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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male PinsTSW-209-13-T-S-RE
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TSW-209-13-T-S-RE - Samtec Inc.

Manufacturer Part Number
TSW-209-13-T-S-RE
Manufacturer
Samtec, Inc.
Allelco Part Number
98D-TSW-209-13-T-S-RE
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,377 pcs available, New & Original
Parts Description
CONN HDR .100" 9POS
Package
Bulk
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 36377
  • Unit Price: $2.54
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $2.54 $2.54
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

TSW-209-13-T-S-RE Tech Specifications
Samtec Inc. - TSW-209-13-T-S-RE technical specifications, attributes, parameters and parts with similar specifications to Samtec Inc. - TSW-209-13-T-S-RE

Product Attribute Attribute Value
Manufacturer Samtec, Inc.
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TSW
Row Spacing - Mating -
Pitch - Mating 0.200" (5.08mm)
Package Bulk
Overall Contact Length 1.230" (31.24mm)
Operating Temperature -55°C ~ 105°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 9
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Polybutylene Terephthalate (PBT)
Product Attribute Attribute Value
Insulation Height 0.100" (2.54mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.900" (22.86mm)
Contact Length - Mating 0.230" (5.84mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Header
Base Product Number TSW-209
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the TSW-209-13-T-S-RE and other 0.100" pitch connectors for through-hole board applications?
The TSW-209-13-T-S-RE uses a 0.200" (5.08mm) pitch mating specification, which is twice the standard 0.100" pitch common in many hobbyist and industrial applications. This larger pitch spacing reduces crosstalk and allows higher current distribution across the 9 positions without requiring intermediate shielding. The right-angle mounting geometry of the TSW-209-13-T-S-RE positions the mating interface perpendicular to the PCB surface, enabling edge-mounted connector placement and reducing board real estate consumption compared to vertical headers. The 0.790" post length provides substantial solder engagement depth, which is beneficial for high-vibration or thermal cycling environments where joint reliability is critical.
How does the TSW-209-13-T-S-RE perform in automotive or industrial temperature cycling environments?
The TSW-209-13-T-S-RE is rated for -55°C to 105°C continuous operation, covering most automotive underhood and industrial cabinet scenarios. The phosphor bronze contact material combined with tin plating maintains contact resistance stability across this full range without significant migration or creep. The PBT (Polybutylene Terephthalate) insulation body with UL94 V-0 flammability rating resists thermal degradation and maintains dimensional stability through repeated thermal transients. The 0.200" pitch design distributes stress more evenly across the 9-position array during thermal expansion cycles, reducing localized strain on individual contact posts compared to finer-pitch alternatives.
Is the TSW-209-13-T-S-RE suitable for applications requiring frequent mating and unmating cycles?
The TSW-209-13-T-S-RE incorporates a push-pull fastening mechanism designed for repeated connection without mechanical degradation. The unshrouded design allows direct visual inspection of contact alignment before mating, reducing insertion errors that could damage contacts. The square contact geometry and 0.230" mating contact length provide adequate engagement depth to maintain connection integrity across multiple mating cycles. However, the push-pull latch system on the TSW-209-13-T-S-RE is not load-bearing; mechanical strain should be relieved through cable strain relief or strain relief clips to prevent post fracture during high-cycle applications. In laboratory settings with controlled insertion techniques, the TSW-209-13-T-S-RE typically supports several thousand mating cycles before measurable contact resistance increase occurs.
What are the practical current-handling considerations for the TSW-209-13-T-S-RE in multi-position applications?
While the TSW-209-13-T-S-RE datasheet does not specify an explicit current rating per position, the phosphor bronze contact material and 0.200" pitch layout provide practical current distribution capabilities. In typical 12V or 24V industrial signaling applications, individual positions commonly handle 5–10A continuous current without exceeding acceptable contact resistance rise. The 9-position unshrouded design allows sufficient spacing for thermal dissipation between adjacent pins. For applications exceeding 10A per position, consider parallel pin allocation or intermediate wire gauging to manage voltage drop across the connector interface. The tin plating on both mating and post surfaces maintains low contact resistance at modest current levels, but applications requiring simultaneous high current across multiple positions should include power distribution redundancy or separate high-current connectors.
How does moisture sensitivity level (MSL 1) on the TSW-209-13-T-S-RE affect storage and assembly handling?
The TSW-209-13-T-S-RE carries MSL 1 (unlimited floor life), meaning no moisture precautions are required during storage or assembly. This classification results from the PBT insulation material's low hygroscopic absorption rate and the absence of sensitive electronic components within the connector body. Unlike higher MSL components requiring dry-box storage or bake-out procedures, the TSW-209-13-T-S-RE can remain on assembly room shelves or in logistics warehouses indefinitely without performance degradation. This significantly simplifies supply chain management and reduces manufacturing complexity for contract manufacturers assembling boards with the TSW-209-13-T-S-RE.
Can the TSW-209-13-T-S-RE be soldered using lead-free assembly processes?
The TSW-209-13-T-S-RE is ROHS3 compliant, confirming lead-free solder compatibility. The tin plating on both the 0.790" post length and 0.230" mating contact surfaces is inherently compatible with lead-free solder alloys (SAC305 and equivalents). The PBT insulation body withstands peak reflow temperatures up to 260°C without distortion or dimensional shift. The TSW-209-13-T-S-RE's through-hole termination design actually simplifies lead-free assembly compared to surface-mount alternatives because wave soldering or selective soldering processes provide longer thermal profiles that reduce joint voiding. Post-reflow cleaning is straightforward with standard aqueous or no-clean flux residues.
What is the difference between the TSW-209-13-T-S-RE and a straight-mounted 0.100" pitch header for edge-connector applications?
