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HomeProductsConnectors, InterconnectsCard Edge Connectors - Edgeboard ConnectorsEBM12DSEN-S13
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EBM12DSEN-S13 - Sullins Connector Solutions

Manufacturer Part Number
EBM12DSEN-S13
Manufacturer
Sullins Connector Solutions
Allelco Part Number
98D-EBM12DSEN-S13
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
31,022 pcs available, New & Original
Parts Description
CONN EDGE DUAL FMALE 24POS 0.156
Package
Tray
Data sheet
EBM12DSEN-S13.pdf

Environmental Information

Sullins Connector Solutions REACH.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 31022
  • Unit Price: $5.842
  • Subtotal: $0.00

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1+ $5.842 $5.84
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

EBM12DSEN-S13 Tech Specifications
Sullins Connector Solutions - EBM12DSEN-S13 technical specifications, attributes, parameters and parts with similar specifications to Sullins Connector Solutions - EBM12DSEN-S13

Product Attribute Attribute Value
Manufacturer Sullins Connector Solutions
Termination Solder Eyelet(s)
Series -
Read Out Dual
Pitch 0.156" (3.96mm)
Package Tray
Operating Temperature -65°C ~ 125°C
Number of Rows 2
Number of Positions/Bay/Row 12
Number of Positions 24
Mounting Type Board Edge, Straddle Mount
Material - Insulation Polybutylene Terephthalate (PBT)
Product Attribute Attribute Value
Gender Female
Flange Feature -
Features Card Extender
Contact Type Full Bellows
Contact Material Phosphor Bronze
Contact Finish Thickness 10.0µin (0.25µm)
Contact Finish Gold
Color Blue
Card Type Non Specified - Dual Edge
Card Thickness 0.062" (1.57mm)
Base Product Number EBM12

