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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsTSW-105-11-G-S-RA
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TSW-105-11-G-S-RA - Samtec Inc.

Manufacturer Part Number
TSW-105-11-G-S-RA
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-TSW-105-11-G-S-RA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
48,250 pcs available, New & Original
Parts Description
CONN HEADER R/A 5POS 2.54MM
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 48250
  • Unit Price: $1.20
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $1.20 $1.20
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TSW-105-11-G-S-RA Tech Specifications
Samtec Inc. - TSW-105-11-G-S-RA technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - TSW-105-11-G-S-RA

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TSW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 5
Mounting Type Through Hole, Right Angle
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polybutylene Terephthalate (PBT)
Product Attribute Attribute Value
Insulation Height 0.119" (3.02mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.490" (12.45mm)
Contact Length - Mating 0.230" (5.84mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number TSW-105
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the mating interface specification for the TSW-105-11-G-S-RA header, and how does the 0.100" pitch relate to common PCB layout standards?
The TSW-105-11-G-S-RA is a 5-position header with 0.100" (2.54mm) pitch, which aligns with the standard 0.1" grid widely adopted in hobbyist, industrial, and legacy embedded systems. This pitch spacing is compatible with breadboards and perfboards, making the TSW-105-11-G-S-RA suitable for rapid prototyping and low-volume production layouts. The right-angle through-hole mounting positions the connector perpendicular to the PCB surface, reducing vertical stack height in enclosures and enabling cable entry from the board edge.
How do the contact specifications of the TSW-105-11-G-S-RA support high-reliability interconnection in thermal cycling environments?
The TSW-105-11-G-S-RA employs phosphor bronze contacts with gold plating (10.0µin on mating surfaces, 3.0µin on posts) to minimize contact resistance and oxidation. The solder termination with 0.490" post length provides robust mechanical engagement and thermal mass at the PCB interface. Operating across -55°C to 125°C, the TSW-105-11-G-S-RA maintains contact integrity through repeated thermal cycling; the phosphor bronze substrate resists stress relaxation better than unalloyed copper, while the gold finish prevents fretting corrosion at the mating interface—critical for applications experiencing vibration or repeated connect/disconnect cycles.
What are the key design trade-offs when selecting the TSW-105-11-G-S-RA versus surface-mount alternatives for board-to-board interconnection?
The TSW-105-11-G-S-RA offers through-hole robustness and mechanical stability but requires drilling and post-soldering labor, increasing assembly cost. Surface-mount headers reduce PCB real estate and manufacturing steps but introduce mechanical fragility during insertion and removal cycles. For applications prioritizing durability—industrial control, outdoor instrumentation, or high-vibration environments—the TSW-105-11-G-S-RA's through-hole design and 0.490" solder post provide superior strain relief. Conversely, high-density consumer electronics favor surface mount despite lower mechanical margin.
Is the TSW-105-11-G-S-RA suitable for low-impedance signal transmission, and what PCB layout precautions apply?
The TSW-105-11-G-S-RA is an unshrouded header with square contact geometry and 2.54mm pitch; it is not optimized for controlled impedance or high-speed differential signaling. For digital protocols (I2C, SPI, UART) operating below 10 MHz, the TSW-105-11-G-S-RA performs adequately with standard PCB trace routing. However, for higher frequencies or analog signals sensitive to crosstalk, the 5-position TSW-105-11-G-S-RA configuration lacks individual ground planes between signal lines. Layout should minimize trace length between connector and receiver, provide adjacent ground return paths, and avoid routing high-frequency and low-level analog signals through adjacent positions.
How does the PBT insulation material and UL94 V-0 rating of the TSW-105-11-G-S-RA affect compliance in safety-critical applications?
The TSW-105-11-G-S-RA features polybutylene terephthalate (PBT) insulation rated UL94 V-0, indicating self-extinguishing behavior and compliance with flammability standards in consumer and industrial safety certifications. PBT offers moderate chemical resistance and dimensional stability across the -55°C to 125°C operating range. For medical, industrial control, or automotive applications subject to UL/IEC safety audits, the TSW-105-11-G-S-RA's V-0 rating simplifies certification by demonstrating inherent fire performance. However, PBT is not hermetic; in high-humidity or corrosive environments (salt spray, chemical exposure), the unshrouded TSW-105-11-G-S-RA may require conformal coating to prevent leakage paths or moisture ingress.
What insertion and withdrawal force specifications should engineers expect when designing mating connectors for the TSW-105-11-G-S-RA?
The TSW-105-11-G-S-RA datasheet does not explicitly publish insertion force, but Samtec TSW series headers typically exhibit 50–120 grams per-contact insertion force based on phosphor bronze contact geometry and plating thickness. The right-angle configuration and push-pull fastening mechanism of the TSW-105-11-G-S-RA do not employ positive latching, so withdrawal force is primarily frictional. For mating cables or connectors, design should assume 0.5–1.0 N total disconnect force to avoid accidental displacement during vibration. In applications requiring frequent field mating/unmating, consider strain-relief boots or keying features to prevent misalignment.
How does the TSW-105-11-G-S-RA compare to Molex KK 254 or JST XH series headers in terms of cost, availability, and mechanical durability?
