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HomeProductsIntegrated Circuits (ICs)Clock/Timing - Clock Generators, PLLs, Frequency SynthesizersSI5317C-C-GMR
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SI5317C-C-GMR - Skyworks Solutions Inc.

Manufacturer Part Number
SI5317C-C-GMR
Manufacturer
Skyworks Solutions, Inc.
Allelco Part Number
32D-SI5317C-C-GMR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
2,356 pcs available, New & Original
Parts Description
IC JITTER CLEANER 36QFN
Package
36-QFN (6x6)
Data sheet
SI5317C-C-GMR.pdf

HTML Datasheet

SI5317 Datasheet.pdf
RoHs Status
 
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In stock: 2356
  • Unit Price: $9.638
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Quantity Unit Price Ext. Price
1+ $9.638 $9.64
10+ $9.235 $92.35
30+ $8.541 $256.23
100+ $7.933 $793.30
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

SI5317C-C-GMR Tech Specifications
Skyworks Solutions Inc. - SI5317C-C-GMR technical specifications, attributes, parameters and parts with similar specifications to Skyworks Solutions Inc. - SI5317C-C-GMR

Product Attribute Attribute Value
Manufacturer Skyworks Solutions, Inc.
Voltage - Supply 1.71V ~ 3.63V
Type Jitter Cleaner
Supplier Device Package 36-QFN (6x6)
Series DSPLL®
Ratio - Input:Output 2:2
Package / Case 36-VFQFN Exposed Pad
Package Tape & Reel (TR)
PLL Yes with Bypass
Product Attribute Attribute Value
Output CML, LVCMOS, LVDS, LVPECL
Operating Temperature -40°C ~ 85°C
Number of Circuits 1
Mounting Type Surface Mount
Input Clock, Crystal
Frequency - Max 200MHz
Divider/Multiplier No/No
Differential - Input:Output Yes/Yes
Base Product Number SI5317

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 2 (1 Year)
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SI5317C-C-GMR Image
SI5317C-C-GMR (1)

Manufacturer Part Number

SI5317C-C-GMR

Manufacturer

Skyworks Solutions

Introduction

The SI5317C-C-GMR is a jitter cleaner component from Skyworks Solutions, designed to enhance clock signal integrity in digital systems. It is usually packaged on a tape and reel, suitable for automated assembly processes, targeting applications within communications, networking, and data centers.

Product Features and Performance

Functions as a jitter cleaner improving signal quality

Incorporates a Phase-Locked Loop (PLL) with bypass options

Supports multiple outputs including CML, LVCMOS, LVDS, LVPECL

Operates with a single circuit configuration

Capable of handling input to output ratios of 2:2

Both input and output support differential signaling

Maximum frequency capability up to 200MHz

Product Advantages

Enhances system performance by reducing signal jitter

Flexible power supply range from 1.71V to 3.63V

Supports a wide range of output types catering to diverse requirements

Robust operating temperature range from -40°C to 85°C ensures reliability under varied environmental conditions

Key Technical Parameters

Input Types: Clock, Crystal

Output Types: CML, LVCMOS, LVDS, LVPECL

Frequency Max: 200MHz

Voltage Supply: 1.71V ~ 3.63V

Operating Temperature: -40°C ~ 85°C

Number of Circuits: 1

Differential Input:Output: Yes/Yes

Quality and Safety Features

Constructed following stringent industry standards

Features robust thermal performance suitable for harsh environments

Surface mount package ensures secure and reliable assembly

Compatibility

Compatible with a variety of clock input types and multiple output types, ensuring broad application across different technologies

Application Areas

Telecommunications

Data centers

Networking equipment

High-speed computing applications

Product Lifecycle

Currently marked as Active

Not close to discontinuation and replacements or upgrades should be available for the foreseeable future

Several Key Reasons to Choose This Product

Reduces clock signal jitter significantly, improving overall system stability and performance

Supports a broad range of input and output options providing design flexibility

Operates efficiently across a wide temperature and voltage range, enhancing system reliability

Comes in a compact 36-VFQFN exposed pad package, saving space on PCBs

Active product lifecycle status ensures continuous availability and support

Frequently Asked Questions(FAQ)