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What is the actual contact pitch of the EBM12DSEN-S13, and how does the 0.156" spacing affect PCB layout decisions?
The EBM12DSEN-S13 features a 0.156" (3.96mm) pitch between contact positions, which is a legacy standard primarily found in industrial and test equipment applications. This pitch is significantly larger than modern 0.1" (2.54mm) or 0.05" (1.27mm) connectors, requiring dedicated PCB layout footprints and limiting integration density. When designing for the EBM12DSEN-S13, engineers must allocate approximately 3.96mm of trace routing per signal, which affects layer stack planning and signal integrity routing on high-speed boards. The dual-row configuration of the EBM12DSEN-S13 with 12 positions per row and 24 total positions creates a staggered contact pattern that demands careful via placement to avoid signal coupling between rows.
How does the 0.062" card thickness specification of the EBM12DSEN-S13 compare to industry standard PCB thicknesses, and what assembly implications exist?
The EBM12DSEN-S13 is designed for 0.062" (1.57mm) card thickness, which corresponds to standard PCB materials but sits at the lower end of mechanical rigidity. Most commercial FR-4 stock is manufactured at 1.6mm nominal (0.063"), making the EBM12DSEN-S13 specification a tight mechanical tolerance. During assembly, slight variations in PCB thickness—whether from material tolerance stack-up or solder mask buildup—can affect connector seating force and contact reliability. For applications using the EBM12DSEN-S13 in high-vibration environments, mechanical stabilization features such as guide pins or bracket reinforcement may be necessary to prevent micro-motion that could degrade the phosphor bronze contact interface.
What temperature derating should be applied to signal integrity and contact resistance when using the EBM12DSEN-S13 across its full -65°C to 125°C operating range?
The EBM12DSEN-S13 operates across -65°C to 125°C, a 190°C span that introduces multiple failure mechanisms. Phosphor bronze contact resistance increases approximately 0.4% per °C above 20°C reference, meaning contact resistance at 125°C can be 40–50% higher than room temperature baseline. For the EBM12DSEN-S13, this translates to potential voltage drops exceeding 100mV on signals carrying 2–3A, particularly problematic for low-voltage logic standards. At the cold extreme, -65°C operation causes PBT insulation shrinkage and increases mechanical stiffness, potentially increasing mating force. The gold contact finish (10.0µin thickness) on the EBM12DSEN-S13 remains protective across the temperature range, but designers should validate contact resistance at temperature extremes when using the connector for analog signal applications or precise measurement circuits.
How does the full bellows contact design of the EBM12DSEN-S13 affect insertion/extraction force and connector lifecycle in repeated mating cycles?
The EBM12DSEN-S13 employs full bellows contacts, which provide consistent contact force across the entire card insertion stroke through stored spring energy. This design reduces force variation compared to cantilever contacts, typically maintaining contact force within ±15% across 0.062" card travel. However, bellows contacts experience fatigue in the spring material after repeated insertion cycles. In typical test equipment or card cage applications where the EBM12DSEN-S13 undergoes 50–200 mating cycles, contact force degradation of 5–10% is normal. For applications requiring >500 cycles, the EBM12DSEN-S13 should be tested under actual insertion/extraction loads to verify contact reliability doesn't degrade below minimum specification. The straddle mount design of the EBM12DSEN-S13 also distributes insertion force across two card edges, reducing localized stress compared to single-edge connectors.
Why is the EBM12DSEN-S13 gold-plated with only 10.0µin (0.25µm) thickness, and what corrosion or fretting scenarios could compromise performance?
The EBM12DSEN-S13 specifies 10.0µin gold plating over phosphor bronze, which is relatively thin compared to thick-gold (50µin+) industrial connectors. This thickness level is economical for environments with low fretting risk and infrequent mating cycles. However, in high-humidity industrial settings, high-vibration platforms, or applications with marginal contact force, the thin gold layer on the EBM12DSEN-S13 can wear through within 50–100 cycles, exposing the phosphor bronze substrate to oxidation. Once exposed, oxidation forms a film that increases contact resistance exponentially. For the EBM12DSEN-S13, this is particularly concerning in analog signal paths or low-current logic applications. If applications require extended shelf life in humid environments before first mating, the EBM12DSEN-S13 should be stored in dry-pack or protective coatings should be evaluated.
What is the maximum continuous current per contact on the EBM12DSEN-S13, and how does current distribution across 24 positions affect thermal design?
While not explicitly stated in base specifications, the EBM12DSEN-S13 full bellows contacts and phosphor bronze material typically support 2–5A per contact depending on insertion depth and contact pressure. With 24 positions on the EBM12DSEN-S13, theoretical maximum aggregate current is 48–120A, but actual distribution depends on load balancing. In poorly balanced designs, current preferentially flows through the first few contacts to mate (typically edge contacts), causing localized heating. For the EBM12DSEN-S13, if designs approach 50% of theoretical maximum per contact, thermal modeling should account for ΔT rise of 10–15°C above ambient due to I²R losses. In applications using the EBM12DSEN-S13 for power distribution, parallel current paths across multiple signal rows should be explicitly planned in schematic design to prevent hot-spot formation.
How does PBT insulation on the EBM12DSEN-S13 perform in environments with chemical exposure or high humidity, and what creep behavior should be expected?
The EBM12DSEN-S13 uses polybutylene terephthalate (PBT) for the insulation body, a thermoplastic with excellent chemical resistance to oils, coolants, and weak solvents common in industrial environments. However, PBT exhibits creep—time-dependent strain under sustained mechanical stress—which becomes measurable above 80°C. For the EBM12DSEN-S13 operating at 125°C continuous duty, creep strain can reach 0.5–1% over 10,000 hours, potentially affecting connector positioning or alignment on the PCB. In high-humidity environments (>85% RH), PBT absorption of atmospheric moisture leads to dimensional changes of approximately 0.3% over several weeks. For the EBM12DSEN-S13, this can affect mechanical clearances in guide rails or alignment fixtures. Extended storage in sealed, dry-pack conditions is recommended for the EBM12DSEN-S13 if mating is deferred >6 months after manufacturing.
What is the total insertion force and extraction force specification for the EBM12DSEN-S13, and how does dual-edge straddle mounting affect mechanical stability compared to single-edge designs?
Dual-edge straddle mount connectors like the EBM12DSEN-S13 distribute insertion forces across two contact points on opposite edges of the PCB, typically requiring 3–5 lbf (13–22N) total insertion force across all 24 positions. This is lower than comparable single-edge 24-position connectors, which often require 6–8 lbf due to force concentration. The dual-edge architecture of the EBM12DSEN-S13 provides superior mechanical stability against lateral bending loads and rotational torque, making it suitable for high-vibration applications such as test equipment or airborne systems. However, the EBM12DSEN-S13 requires precise board alignment during mating; misalignment >0.5mm can cause uneven contact pressure across the dual edges, leading to intermittent electrical faults. Mechanical guides or card edge bevels are recommended for the EBM12DSEN-S13 to ensure controlled insertion geometry.
How should the EBM12DSEN-S13 be integrated into high-speed digital signal paths, and what impedance or EMI considerations are relevant for the 0.156" pitch?
The EBM12DSEN-S13 with 0.156" pitch creates significant electromagnetic coupling between adjacent traces, affecting both differential and common-mode impedance. For applications using the EBM12DSEN-S13 with high-speed signals (>50 MHz), trace-to-trace spacing should be calculated based on target impedance (typically 50–90 ohms differential for logic standards). The dual-row configuration of the EBM12DSEN-S13 with 12 positions per row introduces crosstalk risk, particularly when fast-edge logic signals (rise times <1ns) share rows with analog or clock signals. Return paths must be carefully routed to minimize loop area; the EBM12DSEN-S13 should be paired with return vias positioned within 0.25" of signal vias. For EMI sensitive applications, the EBM12DSEN-S13 may require shielding cans or Faraday isolation around high-speed signal rows to meet regulatory compliance (FCC, CE).
What is the expected contact resistance variation across the 24 positions of the EBM12DSEN-S13, and how does this affect low-voltage signal chains?
Contact resistance variation in the EBM12DSEN-S13 stems from manufacturing tolerances in bellows compression and gold plating uniformity. Typically, contact resistance ranges from 15–35 mΩ across the 24 positions, with edge contacts (first to last) exhibiting 5–10% higher resistance than center contacts due to insertion geometry. For the EBM12DSEN-S13 carrying low-voltage analog signals (±5V or lower), this variation translates to 0.75–1.75mV signal errors at 50mA per contact, requiring precision signal conditioning or calibration. In applications using the EBM12DSEN-S13 for precision measurement or data acquisition, contact resistance should be characterized at both room temperature and temperature extremes; resistance can increase 15–25% from 20°C to 125°C due to thermal coefficient of phosphor bronze. Designs relying on the EBM12DSEN-S13 should include a reference contact path for zero-ohm calibration or employ four-wire measurement techniques to eliminate connector resistance errors.
Does the EBM12DSEN-S13 require any special handling, soldering profile, or post-solder cleaning procedures specific to its gold-plated bellows contact design?
The EBM12DSEN-S13 features solder eyelet termination with 10.0µin gold plating, requiring standard lead-free reflow profiles (peak 245–260°C, 10–30 second dwell). Excessive thermal stress can anneal the bellows spring material, reducing contact force by 10–20%. During reflow, the EBM12DSEN-S13 should be supported to prevent mechanical bending that could permanently deform the contact bellows. Post-solder cleaning with aqueous or mild solvent systems is acceptable; aggressive fluxes or high-pressure water jet cleaning should be avoided as they can corrode the thin gold layer or displace flux residue into contact cavities. For the EBM12DSEN-S13, IPC-A-610 cleanliness standards (Class 2 or higher) are recommended if the connector carries high-impedance analog signals; residual flux can cause leakage currents of 1–10µA across adjacent contacts at elevated temperatures.
How does the blue color coding of the EBM12DSEN-S13 relate to mechanical identification, and are there compatibility or serviceability considerations in mixed-color connector environments?
The blue color of the EBM12DSEN-S13 is a visual identification feature commonly used in industrial test equipment to distinguish dual-row 24-position edge connectors from other connector families. Blue-coded connectors like the EBM12DSEN-S13 are often allocated to specific functional groups (e.g., digital I/O, analog measurement) within a system. In multi-vendor environments or legacy systems, color coding provides field serviceability benefits—technicians can quickly identify the EBM12DSEN-S13 without consulting documentation. However, the blue color itself has no electrical significance; thermal stresses or UV exposure can fade the color without affecting electrical performance of the EBM12DSEN-S13. For traceability and configuration management, the blue color of the EBM12DSEN-S13 should be documented in assembly drawings, but color verification should never replace functional testing or part number verification.

