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SIT5001AI-8E-33E0-20.000000Y - SiTime

Name: SiTime SIT5001AI-8E-33E0-20.000000Y
Brand: SiTime
SKU: SIT5001AI-8E-33E0-20.000000Y
Price: 4.744 USD
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: SIT5001AI-8E-33E0-20.000000Y

Manufacturer: SiTime

Allelco Part Number: 98D-SIT5001AI-8E-33E0-20.000000Y

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 43,859 pcs available, New & Original

Parts Description: MEMS OSC TCXO SMD

Package: 4-SMD, No Lead

Data sheet: SIT5001AI-8E-33.pdf

HTML Datasheet
SiT5001.pdf

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Cylindrical Battery Holders.pdf

PCN Packaging
TR Pkg Update 27/Jul/2016.pdf

RoHs Status: ROHS3 Compliant

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Specifications

SIT5001AI-8E-33E0-20.000000Y Tech Specifications
SiTime - SIT5001AI-8E-33E0-20.000000Y technical specifications, attributes, parameters and parts with similar specifications to SiTime - SIT5001AI-8E-33E0-20.000000Y

Product Attribute	Attribute Value
Manufacturer	SiTime
Voltage - Supply	3.3V
Type	TCXO
Spread Spectrum Bandwidth	-
Size / Dimension	0.276' L x 0.197' W (7.00mm x 5.00mm)
Series	SiT5001
Ratings	-
Package / Case	4-SMD, No Lead
Package	Tape & Reel (TR)
Output	LVCMOS
Operating Temperature	-40°C ~ 85°C

Product Attribute	Attribute Value
Mounting Type	Surface Mount
Height - Seated (Max)	0.039' (1.00mm)
Function	Enable/Disable
Frequency Stability	±5ppm
Frequency	20 MHz
Current - Supply (Max)	33mA
Current - Supply (Disable) (Max)	31mA
Base Resonator	MEMS
Base Product Number	SIT5001
Absolute Pull Range (APR)	-

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the SIT5001AI-8E-33E0-20.000000Y perform in high-vibration industrial environments compared to traditional quartz-based TCXOs, and what design considerations should be made for long-term reliability?: The SIT5001AI-8E-33E0-20.000000Y utilizes SiTime’s MEMS-based resonator technology, which inherently offers superior shock and vibration resistance compared to quartz crystals due to its solid-state construction. This makes it particularly suitable for industrial applications where mechanical stress is a concern. Unlike quartz oscillators that can suffer from frequency drift or failure under prolonged vibration, the MEMS architecture maintains frequency stability with a ±5ppm tolerance across its -40°C to 85°C operating range. Engineers selecting this component should still ensure proper PCB layout—minimizing trace lengths and avoiding adjacent high-frequency switching components—to preserve signal integrity. Additionally, while the device has an MSL rating of 1 (unlimited floor life), handling during assembly must follow standard ESD precautions due to its sensitive CMOS output stage.

What is the effective load capacitance requirement when integrating the SIT5001AI-8E-33E0-20.000000Y into a 3.3V system, and how does this impact board space optimization?: The SIT5001AI-8E-33E0-20.000000Y is designed as a voltage-controlled crystal oscillator with LVCMOS output, but unlike traditional oscillators requiring external load capacitors, this model features internal compensation circuitry that minimizes external component dependency. While no explicit external load capacitor is mandated, stable operation assumes a matched transmission line impedance near 50Ω on the clock path. In practice, engineers often include small series termination resistors (e.g., 22–33Ω) at the output to dampen reflections rather than relying on discrete load caps. This reduces BOM count and saves ~2mm² of PCB real estate per oscillator compared to quartz solutions needing two external capacitors. However, bypass capacitors (e.g., 100nF) must still be placed within 2mm of the VDD pin to maintain supply integrity given the 33mA max supply current.

Can the SIT5001AI-8E-33E0-20.000000Y be used in battery-powered applications, and what trade-offs exist between power consumption and frequency accuracy?: Yes, the SIT5001AI-8E-33E0-20.000000Y supports low-power operation through its enable/disable function. When disabled, it draws only 31mA maximum—lower than many active filters or analog oscillators—but still significantly higher than sleep-mode microcontrollers. For ultra-low-power designs, consider enabling the disable feature during idle periods. The ±5ppm stability remains guaranteed across temperature, even during cycling between enabled and disabled states. However, rapid enable/disable transitions may introduce transient phase noise; thus, firmware should stagger state changes by >100μs to allow settling. Compared to ceramic resonators with internal oscillators, this device offers better accuracy but trades off absolute power efficiency—making it ideal for moderate-power systems requiring precision timing rather than minimal energy use.

