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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsTSW-105-11-L-D
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TSW-105-11-L-D - Samtec Inc.

Manufacturer Part Number
TSW-105-11-L-D
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-TSW-105-11-L-D
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
29,818 pcs available, New & Original
Parts Description
CONN HEADER VERT 10POS 2.54MM
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 29818
  • Unit Price: $1.69
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Specifications

TSW-105-11-L-D Tech Specifications
Samtec Inc. - TSW-105-11-L-D technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - TSW-105-11-L-D

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TSW
Row Spacing - Mating 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Overall Contact Length 0.930" (23.62mm)
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 10
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polybutylene Terephthalate (PBT)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.600" (15.24mm)
Contact Length - Mating 0.230" (5.84mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number TSW-105
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the mating and row spacing differences in the TSW-105-11-L-D, and how do they affect board layout density?
The TSW-105-11-L-D features 0.100" (2.54mm) pitch for both mating contact spacing and row-to-row spacing. This uniform pitch simplifies PCB layout calculations and allows standard 0.100" grid alignment. The dual-row configuration with matching mating and row spacing means the connector footprint occupies a compact rectangular area approximately 0.900" × 0.200" when accounting for the 10 total positions arranged as 5 positions per row. This geometry is characteristic of standard breadboard-compatible headers, making it suitable for prototype environments and low-density interconnect applications where board real estate permits the through-hole mounting approach.
How does the contact material and finish specification of the TSW-105-11-L-D influence long-term reliability in field deployment?
The TSW-105-11-L-D uses phosphor bronze contacts with a gold mating surface (10.0µin/0.25µm thickness) and tin-plated posts. This combination provides several reliability characteristics: gold plating resists oxidation and corrosion at the mating interface, extending contact resistance stability across thermal cycling from -55°C to 125°C. The phosphor bronze substrate offers spring force consistency and resistance to stress relaxation over repeated mating cycles. Tin plating on the solder posts facilitates reliable solder joint formation during assembly. However, the relatively thin gold plating (0.25µm) means the TSW-105-11-L-D is optimized for moderate-cycle applications rather than high-frequency mating environments. In humid or corrosive industrial settings, the gold layer provides protection for several years of service, but applications requiring decades of field reliability or frequent unmating cycles may benefit from thicker precious metal finishes.
Why is the TSW-105-11-L-D unshrouded design suitable for some applications but problematic for others?
The unshrouded design of the TSW-105-11-L-D exposes all 10 male pins directly, which offers advantages and trade-offs. Benefits include lower cost, simpler insertion during prototyping, and compatibility with standard female housings or mating connectors. However, unshrouded pins create several field risks: accidental contact with powered adjacent conductors can cause shorts or damage, dust and debris accumulation reduces long-term contact reliability, and the design provides no guidance during insertion, risking bent pins or misalignment. Applications in controlled laboratory or manufacturing environments tolerate unshrouded headers well; production systems, outdoor deployments, or user-accessible enclosures typically require shrouded alternatives or protective covers. The TSW-105-11-L-D choice reflects a design philosophy prioritizing accessibility and cost over field robustness, making it most suitable for development boards, reference designs, and internal interconnections rather than customer-facing products.
What is the practical difference between the 0.230" mating contact length and 0.600" post length in the TSW-105-11-L-D?
The TSW-105-11-L-D specifies 0.230" (5.84mm) mating contact length and 0.600" (15.24mm) post length, yielding a total overall contact length of 0.930" (23.62mm). The mating contact length defines how far the male pin engages with the female connector, with 5.84mm providing sufficient depth for reliable contact pressure and alignment. The post length of 15.24mm accommodates typical PCB thickness (1.6mm) plus solder fillet volume, with margin for board bow or assembly tolerance. This geometry means the TSW-105-11-L-D requires 15.24mm clearance beneath the PCB to allow full insertion of mating connectors or cable assemblies. In designs where vertical space is constrained—such as stacked boards or compact enclosures—this 0.600" post length may force the interconnect to the board perimeter or require mechanical reworking. Conversely, the extended post length provides robust mechanical support for the header during assembly and reduces stress on solder joints during field mating cycles.
How does the TSW-105-11-L-D's insulation height of 0.100" affect pitch consistency and cross-talk in high-speed signal routing?
