About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsTMM-134-01-S-D
TMM-134-01-S-D Image
TMM-134-01-S-D Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

TMM-134-01-S-D - Samtec Inc.

Manufacturer Part Number
TMM-134-01-S-D
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-TMM-134-01-S-D
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
41,867 pcs available, New & Original
Parts Description
CONN HEADER VERT 68POS 2MM
Package
Bulk
Data sheet
TMM-134-01-S-D.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 41867
  • Unit Price: $11.09
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $11.09 $11.09
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TMM-134-01-S-D Tech Specifications
Samtec Inc. - TMM-134-01-S-D technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - TMM-134-01-S-D

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TMM
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Package Bulk
Overall Contact Length 0.323" (8.20mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 68
Mounting Type Through Hole
Material Flammability Rating -
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Product Attribute Attribute Value
Insulation Height 0.059" (1.50mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 3.2A per Contact
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.138" (3.50mm)
Contact Length - Mating 0.126" (3.20mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 30.0µin (0.76µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number TMM-134
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum current handling capability per contact on the TMM-134-01-S-D, and how does this affect PCB trace sizing in high-density layouts?
The TMM-134-01-S-D is rated for 3.2A per contact, which establishes a baseline for thermal and copper weight calculations in the PCB design phase. With 68 positions distributed across two rows at 2.00mm pitch, designers must account for localized heating if multiple contacts carry sustained current simultaneously. For traces connected to TMM-134-01-S-D contacts operating near full rating, IPC-2152 guidelines recommend minimum 2oz copper weight and trace widths of 0.015" to 0.020" to maintain ΔT below 10°C. Phosphor bronze contacts with 30.0µin gold plating on the mating surface support repeated mating cycles without significant contact resistance degradation, but current density should be evaluated per signal cluster rather than assuming uniform distribution across all 68 positions.
How does the 2mm pitch specification of the TMM-134-01-S-D compare to legacy 0.1" (2.54mm) header standards for migration and retrofitting?
The TMM-134-01-S-D operates at 2.00mm pitch, which is 21% tighter than traditional 0.1" headers, enabling a more compact footprint for the 68-position connector. A legacy 2-row, 34-position header at 0.1" pitch occupies approximately 0.86" × 0.20", whereas the TMM-134-01-S-D achieves 68 positions in roughly 0.54" × 0.20" (accounting for row spacing at 2.00mm). This density advantage comes with tighter PCB layout tolerances and reduced clearance for rework access, making retrofitting from 0.1" to TMM-134-01-S-D non-trivial. However, the LCP insulation material in the TMM-134-01-S-D maintains dimensional stability across the -55°C to 125°C operating range, reducing pitch creep concerns that can complicate long-term reliability in legacy headers exposed to thermal cycling.
What solder joint stress profile should be expected when using the TMM-134-01-S-D in applications with significant vibration or mechanical shock?
The TMM-134-01-S-D features 0.138" (3.50mm) post length, which creates a relatively tall compliance arm above the PCB surface. Under vibration (IEC 60068-2-6), this geometry can induce cyclic bending stress at the solder fillet, particularly when the mating connector (or cable bundle attached to the header) introduces lateral loads. Phosphor bronze backing material provides moderate spring force, but repetitive shock loads (such as >5G peak acceleration) can lead to microcracking in tin-plated post terminations after 10,000–50,000 cycles depending on frequency and load direction. Design mitigation includes conformal coating or potting to dampen resonance, mechanical strain relief, or board stiffening near the TMM-134-01-S-D footprint. Gold-plated mating contacts (30.0µin thickness) on the TMM-134-01-S-D remain corrosion-resistant during this stress profile, but solder joint integrity becomes the limiting factor.
Is the TMM-134-01-S-D suitable for high-speed digital applications, and what impedance considerations apply to the 2.00mm pitch layout?
The TMM-134-01-S-D does not feature shielded contacts or controlled impedance geometry, making it more suited for general-purpose interconnect (analog signaling, moderate-speed digital) rather than high-speed serial protocols (e.g., PCIe Gen3 and above). At 2.00mm pitch with unshrouded, square-profile contacts, crosstalk between adjacent signal pairs in the TMM-134-01-S-D can exceed 15–20% in tightly routed layouts, and propagation delay skew between rows may introduce timing margins below ±100ps. For applications requiring differential pair integrity (e.g., LVDS, USB 3.x), interleaving ground contacts within the TMM-134-01-S-D row structure, or routing each differential pair on separate signal layers with tight spacing, becomes necessary. The LCP insulation material exhibits low dielectric loss (tan δ ≈ 0.003 at 1GHz), but the connector's geometry dominates impedance behavior rather than material properties.