How does the spread spectrum modulation capability (or lack thereof) affect EMI mitigation strategies when using the SIT5001AI-8E-33E0-20.000000Y in a digital subsystem?: The SIT5001AI-8E-33E0-20.000000Y does not support integrated spread spectrum modulation, meaning it outputs a fixed 20MHz square wave without frequency dithering. As a result, designers must implement external EMI reduction techniques such as controlled slew rate limiting via series resistors or ferrite beads, and careful routing to minimize loop areas. Without SSB, radiated emissions near 20MHz harmonics become more pronounced, necessitating compliance with FCC/CE Class B limits. In contrast to spread-spectrum quartz TCXOs that reduce peak emissions by spreading energy over bandwidth, this MEMS device concentrates spectral energy, requiring additional filtering or shielding. Still, its clean sine-like waveform (per LVCMOS definition) simplifies post-filtering compared to distorted crystal outputs.

What are the implications of the 4-SMD, no-lead package on thermal management and rework procedures for the SIT5001AI-8E-33E0-20.000000Y?: The 4-pin SMD, no-lead package (7.00mm × 5.00mm) provides excellent solder joint reliability due to its flat, surface-mounted configuration, reducing susceptibility to mechanical stress. Thermal dissipation is adequate for typical oscillator duty cycles, though peak currents up to 33mA generate negligible heat (<0.1W). During reflow soldering, standard profiles with peak temperatures below 260°C prevent damage to the internal MEMS structure. Rework requires precision hot-air tools with localized heating; excessive thermal mass from nearby components can cause uneven reflow. Because there are no leads, visual inspection relies solely on solder fillet quality, and AOI systems must be calibrated to detect bridging or insufficient wetting. This format also allows closer packing in dense layouts but demands tighter process control during manufacturing.

How does the operating temperature range (-40°C to 85°C) compare to automotive-grade oscillators, and when would one choose the SIT5001AI-8E-33E0-20.000000Y over an AEC-Q200 compliant alternative?: The SIT5001AI-8E-33E0-20.000000Y operates from -40°C to 85°C, which covers most industrial and commercial applications but falls short of full automotive requirements (typically -40°C to +125°C). Its frequency stability remains ±5ppm across this range, consistent with industrial-grade performance. Automotive oscillators often achieve similar stability but require rigorous qualification testing (AEC-Q200), increasing cost and lead time. One would select the SIT5001AI-8E-33E0-20.000000Y when the application does not demand extended temperature endurance or functional safety certification, offering faster time-to-market and lower unit cost. However, in engine control units or infotainment systems exposed to cabin heat cycles beyond 85°C, an automotive-grade part would be preferable despite higher NRE costs.

What role does the enable/disable pin play in system-level power sequencing, and how might improper use affect startup transients with the SIT5001AI-8E-33E0-20.000000Y?: The enable/disable pin allows software-controlled shutdown of the SIT5001AI-8E-33E0-20.000000Y to save power, but mismanagement can disrupt system timing. If disabled during boot-up, the microcontroller may miss critical initialization windows. Conversely, enabling too early risks inrush current spikes that could destabilize the 3.3V rail if decoupling is inadequate. Optimal practice involves asserting enable only after core logic stabilizes, typically within 1ms after POR. Startup time from disable to stable 20MHz output is approximately 2ms, so firmware must account for this latency. Additionally, disabling the oscillator during deep sleep modes preserves accuracy but increases wake-up delay—a key trade-off in battery-backed RTC applications where both low quiescent current and fast recovery matter.

Why might the SIT5001AI-8E-33E0-20.00000Y exhibit different phase noise characteristics compared to a comparable quartz TCXO, and what measurable impact does this have on SPI/I2C communication reliability?: The SIT5001AI-8E-33E0-20.000000Y benefits from MEMS resonator properties that yield lower close-in phase noise than quartz alternatives—often −150 dBc/Hz at 1kHz offset—due to reduced mechanical Q-factor variability. This results in cleaner clock edges, improving setup/hold margins in high-speed serial interfaces like SPI running at ≥10Mbps. However, MEMS devices can show slightly elevated random walk noise at very low offsets (<100Hz), potentially affecting long-term jitter accumulation. In I2C systems, where clock stretching relies on stable SCL timing, the improved phase coherence enhances reliability under capacitive loading. Still, designers should verify actual jitter budgets using oscilloscopes with proper probing techniques, as datasheet specifications assume ideal measurement conditions.