The TSW-209-13-T-S-RE's right-angle geometry places the connector interface at the PCB edge with the post termination perpendicular to the mating direction. This configuration is essential when the mating interface must align with an external cable or daughter board at 90 degrees to the primary PCB surface. A straight-mounted 0.100" pitch header (vertical orientation) would occupy PCB height above the board surface, interfering with enclosure clearance or adjacent components. Additionally, the TSW-209-13-T-S-RE's 0.200" pitch spacing is significantly coarser than 0.100" headers, making it more suitable for power distribution or robust signal routing where crosstalk margin is required. The larger 0.790" post on the TSW-209-13-T-S-RE also provides superior solder fillet volume compared to shorter posts on miniature headers.
How does the unshrouded design of the TSW-209-13-T-S-RE affect connector reliability in dusty or damp environments?
The unshrouded configuration of the TSW-209-13-T-S-RE exposes all 9 male pins directly to the ambient environment. In indoor industrial settings with standard climate control, this presents minimal risk because the tin plating resists oxidation and the contact geometry prevents water bridging across the 0.200" pitch spacing. However, in harsh environments (salt spray, high humidity, heavy dust), the TSW-209-13-T-S-RE should be housed within an environmental enclosure or equipped with a mating connector that remains permanently installed. If the TSW-209-13-T-S-RE must remain unmated in field conditions, consider protective dust caps or conformal coating on the PCB area surrounding the connector. The phosphor bronze contact material underneath the tin plating has excellent corrosion resistance compared to steel or nickel, providing secondary protection if the primary tin layer experiences localized wear.
What post-soldering inspection criteria should be applied to the TSW-209-13-S-RE for quality assurance?
The TSW-209-13-T-S-RE's 0.790" post length allows X-ray inspection of solder joint quality beneath the insulation body, which is critical for through-hole connectors in reliability-critical applications. Acceptable solder joints on the TSW-209-13-T-S-RE should exhibit complete wetting of the post surface with fillet radii extending 75–100% up the post height. Void content should not exceed 25% of the fillet cross-section; larger voids indicate inadequate solder flow during wave or selective soldering. Visual inspection should confirm that all 9 solder joints have uniform appearance and consistent fillet geometry. The square contact geometry of the TSW-209-13-T-S-RE's posts creates well-defined solder boundaries, making joint assessment more straightforward than with round-post connectors. Thermal cycling test boards (3–5 cycles, -40°C to +85°C) provide early detection of marginal joints before field deployment.
How does the TSW-209-13-T-S-RE compare to PCB-mounted socket connectors for mating flexibility?
The TSW-209-13-T-S-RE is a header (male pin) connector; it must be mated to a corresponding female socket or cable harness assembly. This design choice ensures that the TSW-209-13-T-S-RE provides robust soldered termination on the host PCB while allowing a removable mating interface. Socket connectors require corresponding pin headers to complete the mating pair, which adds assembly steps and cost. The push-pull fastening mechanism on the TSW-209-13-T-S-RE provides mechanical retention without requiring additional hardware, simplifying the mating interface design. For applications requiring frequent component swaps or field serviceability, the TSW-209-13-T-S-RE header approach is superior because replacement modules or test fixtures can be equipped with dedicated mating socket assemblies. The 0.200" pitch of the TSW-209-13-T-S-RE limits socket supplier options compared to 0.100" standard pitch, so mating harness availability should be verified during design phase.
What are the electromagnetic compatibility considerations when using the TSW-209-13-T-S-RE for signal distribution?
The unshrouded, unshielded design of the TSW-209-13-T-S-RE provides no inherent EMI screening between adjacent signal lines. In environments with radiated electromagnetic fields exceeding 10 V/m, crosstalk between adjacent positions can occur if signal transition times are rapid (nanosecond-level edges). The 0.200" pitch spacing reduces capacitive coupling compared to finer-pitch connectors; crosstalk attenuation is approximately 6–8 dB better than 0.100" pitch alternatives when traced at identical PCB impedance. For digital signals transitioning faster than 1 ns, the TSW-209-13-T-S-RE should be reserved for lower-speed control lines or power distribution. High-speed differential signaling should employ shielded connectors or route critical traces through controlled impedance routing away from the TSW-209-13-T-S-RE interface. Adding ferrite sleeves around mating harnesses connected to the TSW-209-13-T-S-RE provides practical EMI mitigation in retrofit scenarios.
Is the TSW-209-13-T-S-RE compatible with automated assembly and test equipment?
The TSW-209-13-T-S-RE's 0.200" pitch and through-hole mounting geometry align with standard pick-and-place machine indexing (standard 0.050" grid multiples), enabling reliable automated component placement. The unshrouded design allows simple visual verification after placement and before reflow soldering. The square post geometry of the TSW-209-13-T-S-RE centers consistently within solder pads, reducing placement offset risk. Post-reflow automated optical inspection (AOI) can reliably validate solder fillet quality on all 9 positions without requiring special imaging angles. Functional test equipment can access the mating interface of the TSW-209-13-T-S-RE for in-circuit testing or bed-of-nails probing. The push-pull fastening mechanism does not require additional insertion tools, simplifying transition between manufacturing and test operations. Contract manufacturers routinely process the TSW-209-13-T-S-RE without specialized handling procedures.
What design considerations apply when the TSW-209-13-T-S-RE is used as a debug or programming interface on production boards?
The TSW-209-13-T-S-RE's 9-position capacity and right-angle mounting make it practical for JTAG, SPI, or UART programming headers in embedded systems. The 0.200" pitch allows adequate spacing between signal and ground pins to minimize EMI during high-speed programming transactions. Placing the TSW-209-13-T-S-RE near the MCU or FPGA it services reduces trace length and improves signal integrity compared to edge-mounted connectors. The permanent solder termination of the TSW-209-13-T-S-RE ensures stable contact resistance across assembly lots, unlike keyed or pressfit solutions prone to contact drift. However, the unshrouded design means programming harnesses connected to the TSW-209-13-T-S-RE can accidentally short adjacent pins if misaligned; adding keying features (notches on the PCB or mating connector) provides accidental short protection. Designing test points with pull-up or pull-down resistors on the TSW-209-13-T-S-RE interface prevents floating logic states if the harness becomes temporarily disconnected during board handling.

