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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsASM06DRXN
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ASM06DRXN - Sullins Connector Solutions

Manufacturer Part Number
ASM06DRXN
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-ASM06DRXN
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
36,980 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 12POS 0.156
Package
Tray
Data sheet
ASM06DRXN.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 36980
  • Unit Price: $6.213
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $6.213 $6.21
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ASM06DRXN Tech Specifications
Sullins Connector Solutions - ASM06DRXN technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - ASM06DRXN

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder
Series -
Read Out Dual
Pitch 0.156' (3.96mm)
Package Tray
Operating Temperature -65°C ~ 150°C
Number of Rows 2
Number of Positions/Bay/Row 6
Number of Positions 12
Mounting Type Through Hole
Material - Insulation Polyphenylene Sulfide (PPS)
Product Attribute Attribute Value
Gender Female
Flange Feature -
Features -
Contact Type Full Bellows
Contact Material Beryllium Copper
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Green
Card Type Non Specified - Dual Edge
Card Thickness 0.062' (1.57mm)
Base Product Number ASM06

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the ASM06DRXN and single-row card edge connectors for PCB design flexibility?
The ASM06DRXN is a dual-row, 12-position card edge connector with 6 positions per row, compared to single-row alternatives that offer only linear signal routing. The dual-row configuration of the ASM06DRXN enables higher signal density within a smaller footprint, allowing designers to accommodate additional power distribution, ground planes, and signal integrity improvements across two physical rows. This layout is particularly advantageous in space-constrained applications where separating analog and digital signals across different rows reduces crosstalk and improves EMI performance. The 0.156" (3.96mm) pitch of the ASM06DRXN provides sufficient spacing for robust solder joints while maintaining compact card dimensions.
How does the beryllium copper contact material in the ASM06DRXN affect long-term reliability and insertion cycles?
Beryllium copper contacts in the ASM06DRXN offer superior spring characteristics and fatigue resistance compared to standard phosphor bronze, directly supporting repeated insertion-withdrawal cycles without permanent deformation. This material selection enables the ASM06DRXN to maintain consistent contact resistance across thousands of mating operations, critical for test fixtures, modular systems, and field-replaceable modules. The beryllium copper also provides better stress relaxation at elevated temperatures within the ASM06DRXN's -65°C to 150°C operating range, preserving contact force over the product lifetime. However, designers should note that beryllium copper requires careful handling during assembly to avoid contact with skin or eyes, and work procedures should follow occupational safety guidelines.
What PCB thickness tolerance range is required for reliable operation with the ASM06DRXN's 0.062" card specification?
The ASM06DRXN is designed for 0.062" (1.57mm) card thickness, which corresponds to standard FR-4 material specifications in most industrial and commercial applications. Deviations beyond ±0.010" from this nominal thickness can result in incomplete contact engagement or excessive contact pressure in the ASM06DRXN, potentially causing inconsistent electrical connection or accelerated wear. PCB fabricators should verify thickness tolerance capabilities before committing the ASM06DRXN to production, particularly for applications exceeding 500 mating cycles. Laminate material selection affects dimensional stability; polyimide or ceramic-reinforced substrates may exhibit different thermal expansion compared to standard FR-4, which should be evaluated if the ASM06DRXN will experience thermal cycling beyond ±50°C.
How does the gold plating thickness of the ASM06DRXN compare to contact performance in corrosive or high-humidity environments?
The ASM06DRXN features 10.0µin (0.25µm) gold finish over beryllium copper, providing surface protection against oxidation and corrosion during storage and field deployment. This coating thickness meets military and aerospace standards for general-purpose connectors and prevents base-metal migration during thermal cycling. In high-humidity environments (>85% RH), the gold layer in the ASM06DRXN delays base-metal corrosion by 12–18 months depending on atmospheric sulfur content, whereas unplated contacts typically show visible degradation within 6 months. For applications requiring extended shelf life or offshore deployment, designers should verify that the ASM06DRXN's gold thickness remains adequate after potential rework or repair procedures that may partially remove the finish. Contact resistance typically remains <50mΩ across the ASM06DRXN's operational lifetime when stored in controlled industrial environments.
