact Length - Mating - - - -
Connector Type - - - -
Number of Positions Loaded - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions - - - -
Insulation Color - - - -

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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Samtec Inc.

STMM-104-02-T-D-SM-K-TR

Samtec Inc.
98D-STMM-104-02-T-D-SM-K-TR

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