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Home Products Crystals, Oscillators, Resonators Oscillators~~SIT1602BI-83-XXN-40.000000X~~

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SIT1602BI-83-XXN-40.000000X - SiTime

Name: SiTime SIT1602BI-83-XXN-40.000000X
Brand: SiTime
SKU: SIT1602BI-83-XXN-40.000000X
Price: 0.92 USD
Availability: InStock
Rating: 5 (1 reviews)

Manufacturer Part Number: SIT1602BI-83-XXN-40.000000X

Manufacturer: SiTime

Allelco Part Number: 98D-SIT1602BI-83-XXN-40.000000X

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 33,420 pcs available, New & Original

Parts Description: -40 TO 85C, 7050, 50PPM, 2.25V-3

Package

Data sheet: SIT1602BI-83-XX.pdf

Datasheets
SiT1602B.pdf

RoHs Status: Lead free / RoHS Compliant

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Specifications

SIT1602BI-83-XXN-40.000000X Tech Specifications
SiTime - SIT1602BI-83-XXN-40.000000X technical specifications, attributes, parameters and parts with similar specifications to SiTime - SIT1602BI-83-XXN-40.000000X

Product Attribute	Attribute Value
Manufacturer	SiTime
Series	*
Packaging	Tape & Reel (TR)
Moisture Sensitivity Level (MSL)	1 (Unlimited)

Product Attribute	Attribute Value
Manufacturer Standard Lead Time	8 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Detailed Description	Oscillator

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	Lead free / RoHS Compliant

Frequently Asked Questions(FAQ)

How does the frequency stability of SIT1602BI-83-XXN-40.000000X compare to other 40MHz oscillators in the same voltage range, and what design implications might this have for precision timing applications?: The SIT1602BI-83-XXN-40.000000X offers ±50ppm frequency stability across its full operating temperature range from -40°C to +85°C, which is within typical expectations for programmable oscillators at this frequency. While some competitors may offer tighter tolerances like ±25ppm or ±10ppm, achieving those often requires higher supply voltages, increased current consumption, or more complex calibration. For most digital systems—such as industrial controllers, communication modules, or data converters—±50ppm provides sufficient timing accuracy, especially when accounting for system-level clock distribution and synchronization mechanisms. Designers should evaluate whether tighter stability is truly necessary versus the trade-off in power efficiency and cost.

In what scenarios would using a programmable oscillator like SIT1602BI-83-XXN-40.000000X be preferable over fixed-frequency alternatives, and how does its programmability impact system flexibility?: The SIT1602BI-83-XXN-40.000000X supports frequency trimming via internal memory, allowing post-production adjustments without hardware changes. This makes it ideal for mass production environments where minor process variations cause frequency drift or when field updates are needed due to system revisions. Compared to fixed-frequency oscillators, it reduces inventory complexity and enables last-minute design changes—such as correcting crystal aging effects or accommodating different FPGA or microcontroller requirements. However, programmability adds slight latency during startup due to initialization sequences and introduces minimal risk of configuration errors if not managed properly in firmware.

What are the key differences between HCMOS/LVCMOS output types supported by the SIT1602BI-83-XXN-40.000000X and when should each be selected in high-speed digital designs?: The SIT1602BI-83-XXN-40.000000X supports both HCMOS (high-speed CMOS) and LVCMOS outputs, with the latter optimized for lower-voltage logic families such as 1.8V or 1.5V devices. HCMOS typically offers higher drive strength and faster rise/fall times suitable for driving longer traces or capacitive loads, while LVCMOS prioritizes reduced power consumption and compatibility with modern low-voltage microcontrollers. When selecting between them, designers must consider signal integrity, noise margins, and target IC’s input thresholds. For example, interfacing with an ARM Cortex-M processor at 1.8V would favor LVCMOS, whereas driving legacy 3.3V CPLDs might use HCMOS for robustness.

How does the supply current of 4.5mA at 3.63V affect total power budget in battery-powered systems using the SIT1602BI-83-XXN-40.000000X, and what mitigation strategies exist?: At peak supply voltage (3.63V), the oscillator draws approximately 16.3mW (4.5mA × 3.63V). Over an 8-hour operation, this could consume around 47mWh, which may be significant in low-power embedded systems. While modern MCUs often include sleep modes that disable peripherals, continuous clocking remains essential. To reduce impact, designers can select lower VDD (e.g., 2.25V) where possible, though frequency and performance may degrade slightly. Alternatively, switching to a lower-frequency oscillator during inactive periods or using duty-cycled operation can extend battery life. The SiTime part itself does not support dynamic current scaling, so architectural optimization becomes critical.

Can the SIT1602BI-83-XXN-40.000000X operate reliably in automotive-grade temperature ranges, and what modifications would be required beyond standard commercial components?: No, the SIT1602BI-83-XXN-40.000000X is rated only from -40°C to +85°C, which aligns with industrial but not automotive (-40°C to +125°C) specifications. Extending its use into automotive environments would require additional qualification testing, including accelerated thermal cycling, humidity exposure, and vibration validation. Moreover, automotive systems often demand AEC-Q100 compliance and functional safety certifications not provided by standard SiTime parts. For true automotive applications, a qualified version—such as those explicitly marked “AEC-Q100 Grade 2”—should be used instead of relying on industrial-grade oscillators.