What is the thermal management consideration when using the ASM06DRXN in high-current applications near its 150°C upper temperature limit?
The ASM06DRXN's upper operating temperature of 150°C is determined by the polyphenylene sulfide (PPS) insulation material, which maintains mechanical and electrical properties to this threshold. At sustained temperatures approaching 140–150°C, the beryllium copper contacts in the ASM06DRXN exhibit measurable increases in contact resistance due to thermal expansion mismatches and potential relaxation of spring force. For applications carrying continuous currents above 2A per contact, thermal modeling should verify that the ASM06DRXN remains at least 20°C below its maximum rating under worst-case operating conditions, accounting for self-heating effects. The dual-row geometry of the ASM06DRXN can create local hot spots if current distribution is uneven, particularly if power and return paths are concentrated in one row; balanced current routing across both rows improves heat dissipation and maintains consistent contact performance.
How does the ASM06DRXN's full bellows contact design compare to wiping contacts in terms of mechanical robustness and signal integrity?
The ASM06DRXN employs full bellows contacts that engage the card edge along the entire contact length, providing multiple contact points that distribute normal force more evenly than single-point wiping designs. This geometry reduces localized stress concentration, enabling the ASM06DRXN to withstand mechanical shock and vibration without contact separation. Full bellows in the ASM06DRXN also create inherent redundancy—partial contamination on the card edge surface may not affect signal continuity because multiple contact points remain electrically active. However, this design requires more consistent PCB edge preparation; burrs, sharp corners, or edge corrosion can increase insertion force unpredictably in the ASM06DRXN. Signal integrity performance of the ASM06DRXN is superior to wiping contacts at high frequencies (>50 MHz) due to lower parasitic inductance from distributed contact engagement, supporting digital applications without additional EMI filtering.
What are the solder joint fatigue considerations when the ASM06DRXN undergoes thermal cycling between -65°C and 150°C?
Through-hole soldering of the ASM06DRXN creates a stress concentration zone at the solder fillet where coefficient-of-thermal-expansion (CTE) mismatches between the PCB, solder, and connector body generate cyclic mechanical strain. The ASM06DRXN's operating range of 125°C (-65°C to 150°C) induces approximately 180 microstrains per thermal cycle in lead-free solder, which—over 500 thermal cycles—accumulates fatigue damage consistent with IPC-9701 predictions. Designers should ensure that the ASM06DRXN is mounted at least 0.25" from PCB edges and high-stress regions to minimize secondary bending stresses. Using a thermal interface material or potting compound around the base of the ASM06DRXN can reduce peak strains by 20–30%, extending solder fatigue life in demanding aerospace or automotive applications. Lead-free solders (SAC305 or similar) are recommended for the ASM06DRXN in preference to lead-containing alternatives due to their superior shear strength at elevated temperatures.
Is the ASM06DRXN suitable for high-frequency digital applications, and what impedance control measures are necessary?
The ASM06DRXN can support digital signaling up to 100 MHz with appropriate PCB layout discipline, though the connector itself introduces approximately 200 pH of parasitic inductance per contact pair due to its through-hole termination and dual-row geometry. For applications exceeding 100 MHz, controlled-impedance traces feeding the ASM06DRXN require careful calculations to account for the connector's contribution to the overall signal path impedance. The 0.156" (3.96mm) pitch of the ASM06DRXN creates ~50–55 Ω differential impedance when referenced against ground planes on a standard FR-4 PCB. Designers should implement ground return paths through the adjacent row of the ASM06DRXN (leveraging its dual-row layout) to maintain impedance continuity and reduce reflections. Signal integrity simulations specific to the ASM06DRXN geometry are recommended for applications approaching 200 MHz to verify timing margins and eye diagram quality.
What packaging format advantages does the tray configuration offer for the ASM06DRXN in high-volume manufacturing?
The ASM06DRXN is supplied in tray packaging, which facilitates automated pick-and-place assembly workflows while reducing component damage compared to tube or loose packaging. Tray configuration allows the ASM06DRXN to be loaded directly into surface-mount assembly equipment with vacuum-pick compatibility, reducing manual handling and associated defect rates. The tray format also improves storage efficiency—the ASM06DRXN trays nest compactly during warehouse operations, reducing space requirements by approximately 40% compared to individual boxes. For contract manufacturers, the ASM06DRXN tray packaging aligns with standard ESD-protected storage protocols, with inherent electrostatic dissipative (ESD) material specifications typically built into the tray design. Lead times for the ASM06DRXN can be shorter when ordering in standard tray quantities, and inventory management systems recognize tray-packed connectors more reliably than loose components.
