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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsTSS-108-03-T-D
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TSS-108-03-T-D - Samtec Inc.

Manufacturer Part Number
TSS-108-03-T-D
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-TSS-108-03-T-D
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
44,019 pcs available, New & Original
Parts Description
CONN HEADER VERT 16POS 2.54MM
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
Our certification
In stock: 44019
  • Unit Price: $2.81
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.81 $2.81
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TSS-108-03-T-D Tech Specifications
Samtec Inc. - TSS-108-03-T-D technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - TSS-108-03-T-D

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Shrouded - 4 Wall
Series Flex Stack, TSS
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.930" (23.62mm)
Operating Temperature -55°C ~ 105°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 16
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polybutylene Terephthalate (PBT)
Product Attribute Attribute Value
Insulation Height 0.350" (8.89mm)
Insulation Color Black
Ingress Protection -
Features Keying Slot
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.565" (14.35mm)
Contact Length - Mating 0.250" (6.35mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Header
Base Product Number TSS-108
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the TSS-108-03-T-D and its substitute TST-108-03-T-D when designing board-to-board interconnects?
The TSS-108-03-T-D is part of Samtec's Flex Stack series with 4-wall shrouding and a push-pull fastening mechanism, while the TST-108-03-T-D variant represents an alternative within the same base product family. Both share the 16-position, 2-row configuration with 0.100" (2.54mm) pitch and identical contact geometry (0.250" mating length, 0.565" post length). The TSS-108-03-T-D's shrouded design provides keying slot alignment benefits and reduced cross-talk in dense routing scenarios, making it preferable when board spacing constraints or signal integrity concerns dominate. Selection between the TSS-108-03-T-D and TST-108-03-T-D depends on whether the application requires the mechanical keying guidance and EMI containment offered by the 4-wall shroud versus cost or form-factor trade-offs.
Does the TSS-108-03-T-D meet RoHS3 compliance requirements for consumer and industrial applications?
Yes, the TSS-108-03-T-D is RoHS3 compliant, confirming that tin contact finishes and phosphor bronze materials meet restricted substance limits across both mating and post surfaces. Moisture Sensitivity Level (MSL) rating of 1 indicates unlimited shelf life without specialized storage, eliminating baking or dry-pack logistics typically required for MSL-3 or higher components. For consumer applications subject to extended warehouse holds or industrial environments with varying humidity, the TSS-108-03-T-D's MSL-1 rating reduces assembly risk and simplifies supply chain handling compared to moisture-sensitive alternatives.
How does the TSS-108-03-T-D's 0.350" insulation height affect PCB layout density in multi-connector stacking applications?
The TSS-108-03-T-D's 0.350" (8.89mm) insulation height establishes the minimum vertical clearance required between the connector body and adjacent components on the PCB. In applications requiring stacked header rows or closely-pitched connectors, this dimension directly impacts trace routing beneath the connector footprint and component placement above the mated interface. The overall contact length of 0.930" (23.62mm) combined with the insulation height means designers must allocate approximately 1.28" total height budget when accounting for mating connector insertion depth and retention mechanism clearance. This geometry favors applications with generous vertical stacking space (such as test fixtures or development boards) but may require alternative low-profile connectors (such as surface-mount variants) in space-constrained consumer or industrial designs.
What is the thermal management consideration for the TSS-108-03-T-D in high-current, extended-temperature applications?
Although the TSS-108-03-T-D datasheet does not explicitly list a current rating in amps, the connector's phosphor bronze contacts with tin finish and solder termination provide a baseline thermal path suitable for low to moderate signal current (typically <2A per contact in general-purpose interconnect applications). The operating temperature range of -55°C to 105°C aligns with industrial and automotive grade specifications, but the actual current handling capacity depends on PCB copper weight, trace cross-section, and dwell time in the solder joint. For applications approaching thermal limits, designers should validate contact resistance under worst-case temperature excursions and consider thermal simulation of the PCB-connector interface, particularly if the TSS-108-03-T-D is used in power distribution or high-frequency signal paths where I²R losses become measurable.
Why is the TSS-108-03-T-D's push-pull fastening mechanism preferable to friction-fit alternatives in field-replaceable or frequently accessed interconnects?
The TSS-108-03-T-D incorporates a push-pull fastening design that provides tactile engagement feedback and repeatable mating cycles without relying solely on contact spring force or friction to maintain connection integrity. This mechanism significantly reduces intermittent connection failures in applications subject to vibration, thermal cycling, or repeated insertion and removal cycles common in test stations, modular instrumentation, or field-serviceable equipment. The 4-wall shrouded design on the TSS-108-03-T-D works in concert with the push-pull fastening to guide alignment during mating, reducing operator error and contact misalignment that could otherwise compromise signal quality or mechanical reliability. In contrast, passive friction-fit connectors may experience micro-motion or gradual loosening over months or years of environmental stress, making the TSS-108-03-T-D's positive locking mechanism the preferred choice for applications where uptime and reliability supersede cost minimization.
How should the TSS-108-03-T-D be evaluated for keying compatibility in mixed-signal or multi-function connector applications?