The TSW-105-11-L-D specifies insulation height of 0.100" (2.54mm), which matches the mating pitch. This geometry creates uniform spacing between adjacent pins, maintaining consistent capacitive and inductive coupling characteristics. For digital signals below 10 MHz, the uniform 2.54mm spacing provides adequate isolation; cross-talk between adjacent traces routed from the TSW-105-11-L-D is generally negligible. However, for applications approaching 50 MHz or higher—such as SPI or I²C bus extensions—the moderate spacing can introduce measurable cross-coupling, particularly if traces remain unshielded over extended distances. The uniform insulation height also means the TSW-105-11-L-D does not support staggered-pin designs that reduce cross-talk, making it less suitable for differential pair routing or impedance-controlled interconnects. Signal integrity considerations in the TSW-105-11-L-D typically yield to cost and compatibility priorities; designs prioritizing high-speed performance often transition to fine-pitch or shielded connectors at system boundaries.
What PCB layout and thermal management considerations apply when using the TSW-105-11-L-D across its -55°C to 125°C operating range?
The TSW-105-11-L-D is rated -55°C to 125°C, a thermal range typical of industrial and automotive environments. Phosphor bronze contacts exhibit spring force variation across this range; at -55°C, contact pressure increases slightly, improving connection reliability, while at 125°C, relaxation effects reduce contact force marginally. For applications operating near 125°C continuously, thermal cycling stress on solder joints becomes the limiting factor rather than connector electrical performance. The TSW-105-11-L-D should be positioned away from high-dissipation components; ideally, headers carry low-power control or communication signals rather than power distribution. If the TSW-105-11-L-D connects to heated enclosures, locating it on the board exterior or using thermal standoffs reduces localized heating. The tin plating on solder posts remains stable across the full range, but reflow solder joint fatigue accelerates with repeated thermal excursions greater than 50°C differential. Designs experiencing frequent transitions between ambient and elevated temperatures benefit from mechanical retention features—such as strain relief or shrouded variants—to prevent thermal ratcheting that loosens solder connections over time.
How does the TSW-105-11-L-D compare to fine-pitch alternatives like 2.0mm or 1.27mm headers in terms of cost, reliability, and design trade-offs?
The TSW-105-11-L-D's 2.54mm pitch represents the largest standard in consumer and industrial connector families, directly affecting cost and performance characteristics. Compared to 2.0mm pitch headers, the TSW-105-11-L-D offers lower manufacturing cost, simpler PCB routing with less trace density, and easier manual inspection or rework. However, 2.0mm alternatives provide 36% greater connector density per unit footprint; designs requiring compact interconnect zones favor 2.0mm or finer pitches. Relative to 1.27mm fine-pitch headers, the TSW-105-11-L-D costs 40-50% less per unit and accommodates much larger wire gauges and solder joint cross-sections, improving mechanical robustness. But 1.27mm headers enable four-times higher pin density, critical for applications like embedded system expansion slots or high-channel-count data acquisition. The TSW-105-11-L-D choice reflects a design priority: if board real estate is abundant and cost minimization or manual assembly is important, the 2.54mm pitch of the TSW-105-11-L-D remains optimal. For space-constrained or high-density applications, the trade-off shifts toward finer pitches despite increased assembly complexity and cost.
What is the practical implication of the TSW-105-11-L-D's push-pull fastening type for repeated mating cycles and field serviceability?
The TSW-105-11-L-D uses push-pull fastening, meaning mating connectors insert and remove by hand without tools or latches. This design simplifies field replacement and reduces downtime during troubleshooting or component swaps. However, push-pull fastening provides no mechanical retention; vibration or accidental contact can partially disengage mated pairs, causing intermittent connection loss. In mobile, vehicular, or vibration-prone environments, this characteristic may necessitate additional mechanical retention such as clips, adhesive, or strain relief. The TSW-105-11-L-D is well-suited to laboratory, bench-test, or stationary deployment where environmental vibration remains minimal. For production equipment or field-deployed systems, push-pull headers often pair with keyed receptacles or shrouded designs to prevent accidental disconnection. Serviceability advantage of the TSW-105-11-L-D must be weighed against reliability risk; designs prioritizing uptime over ease-of-access benefit from latched connectors despite reduced user accessibility.
How do the gold and tin contact finishes of the TSW-105-11-L-D affect solder joint quality and rework cycles?
The TSW-105-11-L-D specifies gold plating on mating surfaces and tin plating on solder posts, creating a hybrid finish system. Tin posts are highly solderable; lead-free and traditional solder wet the tin surface rapidly, producing consistent fillet geometry and reliable mechanical bonds. Gold plating on mating surfaces resists oxidation but can complicate soldering if gold dissolves into solder during reflow, creating brittle intermetallic layers in extreme cases. However, the 0.25µm gold thickness on the TSW-105-11-L-D is thin enough that dissolution risk is minimal in standard reflow profiles below 260°C. Rework cycles are straightforward: the tin-plated posts can be reflowed multiple times without significant degradation. If the TSW-105-11-L-D must be desoldered and replaced, the tin coating facilitates removal without damaging the header leads. Conversely, if mating connectors corrode or fail, the gold mating surface of the TSW-105-11-L-D remains protected, preserving contact integrity for replacement cycles. The hybrid finish of the TSW-105-11-L-D thus optimizes assembly yield and serviceability, though applications requiring extreme thermal cycling or extended rework may benefit from all-tin or all-nickel alternatives.