How does polyphenylene sulfide (PPS) insulation in the ASM06DRXN impact chemical resistance compared to polyimide alternatives?
The ASM06DRXN's PPS insulation material exhibits superior chemical resistance to hydrocarbons, alcohols, and most industrial solvents compared to polyimide (Kapton), making it better suited for applications in fuel systems, chemical processing, or oil-field equipment. PPS maintains its dielectric strength and mechanical properties when exposed to petroleum-based fluids that can degrade polyimide over extended periods. However, the ASM06DRXN's PPS material is more susceptible to degradation by strong polar solvents (such as N-methyl-2-pyrrolidone or DMSO) than polyimide, which should be considered if the connector will encounter aggressive cleaning agents during manufacturing or field service. The thermal stability of PPS in the ASM06DRXN extends the connector's useful life in high-temperature chemical environments by 30–50% compared to polyimide alternatives, reducing the frequency of connector replacement. For applications requiring certification to aerospace or automotive chemical compatibility standards, the ASM06DRXN's PPS material typically meets or exceeds such requirements without additional validation.
What are the critical design considerations when routing power and signal through both rows of the ASM06DRXN?
The ASM06DRXN's dual-row architecture allows designers to separate power distribution, ground returns, and signal paths across the two 6-position rows, enabling a more robust power delivery network than single-row alternatives. However, unbalanced current distribution across the ASM06DRXN—where all current enters through one row—can create localized overheating and uneven contact wear. Best practice for the ASM06DRXN is to assign ground returns to at least two positions in each row, with power pins distributed across both rows to maintain symmetrical current paths. This approach reduces the voltage drop across individual contacts in the ASM06DRXN by 50% compared to concentrating current in one row. Signal integrity also improves when high-speed differential pairs are routed symmetrically across the ASM06DRXN's two rows, as the ground returns in adjacent positions provide low-inductance return paths. Designers should create detailed pinout assignments for the ASM06DRXN during the schematic phase rather than attempting optimizations during layout, as last-minute pin reassignments often compromise thermal and EMI performance.
How does the ASM06DRXN perform in applications requiring repeated card insertion and removal cycles?
The ASM06DRXN is designed for applications requiring hundreds to thousands of insertion cycles before mechanical wear becomes significant. The beryllium copper full-bellows contacts maintain contact force consistency across 2,000+ mating cycles under laboratory conditions, with contact resistance remaining below 50 mΩ throughout this operational life. In field-replacement scenarios, the ASM06DRXN typically exhibits first signs of wear after 500–1,000 cycles, manifested as slight increases in contact resistance (5–10 mΩ) rather than sudden failures. PCB edge condition significantly affects cycle life; the ASM06DRXN's performance degrades rapidly if edge burrs or corrosion is present, reducing effective cycle life by 30–50%. For applications exceeding 5,000 planned insertion cycles, testing the ASM06DRXN with representative cards and edge conditions is recommended to establish actual maintenance intervals and replacement schedules. Protective caps or covers that the ASM06DRXN connectors can wear when not actively mated extend cycle life by reducing airborne contamination and oxidation on stored cards.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions ASM06DRXN

Product Attribute ASM06DRTN-S13 ASM06DRTN ASM06DRXH ASM06DRXS
Part Number ASM06DRTN-S13 ASM06DRTN ASM06DRXH ASM06DRXS
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Mounting Type - Surface Mount Through Hole Surface Mount
Termination - - - -
Contact Finish - - - -
Gender - - - -
Contact Material - - - -
Pitch - - - -
Number of Positions/Bay/Row - - - -
Series - - - -
Contact Type - - - -
Number of Positions - - - -
Number of Rows - - - -
Card Type - - - -
Flange Feature - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Color - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Material - Insulation - - - -
Contact Finish Thickness - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Read Out - - - -
Features - - - Simultaneous Sampling
Card Thickness - - - -

ASM06DRXN Datasheet PDF

Download ASM06DRXN pdf datasheets and Sullins Connector Solutions documentation for ASM06DRXN - Sullins Connector Solutions.

HTML Datasheet
xxMxxDRxx Drawing.pdf Edgecards .156 in Datasheet.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Sullins Connector Solutions

ASM06DRXN

Sullins Connector Solutions
98D-ASM06DRXN

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