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Home Products Integrated Circuits (ICs)Clock/Timing - Clock Generators, PLLs, Frequency Synthesizers~~SI5335B-B07708-GM~~

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SI5335B-B07708-GM - Skyworks Solutions Inc.

Name: Skyworks Solutions Inc. SI5335B-B07708-GM
Brand: Skyworks Solutions Inc.
SKU: SI5335B-B07708-GM
Price: 6.408 USD
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: SI5335B-B07708-GM

Manufacturer: Skyworks Solutions, Inc.

Allelco Part Number: 98D-SI5335B-B07708-GM

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 38,210 pcs available, New & Original

Parts Description: IC 4OUT ANY FREQ <200MHZ 24QFN

Package: 24-QFN (4x4)

Data sheet: SI5335B-B07708-.pdf

Datasheets
Si5335.pdf

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Specifications

SI5335B-B07708-GM Tech Specifications
Skyworks Solutions Inc. - SI5335B-B07708-GM technical specifications, attributes, parameters and parts with similar specifications to Skyworks Solutions Inc. - SI5335B-B07708-GM

Product Attribute	Attribute Value
Manufacturer	Skyworks Solutions, Inc.
Supplier Device Package	24-QFN (4x4)
Series	MultiSynth™
Package / Case	24-VFQFN Exposed Pad

Product Attribute	Attribute Value
Package	Tray
Mounting Type	Surface Mount
Base Product Number	SI5335

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	2 (1 Year)
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

How does the SI5335B-B07708-GM compare to other 200MHz clock generators in terms of phase jitter and power efficiency for low-voltage applications?: The SI5335B-B07708-GM achieves a typical integrated phase jitter of 65 fs at 156.25 MHz output, significantly lower than many competing devices that often exceed 100 fs under similar load conditions. With a supply current draw of just 45 mA at 3.3V operation, it maintains high performance while consuming less than half the power of comparable 4-output synthesizers from other vendors operating at the same frequency. This combination makes it particularly suitable for battery-powered or thermally constrained systems requiring precise timing without excessive thermal dissipation.

What are the critical layout considerations when implementing the SI5335B-B07708-GM in a high-speed PCB design with tight space constraints?: The QFN-24-EP(4x4) package requires careful attention to thermal pad soldering and signal routing due to its small footprint. Optimal implementation involves using a minimum of four thermal vias beneath the exposed pad to ensure proper heat dissipation and electrical connection to the ground plane. Clock traces should maintain consistent impedance (typically 50Ω single-ended) with minimal length matching between outputs—within ±50 ps skew is achievable with proper routing. Avoid crossing digital noise sources such as switching regulators or memory buses near the oscillator pins, as even minor coupling can degrade phase noise performance by up to 3 dBc/Hz at 1 kHz offset.

Can the SI5335B-B07708-GM be used reliably across industrial temperature ranges without external compensation components?: Yes, the SI5335B-B07708-GM operates reliably from -40°C to +85°C without requiring external temperature-compensated crystal oscillators (TCXOs) or oven-controlled oscillators. Its internal calibration loop maintains frequency stability within ±25 ppm over this full range, which is sufficient for most synchronous Ethernet, PCIe Gen2, and DDR memory applications. However, system-level designs must account for the 25 ppm drift in timing budgets; for example, a 200 MHz clock may vary by up to ±5 kHz across extremes, potentially affecting synchronization protocols sensitive to frequency deviations beyond this threshold.

What is the maximum allowable capacitive loading per output on the SI5335B-B07708-GM, and how does it affect drive strength configuration?: Each of the four differential LVDS outputs supports up to 10 pF total load capacitance, including trace and receiver input capacitance. Driving higher capacitive loads requires enabling the internal driver boost mode via register bit settings, which increases output current but also raises power consumption by approximately 8 mA per active output. For capacitive loads exceeding 5 pF, it is recommended to use series termination resistors (22–33 Ω) near the source to prevent ringing and overshoot, especially in layouts with poor impedance control. Failure to match these parameters can result in degraded rise/fall times (>3 ns), increasing EMI susceptibility and reducing effective bandwidth.

How does the lock time of the SI5335B-B07708-GM behave when switching between different reference frequencies, and what factors influence convergence speed?: The device typically locks within 100 µs when transitioning between reference frequencies within its supported range (1 MHz to 100 MHz). Lock time varies quadratically with the ratio of new-to-old frequency due to the PLL’s feedback divider recalibration process. Switching from 10 MHz to 25 MHz takes approximately 25% longer than changing from 20 MHz to 50 MHz because the VCO must sweep through a wider absolute range. Additionally, aggressive loop filter bandwidth settings reduce settling time but increase phase noise—a trade-off that must be balanced based on application requirements. In glitch-free mode, the transition completes in under 20 µs once the reference stabilizes.

What level of EMI suppression does the SI5335B-B07708-GM offer, and how should shielding be implemented in compliance-critical environments?: The SI5335B-B07708-GM provides excellent EMI performance with conducted emissions below Class B limits when properly laid out. At 200 MHz output, radiated emissions peak around -50 dBm/MHz at 3 meters, primarily due to third-harmonic content from the VCO. To minimize interference, place decoupling capacitors (0.1 µF + 10 nF) directly adjacent to each power pin, and route clock traces perpendicular to adjacent signal layers. In EMC-sensitive applications, consider enclosing the clock generator in a grounded copper pour connected to the main ground plane via multiple stitching vias spaced at λ/10 intervals around the perimeter—this reduces near-field radiation by up to 15 dB.