How does the SI5317C-C-GMR compare to a basic PLL clock buffer in terms of jitter performance for 200MHz LVDS systems, and what design considerations are critical when selecting between them?
The SI5317C-C-GMR integrates a DSPLL® architecture optimized for low-jitter clock regeneration, making it more suitable than standard PLL buffers for applications where phase noise and timing integrity are paramount. Unlike simple buffers, this device supports frequency synthesis with precise multiplication and division, enabling flexible input-to-output ratio configurations (e.g., 2:2), which allows system-level tuning without external components. In a 200MHz LVDS application, its internal voltage-controlled oscillator (VCO) and feedback loop filter are designed to suppress reference and VCO-induced jitter, typically achieving sub-100-fs RMS jitter—significantly better than uncompensated buffers. However, proper PCB layout is essential due to its sensitive supply decoupling requirements (1.71V–3.63V) and thermal pad management on the 36-QFN package.
What are the key differences between using the SI5317C-C-GMR with a crystal versus a clock input in terms of stability, startup time, and phase noise, especially in battery-powered embedded designs?
When configured with an external crystal, the SI5317C-C-GMR leverages the crystal’s inherent high Q-factor and long-term stability, resulting in superior phase noise performance and lower aging drift compared to a clock input derived from another oscillator. This configuration reduces reliance on potentially noisy reference sources but increases boot-up time by several milliseconds due to crystal warm-up and PLL lock acquisition. Conversely, using a clock input allows faster initialization, beneficial in power-constrained systems that require rapid wake-up sequences. However, the quality of the incoming clock directly impacts output jitter; poor signal integrity can degrade performance despite the IC’s internal filtering. Designers must weigh these trade-offs based on application latency tolerance versus long-term reliability needs.
Can the SI5317C-C-GMR be used to condition a low-frequency reference clock (e.g., 10 MHz TCXO) into a 200 MHz LVPECL signal without additional frequency multiplication stages, and what limitations should be considered?
Yes, the SI5317C-C-GMR can multiply a 10 MHz reference up to 200 MHz using its integrated fractional-N or integer-N synthesis capabilities, eliminating the need for discrete multipliers. It supports flexible input/output ratios such as 20:1 (10 MHz in → 200 MHz out) via internal dividers and multipliers, provided the VCO center frequency remains within operational bounds. However, increasing multiplication ratios may elevate close-in phase noise due to quantization effects in fractional mode, necessitating careful loop bandwidth selection. Additionally, output swing compliance for LVPECL must be verified against the 1.71V minimum supply voltage, as reduced headroom could limit drive strength or introduce distortion.
How does the operating temperature range (-40°C to 85°C) of the SI5317C-C-GMR affect frequency accuracy and jitter characteristics in industrial automation environments?
Within its specified -40°C to 85°C range, the SI5317C-C-GMR maintains stable frequency synthesis performance through temperature-compensated internal calibration and robust analog control loops. However, external factors like crystal frequency drift with temperature can indirectly influence output stability if not properly characterized. At extremes, capacitor tolerance variations in the onboard loop filter may slightly alter settling behavior, though this is typically mitigated by the DSPLL®’s digital compensation algorithms. For precision-critical applications, designers should still validate worst-case jitter and lock times under thermal cycling, as prolonged exposure near 85°C may accelerate long-term aging effects on associated passive components.
What are the implications of using the SI5317C-C-GMR’s bypass mode, and how does it affect system redundancy and fault tolerance in mission-critical infrastructure?
Bypass mode allows the input clock to pass directly to the output without PLL processing, useful for test scenarios or failover conditions. While this ensures uninterrupted signal flow during PLL lock loss, it disables jitter attenuation and frequency translation features, exposing downstream circuitry to upstream noise or instability. In redundant systems, bypass can serve as a hot-swappable diagnostic path or backup routing mechanism. However, relying on bypass for fault tolerance requires careful synchronization logic to prevent glitches during mode transitions. Given the SI5317C-C-GMR’s single-circuit design, full redundancy would necessitate dual devices, increasing board complexity and power consumption.
Is the SI5317C-C-GMR suitable for direct connection to a microcontroller’s GPIO clock pin, and what precautions are needed to ensure reliable operation?
Direct connection is feasible only if the GPIO output meets the SI5317C-C-GMR’s differential input thresholds (typically ±200 mV for LVDS/LVPECL modes). Most microcontrollers provide single-ended CMOS outputs, which lack the required differential signaling and noise margin. Therefore, a level translator or transformer-coupled interface is usually necessary to maintain signal integrity and prevent common-mode voltage issues. Moreover, the input must comply with the maximum frequency limit of 200 MHz and exhibit low jitter (<1 ps RMS recommended) to avoid degrading the output performance. Improper termination can also cause reflections, leading to setup/hold violations or increased EMI susceptibility.
How does the 36-VFQFN exposed pad package influence thermal management and signal integrity when mounting the SI5317C-C-GMR on a high-speed PCB?
The 36-QFN (6x6 mm) package with an exposed thermal pad enables efficient heat dissipation from the silicon die to the PCB ground plane, improving junction temperature stability under continuous operation—a benefit for long-duration deployments. Proper soldering and via stitching around the pad enhance conductivity, reducing thermal resistance. From a signal integrity standpoint, the compact footprint minimizes parasitic inductance and capacitance on high-speed nets, supporting clean LVDS/LVPECL transitions up to 200 MHz. However, the fine-pitch leads (0.4 mm pitch) demand precise layout to avoid solder bridging and ensure reliable connections, particularly in automated assembly processes.
What role does the Moisture Sensitivity Level (MSL) 2 classification play in the handling and storage of the SI5317C-C-GMR during manufacturing, and how does it impact shelf life?
MSL 2 indicates that the SI5317C-C-GMR can withstand up to one year of unopened storage at ambient conditions before requiring bake-out if exposed to ambient humidity beyond 60% RH. This classification reflects moderate sensitivity due to the presence of moisture-absorbing materials in the molding compound and underfill. During reflow soldering, uncontrolled moisture ingress can lead to popcorning, damaging bond wires or die attachments. Manufacturers must follow IPC/JEDEC J-STD-033 guidelines for bake cycles and dry packing. Proper handling ensures reliability, especially in high-volume production where traceability and environmental control are essential.
Can the SI5317C-C-GMR support spread spectrum clocking (SSC), and if so, what benefits or drawbacks arise in USB or PCIe-compliant systems?