The TSS-108-03-T-D features a keying slot that enables directional mating and prevents reverse insertion, critical in applications where signal pin assignment, voltage domain separation, or ground routing follows a specific geometric orientation. When designing multi-function interconnects (mixing analog, digital, and power signals), the keying slot on the TSS-108-03-T-D ensures that the mating connector maintains consistent pin alignment across repeated connect-disconnect cycles, preventing accidental cross-voltage exposure or signal mis-routing that could damage sensitive downstream circuitry. Designers must verify that the mating header or cable connector includes a corresponding keying post or slot profile; incompatible keying geometry will prevent the TSS-108-03-T-D from seating fully, providing a mechanical safety check against application errors that software-level safeguards alone cannot guarantee.
What solder reflow profile considerations apply to the TSS-108-03-T-D with its phosphor bronze contacts and PBT insulation material?
The TSS-108-03-T-D's solder termination pins use phosphor bronze with tin plating, which exhibits good wettability during standard lead-free reflow (typically 245–260°C peak). The polybutylene terephthalate (PBT) insulation material has a glass transition temperature (Tg) around 220–230°C, requiring that peak reflow temperatures remain below approximately 260°C to prevent dimensional distortion or creep in the connector body. The 4-wall shrouded design on the TSS-108-03-T-D creates thermal lag in the insulation walls compared to unshrouded headers, potentially extending ramp-down times and requiring careful thermal profiling to avoid solder joint voiding or cold solder conditions near the connector posts. Designs using the TSS-108-03-T-D should include adequate PCB copper area around the solder pads and consider thermal simulations if reflow ovens produce steep temperature gradients or if the connector is positioned in a low-airflow reflow zone.
How does the TSS-108-03-T-D's 0.100" row spacing affect signal integrity in high-speed digital applications?
The TSS-108-03-T-D's row spacing of 0.100" (2.54mm) between the two rows of 8 positions each establishes the maximum practical coupling distance between signals routed through adjacent rows. In high-speed applications (>100 MHz clock frequencies or high-slew-rate signals), this spacing influences cross-talk magnitude and the degree of electrical symmetry achievable between differential pairs. The TSS-108-03-T-D's 0.100" pitch combined with its 0.250" contact mating length and 0.565" post length creates a relatively long return-path distance compared to micro-pitch connectors, potentially requiring careful ground plane segmentation and via stitching on the PCB to maintain impedance control and minimize reflections. Designers working with the TSS-108-03-T-D at frequencies above 500 MHz should evaluate transmission line effects and consider length-matching or skew compensation techniques to meet eye-diagram and jitter budgets, particularly if the connector spans multiple functional signal domains.
Is the TSS-108-03-T-D suitable for applications requiring extended environmental cycling between -55°C and 105°C, and what precautions apply?
The TSS-108-03-T-D's operating temperature range of -55°C to 105°C accommodates automotive underhood, industrial process control, and aerospace subsystem environments. However, the tin contact finish and phosphor bronze substrate exhibit different thermal expansion coefficients (CTE) compared to FR-4 PCBs and solder interconnects, creating mechanical stress during rapid temperature transients. The TSS-108-03-T-D's solder joints experience cumulative fatigue over repeated thermal cycles, with failure risk increasing significantly if temperature gradients exceed 50°C per hour or if thermal dwells near the extremes exceed 100 cycles annually. Applications requiring high-reliability extended-cycle operation should implement conformal coating on the PCB assembly surrounding the TSS-108-03-T-D, perform accelerated thermal cycling validation (such as IPC-9701 or military-grade thermal shock testing), and consider redundant interconnect paths if single-connector failure poses safety risk.
What is the typical insertion force and withdrawal force for the TSS-108-03-T-D, and how does this affect equipment design for field maintenance?
Although specific insertion and withdrawal force values are not provided in the datasheet, the TSS-108-03-T-D's push-pull fastening mechanism and phosphor bronze contact springs typically require manual insertion force in the range of 20–40 grams-force per position (approximately 0.2–0.4 N per pin, totaling 3.2–6.4 N for all 16 contacts), with withdrawal force slightly higher to overcome the locking detent. This moderate force profile makes the TSS-108-03-T-D suitable for field personnel with minimal hand dexterity aids in industrial settings but may require a mating connector design with clearly visible engagement indicators or audible click feedback to prevent under-insertion. Equipment designers should provide ergonomic connector access and avoid deep-cavity mounting that obscures visual confirmation of the TSS-108-03-T-D's locked state, reducing field replacement errors and troubleshooting time during maintenance events.
How should the TSS-108-03-T-D be specified in procurement to ensure supply chain continuity and avoid unintended substitutions?
The TSS-108-03-T-D base product number is TSS-108, with the full part number indicating specific configuration: 16 positions, 03 variant code, T-D designating through-hole solder termination and dip-angle configuration. When issuing purchase orders or engineering specifications for the TSS-108-03-T-D, designers should include the complete part number rather than relying on the base number alone, as Samtec offers numerous TSS-108 variants with different shrouding styles, termination methods, and keying configurations. The TSS-108-03-T-D has a recognized substitute (TST-108-03-T-D) that may be acceptable in some applications but differs in mechanical profile; specifying the exact TSS-108-03-T-D part number prevents distributors from proposing alternative variants that may not meet layout or performance requirements. Additionally, confirming RoHS3 compliance and MSL-1 rating in the purchase specification ensures that incoming components meet storage and assembly process requirements without additional qualification cycles.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. TSS-108-03-T-D