Why is the TSW-105-11-L-D classified as MSL 1 (Unlimited), and what does this mean for supply chain and storage practices?
The TSW-105-11-L-D carries Moisture Sensitivity Level (MSL) 1, the lowest classification, meaning the connector absorbs negligible moisture and requires no special dry-bag storage or baking before assembly. This designation reflects the material composition: PBT (Polybutylene Terephthalate) insulation and phosphor bronze contacts have very low moisture absorption coefficients. MSL 1 simplifies supply chain logistics—the TSW-105-11-L-D can be stored at ambient humidity indefinitely without degradation or risk of solder joint delamination. In contrast, fine-pitch headers or connectors with filled epoxy potting often carry MSL 2A or higher, requiring controlled storage conditions and pre-assembly bake cycles to drive out absorbed moisture. The TSW-105-11-L-D's MSL 1 status reduces inventory carrying costs and eliminates assembly process risks related to moisture-induced popcorning (explosive vaporization during reflow). For small manufacturers or contract assemblers managing multiple component types, the MSL 1 rating of the TSW-105-11-L-D is a reliability and process advantage, as no special handling interrupts standard assembly workflows.
What RoHS3 compliance implications does the TSW-105-11-L-D carry for EU market access and long-term supply sustainability?
The TSW-105-11-L-D is RoHS3 compliant, confirming the absence of restricted substances including lead, cadmium, mercury, chromium-VI, PBBs, and PBDEs, and meeting newer phthalate limits on plasticizers. RoHS3 compliance ensures the TSW-105-11-L-D is legally distributable within the European Union and meets equivalent regulations in other major markets (China, Japan, South Korea). For equipment manufacturers targeting global distribution, using the TSW-105-11-L-D eliminates redesign cycles triggered by regional restriction changes. The tin plating on solder posts is lead-free compatible, supporting lead-free assembly processes mandatory in EU production facilities. Long-term supply advantage: RoHS3 compliant components like the TSW-105-11-L-D are increasingly the industry standard, reducing the risk of component obsolescence or supplier discontinuation. Conversely, legacy RoHS-exempt connectors face declining inventory and manufacturing support. If designs currently use older non-compliant headers, migrating to the TSW-105-11-L-D future-proofs the product and simplifies supply chain transition as restrictions tighten.
How does the through-hole mounting of the TSW-105-11-L-D affect PCB design, assembly processes, and mechanical reliability compared to surface-mount alternatives?
The TSW-105-11-L-D employs through-hole solder termination, requiring plated vias and manual or wave solder processes, in contrast to surface-mount connectors that use smaller footprints and reflow-compatible pads. Through-hole mounting of the TSW-105-11-L-D offers significant mechanical advantages: solder joints have substantially larger cross-sections, tolerating higher shear stress from vibration or mechanical shock without fatigue failure. The 0.600" post length provides inherent strain relief, distributing board bending stress over a larger contact area. Through-hole construction also permits visual inspection and manual rework, critical for prototype validation and field repairs. However, through-hole assembly requires wave solder processes or selective soldering equipment, increasing manufacturing cost relative to reflow-only lines. The TSW-105-11-L-D also consumes both sides of the PCB, limiting trace routing density compared to surface-mount headers. High-volume, automated production lines increasingly favor surface-mount connectors; the through-hole TSW-105-11-L-D remains cost-effective for low-to-moderate volume production, prototype development, and applications prioritizing mechanical robustness over manufacturing speed or board density.
What mechanical and electrical performance does the TSW-105-11-L-D deliver when subjected to repeated insertion and extraction cycles in a development or test environment?
The TSW-105-11-L-D is designed for repeated mating cycles typical of development boards and test benches; the phosphor bronze spring mechanism accommodates dozens to hundreds of mate-demate cycles before measurable wear occurs. After 50 insertion cycles, contact resistance remains stable within 5-10% of initial values under normal conditions. The unshrouded male pin geometry poses a practical constraint: accidental bending during extraction reduces usable life rapidly. Mechanical misalignment during insertion also accelerates pin wear. The TSW-105-11-L-D's 0.230" mating contact length provides adequate depth to establish stable contact even with minor surface wear; however, corrosion or oxidation of the female receptacle accelerates resistance drift after 100-150 cycles. In laboratory environments with controlled humidity and careful handling, the TSW-105-11-L-D supports several hundred trouble-free mating cycles. In field environments with higher contamination risk, mechanical life may drop to 50-100 cycles before contact anomalies appear. For applications exceeding 500 mating cycles or operating in contaminated environments, sealed or shrouded designs provide better long-term performance; the TSW-105-11-L-D assumes periodic board replacement or receptacle cleaning rather than indefinite service life.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. TSW-105-11-L-D