The datasheet does not explicitly list spread spectrum modulation as a feature, implying limited or no native support. Introducing SSC would require external circuitry to modulate the reference input, complicating design and potentially violating compliance standards like USB 3.x or PCIe Gen4, which mandate strict jitter profiles. Even if implemented, SSC could interfere with the DSPLL®’s internal loop dynamics, causing tracking errors or excessive output wander. Therefore, while theoretically possible, it is generally discouraged unless mandated by regulatory requirements and thoroughly validated across all operating conditions.
How does the absence of external divider/multiplier options in the SI5317C-C-GMR affect flexibility when interfacing legacy 25 MHz systems with modern 200 MHz FPGA clocks?
Since the SI5317C-C-GMR lacks dedicated external dividers or multipliers, it relies solely on internal digital synthesis to achieve frequency conversion—such as dividing 200 MHz down to 25 MHz or multiplying 25 MHz up to 200 MHz. This provides sufficient flexibility for most ratio-based transformations (e.g., 8:1 division or 8:1 multiplication), but limits dynamic reconfiguration without firmware changes. Compared to hybrid solutions combining standalone dividers and multipliers, this integration reduces component count and propagation delay, yet offers less granular control over intermediate frequencies. Designers must verify that target ratios fall within the VCO’s valid operating band (typically 1 GHz nominal) and meet phase noise budgets at both endpoints.
What are the risks of exceeding the 3.63V absolute maximum supply voltage on the SI5317C-C-GMR, and how can undervoltage scenarios impact jitter performance?
Exceeding 3.63V risks permanent damage to the internal ESD protection structures and core logic, especially given the tight 1.71V–3.63V operating window. Even brief transients above this threshold may degrade reliability over time. Undervoltage below 1.71V causes the PLL to lose lock or fail to initialize, resulting in undefined output states or complete shutdown. Below nominal supply, the output drivers’ swing diminishes, reducing noise margins in differential interfaces like LVDS, which increases susceptibility to EMI and inter-symbol interference. Stable, well-regulated power delivery with adequate decoupling (e.g., 1 µF bulk + 0.1 µF ceramic per pin) is critical for maintaining low jitter and deterministic behavior.
Does the SI5317C-C-GMR support hot-plug capability, and what precautions are recommended when connecting/disconnecting clocks in live systems?
Hot-plugging is not inherently supported due to the absence of built-in surge protection or clamping diodes on the inputs. Abruptly disconnecting a clock source while powered can induce voltage spikes or floating inputs, potentially triggering latch-up or erratic PLL states. To mitigate this, series resistors (e.g., 22 Ω) and TVS diodes should be added to dampen transients. Additionally, enable/disable sequencing via software control ensures clean transitions between active and standby modes. These measures preserve device integrity and maintain system stability during maintenance or field upgrades.
How does the ECCN designation (EAR99) affect international sourcing and export compliance for the SI5317C-C-GMR, and what documentation is typically required?
Classified under ECCN EAR99, the SI5317C-C-GMR is subject to U.S. Export Administration Regulations but generally qualifies for unrestricted licensing in most countries, simplifying global procurement. However, end-use restrictions apply if deployed in defense, encryption, or nuclear applications. Importers may request commercial invoices and certificates of origin. While not ITAR-controlled, exporters should still verify local regulations, especially in regions with evolving trade policies. Maintaining accurate records of purchase orders and technical specifications aids compliance audits and avoids shipment delays.
What impact does the lack of a DiGi-Electronics programming interface have on field reprogrammability of the SI5317C-C-GMR’s frequency settings?
Without a DiGi-Electronics interface, the SI5317C-C-GMR’s frequency parameters are set at manufacture via hardwired fuses or non-volatile memory that cannot be modified post-deployment. This limits adaptability in production testing or field updates but enhances security by preventing unauthorized configuration changes. Designers must finalize frequency plans early, considering potential system reconfigurations. If future flexibility is needed, alternative devices with I²C or SPI-programmable registers should be evaluated, albeit at higher cost and pin count.
How does the SI5317C-C-GMR handle simultaneous multi-output loads (e.g., LVCMOS and LVDS driving different ASICs), and are there any crosstalk concerns in the 36-QFN package?
The device provides independent output drivers capable of configuring each channel to LVCMOS, LVDS, LVPECL, or LVCMOS modes simultaneously, allowing tailored impedance matching per load. Crosstalk is minimized by internal routing isolation and ground planes, but aggressive switching on adjacent pins can couple noise into sensitive inputs. Careful PCB layer stack-up with solid return paths and spacing (>3× trace width) reduces interference. Thermal gradients across the 6x6 mm die may also cause slight skew between outputs, though this is typically <5 ps for same-device pairs under matched conditions.
What is the typical lock time for the SI5317C-C-GMR when transitioning between frequency bands, and how does it affect real-time system responsiveness?
Lock time varies from tens of microseconds to a few hundred microseconds depending on loop filter design, reference stability, and frequency step size. Smaller steps (e.g., fractional-N hops) settle faster than large jumps (e.g., 10 MHz to 200 MHz). In real-time systems like motor control or communication handshakes, prolonged lock periods can introduce dead zones or missed deadlines. Designers often implement predictive pre-loading or use fast-locking modes (if available) to minimize latency. Monitoring lock detect signals enables graceful fallback strategies during transient events.
Can the SI5317C-C-GMR operate reliably in environments with high electromagnetic interference (EMI), and what layout practices enhance robustness?
The SI5317C-C-GMR itself generates minimal EMI due to its integrated loop filtering and low-power operation, but it remains susceptible to external disturbances. Robust operation demands careful grounding, short return paths, and shielding of high-speed traces. Placing decoupling capacitors within 2 mm of power pins and using guard rings around sensitive nodes reduce coupling. Avoiding parallel routing of clock lines with data buses prevents capacitive crosstalk. In harsh EMI environments, adding ferrite beads on power rails or using differential signaling further improves resilience.
What alternatives exist if the SI5317C-C-GMR’s fixed packaging or voltage range is incompatible with a target system, and how do they compare functionally?
Alternatives include the SI5320 or SI5324 families from Skyworks, offering similar jitter cleaning with broader voltage ranges (1.8V–3.6V), more output channels, or programmable interfaces. The SI5344 provides eight outputs with I²C configuration, enhancing flexibility. Comparatively, the SI5317C-C-GMR excels in space-constrained, low-jitter single-output applications where cost and simplicity outweigh reprogramming needs. Selection hinges on balancing pin count, supply compatibility, output types, and required lock speed—each trade-off reflecting specific system constraints rather than generic performance superiority.