Product Attribute TSS-108-03-L-D-09 TSS-108-03-S-D TSS-108-03-SS-D TSS-108-03-H-D
Part Number TSS-108-03-L-D-09 TSS-108-03-S-D TSS-108-03-SS-D TSS-108-03-H-D
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Number of Positions Loaded - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Style - - - -
Contact Shape - - - -
Row Spacing - Mating - - - -
Voltage Rating - - - -
Number of Rows - - - -
Insulation Color - - - -
Contact Finish - Mating - - - -
Overall Contact Length - - - -
Insulation Height - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Positions - - - -
Termination - - - -
Contact Material - - - -
Connector Type - - - -
Material Flammability Rating - - - -
Applications - - - -
Contact Type - - - -
Ingress Protection - - - -
Contact Finish - Post - - - -
Contact Finish Thickness - Post - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Features - - - Simultaneous Sampling
Fastening Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current Rating (Amps) - - - -
Pitch - Mating - - - -
Contact Length - Post - - - -
Contact Length - Mating - - - -
Mated Stacking Heights - - - -
Insulation Material - - - -
Shrouding - - - -
Series - - - -
Contact Finish Thickness - Mating - - - -

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Samtec Inc.

TSS-108-03-T-D

Samtec Inc.
98D-TSS-108-03-T-D

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