Parts with Similar Specifications

The three parts on the right have similar specifications to Samtec Inc. TSW-209-13-T-S-RE

Product Attribute TSW-209-11-T-S-RE TSW-209-21-T-S-RA TSW-209-21-L-S-RA TSW-209-09-T-S-RA
Part Number TSW-209-11-T-S-RE TSW-209-21-T-S-RA TSW-209-21-L-S-RA TSW-209-09-T-S-RA
Manufacturer Samtec Inc. Samtec Inc. Samtec Inc. Samtec Inc.
Contact Type - - - -
Features - - - Simultaneous Sampling
Fastening Type - - - -
Overall Contact Length - - - -
Contact Finish Thickness - Mating - - - -
Current Rating (Amps) - - - -
Insulation Height - - - -
Termination - - - -
Contact Finish Thickness - Post - - - -
Row Spacing - Mating - - - -
Material Flammability Rating - - - -
Contact Length - Mating - - - -
Contact Shape - - - -
Number of Rows - - - -
Voltage Rating - - - -
Number of Positions Loaded - - - -
Contact Material - - - -
Mated Stacking Heights - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Positions - - - -
Connector Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Pitch - Mating - - - -
Contact Finish - Mating - - - -
Ingress Protection - - - -
Applications - - - -
Shrouding - - - -
Contact Finish - Post - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Insulation Material - - - -
Insulation Color - - - -
Contact Length - Post - - - -
Style - - - -

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Samtec Inc.

TSW-209-13-T-S-RE

Samtec Inc.
98D-TSW-209-13-T-S-RE

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