The TSW-105-11-G-S-RA and Molex KK 254 share the same 0.100" pitch and through-hole topology, but differ in contact finish robustness and cost positioning. The TSW-105-11-G-S-RA uses gold-plated phosphor bronze for all mating surfaces, whereas KK 254 often employs tin plating on secondary contacts, offering lower cost but reduced cycle life in high-vibration environments. The JST XH series operates at 2.5mm pitch (denser) with primary focus on battery interconnection, requiring different cable assemblies. For general-purpose board-to-board or hobbyist applications, the TSW-105-11-G-S-RA trades cost for reliability; Molex KK 254 remains more cost-competitive for high-volume, non-critical designs.
What MSL rating and storage conditions apply to the TSW-105-11-G-S-RA, and does moisture sensitivity affect assembly lead times?
The TSW-105-11-G-S-RA carries MSL (Moisture Sensitivity Level) 1 with unlimited shelf life, indicating no bake-out requirement before assembly and no moisture-related reflow risk. This eliminates procurement bottlenecks and simplifies supply chain logistics compared to MSL 2–3 components requiring dry storage or bake cycles. For high-volume manufacturing, MSL 1 status of the TSW-105-11-G-S-RA enables just-in-time inventory and reduces warehouse overhead. However, the through-hole solder joints still require standard PCB assembly precautions (flux residue cleanup, thermal profile validation) to ensure long-term reliability.
Can the TSW-105-11-G-S-RA be integrated into ROHS3-compliant supply chains without secondary material verification?
The TSW-105-11-G-S-RA is explicitly ROHS3 compliant, confirming conformance to Directive 2011/65/EU and restricted substance limits (lead, cadmium, mercury, brominated flame retardants, etc.). The gold plating (10.0µin mating, 3.0µin post) is permitted under ROHS3 as a functional requirement for contact performance. Samtec's published ROHS certification for the TSW-105-11-G-S-RA eliminates need for secondary material testing or supplier affidavits, streamlining procurement for OEMs targeting EU, China, or environmentally regulated markets. The ECCN classification (EAR99) indicates standard export compliance with minimal trade restriction.
What thermal performance characteristics should be considered when the TSW-105-11-G-S-RA is exposed to sustained elevated temperature near the 125°C upper operating limit?
The TSW-105-11-G-S-RA is rated to 125°C continuous operation, but thermal stress concentrates at the solder joint interface rather than the connector itself. PBT insulation exhibits creep at sustained elevated temperatures; long-term exposure above 100°C may cause dimensional shift or loss of press-fit tension in adjacent receptacles. For applications operating consistently near 125°C (industrial ovens, engine bay wiring, solar inverters), verify that PCB solder profiles achieve sufficient mechanical strength and apply thermal stress analysis to the solder posts. The TSW-105-11-G-S-RA's 0.490" post length and through-hole mounting mitigate some surface-mount thermal fatigue, but cyclic temperature swings (-55°C to +125°C) remain the primary reliability driver.
How does the right-angle mounting of the TSW-105-11-G-S-RA affect circuit card assembly process routing and final product serviceability?
The right-angle configuration of the TSW-105-11-G-S-RA positions connector contacts perpendicular to the PCB, enabling low-profile cable entry and reducing enclosure height. During PCB assembly, right-angle headers require wave-solder or selective-solder processes rather than reflow, adding manufacturing steps and lead time compared to vertical headers. The TSW-105-11-G-S-RA's 5-position single-row design supports simple wave-solder masking. In field service, the right-angle orientation simplifies cable strain relief design and permits connector access from enclosure sides without stacking height penalties, improving maintenance accessibility in densely packed assemblies.
What contact resistance and voltage drop specifications apply to the TSW-105-11-G-S-RA in low-power analog signal routing or precision measurement applications?
Samtec does not publish guaranteed contact resistance for the TSW-105-11-G-S-RA, but gold-plated phosphor bronze headers typically exhibit 10–50 mΩ per contact at insertion. For low-level analog signals (millivolt range, high-impedance sensors), the TSW-105-11-G-S-RA is adequate for conditioning/excitation lines but not recommended for directly routing sensor outputs; differential signal conditioning should occur immediately after the connector to minimize noise coupling through the header contact interfaces. The 5-position unshrouded design lacks inter-signal shielding, so precision applications should dedicate at least one position to ground return and position sensitive signals away from high-current switching nodes.
Is the TSW-105-11-G-S-RA suitable for applications requiring frequent hot-plug or hot-swap cycles, and what precautions apply?
The TSW-105-11-G-S-RA employs push-pull fastening without positive keying or latching mechanisms, permitting blind mating but offering no mechanical protection against misalignment during hot-insertion. For true hot-swap applications (powered connection/disconnection), the TSW-105-11-G-S-RA requires external circuit protection: series resistors or current-limiting buffers to prevent inrush currents, and supervisor logic to prevent data corruption during transient phases. The gold-plated contacts of the TSW-105-11-G-S-RA are resistant to contact bounce and arcing in low-voltage digital signaling (<5V, <1A per pin), but high-current or high-voltage hot-plug events may cause contact wear or pitting. For mission-critical hot-swap, consider keyed or latched alternatives.
What cable assembly options and connector compatibility are available for the TSW-105-11-G-S-RA in production and field service scenarios?
The TSW-105-11-G-S-RA header accepts standard 0.1" pitch receptacle contacts; common mating connectors include Molex KK 254 sockets, Samtec TSM (equivalent shrouded socket), and JST-equivalent 2.54mm pitch housings. Samtec offers pre-crimped and semi-finished cable harness options for TSW series connectors; custom harnesses are economical in volumes above 500 units. The TSW-105-11-G-S-RA's unshrouded design simplifies prototype and low-volume builds, permitting temporary jumper wires or breadboard integration. For production deployments, specify keyed or strain-relieved receptacles to prevent intermittent open-circuit failures in high-vibration environments; the TSW-105-11-G-S-RA's square pin geometry does not impose strict mating requirements, enabling cross-compatibility across multiple header product families.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. TSW-105-11-G-S-RA