How do the gold and tin contact finishes on the TMM-134-01-S-D affect long-term reliability in industrial environments with exposure to corrosive atmospheres?
The TMM-134-01-S-D combines 30.0µin (0.76µm) gold plating on mating contacts with tin-plated post terminations. Gold provides superior corrosion resistance in sulfurous, salt-spray, or chloride-rich atmospheres, protecting against whisker formation and fretting corrosion during mating cycles. However, the thinner-than-standard gold thickness (typical industrial connectors specify 50–100µin) on the TMM-134-01-S-D reduces the tolerance margin for porosity or incomplete coverage that can expose underlying copper to galvanic attack. Tin-plated posts are susceptible to tin whisker growth in high-humidity environments (>85% RH) over 10+ years, though MSL 1 (unlimited moisture sensitivity) rating of the TMM-134-01-S-D implies acceptable moisture absorption by the LCP body. In severe industrial settings, conformal coating or selective nickel underlayering may be warranted for long-term field reliability beyond 15 years.
What is the practical row spacing tolerance on the TMM-134-01-S-D, and how does it affect connector keying or polarization in back-to-back mating scenarios?
The TMM-134-01-S-D specifies 0.079" (2.00mm) row spacing with standard Samtec tolerance of ±0.005" (±0.13mm), resulting in ±6.5% dimensional variation relative to pitch. In single-orientation applications, this tolerance is manageable; however, in polarized or keyed back-to-back mating configurations, accumulation of ±0.005" tolerance on both the TMM-134-01-S-D header and mating receptacle can result in up to ±0.010" (0.25mm) total stack-up. This may exceed mechanical lock or key feature tolerances, leading to misalignment during blind-mate assembly. Samtec TMM-134-01-S-D unshrouded geometry lacks integrated keying features; polarization must be controlled via PCB footprint asymmetry or external mechanical fixtures. In automated pick-and-place environments, vision-guided placement becomes advisable to ensure the TMM-134-01-S-D alignment falls within ±0.003" for reliable subsequent mating.
How does the LCP insulation material in the TMM-134-01-S-D perform under thermal cycling, and what board-level design precautions are needed?
Liquid Crystal Polymer (LCP) insulation in the TMM-134-01-S-D exhibits excellent dimensional stability across -55°C to 125°C, with coefficient of thermal expansion (CTE) of approximately 20–30 ppm/K in the flow direction and 40–50 ppm/K transverse. PCB substrate CTE (typically 16–17 ppm/K) creates a slight mismatch at the TMM-134-01-S-D solder interface, inducing shear stress during thermal excursions. Over 500+ thermal cycles (IEC 60068-2-14), this stress accumulation can initiate cracking in solder fillets or lead to intermittent contact resistance rise. Mitigation includes selecting LCP-compatible solder paste (lead-free SAC305 preferred) with controlled reflow profiles (peak ≤245°C, ramp rate <3°C/s) to minimize thermal shock to the TMM-134-01-S-D body. Thermal stress modeling of the PCB assembly with the TMM-134-01-S-D footprint is recommended for products expecting >200 thermal cycles during product lifetime.
What are the practical insertion and withdrawal force specifications for the TMM-134-01-S-D, and how do these affect assembly line handling?
Samtec does not publish explicit insertion force (IF) or withdrawal force (WF) specifications for the TMM-134-01-S-D in standard datasheets, but the phosphor bronze contact springs and 2mm pitch suggest IF in the range of 2–4 oz-force per pair of contacts (approximately 60–110 grams total for all 68 positions). This moderate force enables hand assembly but requires calibrated mating fixtures on automated lines to prevent over-insertion or contact deformation. The push-pull fastening mechanism on the TMM-134-01-S-D (common in Samtec headers) provides tactile feedback and reduces risk of partial insertion, but assembly line operators must verify full seating of both contact rows before locking. For high-volume manufacturing, investing in carrier tape or stick-and-place fixtures specific to the TMM-134-01-S-D geometry reduces handling errors and improves first-pass yield.
How do the square contact profile and 2mm pitch of the TMM-134-01-S-D affect solderability when using lead-free reflow processes?
Square cross-section contacts on the TMM-134-01-S-D (versus round pins in legacy headers) present four edges to molten solder, creating asymmetric wetting behavior during reflow. Lead-free solder (SAC305 or equivalent) exhibits higher surface tension and narrower reflow window (217–245°C) compared to SnPb, making edge wetting on the TMM-134-01-S-D square posts inconsistent if thermal profiling is not controlled. Bridging risk between adjacent 2mm-pitch contacts increases if solder paste volume is over-specified; IPC-A-610 cleanliness standards become more stringent for the TMM-134-01-S-D to prevent residue entrapment in contact edges. Pre-tinning individual posts of the TMM-134-01-S-D before assembly (selective wave or selective immersion tinning) can improve wetting consistency and reduce rework rates, albeit at increased process cost. Post-reflow inspection via automated optical (AOI) systems should flag insufficient wetting at the TMM-134-01-S-D corner junctions, where lead-free solder bridging is most probable.
What mechanical retention or locking features does the TMM-134-01-S-D provide, and how reliable is push-pull fastening under vibration or thermal shock?