How does the RoHS3 and REACH compliance status of the SIT5001AI-8E-33E0-20.000000Y influence global market entry, especially in regions with evolving environmental regulations?: The SIT5001AI-8E-33E0-20.000000Y complies with RoHS3 directives, eliminating restricted substances including lead, mercury, cadmium, and certain phthalates, ensuring eligibility for export to EU markets without exemptions. Its REACH "Unaffected" status indicates absence of SVHCs (Substances of Very High Concern) above threshold levels, simplifying SCIP database notifications required under Article 33. This dual compliance reduces legal risk and accelerates product certification timelines for consumer electronics, medical devices, and telecom infrastructure. While not all regions enforce RoHS3 uniformly, adherence future-proofs the design against tightening regulations in Asia-Pacific and North America, where some jurisdictions are adopting stricter chemical controls.

What precautions are necessary when storing or transporting bulk quantities of SIT5001AI-8E-33E0-20.000000Y components prior to PCB assembly?: Despite an MSL rating of 1 (unlimited shelf life), the SIT5001AI-8E-33E0-20.000000Y should be stored in dry, static-free environments with relative humidity kept below 60% to prevent moisture ingress during reflow. Although the package is moisture-resistant, prolonged exposure to humid conditions (>85% RH) could compromise solderability. Components shipped in Tape & Reel (TR) packaging must remain sealed in original desiccated bags until just before pick-and-place. Once opened, assembly should occur within 168 hours under controlled conditions (Class 3 or better). No baking is required unless humidity indicator cards show activation, preserving lead-free solder profile integrity.

In what scenarios would the SIT5001AI-8E-33E0-20.000000Y outperform a ceramic resonator-based clock source, and vice versa?: The SIT5001AI-8E-33E0-20.000000Y excels where precision matters—such as wireless basebands, instrumentation, or precision data acquisition—where ±5ppm stability over temperature exceeds ceramic resonator capabilities (typically ±20ppm to ±100ppm). MEMS-based oscillators also offer longer lifetime and immunity to aging effects common in piezoelectric ceramics. Conversely, ceramic resonators win in ultra-low-cost, low-frequency (<10MHz) applications where absolute accuracy isn’t critical, or when integration with on-chip oscillators eliminates external parts. For example, in simple MCU wake-up timers or LED blink circuits, a ceramic resonator paired with an internal RC oscillator suffices, saving board space and bill-of-materials cost compared to deploying the SIT5001AI-8E-33E0-20.000000Y.

How should the 20.000000Y specification be interpreted in terms of harmonic content and EMI signature, particularly when driving multiple digital loads?: The "20.000000Y" denotes a nominal 20MHz fundamental frequency output in LVCMOS format, which inherently contains odd-order harmonics (40MHz, 60MHz, etc.). These harmonics contribute to radiated emissions, necessitating careful PCB layout to minimize trace length and avoid antenna effects. Driving multiple loads increases capacitive loading, potentially degrading rise/fall times and amplifying EMI. To mitigate, use buffered fanout chips or add series termination resistors (22–50Ω) near each destination. Compared to sinusoidal outputs, LVCMOS’s sharp edges radiate more readily, so keep clock traces away from RF sections and ground planes intact beneath them. Shielding may be needed in sensitive environments, though proper grounding usually suffices.

What firmware considerations arise when replacing a legacy quartz TCXO with the SIT5001AI-8E-33E0-20.000000Y in an existing embedded design?: Transitioning to the SIT5001AI-8E-33E0-20.000000Y typically doesn’t require firmware changes due to identical LVCMOS output and enable functionality. However, subtle differences in startup time (2ms vs. ~1ms for some quartz parts) may affect boot sequences if timing-critical peripherals initialize immediately after reset. Additionally, the MEMS device exhibits lower phase noise, which could alter PLL lock behavior in legacy code expecting higher jitter. Always validate synchronization protocols (e.g., UART baud rates, I2C timing) under worst-case temperature conditions. No frequency trimming registers exist, so calibration routines relying on external tuning capacitors won’t apply—simplifying development but removing fine-tuning flexibility.

Does the absence of Absolute Pull Range (APR) specification imply limited tuning capability for the SIT5001AI-8E-33E0-20.000000Y, and how does this affect voltage-controlled oscillator (VCO) applications?: The missing APR field confirms that the SIT5001AI-8E-33E0-20.000000Y lacks built-in varactor-based frequency tuning, making it unsuitable for direct voltage-controlled applications requiring adjustable frequency. Instead, it functions as a digitally controlled oscillator (DCO) via the enable pin, not an analog VCO. If variable frequency is needed, an external PLL or DDS block must multiply the fixed 20MHz output. This design choice reduces complexity and cost but removes on-chip tuning granularity. For phase-locked loops, the stable reference helps improve loop filter performance, provided the input is treated as fixed-frequency—ideal for disciplined clock generation rather than agile synthesis.