How does the SMD7050-4P package size influence PCB layout decisions compared to larger packages like SMD5032, and what are common pitfalls during assembly?: With dimensions of 7.0mm × 5.0mm, the SIT1602BI-83-XXN-40.000000X occupies substantial board space relative to its function, making it suitable for designs where pin count or mechanical constraints outweigh miniaturization goals. However, its small footprint increases sensitivity to soldering defects during reflow—especially tombstoning or insufficient wetting on fine-pitch pads. Proper land pattern design per JEDEC standards, adequate thermal relief, and controlled solder paste volume are essential. Additionally, routing clock traces near sensitive analog sections should be avoided to prevent coupling; guard rings or ground stitching may help maintain signal integrity despite the large physical size.

What role does the ±50ppm frequency stability play in synchronization accuracy across multiple SIT1602BI-83-XXN-40.000000X units in distributed systems, and how much drift accumulates over time?: Assuming worst-case ±50ppm variation between two identical SIT1602BI-83-XXN-40.000000X oscillators, they will diverge by up to 2 microseconds per second (40MHz × 50×10⁻⁶). Over one hour, this equates to approximately 72 milliseconds of timing offset—significant for protocols requiring tight synchronization like SPI, I2C, or USB. In asynchronous systems, this drift is less critical, but in master-slave configurations (e.g., daisy-chained sensors), cumulative error could lead to data corruption. Designers should implement periodic resynchronization or use disciplined oscillators (±1ppm or better) if long-term coherence is required.

Is it acceptable to substitute the SIT1602BI-83-XXN-40.000000X with a crystal-based solution in space-constrained applications, and what trade-offs emerge?: Yes, but with caveats. Crystal oscillators generally require external components (load capacitors, bias resistors) and take longer to start, increasing boot time. They also exhibit greater frequency drift over temperature and aging, potentially exceeding ±100ppm. Conversely, the SIT1602BI-83-XXN-40.000000X integrates these elements and maintains superior stability. If replacing it, ensure the new crystal solution fits within the SMD7050 footprint, supports the same voltage range, and meets system timing budgets. Also consider EMI, as crystals can radiate harmonics more readily than MEMS-based alternatives like SiTime’s own products.

How does programmability affect reliability and failure modes of the SIT1602BI-83-XXN-40.000000X, and are there any known issues related to flash memory endurance?: The embedded non-volatile memory used for frequency trimming has limited write cycles—typically thousands rather than millions—but since trimming occurs infrequently (if ever) after manufacturing, this poses negligible risk in normal operation. However, frequent reprogramming in test environments or during debugging could accelerate wear. Most users never reconfigure the device post-deployment. Reliability-wise, SiTime claims >15-year operational life under typical conditions. As with any EEPROM-like storage, avoiding excessive write operations during production test flows helps preserve longevity.

What considerations apply when cascading multiple clock domains driven by SIT1602BI-83-XXN-40.000000X sources, and how does jitter impact downstream logic?: Cascading clocks from separate SIT1602BI-83-XXN-40.000000X units introduces phase uncertainty due to individual startup timing and frequency mismatches. While datasheet specifies RMS jitter < 1ps, real-world implementations see higher values when combining multiple sources. This jitter translates directly into setup/hold margin violations in synchronous circuits, particularly at high data rates (>50Mbps). Mitigation includes using a single reference clock tree, implementing FIFO buffers for crossing domains, or choosing oscillators with matched initial frequencies during procurement.

How do environmental factors such as humidity and mechanical shock affect the SIT1602BI-83-XXN-40.000000X beyond the specified operating temperature, and what protective measures are recommended?: Although the datasheet does not mandate conformal coating or hermetic sealing, exposure to high humidity (>85% RH) during storage or operation can promote electrochemical migration on exposed leads or solder joints, especially under DC bias. Mechanical shock may displace internal MEMS structures, though SiTime employs robust packaging to minimize this risk. In harsh environments, applying conformal coating after assembly and ensuring proper strain relief on PCB traces adjacent to the oscillator can enhance durability without altering electrical performance.

Can the SIT1602BI-83-XXN-40.000000X be used as a replacement for a TCXO in applications demanding sub-25ppm stability, and why or why not?: No. The SIT1602BI-83-XXN-40.000000X is specified for ±50ppm stability, which is double the tolerance of many TCXOs. While MEMS oscillators like this one eliminate crystal-related issues (aging, shock sensitivity), their inherent frequency accuracy is currently lower than oven-controlled or compensated crystal solutions. Therefore, substituting a TCXO with this device would compromise timing precision in GPS receivers, wireless base stations, or measurement instruments where sub-25ppm is mandatory. Always verify system-level stability requirements before selection.