The TMM-134-01-S-D uses a push-pull fastening mechanism, wherein the mating connector snaps into a receiving slot on the header body. This design provides audible and tactile feedback but relies on mechanical deformation of the mating connector housing to maintain retention. Under cyclic vibration or thermal shock (particularly -55°C to +125°C extremes), repeated micro-motion at the mechanical lock interface can introduce wear, gradually reducing retention force. Long-term field data for similar Samtec headers suggests median functional life of 50–150 mating cycles before retention force drops below acceptable margins, especially in high-vibration environments (>3G continuous). For mission-critical applications, the TMM-134-01-S-D should be supplemented with secondary mechanical fasteners (screws, clips, or adhesive backing) or strain relief. In laboratory stability testing, retention force should be re-measured at baseline, after thermal cycling, and after vibration exposure to establish product-specific reliability margins.
What EMI or shielding considerations apply to the unshrouded TMM-134-01-S-D in mixed-signal or RF applications?
The unshrouded design of the TMM-134-01-S-D provides no integrated electromagnetic shielding, making it unsuitable for high-EMI environments or applications requiring galvanic isolation between signal and ground planes. In mixed-signal systems (e.g., ADC interfaces), crosstalk from the TMM-134-01-S-D connector can couple digital switching noise into sensitive analog signal paths if routing discipline is not maintained. For RF applications above 500 MHz, the lack of shielding around the TMM-134-01-S-D results in significant radiated emissions and susceptibility to external interference. Mitigation requires surrounding the TMM-134-01-S-D with a Faraday cage or shielding enclosure, grounding shield to PCB ground plane through multiple low-impedance paths (vias), and segregating signal layers near the TMM-134-01-S-D footprint. Alternatively, consideration of shielded header alternatives (e.g., Samtec's shrouded connector series) or integration of filtering networks on the PCB near the TMM-134-01-S-D may be necessary for compliance with FCC or CE EMC requirements.
How does MSL 1 (unlimited) moisture sensitivity rating of the TMM-134-01-S-D affect storage, handling, and assembly planning?
MSL 1 rating on the TMM-134-01-S-D means the component has unlimited shelf life without baking, permitting storage at room temperature (≤30°C, ≤60% RH) indefinitely without moisture absorption-related failures. This simplifies supply chain logistics and reduces storage costs compared to MSL 3–4 components requiring dry-box or desiccant storage. However, unlimited MSL classification does not eliminate moisture ingress into the LCP insulation material during operation in humid environments; the TMM-134-01-S-D should still be treated with standard IPC-A-610 handling protocols to prevent condensation during thermal excursions. For PCB assemblies using the TMM-134-01-S-D, post-reflow baking (at 60–80°C for 24–48 hours in a dry oven) is optional but recommended for products destined for high-humidity or tropical deployment. This baking step pre-dries the LCP material and reduces risk of ionic migration or corrosion initiation during early operational hours.
What are the typical PCB land pattern dimensions and trace routing recommendations for optimal solder joint reliability with the TMM-134-01-S-D?
Standard land pattern for the TMM-134-01-S-D post (3.50mm length, square cross-section) is approximately 0.055" × 0.055" (1.40mm × 1.40mm) pads with 0.040" (1.02mm) via diameter for through-hole posts. IPC-7351 guidelines recommend solder mask web of ±0.008" around each pad to control solder fillet geometry and minimize bridging risk. Trace routing from the TMM-134-01-S-D should maintain minimum 0.008" clearance to adjacent pads and incorporate thermal relief spokes (4 × 0.010" spokes at 90° intervals) if pads connect to wide ground or power planes to prevent thermal isolation during reflow. For 68-position density, a two-layer board often requires stitching vias (0.013" diameter) beneath the TMM-134-01-S-D footprint to reduce trace impedance and improve current distribution. Samtec documentation recommends reviewing land pattern files specific to the TMM-134-01-S-D geometry; custom modifications to standard patterns can compromise solder joint strength or increase rework difficulty.
Can the TMM-134-01-S-D be used in applications requiring hot-plug or hot-swap connectivity, and what electrical precautions are necessary?
The TMM-134-01-S-D is mechanically rated for repeated mating cycles (typical Samtec headers support >100 cycles before contact wear becomes significant), but it lacks make-before-break or break-before-make contact sequencing. This means the TMM-134-01-S-D exposes powered circuits to momentary open-circuit or short-circuit conditions during insertion or withdrawal. In hot-swap applications, this can cause voltage spikes, current surges, or logic glitches if connected to sensitive analog or digital circuitry without protection. Circuit-level mitigations for the TMM-134-01-S-D include series current-limiting resistors (10–100Ω), capacitive damping networks, or active hot-swap controllers (e.g., TI TPS2400 series) that ramp voltage/current during mating transients. For high-current rails using the TMM-134-01-S-D, mechanical interlocks that ensure power disconnection before signal removal are advisable. Operating temperature limits (-55°C to +125°C) remain valid during hot-swap; no additional thermal management is required beyond standard thermal relief design around solder joints.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. TMM-134-01-S-D