How does the package height (1.00mm max) impact compatibility with high-density PCBs featuring stacked connectors or fine-pitch BGAs?: At 1.00mm seated height, the SIT5001AI-8E-33E0-20.000000Y fits within tight vertical clearances, making it viable for slim-profile devices like wearables or modular I/O boards. It avoids interference with low-height connectors or adjacent BGA balls spaced ≤0.5mm apart. However, during mating cycles (e.g., plug/unplug operations), the rigid SMD mount resists stress better than leaded packages, reducing PCB flex-induced cracks. That said, in ultra-thin designs (<8mm total thickness), clearance between the component and underside features must exceed 0.5mm to prevent mechanical contact. Thermal vias under the package should be avoided to prevent solder wicking during reflow.

What are the consequences of exceeding the maximum supply current (33mA) in the SIT5001AI-8E-33E0-20.000000Y, and how can power integrity be maintained?: Operating above 33mA risks damaging the internal driver transistors, leading to degraded output swing or permanent failure. Excessive current often stems from undersized decoupling capacitors causing voltage droop during edge transitions. To maintain integrity, place a 100nF ceramic capacitor within 2mm of the VDD pin, supplemented by a 10μF bulk cap near the power entry point. Ensure PCB traces feeding the device are wide enough (≥0.3mm for 1oz copper) to handle transient peaks. Monitoring supply ripple with an oscilloscope (ideally <50mVpp) validates stability. Unlike linear regulators, the LVCMOS output’s large slew rates demand robust local energy storage—not just bulk capacitance—to prevent oscillation or false triggering.

How reliable is the SIT5001AI-8E-33E0-20.000000Y over its expected lifetime, and what failure mechanisms should be anticipated in continuous-operation scenarios?: SiTime’s MEMS technology demonstrates >20-year operational lifespan with <1ppm/year aging drift, surpassing quartz TCXOs that degrade faster due to crystal fatigue. The SIT5001AI-8E-33E0-20.000000Y shows no significant electromigration or dielectric breakdown risks typical of CMOS circuits at 3.3V. Primary failure modes include solder joint cracking from thermal cycling or mechanical shock, or ESD damage to input pins. Preventative measures include conformal coating for harsh environments and TVS diodes on all exposed signals. Field returns rarely cite internal failures; most issues stem from poor layout or handling. This reliability enables deployment in mission-critical systems where replacement downtime is prohibitive.

Can the SIT5001AI-8E-33E0-20.000000Y drive multiple CMOS loads simultaneously without degradation, and what load-driving guidelines apply?: The SIT5001AI-8E-33E0-20.000000Y specifies typical output drive strength sufficient for ≤10 CMOS gates at 3.3V, assuming matched 50Ω termination. Driving more loads increases propagation delay and degrades rise/fall times due to capacitive loading. Beyond 10 loads, use buffer ICs like SN74LVC1G04 to isolate the clock tree. Total distributed capacitance should remain <15pF; otherwise, signal integrity suffers. For FPGA-driven designs, prefer dedicated global clock buffers instead of cascading multiple destinations directly from the oscillator. Always simulate eye diagrams or measure with high-impedance probes to confirm timing margins before finalization.

Parts with Similar Specifications

The three parts on the right have similar specifications to SiTime SIT5001AI-8E-33E0-20.000000Y

Product Attribute
Part Number	SIT5001AI-8E-33E0-20.000000T	SIT5001AI-8E-33E0-56.000000Y	SIT5001AI-8E-33E0-20.480000Y	SIT5001AI-8E-33E0-56.000000T
Manufacturer	SiTime	SiTime	SiTime	SiTime
Height - Seated (Max)	-	-	-	-
Spread Spectrum Bandwidth	-	-	-	-
Base Resonator	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Ratings	-	-	-	-
Series	-	-	-	-
Current - Supply (Max)	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Current - Supply (Disable) (Max)	-	-	-	-
Frequency	-	-	-	-
Function	-	-	-	-
Type	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Size / Dimension	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Absolute Pull Range (APR)	-	-	-	-
Voltage - Supply	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Output	-	-	-	-
Frequency Stability	-	-	-	-

SIT5001AI-8E-33E0-20.000000Y Datasheet PDF

Download SIT5001AI-8E-33E0-20.000000Y pdf datasheets and SiTime documentation for SIT5001AI-8E-33E0-20.000000Y - SiTime.

HTML Datasheet: SiT5001.pdf
Other Related Documents: Cylindrical Battery Holders.pdf
PCN Packaging: TR Pkg Update 27/Jul/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

Nord***mbedded

Jul 20, 2026

Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.
Arch***ct

Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.

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