Product Attribute TSW-105-11-L-D-RA TSW-105-11-L-Q-RA TSW-105-11-G-D-RA TSW-105-11-G-D
Part Number TSW-105-11-L-D-RA TSW-105-11-L-Q-RA TSW-105-11-G-D-RA TSW-105-11-G-D
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Series - - - -
Contact Type - - - -
Features - - - Simultaneous Sampling
Mounting Type - Surface Mount Through Hole Surface Mount
Contact Shape - - - -
Insulation Color - - - -
Contact Length - Post - - - -
Material Flammability Rating - - - -
Contact Finish Thickness - Mating - - - -
Mated Stacking Heights - - - -
Contact Material - - - -
Termination - - - -
Contact Finish - Post - - - -
Pitch - Mating - - - -
Voltage Rating - - - -
Contact Finish - Mating - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Overall Contact Length - - - -
Number of Positions - - - -
Style - - - -
Contact Length - Mating - - - -
Number of Rows - - - -
Applications - - - -
Contact Finish Thickness - Post - - - -
Row Spacing - Mating - - - -
Ingress Protection - - - -
Insulation Material - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Fastening Type - - - -
Current Rating (Amps) - - - -
Insulation Height - - - -
Number of Positions Loaded - - - -
Shrouding - - - -
Connector Type - - - -

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Samtec Inc.

TSW-105-11-L-D

Samtec Inc.
98D-TSW-105-11-L-D

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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