Parts with Similar Specifications

The three parts on the right have similar specifications to Skyworks Solutions Inc. SI5317C-C-GMR

Product Attribute SI5317B-C-GMR SI5317A-C-GMR SI5317C-C-GM SI5317D-C-GMR
Part Number SI5317B-C-GMR SI5317A-C-GMR SI5317C-C-GM SI5317D-C-GMR
Manufacturer Skyworks Solutions Inc. Skyworks Solutions Inc. Skyworks Solutions Inc. Skyworks Solutions Inc.
Divider/Multiplier - - - -
Voltage - Supply - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
PLL - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Differential - Input:Output - - - -
Input - - - -
Output - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Ratio - Input:Output - - - -
Number of Circuits - - - -
Frequency - Max - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

SI5317C-C-GMR Datasheet PDF

Download SI5317C-C-GMR pdf datasheets and Skyworks Solutions Inc. documentation for SI5317C-C-GMR - Skyworks Solutions Inc..

Datasheets
Cylindrical Battery Holders.pdf
HTML Datasheet
SI5317 Datasheet.pdf
PCN Other
Skyworks Acquisition 9/Jul/2021.pdf

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SI5317C-C-GMR Image

SI5317C-C-GMR

Skyworks Solutions Inc.
32D-SI5317C-C-GMR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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