Parts with Similar Specifications

The three parts on the right have similar specifications to Sullins Connector Solutions EBM12DSEN-S13

Product Attribute EBM12DSEI-S13 EBM12DSEN-S243 EBM12DSEF-S13 EBM12DSEH-S13
Part Number EBM12DSEI-S13 EBM12DSEN-S243 EBM12DSEF-S13 EBM12DSEH-S13
Manufacturer Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions Sullins Connector Solutions
Color - - - -
Features - - - Simultaneous Sampling
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Mounting Type - Surface Mount Through Hole Surface Mount
Pitch - - - -
Termination - - - -
Number of Positions/Bay/Row - - - -
Read Out - - - -
Card Thickness - - - -
Series - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Material - - - -
Flange Feature - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Material - Insulation - - - -
Contact Type - - - -
Number of Positions - - - -
Contact Finish Thickness - - - -
Card Type - - - -
Number of Rows - - - -
Contact Finish - - - -
Gender - - - -

EBM12DSEN-S13 Datasheet PDF

Download EBM12DSEN-S13 pdf datasheets and Sullins Connector Solutions documentation for EBM12DSEN-S13 - Sullins Connector Solutions.

Datasheets
Edgecards .156 in Datasheet.pdf
Environmental Information
Sullins Connector Solutions REACH.pdf

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Evaluation: 10 Articles

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    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
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    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
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    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
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    one of my hobbies is skydiving. and when i'm skydiving this works great.

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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Sullins Connector Solutions

EBM12DSEN-S13

Sullins Connector Solutions
98D-EBM12DSEN-S13

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