Product Attribute TSW-105-11-G-S-RE TSW-105-11-G-D-RA TSW-105-11-L-S-RA TSW-105-11-F-S-RA
Part Number TSW-105-11-G-S-RE TSW-105-11-G-D-RA TSW-105-11-L-S-RA TSW-105-11-F-S-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Connector Type - - - -
Fastening Type - - - -
Series - - - -
Row Spacing - Mating - - - -
Mated Stacking Heights - - - -
Insulation Height - - - -
Number of Positions Loaded - - - -
Shrouding - - - -
Applications - - - -
Contact Length - Mating - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Current Rating (Amps) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Contact Finish Thickness - Mating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Overall Contact Length - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Termination - - - -
Contact Finish Thickness - Post - - - -
Contact Length - Post - - - -
Contact Material - - - -
Contact Finish - Post - - - -
Contact Shape - - - -
Pitch - Mating - - - -
Voltage Rating - - - -
Material Flammability Rating - - - -
Style - - - -
Contact Type - - - -
Ingress Protection - - - -
Contact Finish - Mating - - - -
Number of Positions - - - -
Number of Rows - - - -
Features - - - Simultaneous Sampling
Insulation Color - - - -
Insulation Material - - - -

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Samtec Inc.

TSW-105-11-G-S-RA

Samtec Inc.
98D-TSW-105-11-G-S-RA

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