What steps should engineers take when integrating the SIT1602BI-83-XXN-40.000000X into a design with strict EMC regulations, and how does its digital output simplify compliance efforts?: Digital outputs like HCMOS/LVCMOS generate cleaner spectral content compared to analog sinusoidal signals, reducing conducted emissions above 30MHz. Still, careful layout is essential: keep clock traces short, avoid parallel routing with sensitive lines, and use series termination resistors near the source. Since the oscillator operates at 40MHz, fundamental harmonics reach 120MHz, necessitating attention to PCB stack-up and decoupling. Placing bypass capacitors directly at the VDD pin and maintaining low-impedance return paths minimizes loop area and radiated noise, aiding EMC certification.

How does the wide supply voltage range (2.25V–3.63V) benefit system design when using the SIT1602BI-83-XXN-40.000000X, and what precautions are needed for brownout recovery?: Supporting both 2.5V and 3.3V logic families eliminates the need for level shifters in mixed-voltage systems, simplifying board layout and reducing component count. This flexibility is valuable in modular platforms where power rails vary by subsystem. However, during power-up or brownouts below 2.25V, the oscillator may fail to start or produce erratic outputs. Designers should ensure stable rail sequencing and add bulk capacitance close to the IC to prevent transient drops. Monitoring reset circuitry must account for oscillator stabilization time (~1ms typical).

Are there any known compatibility issues between the SIT1602BI-83-XXN-40.000000X and specific FPGAs or microcontrollers, particularly regarding input thresholds or slew rates?: Compatibility depends largely on the receiving IC’s VIH/VIL thresholds and input capacitance. Most modern 3.3V and 1.8V devices accept LVCMOS levels from the oscillator without issue. However, older logic families or low-swing inputs may require buffering. Additionally, some FPGAs expect differential clocks or specific edge rates; single-ended CMOS outputs are generally compatible but may need series resistance to match impedance. Always consult target device datasheets for minimum HIGH voltage requirements and maximum input capacitance to avoid loading effects.

What impact does aging have on the long-term performance of the SIT1602BI-83-XXN-40.000000X, and can the programmability feature compensate for drift?: MEMS-based oscillators like this one exhibit significantly lower aging rates than crystals—typically less than ±3ppm over five years versus ±10ppm or worse for quartz. Nevertheless, gradual frequency shifts still occur due to material stress relaxation. The internal trim capability allows correction within ±50ppm, meaning even if aging pushes frequency outside nominal, adjustment may restore compliance. However, extreme cases beyond the trim range cannot be fixed post-deployment. Regular calibration intervals or environmental controls can further mitigate drift.

How should designers handle ESD protection when handling the SIT1602BI-83-XXN-40.000000X, given its sensitive MEMS structure and exposed pins?: Despite being housed in a standard SMD package, the internal MEMS resonator is vulnerable to electrostatic discharge through control lines. Handling should follow ANSI/ESD-S20.20 procedures: grounded wrist straps, anti-static mats, and conductive packaging. During PCB assembly, ensure proper grounding of pick-and-place equipment and use ionization where static buildup is suspected. Although the part includes built-in ESD protection diodes, exceeding human-body model (HBM) ratings can damage functionality. Avoid direct contact with pins during probing or soldering.

What advantages does the tape and reel packaging provide for automated assembly of the SIT1602BI-83-XXN-40.000000X, and what are common mistakes during SMT processing?: Tape and reel enables high-speed pick-and-place machines to feed components continuously, reducing manual handling and improving throughput in mass production. Consistent orientation ensures correct polarity and placement accuracy. Common pitfalls include misaligned pickup nozzles causing missing components, insufficient vacuum leading to flyaway parts, or incorrect feeder pitch settings resulting in jamming. Adherence to IPC-7351 land patterns and machine-specific calibration minimizes defects. Post-reflow inspection should verify all four pins are soldered and free of bridging.

Parts with Similar Specifications

The three parts on the right have similar specifications to SiTime SIT1602BI-83-XXN-40.000000X

Product Attribute
Part Number	SIT1602BI-83-XXN-40.500000X	SIT1602BI-83-XXN-4.000000X	SIT1602BI-83-XXN-48.000000X	SIT1602BI-83-XXN-40.000000
Manufacturer	SiTime	SiTime	SiTime	SiTime
Detailed Description	-	-	-	-
Lead Free Status / RoHS Status	-	-	-	-
Packaging	-	-	-	-
Moisture Sensitivity Level (MSL)	-	-	-	-
Manufacturer Standard Lead Time	-	-	-	-
Series	-	-	-	-

SIT1602BI-83-XXN-40.000000X Datasheet PDF

Download SIT1602BI-83-XXN-40.000000X pdf datasheets and SiTime documentation for SIT1602BI-83-XXN-40.000000X - SiTime.

Datasheets: SiT1602B.pdf

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I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
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one of my hobbies is skydiving. and when i'm skydiving this works great.
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Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
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Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.
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Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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