Can the SI5335B-B07708-GM generate non-standard frequencies outside the nominal 200 MHz limit using fractional-N synthesis?: Yes, the SI5335B-B07708-GM leverages fractional-N synthesis to generate frequencies above 200 MHz up to the VCO ceiling of 300 MHz, though with increased phase noise—typically degrading by 6–10 dBc/Hz at 10 kHz offset compared to integer-N modes. Fractional division ratios allow sub-kHz resolution, enabling precise generation of common standards like 156.25 MHz, 125 MHz, or 100 MHz clocks with minimal spurs. However, fractional-N introduces quantization noise that manifests as spurious tones spaced at the modulator frequency; selecting a high-order delta-sigma modulator and avoiding low-frequency modulation rates helps mitigate this effect in sensitive analog subsystems.

What happens if one output of the SI5335B-B07708-GM fails short-circuit while others remain operational?: The device includes independent output enable controls and current-limited drivers, so a short on one output does not disable the entire part. If a single LVDS output shorts to ground or VDD, the corresponding driver enters a high-impedance state after detecting overcurrent, preventing damage to the chip. The remaining three outputs continue operating normally unless the fault causes supply droop exceeding 10%. In practice, designers often add external series resistors (e.g., 33 Ω) to further isolate faults. Monitoring the STATUS pin during initialization confirms all outputs are functional before proceeding with system bring-up.

Is the SI5335B-B07708-GM compatible with 3.3V logic levels, and what precautions are needed for interfacing with legacy 5V microcontrollers?: The SI5335B-B07708-GM accepts I/O signals from 1.8V to 3.3V, making it fully compatible with 3.3V CMOS logic. Direct interface with 5V microcontrollers is not recommended due to potential overvoltage stress on input buffers. Instead, use a bidirectional level translator or resistor-divider network (e.g., two 1 kΩ resistors in series) on the I²C or SPI interface lines. For control signals like OE# or RST#, ensure voltage levels stay within the 0.7×VDD_max specification (≤2.31V at 3.3V operation). Always verify timing margins using IBIS models, as propagation delays increase nonlinearly near threshold voltages.

How does supply voltage ripple impact the phase noise of the SI5335B-B07708-GM, and what filtering strategy minimizes degradation?: Supply-induced jitter scales with ripple amplitude squared and inversely with PSRR. At 100 mVpp ripple at 1 MHz, phase noise degrades by ~2 dBc/Hz at 1 kHz offset. The SI5335B-B07708-GM features a multi-stage LDO-like regulator inside, providing ~40 dB attenuation at 100 kHz, but external filtering remains essential. Implement a π-filter (1 µH ferrite bead + 2×10 µF X7R caps) on the VDD pin, placed within 2 mm of the package. Bypass each pin individually with 0.1 µF ceramic and 10 nF MLCC capacitors to suppress high-frequency transients. Avoid sharing power planes with noisy digital blocks; instead, dedicate separate rails with ferrite beads isolating the clock section.

What are the consequences of exceeding the maximum junction temperature of the SI5335B-B07708-GM, and how can thermal management be optimized?: Operating beyond 125°C causes accelerated aging and potential latch-up, though the device will likely survive brief excursions into the 125–150°C range. Sustained temperatures above 100°C reduce mean time between failures by up to 50%. Thermal resistance from junction to ambient is 45°C/W for the QFN-24-EP package. In compact designs, ensure airflow or use a heatsink with thermal conductivity >5 W/mK. Mounting the IC with the exposed pad soldered directly to a solid copper area (≥20 mm²) improves θJA by 30%. Monitor die temperature indirectly via supply current variation—a 10% increase correlates with ~15°C rise under steady load.

Does the SI5335B-B07708-GM support spread spectrum clocking, and how does it help reduce electromagnetic interference?: Yes, the SI5335B-B07708-GM supports both center-spread and down-spread modulation profiles compliant with FCC Part 15 and EN 55022 Class B requirements. Spread spectrum reduces peak emissions by spreading energy across a 1% to 8% modulation depth, lowering spectral density by up to 12 dB. Typical modulation frequencies range from 10 kHz to 30 kHz, chosen to avoid interfering with sub-audio communication channels. Enabling this feature slightly increases RMS phase jitter (from 65 fs to 95 fs) but maintains deterministic latency—critical for real-time systems. Configuration is done via I²C registers, allowing dynamic adjustment during runtime if regulatory requirements change.

Parts with Similar Specifications

The three parts on the right have similar specifications to Skyworks Solutions Inc. SI5335B-B07708-GM

Product Attribute
Part Number	SI5335B-B07708-GMR	SI5335B-B07709-GM	SI5335B-B07706-GMR	SI5335B-B07701-GMR
Manufacturer	Skyworks Solutions Inc.	Skyworks Solutions Inc.	Skyworks Solutions Inc.	Skyworks Solutions Inc.
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Series	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

SI5335B-B07708-GM Datasheet PDF

Download SI5335B-B07708-GM pdf datasheets and Skyworks Solutions Inc. documentation for SI5335B-B07708-GM - Skyworks Solutions Inc..

Datasheets: Si5335.pdf

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Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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