Product Attribute TMM-134-01-S-D-RA-004 TMM-134-01-S-D-RA-006 TMM-134-01-S-D-RA TMM-134-01-S-D-RA-005
Part Number TMM-134-01-S-D-RA-004 TMM-134-01-S-D-RA-006 TMM-134-01-S-D-RA TMM-134-01-S-D-RA-005
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Type - - - -
Fastening Type - - - -
Contact Shape - - - -
Contact Length - Post - - - -
Contact Finish - Mating - - - -
Number of Positions Loaded - - - -
Style - - - -
Contact Finish - Post - - - -
Series - - - -
Termination - - - -
Ingress Protection - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Connector Type - - - -
Contact Material - - - -
Number of Positions - - - -
Insulation Color - - - -
Insulation Material - - - -
Shrouding - - - -
Contact Finish Thickness - Post - - - -
Contact Length - Mating - - - -
Pitch - Mating - - - -
Number of Rows - - - -
Row Spacing - Mating - - - -
Material Flammability Rating - - - -
Applications - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Features - - - Simultaneous Sampling
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Insulation Height - - - -
Mated Stacking Heights - - - -
Current Rating (Amps) - - - -
Voltage Rating - - - -
Overall Contact Length - - - -

TMM-134-01-S-D Datasheet PDF

Download TMM-134-01-S-D pdf datasheets and Samtec Inc. documentation for TMM-134-01-S-D - Samtec Inc..

Datasheets
TMM Thru Hole Drawing 1.pdf TMM_TH Double Row Footprint.pdf TMM Thru Hole Drawing 2.pdf TMM Series TH Datasheet.pdf
HTML Datasheet
TMM Series TH Datasheet.pdf

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
TMM-134-01-S-D Image

TMM-134-01-S-D

Samtec Inc.
98D-TMM-134-01-S-D

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB